JPH065240B2 - Soldering defect inspection method for electronic devices - Google Patents
Soldering defect inspection method for electronic devicesInfo
- Publication number
- JPH065240B2 JPH065240B2 JP60265572A JP26557285A JPH065240B2 JP H065240 B2 JPH065240 B2 JP H065240B2 JP 60265572 A JP60265572 A JP 60265572A JP 26557285 A JP26557285 A JP 26557285A JP H065240 B2 JPH065240 B2 JP H065240B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- electronic device
- solder
- soldering
- conductor portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 25
- 238000005476 soldering Methods 0.000 title claims description 25
- 238000007689 inspection Methods 0.000 title claims description 17
- 230000007547 defect Effects 0.000 title claims description 3
- 239000004020 conductor Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 description 33
- 230000002950 deficient Effects 0.000 description 11
- 238000005259 measurement Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
この発明は、ハブリッド（複合型）集積回路等の配線基
板上に形成される電子装置におけるハンダ付け不良を確
実に検知しうるとともに、その修正作業能率を向上しう
るように改良された検査方法に関する。The present invention relates to an inspection method improved so that a soldering failure in an electronic device formed on a wiring substrate such as a hub lid (composite type) integrated circuit can be reliably detected and the correction work efficiency can be improved. .
【従来の技術およびその問題点】 一般に、ハイブリッド型集積回路等におけるプリント配
線基板への抵抗器等の各単位電子装置の実装方法として
は、チップマウント方式が採用されている。これは、各
単位電子装置のプリント配線基板への実装密度を高める
ために、抵抗器等の各構成部品をチップ状にして装着し
たものであり、回路の複雑化に耐えうるようになってい
る。第４図に示すように、このようなチップ状単位電子
装置１は、その端子部１ａがプリント配線基板２の導体
部２ａにハンダ付けされており、従来、この種のハンダ
付け方式として浸漬ハンダ付け法（ハンダディップ法）
あるいはリフローハンダ付け法などが採用されている。 浸漬ハンダ付け法では、第４図および第５図に示すよう
に、プリント配線基板２上にチップ状単位電子装置１を
可溶性の付着剤Ｓで仮り止めした後、これをハンダ浴槽
に漬けることによりプリント配線基板導体部２ａとチッ
プ状単位電子装置両側面の端子部１ａとハンダ付けされ
る。 ところで、このような浸漬ハンダ付け法により各チップ
状単位電子装置１がハンダ付けされたものにおいては、
プリント配線基板表面の掃除不良や、チップ状単位電子
装置端子部１ａの汚れ等により、ハンダ付け不良が生じ
るため、第６図に示すように、複数の測定端子３を有す
る一対型の測定アーム４を用いた通電方法により、その
ハンダ付け不良個所の有無を検査され、その修正が行わ
れる。 また、リフローハンダ付け法で単位電子装置をプリント
基板上に固定する場合においても、電子装置の両端子部
でのクリームハンダの溶融速度に違いが生じると、電子
装置が傾いて固定されたり、不均一なハンダ付けとなる
問題が頻発している。 ところで、上述したハンダ付け不良個所においては、第
７図に示すように、ハンダ５が単位電子装置単位部１ａ
と配線基板導体部２ａとの間にうまく介装されず、単位
電子装置端子部１ａないし配線基板導体部２ａとハンダ
表面５ａとが完全に離間した状態が生じる場合と、第８
図に示すように、表面張力によって盛り上がり状態にな
っているハンダ５により接続される、チップ状端子電子
装置１の端子部１ａないし配線基板導体部２ａとハンダ
５の表面５ａとが接触しておりながら、実質的に接着し
ていない状態が生じる場合とがある。そのため、従来の
通電検査法によると、上記離間状態にある単位電子装置
端子部１ａないし配線基板導体部２ａとハンダ５とは電
気的に接続されないため、そのハンダ付け不良個所はす
ぐに検出できるが、他方、一応接触状態に置かれている
チップ状単位電子装置端子部１ａないし配線基板導体部
２ａとハンダ表面５ａとは、電気的に接続された状態と
なっているので、その検査結果は可となり、上記のハン
ダ接着不良個所の存在は検知されず、結局、接触不良個
所の検出はできても、接触不良個所は検知不可能であ
り、その検出は目視に頼らざるをえない状態に置かれて
いた。そうなると、その検出確率は、各作業者における
集中力等の技量により大きく左右され、それら接着不良
個所が未検出ないし未修正のまま製品として出荷され装
置に組み込まれる場合がある。すると、その装置におい
て、その使用時の振動等により、上記未接着状態にある
チップ状単位電子装置端子部１ａないし配線基板導体部
２ａとハンダ表面５ａとが、瞬間的に離間し、その接続
がきれ、装置の駆動に支障をきたすという問題があっ
た。そのうえ、目視により検出した接着不良個所は、検
出部品毎に一つ一つ、手作業で修正していかなければな
らないため、手間がかかり生産効率を低下するという問
題もあった。 この発明は、以上のような事情のもとで考え出されたも
ので、電子装置の配線基板と各単位電子装置とのハンダ
付け部におけるハンダ接触不良だけでなくその接着不良
をも検出しハンダ付け不良を確実に検知しうるととも
に、その修正作業能率を向上しうる検査方法を提供する
ことをその課題としている。2. Description of the Related Art Generally, a chip mounting method is adopted as a method of mounting each unit electronic device such as a resistor on a printed wiring board in a hybrid integrated circuit or the like. This is a device in which each component such as a resistor is mounted in a chip shape in order to increase the mounting density of each unit electronic device on a printed wiring board, and can withstand the complexity of the circuit. . As shown in FIG. 4, in such a chip-shaped unit electronic device 1, the terminal portion 1a is soldered to the conductor portion 2a of the printed wiring board 2. Conventionally, as this type of soldering method, immersion soldering is used. Attaching method (Solder dip method)
Alternatively, a reflow soldering method or the like is adopted. In the immersion soldering method, as shown in FIGS. 4 and 5, the chip-shaped unit electronic device 1 is temporarily fixed on the printed wiring board 2 with a soluble adhesive S, and then immersed in a solder bath. The printed wiring board conductor portion 2a and the terminal portions 1a on both side surfaces of the chip-shaped unit electronic device are soldered. By the way, in the case where each chip-shaped unit electronic device 1 is soldered by such an immersion soldering method,
Since poor soldering occurs due to poor cleaning of the surface of the printed wiring board, contamination of the chip-shaped unit electronic device terminal portion 1a, etc., a pair of measuring arms 4 having a plurality of measuring terminals 3 as shown in FIG. By the energizing method using, the presence or absence of the defective soldering portion is inspected and the correction is performed. Even when the unit electronic device is fixed on the printed circuit board by the reflow soldering method, if there is a difference in the melting speed of the cream solder at both terminals of the electronic device, the electronic device is inclined and fixed, or The problem of uniform soldering frequently occurs. By the way, at the above-mentioned defective soldering point, as shown in FIG. 7, the solder 5 is the unit electronic device unit 1a.
Between the wiring board conductor portion 2a and the wiring board conductor portion 2a and the unit electronic device terminal portion 1a or the wiring board conductor portion 2a and the solder surface 5a are completely separated from each other.
As shown in the drawing, the terminal portion 1a or the wiring board conductor portion 2a of the chip-shaped terminal electronic device 1 and the surface 5a of the solder 5 which are connected by the solder 5 which is in a raised state due to surface tension are in contact with each other. However, there may be a case where there is substantially no adhesion. Therefore, according to the conventional energization inspection method, since the unit electronic device terminal portion 1a or the wiring board conductor portion 2a in the separated state and the solder 5 are not electrically connected, the defective soldering portion can be immediately detected. On the other hand, since the chip-shaped unit electronic device terminal portion 1a or the wiring board conductor portion 2a and the solder surface 5a which are placed in contact with each other are electrically connected to each other, the inspection result is acceptable. Therefore, the presence of the above-mentioned solder adhesion defective part is not detected, and in the end, although the contact defective part can be detected, the contact defective part cannot be detected, and the detection must be done by visual inspection. Had been In such a case, the detection probability is greatly influenced by the skill such as the concentration of each worker, and there is a case where the defective adhesion portions are shipped as products as undetected or uncorrected and incorporated in the apparatus. Then, in the device, the chip-shaped unit electronic device terminal portion 1a or the wiring board conductor portion 2a and the solder surface 5a, which are in the unbonded state, are momentarily separated from each other due to vibrations during use, and the connection is made. However, there was a problem that it hindered the drive of the device. In addition, since the defective adhesion portion visually detected must be manually corrected for each detected component, it is troublesome and the production efficiency is reduced. The present invention has been devised under the circumstances as described above, and detects not only the solder contact failure in the soldering portion between the wiring board of the electronic device and each unit electronic device but also the adhesion failure thereof and soldering. It is an object of the present invention to provide an inspection method capable of surely detecting a defective attachment and improving the efficiency of the correction work.
上記の問題を解決するため、この発明方法では、次の技
術的手段が講じられている。 すなわち、配線基板上にハンダ付け法により各単位電子
装置が固定配置された電子装置の検査方法であって、配
線基板の導体部に弾性接触しうる端子部を有する測定手
段を備えた検査アームを用い、上記端子部が上記導体部
に弾性接触させられて通電状態にある配線基板を振動発
生手段によって振動させることを特徴としている。In order to solve the above problems, the following technical means are taken in the method of the present invention. That is, a method of inspecting an electronic device in which each unit electronic device is fixedly arranged on a wiring board by a soldering method, and an inspection arm including a measuring means having a terminal portion capable of elastically contacting a conductor portion of the wiring board is provided. It is characterized in that the terminal portion is elastically brought into contact with the conductor portion and the wiring board in the energized state is vibrated by the vibration generating means.
通電は、単位電子装置端子部と配線基板導体部との間に
介装されるハンダの表面とが接触状態にあるかぎり可能
となるが、従来例においては、単に、配線基板保持手段
により配線基板を固定状に保持して、測定手段により通
電状態を調べることにより、ハンダ付け不良検査をして
いるため、仮に、単位電子装置端子部ないし配線基板導
体部とハンダ表面とが接着しておらず、単に接触してい
るだけの状態であっても、通電可能となり、ハンダ未接
触部の検知は可能であっても、未接着部の検出は不可能
となる。 一方、この発明による検査方法においては、配線基板を
振動発生手段により振動させながら、この配線基板上の
導体部に測定端子を当てて通電測定しているので、単位
電子装置端子部ないし配線基板導体部とハンダ表面とが
完全に接着していない場合は、その振動により上記単位
電子装置端子部ないし配線基板導体部とハンダ表面とが
互いに離間し、両者間の接続がきれる瞬間が生じる。一
方、測定端子は、配線基板の導体部に弾性接触しうるよ
うになっているので、配線基板が上記のように振動させ
られている間も、電子装置への通電可能状態が維持され
る。 すなわち、上述したハンダ未接着部を残したまま装置に
組み込まれた電子装置において、その使用時の振動等に
より、上記ハンダ未接着部における単位電子装置端子部
ないし配線基板導体部とハンダ表面とが離間する状態を
予め人為的に設定し、その状態で通電測定を行なうもの
である。 このように本発明方法では、上記振動発生手段によって
配線基板が振動させられるので、上記ハンダ未接着部に
おける単位電子装置端子部ないし配線基板導体部とハン
ダ表面とが離間させられ、両者間の接続が瞬間的に切れ
ることとなり、これによりハンダ接着不良個所の存在を
を容易に検知しうる。しかも従来例におけるハンダ接触
不良個所を検知しうるだけでなく、その接着不良個所を
も検知しうることとなり、ハンダ付け不良を確実に検知
し、電子装置がそのハンダ未接着部を修正されずに製品
として出荷されるのが確実に回避されるとともに、通電
が停止した時の単位電子装置端子部ないし配線基板導体
部のハンダ付け個所を逆探知することにより、その場で
そのハンダ未接着部を修正することができるため、従来
例における各電子装置毎の目視によるハンダ未接着部検
出動作ないしその修正手動作が省略され、その作業能率
を大幅に向上し、生産効率を大幅に向上しうる。Power can be supplied as long as the surface of the solder interposed between the unit electronic device terminal portion and the conductor portion of the wiring board is in contact, but in the conventional example, the wiring board is simply held by the wiring board holding means. Since the soldering defect is inspected by holding the fixed state and checking the energized state by the measuring means, the unit electronic device terminal section or the wiring board conductor section is not adhered to the solder surface. Even in the state where they are simply in contact with each other, it becomes possible to energize, and even if the solder non-contact portion can be detected, the non-bonded portion cannot be detected. On the other hand, in the inspection method according to the present invention, while the wiring board is vibrated by the vibration generating means, the measurement terminal is applied to the conductor portion on the wiring board to measure the electric current. If the portion and the solder surface are not completely adhered to each other, the vibration causes the unit electronic device terminal portion or the wiring board conductor portion and the solder surface to be separated from each other, resulting in the moment when the connection between them is broken. On the other hand, since the measuring terminal can be elastically contacted with the conductor portion of the wiring board, the energizable state to the electronic device is maintained even while the wiring board is vibrated as described above. That is, in the electronic device incorporated in the device with the solder-unbonded portion left, the unit electronic device terminal portion or the wiring board conductor portion and the solder surface in the solder-unbonded portion may be damaged by vibration or the like during use. The separated state is artificially set in advance, and the energization measurement is performed in that state. As described above, in the method of the present invention, since the wiring board is vibrated by the vibration generating means, the unit electronic device terminal portion or the wiring board conductor portion and the solder surface in the solder unbonded portion are separated from each other, and the connection between them is made. Will momentarily be cut off, and the presence of a defective solder adhesion portion can be easily detected. Moreover, not only the solder contact failure point in the conventional example can be detected, but also the adhesion failure point can be detected, the soldering failure can be reliably detected, and the electronic device does not correct the solder unbonded portion. This ensures that the product will not be shipped as a product, and by detecting the soldering point of the unit electronic device terminal section or the wiring board conductor section when the energization is stopped, the solder unbonded section can be spotted on the spot. Since the correction can be performed, the solder unbonded portion detection operation or the correction hand operation for each electronic device in the conventional example can be omitted, the working efficiency can be greatly improved, and the production efficiency can be greatly improved.
以下、この発明の実施例を図面ゐ参照して具体的に説明
する。 この実施例では、第１図ないし第３図に示すように、プ
リント配線基板２上の各区画毎にハンダ付け法により各
チップ状単位電子装置１がそれぞれ固定配置され、かつ
保持手段７によって保持された電子装置６の集合体を、
プリント配線基板導体部２ａに弾性接触する複数の端子
部３ａを有する測定手段８と、上記プリント配線基板２
を殴打することによる振動発生手段９とを備えた検査ア
ーム１０，１０により通電測定するようにしている。 第１図および第２図に示すように、上記保持手段７は、
対向する一対の取付け治具７ａ，７ａを有しており、こ
の取付け治具７ａ，７ａにより，上記プリント配線基板
２は水平状態に支持されている。上記測定手段８は、一
方が通電測定装置に接続された複数の測定端子３と、こ
の測定端子３に外装されこの測定端子３を復元力により
プリント配線基板２方向へ付勢する圧縮コイルばね１１
と、これら測定端子３ないし圧縮コイルばね１１に外装
されたブラケット１２とを備えており、このブラケット
１２は上下一対の可動式略Ｔ字形検査アーム１０，１０
にそれぞれ直交貫通形成され、これにより支持されてい
る。一方、上記振動発生手段９は、一方をコンプレッサ
等に連結された上下一対の復動式エヤシリンダ１３，１
３と、これらエヤシリンダ１３，１３におけるピストン
部１４，１４のピストンロッド１４ａ，１４ａにそれぞ
れ連結されたゴムパッド１４ｂ，１４ｂとを備えてお
り、上記エヤシリンダ１３，１３は上記検査アーム１
０，１０にそれぞれ直交貫通形成され、これにより支持
されている。 上記各手段を用いた方法によるハンダ付け不良検査は、
次のようにして行われる。 まず、第２図に示すように、取付け治具７ａ，７ａによ
い水平方向の所定の位置に保持されているプリント配線
基板２の導体部２ａに上記測定手段８における測定端子
３の端子部３ａを接触させた後、通電するととともに、
エヤシリンダ１３，１３を駆動させ、ピストン部１４，
１４の往復運動をもって、それに連結されたコムパッド
１４ａ，１４ａで上記プリント配線基板２を殴打させ
る。すると、第３図に示すように、その衝撃力によりプ
リント配線基板２は振動することとなり、この時、プリ
ント配線基板２上に形成されたハンダ５とこのハンダ５
により支持されている各単位電子装置１も振動すること
となるため、ハンダ５が単位電子装置端子部１ａないし
プリント配線基板導体部２ａに接着していない部位にお
いては、単位電子装置端子部１ａないしプリント配線基
板導体部２ａとハンダ表面５ａとが単位電子装置１の振
動の慣性遅れに起因する等して、瞬間的に互いに離間す
ることとなり、それらの接続がきれることにより通電停
止するので、そのハンダ未接着個所を容易に検出しう
る。この場合、たとえば、本出願人等で行った実験結果
によると、殴打回数が１４回／秒以上になっても通電停
止しなければ、その使用に耐えうることが判明してい
る。またこのとき、検出したハンダ付け不良個所をその
場でハンダ付けすることにより、効率的に半製品の修正
作業が行われる。 なお、上記プリント配線基板２は、上記検査ないし修正
作業完了後、各単位区画毎に切断されて次の工程へ移さ
れるが、上記検査ないし修正作業工程は上記検査アーム
１０，１０をＸ，Ｙ軸方向に移動させることにより上記
各単位区画毎に行なわれる。 もちろん、この発明の範囲は、上記実施例に限定されな
い。たとえば、上記実施例における振動発生手段９は、
油圧や電力を利用したものでもよく、また、保持手段７
をバイブレータなどで振動させることにより、間接的に
配線基板２に振動を与えるようにしてもよい。また、単
位時間当たりの振動回数が多ければ１回の通電測定の時
間を短縮でき、ハンダ付け不良の検査工程の処理能力を
アップできる。Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. In this embodiment, as shown in FIGS. 1 to 3, each chip-shaped unit electronic device 1 is fixedly arranged by a soldering method in each section on the printed wiring board 2 and held by a holding means 7. The assembled electronic device 6
Measuring means 8 having a plurality of terminal portions 3a elastically contacting the printed wiring board conductor portion 2a;
The inspection arms 10 and 10 are provided with a vibration generating means 9 by striking. As shown in FIG. 1 and FIG. 2, the holding means 7 is
It has a pair of mounting jigs 7a, 7a facing each other, and the printed wiring board 2 is supported horizontally by the mounting jigs 7a, 7a. The measuring means 8 has a plurality of measuring terminals 3 one of which is connected to an energization measuring device, and a compression coil spring 11 which is mounted on the measuring terminals 3 and biases the measuring terminals 3 toward the printed wiring board 2 by a restoring force.
And a bracket 12 mounted on the measuring terminal 3 and the compression coil spring 11, and the bracket 12 is a pair of upper and lower movable substantially T-shaped inspection arms 10, 10.
Are formed so as to be orthogonal to each other and are supported thereby. On the other hand, the vibration generating means 9 includes a pair of upper and lower return type air cylinders 13, 1 one of which is connected to a compressor or the like.
3 and rubber pads 14b and 14b connected to the piston rods 14a and 14a of the piston portions 14 and 14 of these air cylinders 13 and 13, respectively.
The through holes 0 and 10 are formed so as to cross each other, and are supported thereby. Solder failure inspection by the method using each of the above means,
This is done as follows. First, as shown in FIG. 2, the terminal portion 3a of the measuring terminal 3 in the measuring means 8 is attached to the conductor portion 2a of the printed wiring board 2 which is held at a predetermined horizontal position by the mounting jigs 7a, 7a. After making contact, energize and
The air cylinders 13, 13 are driven, and the piston portion 14,
With the reciprocating motion of 14, the printed wiring board 2 is hit with the comb pads 14a, 14a connected thereto. Then, as shown in FIG. 3, the printed wiring board 2 vibrates due to the impact force, and at this time, the solder 5 formed on the printed wiring board 2 and the solder 5 are formed.
Since each unit electronic device 1 supported by the unit also vibrates, the unit electronic device terminal unit 1a or 1a or the printed wiring board conductor unit 2a is not bonded to the solder 5 by the unit electronic device terminal unit 1a or 1a. The printed wiring board conductor portion 2a and the solder surface 5a are momentarily separated from each other due to, for example, a delay in inertia of vibration of the unit electronic device 1, and when they are disconnected from each other, energization is stopped. It is possible to easily detect the unbonded portion of the solder. In this case, for example, according to the results of experiments conducted by the applicant of the present invention, it has been proved that even if the number of hits exceeds 14 times / second, it can withstand the use unless the power supply is stopped. Further, at this time, the detected defective soldering portion is soldered on the spot, so that the semi-finished product can be corrected efficiently. After the inspection or correction work is completed, the printed wiring board 2 is cut into unit blocks and moved to the next step. In the inspection or correction work step, the inspection arms 10, 10 are moved in X, Y directions. By moving in the axial direction, it is performed for each of the above unit sections. Of course, the scope of the present invention is not limited to the above embodiments. For example, the vibration generating means 9 in the above embodiment is
It may be one using hydraulic pressure or electric power, and the holding means 7
The wiring board 2 may be indirectly vibrated by vibrating the element with a vibrator or the like. Further, if the number of vibrations per unit time is large, the time for one energization measurement can be shortened, and the throughput of the soldering failure inspection process can be improved.
第１図はこの発明一実施例の一部切断斜視図、第２図は
そのII−II線縦断正面図、第３図はその要部の縦断正面
図、第４図は従来例における要部の縦断正面図、第５図
は同じくそのハンダ付け前における要部の縦断正面図、
第６図は同じく通電測定状態における斜視図、第７図は
単位電子装置端子部ないし配線基板導体部とハンダ表面
とが離間した状態の縦断正面図、第８図は単位電子装置
端子部ないし配線基板導体部とハンダ表面とが接触した
状態の縦断正面図である。 １…単位電子装置、２…配線基板、２ａ…配線基板導体
部、３ａ…測定手段端子部、６…電子装置、７…保持手
段、８…測定手段、９…振動発生手段、１０，１０…検
査アーム。FIG. 1 is a partially cutaway perspective view of an embodiment of the present invention, FIG. 2 is a vertical sectional front view of the II-II line, FIG. 3 is a vertical sectional front view of a main portion thereof, and FIG. 4 is a main portion of a conventional example. FIG. 5 is a vertical sectional front view of a main part before soldering,
FIG. 6 is a perspective view in the same state as the energization measurement, FIG. 7 is a vertical sectional front view showing a state in which the terminal portion of the unit electronic device or the conductor portion of the wiring board is separated from the solder surface, and FIG. 8 is the terminal unit or wiring of the unit electronic device. It is a vertical cross-sectional front view of a state where the board conductor portion and the solder surface are in contact with each other. DESCRIPTION OF SYMBOLS 1 ... Unit electronic device, 2 ... Wiring board, 2a ... Wiring board conductor part, 3a ... Measuring means terminal part, 6 ... Electronic device, 7 ... Holding means, 8 ... Measuring means, 9 ... Vibration generating means, 10, 10 ... Inspection arm.
Claims (1)
子装置が固定配置された電子装置の検査方法であって、
配線基板の導体部に弾性接触しうる端子部を有する測定
手段を備えた検査アームを用い、上記端子部が上記導体
部に弾性接触させられて通電状態にある配線基板を振動
発生手段によって振動させることを特徴とする、電子装
置のハンダ付け不良検査方法。1. A method for inspecting an electronic device, wherein each unit electronic device is fixedly arranged on a wiring board by a soldering method,
Using the inspection arm having the measuring means having the terminal portion capable of elastically contacting the conductor portion of the wiring board, the terminal portion is elastically brought into contact with the conductor portion and the wiring board in the energized state is vibrated by the vibration generating means. A soldering defect inspection method for an electronic device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60265572A JPH065240B2 (en) | 1985-11-25 | 1985-11-25 | Soldering defect inspection method for electronic devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60265572A JPH065240B2 (en) | 1985-11-25 | 1985-11-25 | Soldering defect inspection method for electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62124466A JPS62124466A (en) | 1987-06-05 |
| JPH065240B2 true JPH065240B2 (en) | 1994-01-19 |
Family
ID=17418976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60265572A Expired - Fee Related JPH065240B2 (en) | 1985-11-25 | 1985-11-25 | Soldering defect inspection method for electronic devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065240B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180076333A (en) * | 2016-12-27 | 2018-07-05 | 가부시키가이샤 코스모 라이프 | Water server with lock |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55168882U (en) * | 1979-05-24 | 1980-12-04 | ||
| JPS58116676U (en) * | 1982-02-01 | 1983-08-09 | 株式会社精工舎 | Electric circuit testing equipment |
-
1985
- 1985-11-25 JP JP60265572A patent/JPH065240B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180076333A (en) * | 2016-12-27 | 2018-07-05 | 가부시키가이샤 코스모 라이프 | Water server with lock |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62124466A (en) | 1987-06-05 |
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|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |