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JPH0652833B2 - Eraser for copier - Google Patents
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JPH0652833B2 - Eraser for copier - Google Patents

Eraser for copier

Info

Publication number
JPH0652833B2
JPH0652833B2 JP63252485A JP25248588A JPH0652833B2 JP H0652833 B2 JPH0652833 B2 JP H0652833B2 JP 63252485 A JP63252485 A JP 63252485A JP 25248588 A JP25248588 A JP 25248588A JP H0652833 B2 JPH0652833 B2 JP H0652833B2
Authority
JP
Japan
Prior art keywords
eraser
film
copying machine
plate
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63252485A
Other languages
Japanese (ja)
Other versions
JPH0299978A (en
Inventor
公義 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP63252485A priority Critical patent/JPH0652833B2/en
Publication of JPH0299978A publication Critical patent/JPH0299978A/en
Publication of JPH0652833B2 publication Critical patent/JPH0652833B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【産業上の利用分野】[Industrial applications]

本考案は複写機に取付けて使用されるイレーサーに関す
るものである。
The present invention relates to an eraser used by being attached to a copying machine.

【従来技術】[Prior art]

この種のイレーサーとしては、第11〜12図に示した
構成のものが従来例として周知である。この従来例の構
成において、1はIC、抵抗等の電子部品を搭載した基
板であり、該基板は配線がプリントしてあるフレキシブ
ル基板2と略一体的に貼着され且つ対応する電子部品が
電気的に接続され、更にフレキシブル基板2にLEDの
搭載基板3を一体的に貼着固定し、対応する配線と電気
的に接続させることにより、前記電子部品によりLED
が駆動されるように構成されている。そして、実際の使
用に際しては、LEDの搭載基板3が仮想線で示したよ
うに、略90°方向を変えた状態、即ち前記フレキシブ
ル基板2を折り曲げた状態で使用している。尚、4はL
ED、5はレンズである。
As this type of eraser, the structure shown in FIGS. 11 to 12 is well known as a conventional example. In the configuration of this conventional example, 1 is a substrate on which electronic components such as ICs and resistors are mounted, and the substrate is attached substantially integrally with the flexible substrate 2 on which wiring is printed, and the corresponding electronic component is an electrical component. Are electrically connected to each other, and the LED mounting substrate 3 is integrally adhered and fixed to the flexible substrate 2 and electrically connected to the corresponding wiring, so that the LED can be connected to the electronic component.
Are configured to be driven. In actual use, the LED mounting board 3 is used in a state in which the direction is changed by approximately 90 °, that is, the flexible board 2 is bent, as shown by an imaginary line. 4 is L
ED and 5 are lenses.

【発明が解決しようとする課題】[Problems to be Solved by the Invention]

前記従来例のイレーサーにおいては、電子部品の搭載基
板と、フレキシブル基板と、LEDの搭載基板とを夫々
別々に形成し、それ等を合体させると共に、電気的に接
続させなければならないため、接続ピッチを小さくでき
ず、全体として大型化し、取付けスペースに制約を受け
る複写機に対して、小型化できないと云う課題を有して
いる。又、仮に小型化できたにしても、迷光の対応策及
び放熱の対応策に課題を有している。
In the conventional eraser, the electronic component mounting substrate, the flexible substrate, and the LED mounting substrate are separately formed, and they must be united and electrically connected. However, there is a problem in that the size of the copying machine cannot be made smaller, the size of the copying machine becomes larger as a whole, and the size of the copying machine cannot be made smaller. Further, even if the size can be reduced, there are problems in measures against stray light and measures against heat dissipation.

【課題を解決するための手段】[Means for Solving the Problems]

前記従来例の課題を解決する具体的手段として本発明
は、ベアチップIC及びベアチップLED等をワイヤー
ボンディングすると共に、他の電子部品を搭載させ、該
各々が搭載されたエリアの裏面側には夫々放熱板が取り
付けられた一枚のフィルム状フレキシブルプリント基板
を前記放熱板と対応する位置に、該放熱板の厚みとほぼ
同じ深さの凹部が形成された平面板と立上り板とで断面
略L字状に形成されたブロックフィンに、前記平面板の
凹部へ放熱板を嵌着させることにより、一体的に巻き付
けて取り付けたことを特徴とする複写機用イレーサーを
提供するものであり、前記フィルム状フレキシブルプリ
ント基板を、前記ブロックフィンの各取付面の面積に対
応するようにエリアを分けて電子部品を搭載し、プリン
ト配線した構成にすることによって、接続ピッチ等を考
慮する必要がなく、従ってベアチップLEDの取付けピ
ッチも著しく狭くすることができ、それによって全体を
小型化できるのである。又、接続箇所が減らせるので、
信頼性が上がり、且つ工数も減少する。
As a concrete means for solving the problems of the conventional example, the present invention wire-bonds a bare chip IC, a bare chip LED, etc., and mounts other electronic parts, and radiates heat to the back side of the area where each of them is mounted. A single film-like flexible printed circuit board to which a plate is attached is provided at a position corresponding to the heat dissipation plate, and a flat plate and a rising plate having a recess having a depth substantially the same as the thickness of the heat dissipation plate are formed into a substantially L-shaped section. To provide an eraser for a copying machine, characterized in that a heat dissipation plate is fitted into a concave portion of the flat plate and is integrally wound and attached to a block fin formed in a strip shape. The flexible printed circuit board has a structure in which electronic parts are mounted by dividing the area so as to correspond to the area of each mounting surface of the block fin, and printed wiring is formed. It by no need to consider the connection pitch and the like, thus mounting pitch of the bare chip LED may also be considerably narrower, it can reduce the overall size of the thereby. Also, since the number of connection points can be reduced,
Reliability is improved and man-hours are reduced.

【実施例】【Example】

次に、本発明を図示の実施例により詳細に詳しく説明す
ると、10は放熱及び複写機への取付け用ブロックフィン
であり、該ブロックフィン10の周面に巻き付けてフィル
ム状フレキシブルプリント基板20を取付けると共に、該
フィルム状フレキシブルプリント基板20に給電するため
のコネクター30が一体的に取付けられたイレーサーが構
成されている。 前記ブロックフィン10は平面板11と立上り板12とで形成
され断面L字状を呈するものである。そして、前記平面
板11の表裏両面には所定深さの凹部13,14が形成され、
全体的に黒色アルマイト又は黒色塗料などを施して黒色
に形成してある。 前記フィルム状フレキシブルプリント基板20は、ダイボ
ンディング及びワイヤーボンディング可能なポリイミド
系又はポリエステル系フィルムで形成され、第3図に示
したように、略3つのエリアA,B,Cに区分して一連
のCu箔からなるプリント配線21がなされ、これ等エリ
アの内エリアAはベアチップIC22が搭載されるIC搭
載エリアであり、エリアBは抵抗23が搭載される抵抗搭
載エリアで、エリアCはベアチップLED24が搭載され
るLED搭載エリアとなっている。このように各エリア
間を繋ぐプリント配線21は一連に形成され、その配線
間隔は略1mm程度であり、従って、この等配線上に接続
して搭載される各電子部品、特にベアチップLEDの取
付け間隔も略1mm程度になるのである。そして、前記各
エリアの裏面側には、夫々アルミニウム製の放熱板25,2
6,27が夫々取付けられている。 これら放熱板の取付け構造は、第5図に示した通りであ
り、前記フィルム状フレキシブルプリント基板20との間
で絶縁性の接着剤等を用いて一体的に取付けられる。そ
して、これらの放熱板25,26,27自身は全体として黒色ア
ルマイト又は黒色塗料などを施して絶縁させ黒色に形成
してある。尚、前記フィルム状フレキシブルプリント基
板20の表裏両面は、各電子部品の接続部を除いて全面的
に絶縁性の保護皮膜28により被覆され、保護されている
のである。そして、この保護皮膜を例えば、黒色の樹脂
塗料を用いて塗布することで、全体的に黒色にすること
ができ、前記放熱板との間において充分な絶縁性が保て
るのである。 このように構成されたフィルム状フレキシブルプリント
基板20を前記ブロックフィン10に対して巻き付けるよう
にして取付ける。この場合に、ブロックフィン10の平面
板11の表面側の凹部13にフィルム状フレキシブルプリン
ト基板10の放熱板25を嵌着し、例えば接着剤等により接
着固定し、続いてフィルム状フレキシブルプリント基板
を平面板11の自由端部に沿って折り曲げて裏面側に位置
させ、該裏面側において前記放熱板26を裏面側の凹部14
に嵌着させるように、更にフィルム状フレキシブルプリ
ント基板を折り曲げて立上り板12に添わせるようにし、
該立上り板12と放熱板27とを接着剤等により一体的に接
着固定して巻き付けが終了し、ブロックフィン10に対し
て各種電子部品を搭載したフィルム状フレキシブルプリ
ント基板20が安定した状態で一体的に巻き付いて取付け
られるのである。その後において、前記コネクター30が
アルミニウム基板10上に絶縁性接着剤及び、適宜の絶縁
部材を介してビス等により固定され、各端子は前記プリ
ント配線24との間で電気的に接続されるのである。 前記ベアチップLED24の前面側には、第6〜8図に示
したような、一体又は別体に形成された迷光遮蔽部材32
及びマスク部材33を介してレンズ34が取付けられる。こ
の迷光遮蔽部材及びマスク部材は、例えば黒色の樹脂で
形成され、前記各ベアチップLED24の配設間隔に対応
して仕切り部32a、33aが設けられ、各ベアチップLED
を個々に仕切って相互に光が干渉しないように構成され
ている。 前記レンズ34は、第9〜10図に示したように、透明な
アクリル樹脂等により一連に長尺に形成され、各対応す
るベアチップLED24に対してレンズ部35が突出して隣
接状態に形成され、反対側の上面は平坦に形成されてい
る。そして、これ等各レンズ部35の存在並びに前記迷光
遮蔽部材32及びマスク部材33とによって、レンズ34自体
がライトガイドの役目をしないようになっている。更
に、レンズ34は前記レンズ部35を除いた他の部分を黒色
とすれば、前記迷光遮蔽部材32及びマスク部材33の使用
は必ずしも必要としないのである。この場合には、各ベ
アチップLED24は前記レンズ部35を正確に対峠させ、
隣接するレンズ部で相互間に光の干渉がなくなるように
する。
Next, the present invention will be described in detail with reference to the illustrated embodiment. Reference numeral 10 is a block fin for heat dissipation and attachment to a copying machine, which is wound around the peripheral surface of the block fin 10 to mount the film-like flexible printed circuit board 20. At the same time, an eraser is integrally formed with a connector 30 for supplying electric power to the film-like flexible printed circuit board 20. The block fin 10 is formed of a flat plate 11 and a rising plate 12 and has an L-shaped cross section. Then, recesses 13 and 14 having a predetermined depth are formed on both front and back surfaces of the flat plate 11,
A black alumite or black paint is applied on the whole to form a black color. The film-like flexible printed board 20 is formed of a polyimide-based or polyester-based film capable of die-bonding and wire-bonding, and is divided into approximately three areas A, B, and C as shown in FIG. A printed wiring 21 made of Cu foil is formed. Of these areas, an area A is an IC mounting area on which a bare chip IC 22 is mounted, an area B is a resistor mounting area on which a resistor 23 is mounted, and an area C is a bare chip LED 24. It is an LED mounting area. In this way, the printed wirings 21 that connect the respective areas are formed in series, and the wiring interval is about 1 mm. Therefore, the mounting interval of each electronic component, particularly the bare chip LED, which is connected and mounted on the equal wiring, is mounted. Is about 1 mm. Then, on the back side of each of the above-mentioned areas, heat sinks 25, 2 made of aluminum are respectively provided.
6,27 are installed respectively. The mounting structure of these heat radiating plates is as shown in FIG. 5, and they are integrally mounted on the film-like flexible printed circuit board 20 by using an insulating adhesive or the like. The heat radiating plates 25, 26, 27 themselves are black-colored or black-painted as a whole so as to be insulated and blackened. The front and back surfaces of the film-like flexible printed circuit board 20 are entirely covered and protected by an insulating protective film 28 except for the connection parts of the electronic components. Then, by applying this protective film by using, for example, a black resin coating, it is possible to make the color black as a whole, and it is possible to maintain sufficient insulation between the heat radiation plate and the heat radiation plate. The film-like flexible printed circuit board 20 configured as described above is attached to the block fin 10 so as to be wound. In this case, the heat dissipation plate 25 of the film-shaped flexible printed circuit board 10 is fitted into the recess 13 on the surface side of the flat plate 11 of the block fin 10, and is fixed by adhesion with, for example, an adhesive, and then the film-shaped flexible printed circuit board. The flat plate 11 is bent along the free end of the flat plate 11 and positioned on the back surface side.
So that the film-shaped flexible printed circuit board is bent so that it fits on the rising plate 12,
The rising plate 12 and the heat dissipation plate 27 are integrally bonded and fixed with an adhesive or the like to complete the winding, and the film-shaped flexible printed circuit board 20 on which various electronic parts are mounted is integrated with the block fin 10 in a stable state. It is installed by winding it around. After that, the connector 30 is fixed on the aluminum substrate 10 with an insulating adhesive and a screw or the like via an appropriate insulating member, and each terminal is electrically connected to the printed wiring 24. . On the front side of the bare chip LED 24, the stray light shielding member 32 integrally or separately formed as shown in FIGS.
The lens 34 is attached via the mask member 33. The stray light shielding member and the mask member are formed of, for example, black resin, and partition portions 32a and 33a are provided corresponding to the arrangement intervals of the bare chip LEDs 24.
Are individually partitioned so that light does not interfere with each other. As shown in FIGS. 9 to 10, the lens 34 is formed in a long series of transparent acrylic resin or the like, and the lens portion 35 is formed adjacent to each corresponding bare chip LED 24. The upper surface on the opposite side is formed flat. The presence of each of these lens portions 35 and the stray light shielding member 32 and the mask member 33 prevent the lens 34 itself from serving as a light guide. Further, the lens 34 does not necessarily need to use the stray light shielding member 32 and the mask member 33 if the other portions except the lens portion 35 are black. In this case, each bare chip LED 24 exactly faces the lens portion 35,
Make sure that adjacent lens parts do not interfere with each other.

【発明の効果】【The invention's effect】

以上説明したように本発明に係る複写機用イレーサー
は、ベアチップIC及びベアチップLED等をワイヤー
ボンディングすると共に、他の電子部品を搭載させ、該
各々が搭載されたエリアの裏面側には夫々放熱板が取り
付けられた一枚のフィルム状フレキシブルプリント基板
を前記放熱板と対応する位置に、該放熱板の厚みとほぼ
同じ深さの凹部が形成された平面板と立上り板とで断面
略L字状に形成されたブロックフィンに、前記平面板の
凹部へ放熱板を嵌着させることにより、一体的に巻き付
けて取り付けた構成にしたことにより、従来例のように
複数の基板の接続及び端子部の接続がなく、しかも接続
のためのスペースを広く取る必要もなく、従って電子部
品の搭載ピッチを著しく狭くでき小型化が図れるばかり
でなく、作業性及び生産性に富むと云う優れた効果を奏
する。 又、フィルム状フレキシブルプリント基板を、前記ブロ
ックフィンの各取付面の面積に対応するようにエリアを
別けて電子部品を搭載し、プリント配線したことによ
り、各電子部品の搭載作業が集中して行え、それによっ
ても作業性及び生産性に富むと云う優れた効果を奏す
る。 更に、各電子部品が搭載された各エリア毎に、その裏面
側に絶縁性の接着剤などを介して黒色の放熱板を取付け
たこと、及びフレキシブルプリント基板を、黒色に形成
したこと、並びにベアチップIC、ベアチップLED側
に突出するレンズ部を有するレンズを用いたことによっ
て、各電子部品の放熱効果を高め、同時に迷光を吸収し
て、迷光による種々のトラブルを回避できると云う優れ
た効果も奏する。
As described above, the eraser for a copying machine according to the present invention wire-bonds bare chip ICs and bare chip LEDs, and also mounts other electronic parts, and radiates heat to the back surface of the area where each of them is mounted. A single sheet of film-shaped flexible printed circuit board attached with a heat sink is provided at a position corresponding to the heat sink with a flat plate and a rising plate having a recess having a depth substantially the same as the thickness of the heat sink. The heat dissipation plate is fitted into the concave portion of the flat plate in the block fin formed in 1. so that the block fin is integrally wound and attached. There is no connection, and there is no need to take a large space for connection. Therefore, not only the mounting pitch of electronic parts can be significantly narrowed and downsizing can be achieved, but also workability and Excellent effects referred to as rich in production properties. Also, by mounting the electronic parts on the film-like flexible printed circuit board in different areas so as to correspond to the area of each mounting surface of the block fins and by performing the printed wiring, the mounting work of each electronic part can be concentrated. This also brings about the excellent effect of being rich in workability and productivity. Further, for each area where each electronic component is mounted, a black heat radiating plate is attached to the back surface side of the area through an insulating adhesive or the like, a flexible printed board is formed in black, and a bare chip is used. By using the lens having the lens portion protruding toward the IC and the bare chip LED side, the heat dissipation effect of each electronic component is enhanced, and at the same time, stray light is absorbed and various troubles due to stray light can be avoided. .

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係る複写機用イレーサーの一実施例を
示す平面図、第2図は第1図のII−II線に沿う拡大断面
図、第3図はフレキシブルプリント基板を示す平面図、
第4図は同フレキシブルプリント基板の側面図、第5図
は同フレキシブルプリント基板の一部を拡大して示した
斜視図、第6図は本発明のイレーサーに使用される迷光
遮蔽部材の一部を拡大して示した平面図、第7図は同迷
光遮蔽部材の配設状態を示す要部の拡大断面図、第8図
は同迷光遮蔽部材及びマスク部材の配設状態を示す要部
の拡大断面図、第9図はレンズの下面図、第10図は同
レンズの側面図、第11図は従来例のイレーサーの平面
図、第12図は同イレーサーの側面図である。 10……ブロックフィン 11……平面板、12……立上り板 13、14……凹部 20……フィルム状フレキシブルプリント基板 21……プリント配線、22……ベアチップIC 23……抵抗、24……ベアチップLED 25、26、27……放熱板、28……保護皮膜 30……コネクター、32……迷光遮蔽部材 32a、33a……仕切り部 33……マスク部材、34……レンズ 35……レンズ部
1 is a plan view showing an embodiment of an eraser for a copying machine according to the present invention, FIG. 2 is an enlarged sectional view taken along line II-II of FIG. 1, and FIG. 3 is a plan view showing a flexible printed circuit board. ,
FIG. 4 is a side view of the flexible printed circuit board, FIG. 5 is an enlarged perspective view of a part of the flexible printed circuit board, and FIG. 6 is a part of a stray light shielding member used in the eraser of the present invention. 7 is an enlarged plan view, FIG. 7 is an enlarged cross-sectional view of an essential part showing the arrangement state of the stray light shielding member, and FIG. 8 is an essential sectional view showing the arrangement state of the stray light shielding member and the mask member. FIG. 9 is an enlarged sectional view, FIG. 9 is a bottom view of the lens, FIG. 10 is a side view of the lens, FIG. 11 is a plan view of an eraser of a conventional example, and FIG. 12 is a side view of the eraser. 10 …… Block fin 11 …… Flat plate, 12 …… Standing plate 13,14 …… Concave 20 …… Film flexible printed circuit board 21 …… Printed wiring, 22 …… Bare chip IC 23 …… Resistance, 24 …… Bare chip LED 25, 26, 27 ...... Heat sink, 28 ...... Protective film 30 ...... Connector, 32 ...... Stray light shielding member 32a, 33a ...... Partition part 33 ...... Mask member, 34 ...... Lens 35 ...... Lens part

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】ベアチップIC及びベアチップLED等を
ワイヤーボンディングすると共に、他の電子部品を搭載
させ、該各々が搭載されたエリアの裏面側には夫々放熱
板が取り付けられた一枚のフィルム状フレキシブルプリ
ント基板を前記放熱板と対応する位置に、該放熱板の厚
みとほぼ同じ深さの凹部が形成された平面板と立上り板
とで断面略L字状に形成されたブロックフィンに、前記
平面板の凹部へ放熱板を嵌着させることにより、一体的
に巻き付けて取り付けたことを特徴とする複写機用イレ
ーサー。
1. A film-shaped flexible film, in which a bare chip IC, a bare chip LED, and the like are wire-bonded and other electronic components are mounted, and a heat sink is attached to the back side of the area where each of them is mounted. The printed board is placed at a position corresponding to the heat radiating plate on a block fin formed in a substantially L-shaped cross section with a flat plate and a rising plate having a recess having a depth substantially the same as the thickness of the heat radiating plate. An eraser for a copying machine, characterized in that a heat dissipation plate is fitted into a concave portion of a face plate so as to be integrally wound and attached.
【請求項2】フィルム状フレキシブルプリント基板を、
前記ブロックフィンの各取付面の面積に対応するように
エリアを別けて電子部品を搭載し、プリント配線したこ
とを特徴とする請求項1記載の複写機用イレーサー。
2. A film-like flexible printed circuit board,
2. An eraser for a copying machine according to claim 1, wherein electronic parts are mounted in different areas so as to correspond to the areas of the mounting surfaces of the block fins, and printed wiring is provided.
【請求項3】各電子部品が搭載された各エリア毎に、そ
の裏面側に黒色の絶縁層を介して放熱板を取り付けたこ
とを特徴とする請求項1又は2記載の複写機用イレーサ
ー。
3. The eraser for a copying machine according to claim 1, wherein a heat radiating plate is attached to the back surface side of each area on which each electronic component is mounted via a black insulating layer.
【請求項4】フィルム状フレキシブルプリント基板を、
ワイヤーボンディング可能なポリイミド系又はポリエス
テル系フィルムで形成し、且つ黒色に形成したことを特
徴とする請求項1、2又は3記載の複写機用イレーサ
ー。
4. A film-shaped flexible printed circuit board,
The eraser for a copying machine according to claim 1, 2 or 3, wherein the eraser is formed of a wire-bondable polyimide-based or polyester-based film and is formed in black.
【請求項5】フィルム状フレキシブルプリント基板の上
面に、一体又は別体に形成した黒色のマスク及び迷光遮
蔽部材を配設し、その上部に凸部を内側に向けて上面が
平坦なレンズを配設したことを特徴とする請求項1、
2、3又は4記載の複写機用イレーサー。
5. A black mask and a stray light shielding member integrally or separately formed are provided on the upper surface of the film-like flexible printed circuit board, and a lens having a flat upper surface is arranged above the black mask and the stray light shielding member. It is provided, The claim 1 characterized by the above-mentioned.
An eraser for a copying machine according to item 2, 3 or 4.
JP63252485A 1988-10-06 1988-10-06 Eraser for copier Expired - Lifetime JPH0652833B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63252485A JPH0652833B2 (en) 1988-10-06 1988-10-06 Eraser for copier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63252485A JPH0652833B2 (en) 1988-10-06 1988-10-06 Eraser for copier

Publications (2)

Publication Number Publication Date
JPH0299978A JPH0299978A (en) 1990-04-11
JPH0652833B2 true JPH0652833B2 (en) 1994-07-06

Family

ID=17238033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63252485A Expired - Lifetime JPH0652833B2 (en) 1988-10-06 1988-10-06 Eraser for copier

Country Status (1)

Country Link
JP (1) JPH0652833B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4242792A1 (en) 2022-03-10 2023-09-13 Lenovo (Singapore) Pte. Ltd. Electronic apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0438784A (en) * 1990-06-05 1992-02-07 Kenwood Corp Display device for cassette door
US8642181B2 (en) 2004-08-23 2014-02-04 Mitsubishi Gas Chemical Company, Inc. Metal-clad white laminate
JP5124921B2 (en) * 2004-08-23 2013-01-23 三菱瓦斯化学株式会社 Metal-clad white laminate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6252989U (en) * 1985-09-24 1987-04-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4242792A1 (en) 2022-03-10 2023-09-13 Lenovo (Singapore) Pte. Ltd. Electronic apparatus

Also Published As

Publication number Publication date
JPH0299978A (en) 1990-04-11

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