JPH0655480B2 - Laminated board manufacturing method - Google Patents
Laminated board manufacturing methodInfo
- Publication number
- JPH0655480B2 JPH0655480B2 JP21044190A JP21044190A JPH0655480B2 JP H0655480 B2 JPH0655480 B2 JP H0655480B2 JP 21044190 A JP21044190 A JP 21044190A JP 21044190 A JP21044190 A JP 21044190A JP H0655480 B2 JPH0655480 B2 JP H0655480B2
- Authority
- JP
- Japan
- Prior art keywords
- base paper
- cellulose
- laminated
- laminated board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 229920003043 Cellulose fiber Polymers 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 238000004080 punching Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920002678 cellulose Polymers 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229920005610 lignin Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 102000009123 Fibrin Human genes 0.000 description 1
- 108010073385 Fibrin Proteins 0.000 description 1
- BWGVNKXGVNDBDI-UHFFFAOYSA-N Fibrin monomer Chemical compound CNC(=O)CNC(=O)CN BWGVNKXGVNDBDI-UHFFFAOYSA-N 0.000 description 1
- 229920002488 Hemicellulose Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229950003499 fibrin Drugs 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Laminated Bodies (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は積層板の製造方法に係り、特に打抜き加工性，
熱寸法安定性が良好で、しかも廉価に簡単な工程で得ら
れる積層板の製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a laminated sheet, and particularly to punching workability,
The present invention relates to a method for manufacturing a laminated board which has good thermal dimensional stability and is obtained at a low cost by a simple process.
〔従来の技術〕 電子機器の小型化，軽量化，高性能化に伴ない、プリン
ト配線板は年々高密度化が進行しており、之に対応する
積層板用原紙が求められている。この特性としては打抜
き加工性，熱寸法安定性が共に良好であり、またコスト
競争力を有することが望まれている。[Prior Art] With the miniaturization, weight reduction, and higher performance of electronic devices, the density of printed wiring boards is increasing year by year, and there is a demand for a base paper for laminated boards that meets these requirements. With regard to this property, it is desired that both punching workability and thermal dimensional stability are good, and that cost competitiveness is achieved.
積層板は通常同じ坪量の複数枚の積層板用原紙に熱硬化
性樹脂を所定量含浸させ、熱圧成形を行なつて得られ
る。この際、熱圧成形時に流動した樹脂は流出し、廃棄
されているのが現状である。The laminated plate is usually obtained by impregnating a predetermined amount of a thermosetting resin on a plurality of laminated base papers having the same basis weight and performing thermocompression molding. At this time, the resin that has flowed during the thermocompression molding flows out and is discarded.
従来、α−セルロース含量が75％以上88％未満である原
紙を単独で用いると積層板の熱寸法安定性は良好である
が、打抜き加工性に問題があり、一方α−セルロース含
量が88％以上の原紙を用いると積層板の打抜き加工性は
良好であるが、熱寸法安定性が悪いことが知られてい
る。α−セルロースを88％以上含有する繊維素繊維を抄
造してなる積層板用原紙を用いこれに熱硬化性樹脂を所
定量含浸付着させた基材と、α−セルロース75％以上〜
88％未満含有繊維素繊維を抄造してなる積層板用原紙に
熱硬化性樹脂を所定量含浸付着させた基材を、組み合せ
て成型することにより打抜き加工性及びそり特性が共に
良好な積層板が得られることが知られている（特開昭62
-48532号）。Conventionally, when a base paper having an α-cellulose content of 75% or more and less than 88% is used alone, the thermal dimensional stability of the laminated sheet is good, but there is a problem in punching workability, while the α-cellulose content is 88%. It is known that when the above base paper is used, the punching workability of the laminated plate is good, but the thermal dimensional stability is poor. A base material obtained by impregnating and adhering a predetermined amount of a thermosetting resin onto a base paper for a laminated plate, which is made by making fibrin fibers containing 88% or more of α-cellulose, and α-cellulose of 75% or more-
Laminated board with excellent punching workability and warpage characteristics by combining and molding base materials in which a predetermined amount of thermosetting resin is impregnated and adhered to a base paper for laminated board made from paper containing fibrous fibers containing less than 88% It is known that
-48532).
本発明は打抜き加工性及び熱寸法安定性の改善された積
層板を提供しようとするものであるが、更に熱硬化性樹
脂の節減が出来、樹脂含浸，乾燥工程での原紙処理量の
減少を図ることを目的とするものである。The present invention is intended to provide a laminate having improved punching workability and thermal dimensional stability, but it is possible to further reduce the amount of thermosetting resin, and to reduce the amount of base paper processed in the resin impregnation and drying steps. This is intended to be achieved.
本発明者等はこの課題を解決するため種々検討した結
果、α−セルロース含量が88％以上且つ坪量が20〜50g
／m2で熱硬化性樹脂が含浸されていない積層板用原紙
(A)と、α−セルロース含量が75％以上88％未満である
セルロース繊維を抄紙し、熱硬化性樹脂を所定量（樹脂
含有率50％以上）含浸させた基材(B)とを、(B)基材を内
層に、(A)原紙を表裏側の外層に組み合わせ熱圧成型す
ることにより、この目的を達成し得ることを見出し本発
明に到達した。As a result of various studies by the present inventors to solve this problem, the α-cellulose content is 88% or more and the basis weight is 20 to 50 g.
/ M 2 with no thermosetting resin impregnated into laminated board base paper
(A) and a base material (B) impregnated with a predetermined amount (resin content of 50% or more) of a thermosetting resin for making paper from cellulose fibers having an α-cellulose content of 75% or more and less than 88%, The inventors have found that this object can be achieved by combining the (B) base material as the inner layer and the (A) base paper as the outer layers on the front and back sides, and arrived at the present invention.
α−セルロース含量が88％以上である原紙を用いると、
積層板の表面クラツクが少なくなり打抜き加工性が良好
となる。之はパルスの精製度が高くなることにより、 熱硬化性樹脂との親和性が良くなる。Using a base paper with an α-cellulose content of 88% or more,
The surface crack of the laminated plate is reduced and the punching workability is improved. The higher the degree of purification of the pulse, the better the affinity with the thermosetting resin.
α−セルロース以外の成分であるリグニンやヘミセル
ロースが減少するために、原紙の弾性率が低くなり打抜
き時の剪断力が小さくなる などの要因が考えられる。Since lignin and hemicellulose, which are components other than α-cellulose, are reduced, the elastic modulus of the base paper becomes low and the shearing force at the time of punching becomes small.
α−セルロース含量が75％以上〜88％未満である原紙の
場合、積層板の熱寸法安定性が良好になるのは、リグニ
ン含量が大きく繊維間結合力を強くするためであると考
えられる。In the case of a base paper having an α-cellulose content of 75% or more and less than 88%, it is considered that the thermal dimensional stability of the laminated sheet is good because the lignin content is large and the interfiber bonding strength is increased.
表面クラツクは表裏側の外層の影響が大きいことは知ら
れており、この層に打抜き加工性の良い原紙を組合わせ
ると、その効果により表面クラツクの防止性が大きくな
る。本発明は熱硬化性樹脂未含浸である原紙(A)は熱圧
成形時に基材(B)から移行した樹脂を吸収浸透するた
め、流出廃棄される樹脂が低減され、更に樹脂の含浸，
乾燥の工程が省かれるので、工程での原紙処理量が減少
し省コストに役立つ。It is known that the surface cracks are greatly influenced by the outer layers on the front and back sides. When this layer is combined with a base paper having good punching workability, the effect of increasing the surface crack prevention is enhanced. In the present invention, the base paper (A) that is not impregnated with a thermosetting resin absorbs and permeates the resin that has migrated from the base material (B) during thermocompression molding, so that the resin that is discharged and discarded is reduced.
Since the drying step is omitted, the processing amount of the base paper in the step is reduced, which contributes to cost saving.
ここで、外層に用いられるα−セルロース含量が88％以
上の原紙の坪量を20〜50g／m2に規定したのは、20g／m2
未満では打抜き加工性向上の効果が期待し難くなり、ま
た50g／m2超になると熱圧成形時の移行樹脂の吸収浸透
が不良になるからである。Here, the α- cellulose content used in the outer layer defined a basis weight of 88% or more of the base paper in 20 to 50 g / m 2 is, 20 g / m 2
If it is less than 50 g, it is difficult to expect the effect of improving the punching workability, and if it exceeds 50 g / m 2 , the absorption and permeation of the transfer resin at the time of thermocompression molding becomes poor.
以下、本発明の効果を実施例によつて示す。なお、実施
例，比較例の％は重量％である。Hereinafter, the effects of the present invention will be shown by examples. In the examples and comparative examples,% is% by weight.
実施例１ α−セルロース含量が92％のセルロース繊維を抄紙し、
坪量24g／m2，密度0.5g／cm3の積層板用原紙を得た（Ａ
原紙）。Example 1 Paper making cellulose fibers having an α-cellulose content of 92%,
A base paper for a laminate having a basis weight of 24 g / m 2 and a density of 0.5 g / cm 3 was obtained (A
Base paper).
次に、α−セルロース含量が85％であるセルロース繊維
を抄紙して得られた、坪量126g／m2，密度0.5g／cm3の
積層板用原紙（Ｂ原紙）に、市販アルコール性フエノー
ル樹脂（商品名BLS-3122：昭和高分子株式会社製）を含
浸させた後、乾燥させて樹脂含有率＊が52％のプリプレ
グを作成した（Ｂ基材）。Ｂ基材を８枚、その両側にＡ
原紙を、更に片面に銅箔（厚さ35μｍ）を組合わせ、15
5℃，100kg／cm2で60分間の条件で熱圧成形し、加圧状
態のまま30分間冷却後、板厚1.6mmの片面銅張り積層板
を得た。Next, a commercially available alcoholic phenol was used as a base paper for a laminated board (B base paper) having a basis weight of 126 g / m 2 and a density of 0.5 g / cm 3 obtained by making a cellulose fiber having an α-cellulose content of 85%. After impregnating a resin (BLS-3122: Showa High Polymer Co., Ltd.), the resin was dried to prepare a prepreg having a resin content rate of 52% (B base material). Eight B base materials, A on both sides
Combine the base paper with copper foil (thickness 35 μm) on one side, and
Thermocompression molding was performed under the conditions of 5 ° C. and 100 kg / cm 2 for 60 minutes, and after cooling for 30 minutes in a pressurized state, a single-sided copper-clad laminate having a plate thickness of 1.6 mm was obtained.
実施例２ α−セルロース含量が89％のセルロース繊維を用いて、
坪量50g／m2，密度0.5g／cm3の積層板用原紙を得た（Ａ
原紙）。 Example 2 Using cellulose fibers having an α-cellulose content of 89%,
A base paper for a laminated board having a basis weight of 50 g / m 2 and a density of 0.5 g / cm 3 was obtained (A
Base paper).
更に実施例１と同様にしてプリプレグ、更に続いて積層
板を得た。Further, in the same manner as in Example 1, a prepreg and then a laminated plate were obtained.
比較例１ α−セルロース含量が85％のセルロース繊維を抄紙し、
坪量132g／m2，密度0.5g／cm3の積層板用原紙を得た。
実施例１と同様の方法でプリプレグを作成し、このプリ
プレグを８枚重ね、更に片面に銅箔をを組合わせ、155
℃，100kg／cm2で60分間の条件で熱圧成形し、加圧状態
のまま30分間冷却後、板厚1.6mmの片面銅張り積層板を
得た。Comparative Example 1 Paper made from cellulose fibers having an α-cellulose content of 85%,
A base paper for a laminate having a basis weight of 132 g / m 2 and a density of 0.5 g / cm 3 was obtained.
A prepreg was prepared in the same manner as in Example 1, eight prepregs were stacked, and a copper foil was further combined on one side,
Thermoforming was carried out under conditions of 100 ° C./cm 2 for 60 minutes, and after cooling for 30 minutes in a pressed state, a single-sided copper-clad laminate having a thickness of 1.6 mm was obtained.
比較例２ α−セルロース含量が92％のセルロース繊維を抄紙し、
坪量132g／m2，密度0.5g／cm3の積層板用原紙を得た。Comparative Example 2 Paper made from cellulose fibers having an α-cellulose content of 92%,
A base paper for a laminate having a basis weight of 132 g / m 2 and a density of 0.5 g / cm 3 was obtained.
更に比較例１と同様にしてプリプレグを、更に続いて積
層板を得た。Further, in the same manner as in Comparative Example 1, a prepreg was prepared, and subsequently a laminated plate was obtained.
実施例１，２及び比較例１，２により得られた積層板に
就いて、低温での打抜き加工性，熱膨張係数・熱収縮係
数，樹脂の移行性などを試験した結果を次表に示した。The following table shows the results of testing the laminates obtained in Examples 1 and 2 and Comparative Examples 1 and 2 for punching workability at low temperature, coefficient of thermal expansion / coefficient of thermal contraction, migration of resin, etc. It was
〔発明の効果〕 表に示したように、α−セルロース含量が88％以上含有
するセルロース繊維素を抄紙して成る坪量が20〜50g／m
2の積層板原紙(A)を表裏層に、α−セルロース含量が75
％以上〜88％未満であるセルロース繊維素を抄造して成
る積層板原紙に熱硬化性樹脂を所定量含浸付着させた基
材(B)を内層に組合わせた片面銅張り積層板の品質は、
比較例に比べて熱寸法安定性を改善し、低温での打抜き
加工性が向上した。 [Effects of the Invention] As shown in the table, the basis weight of the paper made of cellulose fibrous material containing α-cellulose of 88% or more has a basis weight of 20 to 50 g / m 2.
2 laminated board base paper (A) in the front and back layers, the α-cellulose content is 75
% Or more to less than 88% Cellulose fibrous material is laminated. The quality of a single-sided copper-clad laminated board in which a base material (B) impregnated with a predetermined amount of a thermosetting resin is attached to an inner layer ,
The thermal dimensional stability was improved and the punching workability at low temperatures was improved compared to the comparative example.
更に内層の原紙にのみ熱硬化性樹脂を含浸させるので、
樹脂の節減が出来た。また、内層に用いる積層板用原紙
の坪量を小さくすることが出来、樹脂含浸，乾燥工程で
の原紙処理量を減少し省コストを図ることが出来た。Furthermore, since the thermosetting resin is only impregnated into the inner layer base paper,
We were able to save resin. Further, the basis weight of the laminated base paper used for the inner layer can be reduced, and the processing amount of the base paper in the resin impregnation and drying steps can be reduced to achieve cost saving.
Claims (1)
るセルロース繊維を抄紙して成る坪量20〜50g／m2で熱
硬化性樹脂の含浸されていない積層板用原紙、と (B)、α−セルロース含量75％以上88％未満であるセル
ロース繊維を抄紙して成る積層板用原紙に熱硬化性樹脂
を所定量含浸させた基材、 とを(B)の基材を内層に、(A)の原紙を外層に組合わせ加
熱成形することを特徴とする積層板の製造方法。1. (A), a base paper for a laminate, which has a basis weight of 20 to 50 g / m 2 and is not impregnated with a thermosetting resin, which is made by making a cellulose fiber having an α-cellulose content of 88% or more; (B), a base material obtained by impregnating a predetermined amount of a thermosetting resin on a base paper for a laminated plate, which is made by making a cellulose fiber having an α-cellulose content of 75% or more and less than 88%, and a base material of (B). A method for producing a laminated board, which comprises combining the base paper (A) with an outer layer and heat-molding the inner layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1-206945 | 1989-08-11 | ||
| JP20694589 | 1989-08-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03162954A JPH03162954A (en) | 1991-07-12 |
| JPH0655480B2 true JPH0655480B2 (en) | 1994-07-27 |
Family
ID=16531637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21044190A Expired - Fee Related JPH0655480B2 (en) | 1989-08-11 | 1990-08-10 | Laminated board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0655480B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690967A (en) * | 2016-01-21 | 2016-06-22 | 深圳市柳鑫实业股份有限公司 | Regeneration method of waste base plate for drilling |
-
1990
- 1990-08-10 JP JP21044190A patent/JPH0655480B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105690967A (en) * | 2016-01-21 | 2016-06-22 | 深圳市柳鑫实业股份有限公司 | Regeneration method of waste base plate for drilling |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03162954A (en) | 1991-07-12 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |