JPH0655840B2 - Electrically conductive organic polymer materials - Google Patents
Electrically conductive organic polymer materialsInfo
- Publication number
- JPH0655840B2 JPH0655840B2 JP23788285A JP23788285A JPH0655840B2 JP H0655840 B2 JPH0655840 B2 JP H0655840B2 JP 23788285 A JP23788285 A JP 23788285A JP 23788285 A JP23788285 A JP 23788285A JP H0655840 B2 JPH0655840 B2 JP H0655840B2
- Authority
- JP
- Japan
- Prior art keywords
- organic polymer
- polymer material
- electrically conductive
- conductive organic
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002861 polymer material Substances 0.000 title claims description 38
- 229920000620 organic polymer Polymers 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims description 67
- 239000002019 doping agent Substances 0.000 claims description 53
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 claims description 50
- 239000000835 fiber Substances 0.000 claims description 39
- 239000005011 phenolic resin Substances 0.000 claims description 30
- 239000002131 composite material Substances 0.000 claims description 27
- 239000011592 zinc chloride Substances 0.000 claims description 25
- 235000005074 zinc chloride Nutrition 0.000 claims description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 19
- 229920006282 Phenolic fiber Polymers 0.000 claims description 19
- 229920003026 Acene Polymers 0.000 claims description 18
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 14
- 229920001568 phenolic resin Polymers 0.000 claims description 14
- 238000004438 BET method Methods 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 239000011734 sodium Substances 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 5
- 239000000460 chlorine Substances 0.000 claims description 5
- 239000004744 fabric Substances 0.000 claims description 5
- 229910052708 sodium Inorganic materials 0.000 claims description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 3
- 229910052740 iodine Inorganic materials 0.000 claims description 3
- 239000011630 iodine Substances 0.000 claims description 3
- 229910052744 lithium Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052792 caesium Inorganic materials 0.000 claims description 2
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- 229910052701 rubidium Inorganic materials 0.000 claims description 2
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 238000001723 curing Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- -1 phenol Chemical class 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 229910017008 AsF 6 Inorganic materials 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 150000001340 alkali metals Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 150000007522 mineralic acids Chemical class 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229920003987 resole Polymers 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910020366 ClO 4 Inorganic materials 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 150000001721 carbon Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000004453 electron probe microanalysis Methods 0.000 description 3
- 238000000921 elemental analysis Methods 0.000 description 3
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920001197 polyacetylene Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- 229910015015 LiAsF 6 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical class C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical class OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910013063 LiBF 4 Inorganic materials 0.000 description 1
- 229910013684 LiClO 4 Inorganic materials 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000007580 dry-mixing Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000005352 hydroxybiphenyls Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 239000011268 mixed slurry Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 150000007530 organic bases Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- WEGDVNIPLOLRJC-UHFFFAOYSA-M sodium;naphthalene-1-carboxylate Chemical compound [Na+].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 WEGDVNIPLOLRJC-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は電気伝導性有機高分子系材料に係り、更に詳し
くはフェノール樹脂及びフェノール繊維からなる複合成
形体の熱処理物である電気伝導性有機高分子系材料に関
する。Description: TECHNICAL FIELD The present invention relates to an electrically conductive organic polymer material, and more specifically, an electrically conductive organic material that is a heat-treated product of a composite molded article composed of a phenol resin and phenol fiber. It relates to a polymeric material.
(従来の技術) 高分子材料は成型性、軽量性および量産性に優れてい
る。そのため高分子材料のこれらの特性を生かして、電
気的に半導性を有する有機高分子材料がエレクトロニク
ス産業を始めとして多くの産業分野において希求されて
いる。初期の有機半導体はフィルム状あるいは板状体等
に成形することが困難あり、又n型あるいはp型の不純
物半導体としての性質を有していなかったため、用途的
にも限定されていた。近年、比較的成形性に優れた有機
半導体が得られるようになり、しかもこれらの半導体に
電子供与性ドーパントあるいは電子受容性ドーパントを
ドーピングすることによってn型あるいはp型の有機半
導体とすることが可能となった。そのような有機半導体
の代表例として、ポリアセチレンがある。この有機半導
体は約10-5(Ω・cm)-1の電気伝導度を有しているが
I2、AsF5等の電子受容性ドーパントあるいはLi、Na等の
電子供与性ドーパントをドーピングすることによって電
気伝導度を大巾に向上させることができ、102〜103
(Ω・cm)-1の伝導度が得られている。ところがポリア
セチレンは酸素によって酸化され易い欠点がある。この
ため空気中で取り扱うことが困難あり、工業材料として
は実用性に欠ける。(Prior Art) Polymer materials are excellent in moldability, light weight, and mass productivity. Therefore, by utilizing these characteristics of the polymer material, an organic polymer material having electrical semiconductivity is desired in many industrial fields including the electronics industry. The initial organic semiconductor was difficult to be formed into a film or a plate, and did not have the property as an n-type or p-type impurity semiconductor, so that its application was limited. In recent years, organic semiconductors having relatively excellent moldability have been obtained, and it is possible to obtain an n-type or p-type organic semiconductor by doping these semiconductors with an electron-donating dopant or an electron-accepting dopant. Became. Polyacetylene is a typical example of such an organic semiconductor. This organic semiconductor has an electric conductivity of about 10 -5 (Ω · cm) -1
I 2, AsF 5 and the like electron-accepting dopant or Li, and can be improved by a large margin the electrical conductivity by doping an electron donating dopant such as Na, 10 2 to 10 3
A conductivity of (Ω · cm) -1 is obtained. However, polyacetylene has a drawback that it is easily oxidized by oxygen. For this reason, it is difficult to handle in air, and it is not practical as an industrial material.
また、本願と同一出願人の出願にかかる特開昭58−1366
49号公報には、(A)炭素、水素および酸素から成る芳香
族系縮合ポリマーの熱処理物であって、水素原子/炭素
原子の原子比が0.60〜0.15のポリアセン系骨格構造
を含有する不溶不融性基体と、(B)電子供与性ドーピン
グ剤又は電子受容性ドーピング剤とから成り、(C)電気
伝導性が未ドープの該基体よりも大である電気伝導性有
機高分子系材料が開示されている。上記不溶不融性基体
は、耐熱性耐酸化性に優れており、しかも上記のとおり
電子供与性ドーピング剤あるいは電子受容性ドーピング
剤によってドーピングが可能であり、p型あるいはn型
の性質を示す有機半導体を与える。しかしながら、上記
公開公報にはBET法による比表面積の記述はなかった。Further, Japanese Patent Application Laid-Open No. 58-1366 filed by the same applicant as the present application
No. 49 discloses a heat-treated product of (A) an aromatic condensation polymer composed of carbon, hydrogen and oxygen, which has a polyacene skeleton structure having an atomic ratio of hydrogen atoms / carbon atoms of 0.60 to 0.15. An electrically conductive organic polymer comprising an insoluble and infusible substrate contained therein, and (B) an electron donating doping agent or an electron accepting doping agent, and (C) an electrical conductivity higher than that of the undoped substrate. A system material is disclosed. The insoluble and infusible substrate is excellent in heat resistance and oxidation resistance, can be doped with an electron donating doping agent or an electron accepting doping agent as described above, and exhibits p-type or n-type properties. Give semiconductors. However, the above publication does not describe the specific surface area by the BET method.
また、本願と同一出願人の出願にかかる先願の特願昭59
−8152号は未だ未公開であるが、同先願において、 (A) 炭素、水素および酸素からなる芳香族系縮合ポリ
マーの熱処理物であって、水素原子/炭素原子の原子比
が0.60〜0.15であり、かつBET法による比表面積
値が600m2/g以上であるポリアセン系骨格構造を含
有する不溶不融性基体と、 (B) 電子供与性ドーピング剤又は電子受容性ドーピン
グ剤とからなり、 (C) 電気伝導度が未ドープの該基体よりも大であるこ
とを特徴とする電気伝導性有機高分子系材料が提案され
ている。In addition, Japanese Patent Application No. Sho 59, which is an earlier application filed by the same applicant as this application
No. -8152 has not been published yet, but in the prior application, it is a heat-treated product of (A) an aromatic condensation polymer composed of carbon, hydrogen and oxygen, and the atomic ratio of hydrogen atom / carbon atom is 0.60. To 0.15 and a specific surface area value by the BET method of 600 m 2 / g or more containing an insoluble infusible substrate, and (B) an electron-donating or electron-accepting doping agent And (C) an electrically conductive organic polymer material characterized by having an electric conductivity higher than that of the undoped substrate.
この有機高分子系材料は比表面積比が600m2/g以上
であるため、比較的イオン半径の大きなドーパント例え
ばClO4 -、BF4 -等でもスムーズにドーピングしうる。し
かしながら、この先願においてもポリアセン系骨格構造
を有する不溶不融性基体からなる電気伝導性高分子系材
料は機械的強度に問題があり、その点で実用化は未だ不
充分であった。Since this organic polymer material has a specific surface area ratio of 600 m 2 / g or more, it can be smoothly doped with a dopant having a relatively large ionic radius, such as ClO 4 − or BF 4 − . However, also in this prior application, the electrically conductive polymer material composed of an insoluble and infusible substrate having a polyacene skeleton structure has a problem in mechanical strength, and in that respect, its practical application is still insufficient.
(発明が解決しようとする問題点) 本発明の目的は機械的強度に優れた電気伝導性有機高分
子系材料を提供することにある。(Problems to be Solved by the Invention) An object of the present invention is to provide an electrically conductive organic polymer material excellent in mechanical strength.
本発明の他の目的は耐熱性、耐酸化性に優れた電気伝導
性有機高分子系材料を提供することにある。Another object of the present invention is to provide an electrically conductive organic polymer material having excellent heat resistance and oxidation resistance.
本発明のさらに他の目的は電子供与性ドーパントおよび
/または電子受容性ドーパントをドーピングした電気伝
導性有機高分子系材料を提供することにある。Still another object of the present invention is to provide an electrically conductive organic polymer material doped with an electron donating dopant and / or an electron accepting dopant.
本発明のさらに他の目的は比較的イオン半径の大きな電
子供与性ドーパントおよび/または電子受容性ドーパン
トでさえもスムーズにドーピングし得る電気伝導性有機
高分子系材料を提供することにある。Still another object of the present invention is to provide an electrically conductive organic polymer material capable of smoothly doping an electron donating dopant and / or an electron accepting dopant having a relatively large ionic radius.
本発明のさらに他の目的はフィルム状、板状等の成形体
である電気伝導性有機高分子系材料を提供することにあ
る。Still another object of the present invention is to provide an electrically conductive organic polymer material which is a film-shaped, plate-shaped or the like formed body.
本発明のさらに他の目的および利点は以下の説明から明
らかとなろう。Further objects and advantages of the present invention will be apparent from the following description.
(問題点を解決するための手段)) 上述の目的は、フェノール樹脂、フェノール繊維もしく
は繊維構造物並びに塩化亜鉛からなる複合成形体の熱処
理物であって、水素原子/炭素原子の原子比が0.05〜
0.6であり、且つBET法による比表面積値が600m2
/g以上であるポリアセン系骨格構造を有する不溶不融
性基体からなる電気伝導性有機高分子系材料によって達
成される。(Means for Solving Problems) The above-mentioned object is a heat-treated product of a composite molded article composed of a phenol resin, a phenol fiber or a fiber structure, and zinc chloride, wherein the atomic ratio of hydrogen atoms / carbon atoms is 0. 0.05
0.6 and specific surface area value by BET method is 600 m 2
/ G or more is achieved by the electrically conductive organic polymer material composed of an insoluble and infusible substrate having a polyacene skeleton structure.
本発明における複合成形体とはフェノール樹脂、フェノ
ール繊維もしくは繊維構造物並びに塩化亜鉛からなるフ
ィルム状、板状等任意の形を有した成形性である。フェ
ノール樹脂とはフェノール性水酸基を有する芳香族炭化
水素化合物とアルデヒドとの未硬化の縮合物が好適であ
り、かかる芳香族化合物の具体例として例えばフェノー
ル、クレゾール、キシレノール等のフェノール類が挙げ
られ、これらの他例えばメチレンビスフェノール類、ヒ
ドロキシビフェニル類やヒドロキシナフタレン類も適用
可能である。そしてこれらの化合物中、実用的にはフェ
ノール類、殊にフェノールが好適である。また、本発明
に使用するアルデヒドとしてはアセトアルデヒド、その
他のアルデヒド使用可能であるが就中ホルムアルデヒド
が好適である。フェノール繊維とは例えばノボラック型
フェノール樹脂を溶融紡糸したものを酸又は塩基性触媒
下でホルムアルデヒド等の硬化剤によって架橋した繊維
があり、またフェノール繊維構造物とかかる繊維からな
る構造物、例えば編織物、不織布等が挙げられる。The composite molded article in the present invention is a moldability having an arbitrary shape such as a film shape or a plate shape made of a phenol resin, a phenol fiber or a fiber structure, and zinc chloride. Phenol resin is preferably an uncured condensate of an aromatic hydrocarbon compound having a phenolic hydroxyl group and an aldehyde, and specific examples of such an aromatic compound include phenols such as phenol, cresol, and xylenol. Other than these, for example, methylenebisphenols, hydroxybiphenyls and hydroxynaphthalenes can be applied. Of these compounds, phenols, particularly phenol, are suitable for practical use. As the aldehyde used in the present invention, acetaldehyde and other aldehydes can be used, but formaldehyde is particularly preferable. Phenol fibers include, for example, fibers obtained by melt-spinning a novolac type phenolic resin with a curing agent such as formaldehyde under an acid or basic catalyst, and a phenol fiber structure and a structure composed of such fibers, for example, a knitted fabric. , Nonwoven fabrics, and the like.
そしてこれらの素材から形成される複合成形体は例えば
未硬化フェノール樹脂、フェノール繊維もしくは繊維構
造物並びに塩化亜鉛を適当な条件で混合成形し、硬化す
ることによって得られる。混合方法としては上記した3
成分が均一に混合出来るならば乾式混合、湿式混合等ど
の様な方法でもよいが、充分に均一に混合するには適当
な溶媒、例えば水、メタノール、アセトン等を加えるこ
とによって未硬化フェノール樹脂及び塩化亜鉛を溶液状
にした後、フェノール繊維もしくは繊維構造物を添加し
混合するのが望ましい。又フェノール繊維もしくは繊維
構造物がクロス状、あるいはフェルト状の場合にはこれ
らに前記した未硬化フェノール樹脂及び塩化亜鉛の溶液
を含浸させて、プリプレグを作ればよい。成形方法とし
ては一般に樹脂成形品を作る場合と同様な方法で可能で
あるが、例えばフィルム状を得たい場合には上記した3
成分混合スラリーをアプリケーターによって適当な厚み
に成膜すればよい、又板状体を得る場合では一般によく
知られているように、型枠を作って加圧成形すればよ
い。又上記したプリプレグを金属等の平板の間に入れ加
圧成形すれば適当な厚みの板が得られる。硬化方法とし
ては未硬化フェノール樹脂としてレゾールを用いる場合
では成形時あるいは成形後に50〜200℃の温度で熱
硬化するのが簡便である。特に型枠等を使用してプレス
成形する方法では成形と同時に加熱して硬化することが
出来る。又未硬化フェノール樹脂としてノボラックを使
用する場合には適当な硬化剤、例えばヘキサメチレンテ
トラミンの如きそれ自体ホルムアルデヒドの発生剤であ
ると同時に有機塩基発生剤である硬化剤をあらかじめ混
合しておき成形後、加熱硬化すればよい。A composite molded body formed from these materials can be obtained by, for example, mixing and molding an uncured phenol resin, a phenol fiber or a fiber structure, and zinc chloride under appropriate conditions and curing. As the mixing method, the above 3
Any method such as dry mixing and wet mixing may be used as long as the components can be uniformly mixed, but for sufficiently uniform mixing, an uncured phenol resin and an uncured phenol resin can be prepared by adding an appropriate solvent such as water, methanol, or acetone. It is desirable to add the phenolic fiber or fiber structure and mix after making the zinc chloride into solution. When the phenolic fiber or the fiber structure is in the form of cloth or felt, it may be impregnated with the solution of the uncured phenolic resin and zinc chloride to form a prepreg. As a molding method, generally, the same method as in the case of producing a resin molded product can be used.
A film of the component-mixed slurry may be formed into an appropriate thickness by an applicator, and when a plate-like body is obtained, a mold may be formed and pressure-molded, as is well known. If the prepreg described above is put between flat plates of metal or the like and pressure-molded, a plate having an appropriate thickness can be obtained. As a curing method, when a resol is used as an uncured phenol resin, it is convenient to heat cure at a temperature of 50 to 200 ° C. during or after molding. Particularly, in the method of press molding using a mold or the like, it is possible to heat and cure at the same time as molding. When novolac is used as the uncured phenolic resin, a suitable curing agent, for example, a curing agent which is itself a formaldehyde generator such as hexamethylenetetramine and at the same time an organic base generator is mixed in advance and molded. It may be cured by heating.
この様にして得られた複合成形体はフェノール樹脂、フ
ェノール繊維もしくは繊維構造物並びに塩化亜鉛から成
っており、フィルム状、板状等任意の形状を有した機械
的強度に優れた成形体であり適当な大きさに切断した
り、円形、矩形等の形状に加工することが可能である。
この複合成形体に後に述べる方法によってポリアセン系
骨格構造を含有する不溶不融性基体とするのであるが、
該基体の機械的強度は複合成形体中のフェノール繊維、
繊維構造物によって発揮されるものである。即ちフェノ
ール繊維もしくは繊維構造物を使用することにより、不
溶不融性基体からなる電気伝導性有機高分子系材料の強
度が大巾に向上するのである。複合成形体におけるフェ
ノール繊維もしくは繊維構造物の量は極少量でも効果は
認められるが好ましくはフェノール繊維(繊維構造物)
/フェノール樹脂の重量比が0.05以上である。0.05
以上では特に得られるポリアセン系骨格構造を含有する
不溶不融性基体の強度が向上し、好ましい。また塩化亜
鉛は該複合成形体を後に示す方法によって不溶不融性基
体とする時、基体の比表面積値(BET法)を高くする
効果を有するものであるが、その量は少量でも該効果を
有するが好ましくは塩化亜鉛/〔フェノール樹脂+フェ
ノール繊維(繊維構造物)〕の重量比が0.5〜7であ
る。0.5以上では塩化亜鉛が充分な効果を発揮し、不溶
不融性基体の比表面積値を大巾に高くすることが出来、
好適である。The thus obtained composite molded article is composed of phenolic resin, phenolic fiber or fiber structure and zinc chloride, and is a molded article having an arbitrary shape such as a film shape or a plate shape and excellent in mechanical strength. It is possible to cut it into an appropriate size and process it into a shape such as a circle or a rectangle.
This composite molded body is made into an insoluble and infusible substrate containing a polyacene-based skeleton structure by the method described later.
The mechanical strength of the substrate is the phenol fiber in the composite molded body,
It is demonstrated by the fiber structure. That is, the use of the phenol fiber or the fiber structure significantly improves the strength of the electrically conductive organic polymer material composed of the insoluble and infusible substrate. The effect is recognized even if the amount of phenolic fiber or fiber structure in the composite molded product is extremely small, but preferably phenolic fiber (fiber structure)
The weight ratio of / phenol resin is 0.05 or more. 0.05
Above all, the strength of the insoluble infusible substrate containing the polyacene-based skeleton structure obtained is particularly improved, which is preferable. Further, zinc chloride has the effect of increasing the specific surface area value (BET method) of the substrate when the composite molded body is made into an insoluble and infusible substrate by the method described later, but even if the amount is small, the effect can be obtained. However, the weight ratio of zinc chloride / [phenolic resin + phenolic fiber (fiber structure)] is preferably 0.5 to 7. When it is 0.5 or more, zinc chloride exerts a sufficient effect, and the specific surface area of the insoluble and infusible substrate can be greatly increased,
It is suitable.
反面上記した塩化亜鉛の量が7を越える場合にはフェノ
ール樹脂の絶対量が少なくなり、フィルムあるいは板状
等の成形が難しくなり、又未硬化フェノール樹脂の硬化
反応が起こり難くなり、問題点が生じる。On the other hand, when the above-mentioned amount of zinc chloride exceeds 7, the absolute amount of the phenolic resin becomes small, making it difficult to form a film or a plate, and the curing reaction of the uncured phenolic resin becomes difficult to occur. Occurs.
次にこの複合成形体を非酸化性雰囲気中で熱処理して、
水素原子/炭素原子の原子比が0.05〜0.6、好ましく
は0.15〜0.60のポリアセン系骨格構造を有した不溶
不融性基体を得ることが出来る。熱処理温度は通常40
0〜800℃であり、熱処理の好ましい昇温条件は複合
成形体の組成比、硬化条件あるいはその形状によって多
少異なるが、一般には室温から300℃程度の温度まで
は比較的大きな昇温速度とすることが可能であり、例え
ば100℃/時間の速度とすることも可能である。30
0℃以上の温度となると、フェノール樹脂及びフェノー
ル繊維(繊維構造物)の熱分解が開始し水蒸気、水素、
メタン、一酸化炭素の如きガスが発生し始めるため、充
分に遅い速度で昇温せしめるのが有利である。次にこの
ようにして得られたポリアセン系骨格構造を有した基体
を50〜100℃の温水にて洗浄し、該基体中に残存し
ている塩化亜鉛を除去し乾燥する。この様にしてポリア
セン系骨格構造を含有する不溶不融性基体からなる電気
伝導性有機高分子系材料を得るのであるが、この基体の
水素原子/炭素原子の原子比が0.6を越える場合には未
がポリアセン系骨格構造が発達していないため、電子の
共役系が局存化していると考えられ、ドーパントをドー
ピングしても電気伝導度が増大せずn型あるいはp型の
半導体とならない。又H/Cの原子比が0.05未満の場
合にはポリアセン系骨格構造は充分に発達し、電子の共
役系は充分に非局在化して、ドーパントはドーピングさ
れるがドーピング前の基体自体の電気伝導度がかなり大
きいため、ドーピングの電気伝導度に対する寄与が小さ
く、電気伝導度が未ドープの該基体よりもそれ程増大し
ない。Next, this composite molded body is heat treated in a non-oxidizing atmosphere,
It is possible to obtain an insoluble and infusible substrate having a polyacene-based skeleton structure with an atomic ratio of hydrogen atoms / carbon atoms of 0.05 to 0.6, preferably 0.15 to 0.60. Heat treatment temperature is usually 40
It is 0 to 800 ° C., and the preferable temperature rising condition of the heat treatment is somewhat different depending on the composition ratio of the composite molded body, the curing conditions or the shape thereof, but generally a relatively high temperature rising rate from room temperature to about 300 ° C. It is possible, for example, to use a rate of 100 ° C./hour. Thirty
When the temperature reaches 0 ° C or higher, thermal decomposition of the phenol resin and the phenol fiber (fiber structure) starts, and steam, hydrogen,
Since gas such as methane and carbon monoxide begins to be generated, it is advantageous to raise the temperature at a sufficiently slow rate. Next, the substrate having a polyacene skeleton structure thus obtained is washed with warm water at 50 to 100 ° C. to remove zinc chloride remaining in the substrate and dried. In this way, an electrically conductive organic polymer material comprising an insoluble and infusible substrate containing a polyacene skeleton structure is obtained. When the atomic ratio of hydrogen atom / carbon atom of this substrate exceeds 0.6, Since the polyacene-based skeleton structure has not yet been developed, it is considered that the conjugated system of electrons is localized, and even if the dopant is doped, the electrical conductivity does not increase and the semiconductor does not become an n-type or p-type semiconductor. When the H / C atomic ratio is less than 0.05, the polyacene skeleton structure is fully developed, the conjugated system of electrons is sufficiently delocalized, and the dopant is doped but the substrate itself before doping is Since the electric conductivity of the is very high, the contribution of the doping to the electric conductivity is small, and the electric conductivity is not so much increased as compared with the undoped substrate.
又、このポリアセン系骨格構造を含有する不溶不融性基
体のBET法による比表面積値は、塩化亜鉛を使用して
製造しているため極めて大きな値となるが600m2/g
以上であると特に好ましい。Further, the specific surface area value of the insoluble and infusible substrate containing the polyacene skeleton structure by the BET method is extremely large because it is manufactured using zinc chloride, but it is 600 m 2 / g.
It is especially preferable that it is above.
本発明のポリアセン系骨格構造を有する不溶不融性基体
はBET法による比表面積値が600m2/g以上と極め
て大きいためドーピング速度が大きく、厚みのある基体
に対しても短時間でドーピングが可能であり、又イオン
半径の大きいドーパント、例えばClO4 -、BF4 -等のドー
パントをスムーズに基体中ドーピングすることが可能で
ある。例えばClO4 -イオンを基体にLi/LiClO4 1モル/
プロピレンカ−ボネート/基体の構成で電解ドーピン
グする場合、比表面積が600m2/g未満では電極間電
圧4Vの電位差でドーピングすることは難しいが、本発
明の600m2/g以上の基体ではこの電位差で充分にCl
O4 -イオンを基体中に導入することができる。The insoluble and infusible substrate having a polyacene skeleton structure of the present invention has a very large specific surface area value of 600 m 2 / g or more as measured by the BET method, so that the doping rate is high and it is possible to dope a thick substrate in a short time. In addition, it is possible to smoothly dope the substrate with a dopant having a large ionic radius, such as ClO 4 − and BF 4 − . For example ClO 4 - ion in the substrate Li / LiClO 4 1 mol /
When electrolytically doping with a propylene carbonate / substrate structure, it is difficult to dope with a potential difference of 4 V between electrodes when the specific surface area is less than 600 m 2 / g, but with a substrate of 600 m 2 / g or more according to the present invention, this potential difference. Is enough Cl
O 4 − ions can be introduced into the substrate.
又、不溶不融性基体からなる電気伝導性有機高分子系材
料はフィルム状、板状あるいは円筒状等々、任意の形状
の成形体に加工出来るが、フェノール繊維もしくは繊維
構造物を使用して製造しているため、機械的強度に優れ
ており、実用上充分な強度を有している。特にフェノー
ル繊維もしくは繊維構造物として編織物あるいはフェル
ト状の繊維集合体を用いて製造したときには基体からな
る成形体の厚み、大きさ、密度等を任意に設定出来るの
みならず、その強度も特に優れたものが得られる。In addition, the electrically conductive organic polymer material consisting of insoluble and infusible substrate can be processed into a molded body of any shape such as film, plate or cylinder, but it is manufactured using phenol fiber or fiber structure. Therefore, it has excellent mechanical strength, and has practically sufficient strength. In particular, when the knitted fabric or the felt-like fiber aggregate is used as the phenolic fiber or the fiber structure, the thickness, size, density, etc. of the molded body composed of the substrate can be arbitrarily set, and its strength is also particularly excellent. You can get what you want.
ところで本発明のH/Cの原子比が0.60〜0.05のポ
リアセン系骨格構造を有した不溶不融性基体の電気伝導
度はH/Cの原子比によって大きく異なっているが、例
えばH/C=0.6の場合では、約10-11Ω-1cm-1以下で
あり、又H/C=0.05では約100Ω-1cm-1の半導体
である。該基材に後に示すような電子供与性ドーパント
あるいは電子受容性ドーパントをドーピングすると大巾
に電気伝導度が増大し、n型あるいはp型の半導体とな
るものである。By the way, the electric conductivity of the insoluble and infusible substrate having a polyacene skeleton structure of H / C atomic ratio of 0.60 to 0.05 of the present invention is largely different depending on the H / C atomic ratio. When H / C = 0.6, it is about 10 -11 Ω -1 cm -1 or less, and when H / C = 0.05, it is a semiconductor of about 10 0 Ω -1 cm -1 . When the substrate is doped with an electron-donating dopant or an electron-accepting dopant as described below, the electric conductivity is greatly increased, and the substrate becomes an n-type or p-type semiconductor.
又、該ポリアセン系骨格構造を有する不溶不融性基体は
BET法による比表面積値が600m2/g以上と非常に
大きな値を示すため、酸素等のガスが侵入し、劣化し易
いと考えられるが、現実には空気中に長時間放置して
も、物性等に変化はなく、例えば空気中に1000時間
放置しても電気伝導度に変化がなく、酸化安定性に優れ
ているものである。Further, since the insoluble and infusible substrate having the polyacene skeleton structure shows a very large specific surface area value of 600 m 2 / g or more by the BET method, it is considered that gas such as oxygen penetrates and is easily deteriorated. However, in reality, even if left in the air for a long time, the physical properties and the like do not change. For example, even if left in the air for 1000 hours, the electrical conductivity does not change, and the oxidation stability is excellent. .
かかる本発明の不溶不融性基体にドーピングし得る電子
供与性ドーパント、あるいは電子受容性ドーパントとし
ては一般に知られているドーパントのいずれもが可能で
ある。Either an electron donating dopant or an electron accepting dopant which can be doped into the insoluble and infusible substrate of the present invention can be any of the dopants generally known.
電子供与性ドーパントとしては電子を難し易い物質が用
いられる。例えばリチウム、ナトリウム、カリウム、ル
ビジウムあるいはセシウムの如き周期律表の第1A族金
属が好ましく用いられる。またテトラアルキルアンモニ
ウムカチオン例えば(C2H5)4N+(C4H9)4N+等も好まし
く用いられる。As the electron-donating dopant, a substance that easily causes electrons is used. For example, a Group 1A metal of the periodic table such as lithium, sodium, potassium, rubidium or cesium is preferably used. Further, tetraalkylammonium cations such as (C 2 H 5 ) 4 N + (C 4 H 9 ) 4 N + are also preferably used.
また電子受容性ドーパントとしては電子を受け取り易い
物質が用いられる。例えば弗素、塩素、臭素、沃素の如
きハロゲン、AsF5、PF5、BF3、BCl3、BBr3の如きハロゲ
ン化合物、SO3あるいはN2O5の如き非金属元素の酸化物
あるいはH2SO4、HNO3又はHClO4の如き無機酸に由来する
陰イオン等が好ましく用いられる。A substance that easily accepts electrons is used as the electron-accepting dopant. For example, halogens such as fluorine, chlorine, bromine and iodine, halogen compounds such as AsF 5 , PF 5 , BF 3 , BCl 3 and BBr 3 , oxides of non-metal elements such as SO 3 or N 2 O 5 or H 2 SO 5. Anions derived from an inorganic acid such as 4 , HNO 3 or HClO 4 are preferably used.
かかるドーパントのドーピング方法としてはポリアセチ
レンあるいポリフェニレンについて従来用いられている
ドーピング法と本質的に同じ方法を使用することができ
る。As a doping method of such a dopant, essentially the same doping method as that conventionally used for polyacetylene or polyphenylene can be used.
ドーパントがアルカリ金属の場合には、溶融したアルカ
リ金属あるいはアルカリ金属の蒸気と不溶不融性基体と
を接触せしめてドーピングすることができ、また例えば
テトラヒドロフラン中で生成せしめたアルカリ金属ナフ
タレン錯体と不溶不融性基体とを接触せしめてドーピン
グすることもできる。When the dopant is an alkali metal, it can be doped by bringing molten alkali metal or vapor of the alkali metal into contact with the insoluble and infusible substrate, and is insoluble and insoluble with the alkali metal naphthalene complex produced in tetrahydrofuran, for example. It is also possible to dope by contacting with a fusible substrate.
ドーパントがハロゲン、ハロゲン化合物あるいは非金属
元素の酸化物である場合にはこれらのガスを不溶不融性
基体と接触せしめることにより容易にドーピングを行う
ことができる。When the dopant is halogen, a halogen compound or an oxide of a non-metal element, the doping can be easily performed by bringing these gases into contact with the insoluble and infusible substrate.
ドーパントが無機酸に由来する陰イオンである場合に
は、無機酸を不溶不融性基体に直接塗布あるいは含浸せ
しめるかあるいはこれらの無機酸を含む電解液中で不溶
不融性基体を陽極として電解してドーピングを行うこと
もできる。When the dopant is an anion derived from an inorganic acid, the insoluble infusible substrate is directly coated or impregnated with the inorganic acid, or electrolysis is performed using the insoluble infusible substrate as an anode in an electrolytic solution containing these inorganic acids. Then, the doping can be performed.
ドーパントは一般に芳香族系縮合ポリマーの繰返し単位
に対して10-5モル以上の割合で得られる本発明の有機
高分子材料に存在するように用いられる。The dopant is generally used so as to be present in the organic polymer material of the present invention obtained in a ratio of 10 −5 mol or more based on the repeating unit of the aromatic condensation polymer.
かくして得られるH/Cの原子比が0.60〜0.05のポ
リアセン骨格構造を有した不溶不融性基体にドーパント
をドーピングした本発明の有機高分子系材料はドーピン
グ前の不溶不融性基体の電気伝導度よりも高い電気伝導
度、好ましくはドーピング前の不溶不融性基体よりも1
0倍以上又はそれ以上適当な方法によれば103〜108
倍、又はそれ以上の高い電気伝導度を示す。The organic polymer material of the present invention obtained by doping the insoluble infusible substrate having a polyacene skeleton structure having an H / C atomic ratio of 0.60 to 0.05 thus obtained with the dopant is insoluble infusible before doping. Electrical conductivity higher than that of the substrate, preferably 1 than the insoluble infusible substrate before doping.
0 times or more or more 10 3 to 10 8 by a suitable method
It shows high electrical conductivity, which is double or more.
電子供与性ドーパントをドーピングされた本発明の電気
伝導性有機高分子系材料はn型(電子過剰型)半導体又
は導体の電気伝導性を有する。また、電子受容性ドーパ
ントをドーピングされた本発明の電気伝導性有機高分子
系材料はp型(正孔過剰型)半導体又は導体の電気伝導
度を有する。The electrically conductive organic polymer material of the present invention doped with an electron donating dopant has the electrical conductivity of an n-type (electron excess type) semiconductor or conductor. The electrically conductive organic polymer material of the present invention doped with an electron-accepting dopant has the electrical conductivity of a p-type (hole excess type) semiconductor or conductor.
一方、本発明によればドーパントとして電子供与性ドー
パントと電子受容性ドーパントとを一緒に用いることも
できる。これらのドーパントが本発明の電気伝導性有機
高分子系材料にほぼ均一に混在する場合にはいずれか一
方の多く存在する方のドーパントによってp型又はn型
となる。例えば、電子供与性ドーパントが多く存在する
場合にはn型となり、電子受容性ドーパントが多く存在
する場合にはp型となる。ドーパントが混在するこのよ
うな電気伝導性有機高分子系材料は、ドーパントの混合
物と不溶不融性基体とを接触せしめるか、あるいは一方
のドーパントに接触せしめ次に他方のドーパントに接触
せしめることによって製造できる。On the other hand, according to the present invention, an electron donating dopant and an electron accepting dopant can be used together as a dopant. When these dopants are almost uniformly mixed in the electrically conductive organic polymer material of the present invention, either one of them is p-type or n-type depending on which one is most abundant. For example, when there are many electron-donating dopants, it becomes n-type, and when there are many electron-accepting dopants, it becomes p-type. Such an electrically conductive organic polymer material containing a mixture of dopants is produced by contacting a mixture of dopants with an insoluble infusible substrate, or by contacting one dopant and then another dopant. it can.
また本発明には所謂p−n接合面を有する電気伝導性有
機高分子系材料も含まれる。かかる材料は、不溶不融性
基体成形体の一方から電子供与性ドーパントをドーピン
グせしめ、他方から電子受容性ドーパントをドーピング
せしめるか、あるいは不溶不融性基体成形体の全面にい
ずれか一方のドーパントをドーピングせしめ、次いで他
方のドーパントをその面の一部のみにドーピングせしめ
ることによって製造できる。The present invention also includes an electrically conductive organic polymer material having a so-called pn junction surface. Such a material can be doped with an electron-donating dopant from one of the insoluble and infusible substrate compacts and doped with an electron accepting dopant from the other, or with one of the dopants on the entire surface of the insoluble and infusible substrate compact. It can be made by doping and then doping the other dopant only in part of its face.
(発明の効果) 本発明の電気伝導性有機高分子系材料は機械的強度に優
れているため、薄いフィルムから厚い板状体あるいは円
筒状等任意の形状の成形体とする事が可能であり、これ
らは例えばダイオード太陽電池あるいはバッテリー用の
電極等として種々の分野において用いられる。(Effect of the invention) Since the electrically conductive organic polymer material of the present invention is excellent in mechanical strength, it is possible to form a thin film into a thick plate-shaped body or a molded body of any shape such as a cylindrical shape. , These are used in various fields, for example, as electrodes for diode solar cells or batteries.
以下実施例を挙げて本発明をさらに詳細に説明する。Hereinafter, the present invention will be described in more detail with reference to examples.
実施例1 レゾール型フェノール樹脂(約65%濃度の水溶液)/
水/塩化亜鉛を重量比で10/3/12の割合で混合し
た溶液をフェノール繊維の平織クロス(日本カイノール
社製)に含浸させ、得られた該溶液含浸クロスを、10
0℃に加熱された積層板用加圧成形機を用いて、約10
分間、加圧下、成形硬化し、厚み約500μの板状の複
合成形体を得た。この複合成形体においてフェノール繊
維/フェノール樹脂の重量比は0.15であった。又塩化
亜鉛/(フェノール樹脂+フェノール繊維)の重量比は
1.6であった。又上記したレゾール、水及び塩化亜鉛の
混合溶液をアプリケーターにて成膜した後、100℃の
温度で約20分間、硬化反応させて、厚み500μの板
状成形体を得た。この板状成形体においてフェノール繊
維/フェノール樹脂の重量比は0であり、又塩化亜鉛/
(フェノール樹脂+フェノール繊維)の重量比は1.8で
あった。次にこれらの複合成形体及び成形体をシリコニ
ット電気炉に入れ、窒素雰囲気中で550℃まで約40
℃/時間の昇温速度にて熱処理した。次にこれらの熱処
理物を100℃の温水にて約5時間洗浄し、残存してい
る塩化亜鉛を除去した。洗浄後、60℃の温度で3時間
減圧乾燥して、不溶不融性基体の板状体を得た。これら
不溶不融性基体の板状体のうち、上記した本発明の複合
成形体より得られた板状基体は機械的強度に優れてお
り、取扱いが容易であったが、フェノール繊維を使用せ
ずに作った成形体より得られた板状基体は強度が弱く、
取り扱いに注意を要した。曲げ強度の測定値を第1表に
示す。Example 1 Resol type phenol resin (about 65% concentration aqueous solution) /
A plain weave cloth of phenolic fiber (manufactured by Nippon Kynol Co., Ltd.) was impregnated with a solution in which water / zinc chloride was mixed at a weight ratio of 10/3/12.
Using a pressure molding machine for laminated plates heated to 0 ° C., about 10
The mixture was molded and cured under pressure for a minute to obtain a plate-shaped composite molded body having a thickness of about 500μ. In this composite molded body, the weight ratio of phenolic fiber / phenolic resin was 0.15. The weight ratio of zinc chloride / (phenolic resin + phenolic fiber) is
It was 1.6. Further, after forming a film of the above-mentioned mixed solution of resole, water and zinc chloride with an applicator, a curing reaction was carried out at a temperature of 100 ° C. for about 20 minutes to obtain a plate-shaped molded product having a thickness of 500 μm. In this plate-shaped molded body, the weight ratio of phenol fiber / phenol resin is 0, and zinc chloride /
The weight ratio of (phenolic resin + phenolic fiber) was 1.8. Next, the composite molded body and the molded body are placed in a silicon knit electric furnace and heated to about 550 ° C. in a nitrogen atmosphere for about 40 minutes.
Heat treatment was performed at a temperature rising rate of ° C / hour. Next, these heat-treated products were washed with warm water at 100 ° C. for about 5 hours to remove residual zinc chloride. After washing, it was dried under reduced pressure at a temperature of 60 ° C. for 3 hours to obtain a plate-like body of an insoluble and infusible substrate. Among these insoluble and infusible substrate plates, the plate substrate obtained from the above-mentioned composite molded article of the present invention had excellent mechanical strength and was easy to handle, but using phenol fiber The plate-shaped substrate obtained from the molded product made without
Careful handling was required. Table 1 shows the measured values of bending strength.
次に複合成形体より得られた本発明の不溶不融性基体を
ケイ光X線分析にかけたところ、Znは0.01重量%(対
基体)以下であり、又Clは0.5重量%以下であり、塩化
亜鉛は基体中にほとんど残存していない事が判明した。
又該基体をX線回折したところ2θで20〜22゜の所
にメインピークが存在し又41〜46゜の範囲に小さな
ピークが認められ基体がポリアセン系骨格構造を有して
いることが確認された。Next, when the insoluble and infusible substrate of the present invention obtained from the composite molded body was subjected to a fluorescent X-ray analysis, Zn was 0.01% by weight (relative to the substrate) or less, and Cl was 0.5% by weight or less. It was found that zinc chloride hardly remained in the substrate.
When X-ray diffraction of the substrate was conducted, a main peak was present at 20 to 22 ° at 2θ and a small peak was observed in the range of 41 to 46 °, confirming that the substrate had a polyacene skeleton structure. Was done.
次に本発明の複合成形体より得られた不溶不融性基体及
びフェノール繊維を使わずに作った不溶不融性基体につ
いて電気伝導度元素分析、及びBET法による比表面積
値を測定した。これらの結果をまとめて第1表に示す。Next, the insoluble infusible substrate obtained from the composite molded article of the present invention and the insoluble infusible substrate prepared without using the phenol fiber were subjected to electrical conductivity elemental analysis and specific surface area value by BET method. The results are summarized in Table 1.
次に充分に脱水したプロピレンカーボネートにLiAsF6を
溶解させて約1.0モル/の溶液とし、リチウム金属を
負極とし不溶不融性基体の板状体を正極とし上記した溶
液を電解液として、両極間に4Vの電圧を付与し、AsF6
-イオンを不溶不融性基体にドーピングした。Next, LiAsF 6 is dissolved in sufficiently dehydrated propylene carbonate to obtain a solution of about 1.0 mol / liter, lithium metal is used as a negative electrode, insoluble and infusible substrate plate is used as a positive electrode, and the above solution is used as an electrolytic solution. Voltage of 4V is applied to AsF 6
- doped ions into insoluble and infusible base.
ドーピング量は基体中の炭素原子1個当りのAsF6 -イオ
ンの数で表わす事としたが、本発明ではAsF6 -イオンの
数はドーピング時に回路に流れた電流値より求めたもの
である。The doping amount is represented by the number of AsF 6 − ions per carbon atom in the substrate, but in the present invention, the number of AsF 6 − ions is obtained from the current value flowing in the circuit at the time of doping.
このようにしてAsF6 -イオンがドーピングされた不溶不
融性基体よりなる電気伝導性有機高分子系材料が得られ
た。ドーピング後、該材料を取り出してアセトンにて洗
浄し、60℃の温度で60分間減圧乾燥を行い次に電気
伝導度を測定した。結果を第1表に示す。Thus, an electrically conductive organic polymer material composed of an insoluble and infusible substrate doped with AsF 6 − ions was obtained. After doping, the material was taken out, washed with acetone, dried under reduced pressure at a temperature of 60 ° C. for 60 minutes, and then the electrical conductivity was measured. The results are shown in Table 1.
実施例2 レゾール型フェノール樹脂(約65%濃度の水溶液)/
水/塩化亜鉛を重量比で10/1/5の割合で混合した
溶液にフェノール繊維(繊維径約15μ)のカットファ
イバー(カット長約2mm)を加え、充分に混合した後、
該スラリーより、約100℃に加熱した加圧成形機を使
用して加圧下、約10分間成形硬化して、約100μ厚
のフィルム状複合成形体を得た。このフィルム状複合成
形体におけるフェノール繊維/フェノール樹脂の重量比
は0.08であり、又塩化亜鉛/(フェノール樹脂+フェ
ノール繊維)の重量比は0.7であった。次にこのフィル
ム状複合成形体をシリコユニット電気炉にて所定温度ま
で熱処理し、その後実施例1と同様に温水にて洗浄し、
乾燥して水素/炭素の原子比の異なるフィルム状の不溶
不融性基体を得た。この基体について元素分析、BET
法による比表面積値及び曲げ強度測定を行った。これら
の結果をまとめて第2表に示す。 Example 2 Resol type phenolic resin (about 65% concentration aqueous solution) /
To a solution prepared by mixing water / zinc chloride in a weight ratio of 10/1/5, add a cut fiber (cut length of about 2 mm) of phenolic fiber (fiber diameter of about 15 μ) and mix thoroughly,
The slurry was molded and cured under pressure using a pressure molding machine heated to about 100 ° C. for about 10 minutes to obtain a film-shaped composite molded body having a thickness of about 100 μm. The weight ratio of phenolic fiber / phenolic resin in this film-form composite molded article was 0.08, and the weight ratio of zinc chloride / (phenolic resin + phenolic fiber) was 0.7. Next, this film-shaped composite molded body was heat-treated to a predetermined temperature in a silicon unit electric furnace, and then washed with warm water in the same manner as in Example 1,
After drying, film-shaped insoluble and infusible substrates having different hydrogen / carbon atomic ratios were obtained. Elemental analysis, BET
The specific surface area value and the bending strength were measured by the method. The results are summarized in Table 2.
次に実施例1と同じ方法にてドーピングを行った。ただ
し本実施例ではLiAsF6の代わりにLiBF4を使用した。結
果をまとめて第2表に示す。Next, doping was performed by the same method as in Example 1. However, in this example, LiBF 4 was used instead of LiAsF 6 . The results are summarized in Table 2.
実施例3 レゾール型フェノール樹脂(約65%濃度の水溶液)/
水/塩化亜鉛を所定の重量比で混合し、該溶液をフェノ
ール繊維のフェルト(日本カイノール社製)に含浸させ
た。次に100℃に加熱された加圧成形機にて、該溶液
含浸フェルトを所定圧力下、約15分間、成形硬化し
て、板状の複合成形体を作成した。 Example 3 Resol type phenol resin (about 65% concentration aqueous solution) /
Water / zinc chloride were mixed at a predetermined weight ratio, and the solution was impregnated into a felt of phenolic fiber (manufactured by Nippon Kynol Co., Ltd.). Then, the solution-impregnated felt was molded and cured under a predetermined pressure for about 15 minutes by a pressure molding machine heated to 100 ° C. to prepare a plate-shaped composite molded body.
これらの複合成形体においてフェノール繊維のフェルト
/フェノール樹脂の重量比は0.2〜1.0であり、又塩化亜
鉛/(フェノール繊維のフェルト+フェノール樹脂)の
重量比は1.5〜4であった。次に実施例1と同じ条件に
て熱処理、洗浄及び乾燥を行って不溶不融性基体の板状
体を得た。これらの試料について、元素分析、電気伝導
度BET法による比表面積及び曲げ強度の測定を行っ
た。結果は第3表に示す。The weight ratio of phenol fiber felt / phenol resin was 0.2 to 1.0, and the weight ratio of zinc chloride / (phenol fiber felt + phenol resin) was 1.5 to 4 in these composite molded bodies. Next, heat treatment, washing and drying were performed under the same conditions as in Example 1 to obtain a plate-shaped insoluble and infusible substrate. For these samples, the elemental analysis and the specific surface area and bending strength were measured by the electrical conductivity BET method. The results are shown in Table 3.
次に該板状体を真空ライン中に入れ、真空度を10-2to
rr以下にした後、室温にてヨウ素ガスをラインに導入し
てドーピングを約10分間行った。ドーピング後の電気
伝導度を第3表に示す。またヨウ素をドープした該板状
体をラインから取り出してEPMA(エレクトンプロー
ブX線マイクロアナリシス)にかけヨウ素の試料の断面
中での分布状態を調べたところ、いずれの試料でもヨウ
素は試料の表面から内部まで均一に分布していた。Next, the plate-like body is put into a vacuum line and the degree of vacuum is set to 10 -2 to
After adjusting to rr or less, iodine gas was introduced into the line at room temperature to perform doping for about 10 minutes. The electrical conductivity after doping is shown in Table 3. The iodine-doped plate was taken out of the line and subjected to EPMA (electron probe X-ray microanalysis) to examine the distribution state of iodine in the cross section of the sample. Was evenly distributed up to.
実施例4 H/Cの原子比が0.22でありBET法による比表面積
値が1250m2/gである実施例1の本発明基体を脱し
たテトラヒドフラン、ナフタレン及び金属ナトリウムを
用いて作成したナトリウムナフタレートのテトラヒドロ
フラン溶液にドライボックス(N2気流)中に浸漬し、ナ
トリウムのドーピングを試みた。約30分間浸漬した
後、脱水したテトラヒドロフランにて洗浄し室温にて減
圧乾燥を行った。該試料の電気伝導度を測定したとこ
ろ、未ドープの約10-4Ω-1cm-1より大巾に増大し約1
00Ω-1cm-1となっていた。又該試料についてEPMA
分析を行ったところ、試料内部までナトリウムがドーピ
ングされていた。 Example 4 Prepared using tetrahydrofuran, naphthalene and metallic sodium obtained by removing the substrate of the present invention of Example 1 having an H / C atomic ratio of 0.22 and a specific surface area value of 1250 m 2 / g by the BET method. Sodium naphthalate solution in tetrahydrofuran was immersed in a dry box (N 2 gas flow) to attempt sodium doping. After soaking for about 30 minutes, it was washed with dehydrated tetrahydrofuran and dried under reduced pressure at room temperature. When the electric conductivity of the sample was measured, it was found that the electric conductivity increased to a level of about 1 × 10 −4 Ω −1 cm −1.
It was 0 0 Ω -1 cm -1 . Also, regarding the sample, EPMA
As a result of analysis, sodium was doped into the inside of the sample.
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 // B32B 5/00 A 7016−4F Continuation of the front page (51) Int.Cl. 5 Identification number Office reference number FI technical display location // B32B 5/00 A 7016-4F
Claims (12)
繊維構造物並びに塩化亜鉛からなる複合成形体の熱処理
物であって、水素原子/炭素原子の原子比が0.05〜0.
6であり、且つBET法による比表面積値が600m2/
g以上であるポリアセン系骨格構造を有する不溶不融性
基体からなる電気伝導性有機高分子系材料。1. A heat-treated product of a composite molded article composed of a phenol resin, a phenol fiber or a fiber structure, and zinc chloride, wherein the atomic ratio of hydrogen atoms / carbon atoms is 0.05 to 0.5.
6 and the specific surface area value by the BET method is 600 m 2 /
An electrically conductive organic polymer material comprising an insoluble and infusible substrate having a polyacene skeleton structure of g or more.
比で0.05以上のフェノール繊維もしくは繊維構造物を
含むものである特許請求の範囲第(1)項に記載の電気伝
導性有機高分子系材料。2. The electrically conductive organic polymer system according to claim 1, wherein the composite molded article contains phenolic fibers or fiber structures in a weight ratio to the phenolic resin of 0.05 or more. material.
ル繊維もしくは繊維構造物との総重量に対して0.5〜7
の塩化亜鉛を含むものである特許請求の範囲第(1)項又
は第(2)項に記載の電気伝導性有機高分子系材料。3. The composite molded article is 0.5 to 7 relative to the total weight of the phenolic resin and the phenolic fiber or fiber structure.
The electrically conductive organic polymer material according to claim (1) or (2), wherein the material contains zinc chloride.
ト状のものである特許請求の範囲第(1)項乃至第(3)項の
何れかに記載の電気伝導性有機高分子系材料。4. The electrically conductive organic polymer material according to any one of claims (1) to (3), wherein the phenolic fiber structure is a knitted fabric or a felt-like structure.
原子の原子比が0.15〜0.6のものである特許請求の範
囲第(1)項〜第(4)項の何れかに記載の電気伝導性有機高
分子系材料。5. The heat-treated product of the composite molded article according to any one of claims (1) to (4), wherein the atomic ratio of hydrogen atoms / carbon atoms is 0.15 to 0.6. The electrically conductive organic polymer material described.
の範囲第(1)項〜第(5)項の何れかに記載の有機高分子系
材料。6. The organic polymer material according to any one of claims (1) to (5), wherein the organic polymer material is a molded product.
しくは繊維構造物並びに塩化亜鉛からなる複合成形体の
熱処理物であって水素原子/炭素原子の原子比が0.05
〜0.6であり、且つBET法による比表面積値が600m
2/g以上であるポリアセン系骨格構造を有する不溶不
融性基体、および (B) 電子供与性ドーパント又は電子受容性ドーパント
とからなり、 (C) 電気伝導度が未ドープの該基体よりも大であるこ
とを特徴とする電気伝導性有機高分子系材料。7. A heat-treated composite molded article comprising (A) a phenolic resin, a phenolic fiber or a fiber structure, and zinc chloride having an atomic ratio of hydrogen atoms / carbon atoms of 0.05.
~ 0.6 and specific surface area value by BET method is 600m
An insoluble infusible substrate having a polyacene skeleton structure of 2 / g or more, and (B) an electron-donating dopant or an electron-accepting dopant, and (C) a larger electric conductivity than the undoped substrate. An electrically conductive organic polymer material characterized in that
ウム、カリウム、ルビジウム及びセシウムを含む第1.A
族金属である特許請求の範囲第(7)項に記載の電気伝導
性有機高分子系材料。8. A. 1.A wherein the electron donating dopant comprises lithium, sodium, potassium, rubidium and cesium.
The electrically conductive organic polymer material according to claim (7), which is a group metal.
級アルキル)アンモニウムカチオンである特許請求の範
囲第(7)項に記載の電気伝導性有機高分子系材料。9. The electrically conductive organic polymer material according to claim 7, wherein the electron donating dopant is a tetra (C 1 -C 5 lower alkyl) ammonium cation.
素、沃素である特許請求の範囲第(7)項記載の電気伝導
性有機高分子系材料。10. The electroconductive organic polymer material according to claim 7, wherein the electron-accepting dopant is fluorine, chlorine, bromine or iodine.
F3、BCl3、BBr3である特許請求の範囲第(7)項記載の電
気伝導性有機高分子系材料。11. An electron-accepting dopant is AsF 5 , PF 5 , or B.
The electrically conductive organic polymer material according to claim (7), which is F 3 , BCl 3 , or BBr 3 .
2O5等の非金属元素の酸化物あるいはH2SO4、HNO3あるい
はHClO4に由来する陰イオンである特許請求の範囲第(7)
項記載の電気伝導性有機高分子系材料。12. The electron-accepting dopant is SO 3 or N.
An oxide derived from a non-metal element such as 2 O 5 or an anion derived from H 2 SO 4 , HNO 3 or HClO 4 (7)
The electrically conductive organic polymer material according to the item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23788285A JPH0655840B2 (en) | 1985-10-23 | 1985-10-23 | Electrically conductive organic polymer materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23788285A JPH0655840B2 (en) | 1985-10-23 | 1985-10-23 | Electrically conductive organic polymer materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6296527A JPS6296527A (en) | 1987-05-06 |
| JPH0655840B2 true JPH0655840B2 (en) | 1994-07-27 |
Family
ID=17021819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23788285A Expired - Fee Related JPH0655840B2 (en) | 1985-10-23 | 1985-10-23 | Electrically conductive organic polymer materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0655840B2 (en) |
-
1985
- 1985-10-23 JP JP23788285A patent/JPH0655840B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6296527A (en) | 1987-05-06 |
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