JPH065633B2 - Connection method between wiring board and connector - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION A ceramic wiring substrate is known in which a conductor paste is printed on a ceramic substrate and fired. However, the present invention provides a heat-generating electronic component such as a semiconductor device. The present invention relates to a method of connecting a wiring board such as a ceramic wiring board to be mounted to a connector.

[Background of technology]

To connect the wiring pattern of the wiring board with the terminal of the connector for pulling out the terminals of the ceramic wiring board or printed circuit board to the outside, the means to insert the terminal into the through hole opened in the wiring board and solder A means is known in which a terminal is overlaid on a pad provided on a board, and the terminals are bonded and soldered. The former means for inserting terminals into the through holes and soldering them is mechanically and firmly coupled, and there is no problem such as peeling of the pads. However, since it is difficult to form a through hole in a ceramic wiring substrate, it is often used to bond the latter terminals to each other for soldering, but it is difficult to rely on the adhesion strength of pads for connecting the terminals. The present invention relates to a method for connecting a connector to a ceramic wiring board or the like in which terminals are overlapped and bonded to the pads and soldered as described above.

[Prior art and its problems]

FIG. 1 (a) is a plan view showing a soldered portion of a conventional ceramic wiring board and a connector, and (b) is a drawing of (a).
FIG. In the ceramic wiring board 1c, an inner layer conductor pattern 2 is provided on the ceramic substrate 1, an insulating layer 3 made of glass or the like is provided on the ceramic substrate 1 for insulation, and a surface layer conductor pattern 4 is provided on the insulating layer 3. It has a configuration provided. Then, in order to mount the connector 5 and connect the terminal 6 to the conductor pattern, a pad 7 for soldering is provided on the same layer as the conductor pattern 4 on the surface, and the terminal 6 is placed on the pad 7 and soldered. Attach. When connecting the conductor pattern 2 of the inner layer to the connector terminal 6, the conductor pattern 2 of the inner layer
Is drawn to the surface layer through a through hole and connected to the pad 7 provided on the surface.

The terminals 6 ... And the pads 7 ...
Preliminary solder is previously attached to the terminals, and the soldering iron is pressed from above the terminals 6 to heat the terminals. However, the ceramic substrate 1 provided with the pads 7 has good thermal conductivity, and the ceramic wiring substrate 1c is attached to the heat radiating casing 9 with the compound 8 having high thermal conductivity, and the pads 7 ... And the terminals 6 ... Soldered in the aligned state. Therefore, the heat is transmitted through the compound 8 to the heat radiating casing 9 having a large heat capacity to be dispersed, so that it is extremely difficult to raise the temperature of the soldering portion.

Therefore, usually, the casing 9 is set on a jig called a hot plate, and the casing 9 and the entire ceramic wiring board 1c are preheated and soldered. However, on the ceramic wiring board 1c, electronic parts such as semiconductor devices are mounted, and since the housing part of the connector is usually made of synthetic resin, when it is heated by a hot plate, etc., the mounted parts and connector housing etc. May deteriorate. In addition, with the shift to car electronics, it is usual that the wiring board 1c on which electronic components are mounted is manufactured by an electronic device manufacturer, supplied to a set manufacturer, and then assembled in the heat dissipation casing 9 by the set manufacturer. Such heating by the hot plate also imposes a burden on the set maker, and it takes time for the casing 9 and the ceramic wiring board 1c to rise to a predetermined temperature, so that workability is also poor. Such a problem is particularly remarkable in the case of a ceramic wiring board having excellent heat conduction, but also occurs in a case of a synthetic resin printed board or the like.

On the other hand, as described in Japanese Patent Application Laid-Open No. 55-165584, instead of connecting the shortest distance between the terminal of the printed circuit board and the connector terminal with the lead wire, the lead wire is provided with a curved portion so that It has been proposed that the applied vibration be absorbed by the bending portion.

However, in this method, since the lead wires are positioned and soldered one by one, workability is poor. As in recent years, with the progress of computerization of automobiles, the number of terminals of the connector is large and the terminal pitch P is very small as shown in FIG. 1. Therefore, each lead wire is positioned and soldered one by one. Is difficult to achieve, resulting in a decrease in manufacturing efficiency.

Moreover, as described above, when only a wiring board on which electronic components are mounted is manufactured by an electronic device manufacturer and transferred to an automobile manufacturer to be connected to a connector, soldering to the wiring board is required during vibration or handling during transfer. There is a problem that the attached lead wires are deformed and do not match the terminal pitch of the connector.

Further, in the conventional method, the printed circuit board fixed to the metal case and the connector housing made of synthetic resin,
Since it is mounted in close contact so that there is no gap, when the metal case expands and contracts due to temperature changes, the printed circuit board may warp and the adhesion with the metal case deteriorates, resulting in poor heat dissipation. There is a fear.

[Object of the Invention]

An object of the present invention is to focus on such a problem, and to position the connector efficiently and with high accuracy without impairing the heat dissipation of the components mounted on the printed circuit board, and even with a connector having a large number of terminals. Therefore, it is possible to prevent the lead conductor from being deformed before the soldering to the connector.

[Structure of Invention]

To achieve this object, the technical means according to the present invention includes a casing for heat dissipation of a wiring board so that a space in the longitudinal direction of the connector terminal can be provided between the terminal at the back of the connector and the wiring board. , And each terminal on the back of the connector and each pad on the wiring board are connected by soldering with a lead conductor having a relaxation means for absorbing the change in the distance.

At the time of this soldering connection, a comb-tooth-shaped conductor in which the base ends of the lead conductors having the relaxing means are integrally connected by a bridge portion is used, and the tips of the lead conductors of the comb-tooth-shaped conductor are connected to a wiring board. Solder to each pad of. After that, before connecting the base end of each lead conductor to the connector terminal, the bridge part is cut off and each lead conductor is separated, and the base end side of each lead conductor is connected to each terminal of the connector back part. Solder.

[Action]

According to the present invention, as shown in FIG. 2 and FIG. 3, the wiring board 1 is provided so that a space in the longitudinal direction of the connector terminal 53 can be provided between the terminal 53 at the back of the connector and the wiring board 1c.
Since c is attached to the heat dissipation casing 9, even if the wiring board 1c is displaced integrally with the casing 9 due to thermal expansion and contraction of the metal casing 9 due to temperature change, the wiring board 1c abuts on the connector side and is deformed. Never do
A problem that a gap is generated between the casing 9 and the heat radiation failure is solved.

Further, since the lead conductor 10 connecting each terminal 53 on the back of the connector and each pad of the wiring board 1c has a relaxing means for absorbing the change in the interval, even if the interval is changed, it is as in the conventional case. A force for peeling the soldering pad of the wiring board 1c does not occur.

Further, at the time of this soldering connection, the comb-teeth-shaped conductors whose base ends are integrally connected by the bridge portion 15 of the lead conductors 10 ... Since each pad 7 of the wiring board 1c is soldered, unlike the conventional case where one conductor is soldered one by one, all the lead conductors 10 ... Can be positioned and soldered all at once with high accuracy.

Moreover, just before the base end of each lead conductor is connected to the connector by transferring the wiring substrate 1c while the base end of each lead conductor remains the comb-shaped conductor integrally connected by the bridge portion 15, Of the lead conductor 1 by cutting off the bridge portion 15 of
Since 0s are independent, the problem that the lead wires are deformed during transfer or handling and the pitch does not match the pitch of the connector terminals, like the conventional method of soldering the lead wires one by one, is solved. .

Since the tips of the respective lead conductors are already soldered to the pads of the wiring board 1c, the lead conductors are not separated by cutting off the bridge portion 15 of the comb-shaped conductor, and the lead conductors are positioned at the same time. Since they can be matched and soldered, the base end side can be positioned and soldered with high precision, as in the case of soldering the tip side, which is particularly effective when soldering to a high-density connector with a narrow terminal pitch. And the manufacturing efficiency is improved.

Example of Invention

Next, practical examples of how the method of connecting the wiring board and the connector according to the present invention is embodied will be described. FIG. 2 is a perspective view showing the whole state in which the connector is mounted in the casing, and FIG. 3 is a cross-sectional view of essential parts showing the connected state of the connector and the wiring board. A ceramic wiring board 1c is attached to the inner bottom surface of a casing 9 having good heat conductivity such as aluminum with a compound 8 having good heat conductivity. Reference numeral 5 denotes a connector, which is a synthetic resin housing 51.
A large number of contacts 52 ... Are insert-held. Integral with the contacts 52 ... And the housing 5
The terminals 53 ... Protruding from the back of 1 are parallel to the ceramic wiring board 1c. These terminals 53 correspond to the pads 7 of the ceramic wiring board 1c, and the respective pads 7 and the terminals 53 are the Ω-shaped lead conductors 1.
Connected with 0. That is, one end 10 of the lead conductor 10 ...
a is soldered to the pads 7 of the ceramic wiring board 1c, and the other end 10b is soldered to the terminals 53 of the connector. 11 and 12 are solders, respectively. Reference numeral 13 is a cover plate of the casing 9.

In the present invention, the lead conductors 10 which are separate from the terminals 53 are used to connect the pads 7 and the terminals 53. For connection, first, as shown in FIG. 4, when mounting the electronic components 14 such as a semiconductor device on the ceramic wiring substrate 1c, one ends 10a of the lead conductors 10 are soldered to the pads 7. Then, it is supplied to the set maker with the lead conductors 10 attached, and the other end 10b of the lead conductors 10 is soldered to the terminals 53 of the connector on the set maker side.

Since it is not efficient to solder the lead conductors 10 to the pads 7 one by one, as shown in FIG.
The other ends 10b of 0 ... Are formed in a comb-like shape in which the bridge portions 15 are connected to each other, and the one ends 10a ... Are soldered to the pads 7 ... All together while the lead conductors 10 ... Are integrally connected. After soldering to the pads 7 ..., the bridge portion 15 is cut off by cutting from the position of the chain line 16. If the cutting of the bridge portion 15 is performed immediately before soldering to the connector terminals 53 of the other end 10b, the lead conductors 10 ...
It is also effective in preventing deformation of the.

The lead conductors 10 ... Are formed in an inverted U shape so that the lead conductors 10 ... Can be easily deformed in the surface direction of the ceramic wiring board 1c. That is, since the casing 9 made of aluminum or the like has a large coefficient of thermal expansion with respect to the ceramic wiring board 1c, the distance between the left end of the ceramic wiring board 1c and the connector terminals 53 changes depending on the temperature change. When mounted in the engine room of a car or the like, the temperature change is particularly large. Therefore, when the distance between the left end of the ceramic wiring board 1c and the connector terminals 53 changes, stress is generated between the pads 7 to which the end portions 10a of the lead conductors 10 are soldered and the ceramic wiring board 1c. 7 may peel off. Therefore, the lead conductors 10 ... Are formed into a U-shape or an inverted U-shape so that they are easily deformed in the surface direction of the ceramic wiring board 1c.
The force acting between the pads 7 ... And the ceramic wiring board 1c is relaxed. Therefore, if the shape is such that it is easily deformed in the surface direction of the ceramic wiring board 1c as shown by the arrow in FIG.
The shape is not limited to a letter shape, and may be, for example, an l-shape.

〔The invention's effect〕

As described above, according to the present invention, the terminal 53 on the back of the connector is provided.
Since the space is provided between the wiring board 1c and the wiring board 1c, the problem that the wiring board 1c is deformed by the thermal expansion and contraction of the metal casing and a gap is generated between the wiring board 1c and the heat radiation casing 9 to cause heat radiation failure is solved. To be done.

Further, even if the spacing changes due to a temperature change, each lead conductor 10 has a relaxation means for absorbing the change in the spacing, so that the soldering pad of the wiring board 1c is not peeled off. Absent.

Further, at the time of this soldering connection, a comb-shaped conductor is used to solder the tip of each lead conductor 10 to each pad 7 of the wiring board 1c, and in this way, each lead conductor 10
In the state where the tip end of the lead wire is soldered to the wiring board 1c side, the bridge portion 15 is cut off and the base end side is soldered to the connector terminal. Therefore, all the lead conductors 10 are collectively positioned with high accuracy. Suitable for soldering to high-density connectors with narrow terminal pitch, which improves the manufacturing efficiency.

With the tip of each lead conductor 10 of the comb-shaped conductor soldered to the wiring board 1c side and the base end integrally connected by the bridge portion 15, the wiring board 1c is transferred, and the base end of each lead conductor is connected to the connector. Just before soldering to the bridge part 1
Since 5 is cut off, it is possible to prevent the lead conductor from being deformed during transportation or handling.

[Brief description of drawings]

FIG. 1 is a plan view and a partial sectional view showing a conventional connection structure between a connector and a wiring board, and FIG. 2 and the following figures show an embodiment of a method for connecting a wiring board and a connector according to the present invention.
The figure is a perspective view, FIG. 3 is a cross-sectional view showing the main part, FIG. 4 is a side view showing the connection order of the lead conductors, and FIG. 5 is a perspective view of the lead conductors. In the figure, 1 is a ceramic substrate, 1c is a ceramic wiring substrate, 5 is a connector, 51 is a housing, 52 is a contact, 53 ... Terminals, 7 ... Pads, 9 is a casing, 1
0 ... Lead conductors, 10a and 10b are end portions of the lead conductors, and 11 and 12 are solder portions, respectively.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Shoji Kawada 2-1-1 Asahi-cho, Kariya City, Aichi Prefecture Aisin Seiki Co., Ltd. (72) Hiroaki Morioka 2-1-1 Asahi-cho, Kariya City, Aichi Prefecture Aisin In Seiki Co., Ltd. (72) Inventor Naoji Sakakibara 2-1-1 Asahi-cho, Kariya city, Aichi Prefecture Aisin Seiki Co., Ltd. Examiner Machiko Aoyama (56) Reference JP-A-55-165584 (JP, A) Actual Kai 50-38255 (JP, U)

Claims (1)

[Claims] 1. A connector in the longitudinal direction of the connector terminal is provided between the terminal on the back of the connector and the wiring board.
When the wiring board is pasted on a casing for heat dissipation and each terminal on the back of the connector is connected to each pad of the wiring board having a wiring pattern by a lead conductor having a relaxation means for absorbing the change in the spacing. In addition, a comb-shaped conductor in which the base ends of the lead conductors having the relaxing means are integrally connected by a bridge portion is used, and the tips of the lead conductors of the comb-shaped conductor are soldered to the pads of the wiring board. Then, before connecting the base end of each lead conductor to the terminal on the back of the connector, cut off the bridge part to keep each lead conductor independent, and connect the base end of each lead conductor to the connector back. A method of connecting a wiring board and a connector, which comprises soldering to each terminal.