JPH0656367B2 - Solid surface condition analyzer - Google Patents
Solid surface condition analyzerInfo
- Publication number
- JPH0656367B2 JPH0656367B2 JP59065714A JP6571484A JPH0656367B2 JP H0656367 B2 JPH0656367 B2 JP H0656367B2 JP 59065714 A JP59065714 A JP 59065714A JP 6571484 A JP6571484 A JP 6571484A JP H0656367 B2 JPH0656367 B2 JP H0656367B2
- Authority
- JP
- Japan
- Prior art keywords
- sample
- state
- solid surface
- rays
- dispersed
- Prior art date
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- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/223—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/07—Investigating materials by wave or particle radiation secondary emission
- G01N2223/076—X-ray fluorescence
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は、特に固体表面に吸着した化学種の構造、結合
状態、運動状態の測定に適した、固体表面の状態分析装
置に関する。Description: FIELD OF THE INVENTION The present invention relates to an apparatus for analyzing the state of a solid surface, which is suitable for measuring the structure, bonding state, and motion state of a chemical species adsorbed on a solid surface.
従来、固体表面の状態分布には、光電子分光、オージエ
電子分光、電子エネルギー損失分光などの方法が用いら
れている。しかし、これらの方法では、吸着種のエネル
ギー準位やその幅などが測定できるにすぎず、固相−気
相界面における化学反応の機構を知る上で必要な、吸着
種と表面との結合状態や、表面での運動状態などについ
ての詳しい知見を得ることは困難である。Conventionally, methods such as photoelectron spectroscopy, Auger electron spectroscopy, and electron energy loss spectroscopy have been used for the state distribution on the solid surface. However, these methods can only measure the energy level and the width of the adsorbed species, and the bonding state between the adsorbed species and the surface, which is necessary for understanding the mechanism of the chemical reaction at the solid-gas phase interface. Moreover, it is difficult to obtain detailed knowledge about the state of motion on the surface.
近年活発に研究開発が行なわれている半導体プロセス分
野においては、低抵抗シリコン基板上に高抵抗シリコン
薄膜をCVD法で作成する場合のように、固体試料の表
面に化学種を吸着させて、表面反応により薄膜を形成す
る技術が多用されている。このような場合には、固体試
料(低抵抗シリコン基板)上での吸着化学種(モノシラ
ンなどのシリコンを含む分子またはラジカル)の電子状
態を知ることが必要となる。In the field of semiconductor processing, which has been actively researched and developed in recent years, a chemical species is adsorbed on the surface of a solid sample so that a high resistance silicon thin film is formed on a low resistance silicon substrate by a CVD method. A technique of forming a thin film by reaction is widely used. In such a case, it is necessary to know the electronic state of the adsorbed chemical species (molecules or radicals containing silicon such as monosilane) on the solid sample (low resistance silicon substrate).
本発明の目的は、上記のような既存の表面測定方法の持
つ不充分な点を補うことが可能で、しかも測定を完全に
非破壊で行い得る、固体表面に吸着した化学種の状態分
析装置を提供することにある。An object of the present invention is to provide an apparatus for analyzing the state of chemical species adsorbed on a solid surface, which is capable of compensating for the deficiencies of the existing surface measurement methods as described above, and which is capable of completely nondestructive measurement. To provide.
上記目的を達成するため、本発明においてはX線領域の
光を励起光とするラマン散乱を利用している。In order to achieve the above object, the present invention utilizes Raman scattering in which light in the X-ray region is used as excitation light.
従来、ラマン散乱は可視光を励起光源として、主に分子
起動や格子振動の測定に用いられている。励起光の波長
を短くしてX線を用いれば、原子、分子の電子遷移を伴
うラマン散乱を観測できることが、本発明の原理であ
る。本発明によれば、化学種の固体表面への吸着に伴う
電子状態の変化を、非破壊で詳しく解析することが可能
である。Conventionally, Raman scattering has been used mainly for the activation of molecules and the measurement of lattice vibrations using visible light as an excitation light source. The principle of the present invention is that Raman scattering accompanied by electronic transitions of atoms and molecules can be observed by using X-rays with a shorter excitation light wavelength. According to the present invention, it is possible to analyze non-destructively a detailed change in electronic state due to adsorption of a chemical species on a solid surface.
第1図に示すように、ラマン散乱は物質がある波長の光
1を吸収する過程と、別の波長の光2、または3を放出
する過程とが同時に起こる現象と考えられる。ここで物
質は、図中のエネルギー準位の中例えば4,5,6,7
において、初期状態4から中間状態5を経て終状態6ま
たは7へと遷移する。励起光1と、散乱光2,3とのエ
ネルギー差は、物質エネルギー準位4と6、および4と
7のエネルギー差に対応しているので、これを用いる
と、例えばエネルギー準位4と6、または4と7との間
で直接遷移が起こらないような場合でも、それらのエネ
ルギー準位間のエネルギー差を決定することが可能であ
る。励起光1として可視領域の光を用いると、分子の振
動、回転準位や、結晶の格子振動準位などに関する知見
が得られる。As shown in FIG. 1, Raman scattering is considered to be a phenomenon in which a process of absorbing light 1 having a certain wavelength and a process of emitting light 2 or 3 having another wavelength occur at the same time. Here, the substance is, for example, 4, 5, 6, 7 in the energy levels in the figure.
In, the state transits from the initial state 4 to the final state 6 or 7 via the intermediate state 5. Since the energy difference between the excitation light 1 and the scattered light 2 and 3 corresponds to the energy difference between the material energy levels 4 and 6 and 4 and 7, using this, for example, the energy levels 4 and 6 , Or even if no direct transition between 4 and 7 occurs, it is possible to determine the energy difference between those energy levels. When light in the visible region is used as the excitation light 1, it is possible to obtain knowledge about vibrations of molecules, rotational levels, lattice vibration levels of crystals, and the like.
励起光1の波長を短くしてX線領域に設定すると、原子
や分子の電子状態間で同様な現象が観測されるようにな
る。When the wavelength of the excitation light 1 is shortened and set in the X-ray region, a similar phenomenon is observed between the electronic states of atoms and molecules.
第2図に、本発明の一実施例における装置構成を示す。
X線発生源と所定の波長のX線を選び出す分光系とから
なる励起光供給部Aより出る励起光8は、試料台9の保
持されている試料10に照射される。試料10の表面か
らの散乱光11の一部を、スリツト12により取り出
し、スリツト13を経て回折格子14に導く。ここで波
長分散された散乱光を写真乾板、ダイオードアレイ、シ
ンチレーターなどの検出器15により検出してスペクト
ルを得る。ここで、励起光8、散乱光11の光路全体、
および試料10は真空容器中に収められている。また、
励起光8、および散乱光11が試料10の表面となす角
度は、互いに独立に変えることができる。FIG. 2 shows a device configuration in one embodiment of the present invention.
Excitation light 8 emitted from an excitation light supply unit A including an X-ray generation source and a spectroscopic system that selects X-rays having a predetermined wavelength is applied to a sample 10 held on a sample table 9. A part of the scattered light 11 from the surface of the sample 10 is taken out by the slit 12 and guided to the diffraction grating 14 via the slit 13. Here, the scattered light wavelength-dispersed is detected by a detector 15 such as a photographic plate, a diode array, or a scintillator to obtain a spectrum. Here, the entire optical paths of the excitation light 8 and the scattered light 11,
The sample 10 is stored in a vacuum container. Also,
The angles formed by the excitation light 8 and the scattered light 11 with the surface of the sample 10 can be changed independently of each other.
励起光供給部Aの一実施例を第3図に示す。第2図にお
ける励起光8を、第3図では軌道放射光(SOR)17
から得ている。電子蓄積リングの一部であるマグネツト
部16で電子が加速されることにより発生する軌道放射
光17を、回折格子19、スリツト20により波長選択
して励起光8を得る。第3図における波長選択用の分光
系の構成をより複雑にして、励起光8の波長を変えても
分散光の結像位置や励起光8の進行方向が変化しないよ
うな分光系を使用することもできる。An example of the excitation light supply section A is shown in FIG. The excitation light 8 in FIG. 2 is converted into the orbital emission light (SOR) 17 in FIG.
Is obtained from The orbital radiation 17 generated by the acceleration of electrons in the magnet portion 16 which is a part of the electron storage ring is wavelength-selected by the diffraction grating 19 and the slit 20 to obtain the excitation light 8. The configuration of the wavelength selection spectroscopic system in FIG. 3 is made more complicated, and a spectroscopic system that does not change the imaging position of the dispersed light or the traveling direction of the excitation light 8 even if the wavelength of the excitation light 8 is changed You can also
第4図は励起光供給部Aの別の実施例である。プラズマ
X線源18において面状の放電が先端部で収束、ピンチ
する際に発生するX線を回折格子19で波長分散し、そ
の一部を取り出して励起光8とする。光源として他のX
線源を使用することも可能である。FIG. 4 shows another embodiment of the excitation light supply section A. In the plasma X-ray source 18, the X-rays generated when the planar discharge is converged and pinched at the tip portion are wavelength-dispersed by the diffraction grating 19, and a part thereof is extracted as excitation light 8. Other X as a light source
It is also possible to use a radiation source.
上記の装置において、励起光の試料面に対する視射角
を、試料材料の臨界角よりも小さく設定すると、試料内
部への光の侵入がなくなるので、表面のみでの散乱光が
検出できる。In the above apparatus, if the glancing angle of the excitation light with respect to the sample surface is set to be smaller than the critical angle of the sample material, light does not enter the inside of the sample, so scattered light can be detected only on the surface.
第5図は、本発明になる装置の別の実施例の構成図であ
る。励起光用の回折格子19により分散された光のうち
所定の波長成分をスリツト20により取り出し、これを
励起光8として試料10に照射する。散乱光11は、回
折格子14により波長分散して写真乾板、ダイオードア
レイ、シンチレーターなどの検出器15により検出した
スペクトルを得る。FIG. 5 is a block diagram of another embodiment of the device according to the present invention. A predetermined wavelength component of the light dispersed by the excitation light diffraction grating 19 is extracted by the slit 20, and this is irradiated onto the sample 10 as the excitation light 8. The scattered light 11 is wavelength-dispersed by a diffraction grating 14 to obtain a spectrum detected by a detector 15 such as a photographic plate, a diode array, a scintillator.
次に、第6図、および第7図により、本実施例におけ
る、第5図中の励起光用回折格子19の分散の方向zと
試料10の傾きとの関係、および励起光8の試料10に
対する入射方向、散乱光11の検出方向、励起光8の試
料10の面上への結像線21との関係を説明する。Next, referring to FIGS. 6 and 7, in the present embodiment, the relationship between the dispersion direction z of the diffraction grating 19 for excitation light and the inclination of the sample 10 in FIG. 5 and the sample 10 of the excitation light 8 are shown. The relationship between the incident direction, the detection direction of the scattered light 11, and the imaging line 21 of the excitation light 8 on the surface of the sample 10 will be described.
第6図は、本実施例の試料部分を第5図における励起光
用回折格子19の分散の方向、すなわち第5図のz軸方
向より見た部分図である。試料10は、その面がz軸と
平行で、しかも励起光8が試料面に対して平行に近い角
度で入射するように設置されており、散乱光11は、励
起光8の試料10への入射方向に近く、しかも試料面に
対して平行に近い方向より検出する。FIG. 6 is a partial view of the sample portion of the present embodiment as seen from the dispersion direction of the excitation light diffraction grating 19 in FIG. 5, that is, the z-axis direction in FIG. The sample 10 is installed so that its surface is parallel to the z-axis and the excitation light 8 is incident on the sample surface at an angle nearly parallel to the sample surface. Detection is performed from the direction close to the incident direction and parallel to the sample surface.
第7図は、本実施例の試料部分を、第5図におけるy軸
の方向、すなわち励起光用回折格子19の分散方向z
と、励起光8の進行方向のいずれに対しても垂直な方向
より見た部分図である。一般に、点状光源から出た光
は、回折格子により分散されると分散の方向と垂直な線
状に結像する。FIG. 7 shows the sample portion of this embodiment in the y-axis direction in FIG. 5, that is, the dispersion direction z of the diffraction grating 19 for excitation light.
3 is a partial view as seen from a direction perpendicular to the traveling direction of the excitation light 8. FIG. In general, when light emitted from a point light source is dispersed by a diffraction grating, it forms an image in a line shape perpendicular to the direction of dispersion.
第7図において、試料10の面上への励起光8の結像線
21のz軸方向の幅は、試料面がz軸に対して平行であ
れば、励起光8の試料面に対する入射角が変化しても、
ほぼ一定に保たれる。したがつて、試料面に平行に近
く、しかも結像線21と励起光8のつくる面に入る方
向、ないしは、それに近い方向に第5図における検出用
回折格子14を配置した本実施例の場合、この検出用回
折格子14より見た結像線21からの散乱光11は、近
似的に点光源と見なせる。このような条件においては、
散乱光をピンホール等を通過させることなく、直接検出
用回折格子14に導いても、分散光は点光源から出る光
と同様な結像をする。ここで、検出用回折格子14とし
て、光源までの距離が結像位置にほとんど影響を与えな
い、たとえば、フラツトフイールド型凹面回折格子を用
いると、通常の回折格子を用いた場合以上に点光源から
の光に近い結像を、検出器15の位置に得ることができ
る。In FIG. 7, the width of the imaging line 21 of the excitation light 8 on the surface of the sample 10 in the z-axis direction is the incident angle of the excitation light 8 with respect to the sample surface if the sample surface is parallel to the z-axis. Changes,
It is kept almost constant. Therefore, in the case of the present embodiment in which the detection diffraction grating 14 in FIG. 5 is arranged in a direction close to the sample surface and in the direction in which it enters the plane formed by the imaging line 21 and the excitation light 8, or in the direction close thereto. The scattered light 11 from the image forming line 21 viewed from the detection diffraction grating 14 can be approximately regarded as a point light source. Under these conditions,
Even if the scattered light is directly guided to the detection diffraction grating 14 without passing through the pinhole or the like, the dispersed light forms an image similar to the light emitted from the point light source. Here, as the detection diffraction grating 14, the distance to the light source has almost no influence on the image forming position. For example, if a flat field type concave diffraction grating is used, the point light source is more than that in the case of using a normal diffraction grating. An image close to the light from can be obtained at the position of the detector 15.
以上説明したような本実施例の方法においては、励起光
8の入射角、および散乱光11の検出の方向の両方を、
試料面に対して平行に近く設定してあるにもかかわら
ず、励起光8が試料10を経ずに直接検出器15に入る
ことに対する対策を行う必要がない。しかも、散乱光1
1の分光を行う際に、これをピンホール等で点光源化す
る必要がないため、散乱光11を損失なく検出すること
ができる。したがつて、高い検出感度が得られる。In the method of the present embodiment as described above, both the incident angle of the excitation light 8 and the detection direction of the scattered light 11 are
Even if the excitation light 8 is set nearly parallel to the sample surface, it is not necessary to take measures against the excitation light 8 directly entering the detector 15 without passing through the sample 10. Moreover, scattered light 1
Since it is not necessary to convert this into a point light source with a pinhole or the like when performing the 1st spectroscopy, the scattered light 11 can be detected without loss. Therefore, high detection sensitivity can be obtained.
一般に、分光系のエネルギー分解能ΔE(eV),波長
分解能Δλ/λ,光の波長λ(Å)の間には、 ΔE=1.25×104×(Δλ/λ)/λ の関係があるので、Δλ/λ=5×10-4の分光系を用
いてλ=10Åの励起光の散乱を観測した場合、1eV
以下のエネルギー分解能で散乱光の測定を行うことがで
きる。ラマン散乱において遷移エネルギーが通常0.5e
V以上である電子遷移が観測されるためには、励起光8
の波長は500Å以下のX線領域であることが必要であ
る。また、分光系に波長分解能は上記波長領域では10
-4以下であるのが現状なので、吸着による電子状態の変
化を観測し得る程度のエネルギー分解能(1eV)を
得るためには、励起光8の波長は5Å以上であることが
必要がである。Generally, there is a relationship of ΔE = 1.25 × 10 4 × (Δλ / λ) / λ among the energy resolution ΔE (eV) of the spectroscopic system, the wavelength resolution Δλ / λ, and the wavelength λ (Å) of light. Therefore, when the scattering of the excitation light of λ = 10 Å is observed using the spectroscopic system of Δλ / λ = 5 × 10 −4 , it is 1 eV.
The scattered light can be measured with the following energy resolution. The transition energy is usually 0.5e in Raman scattering
In order to observe an electronic transition of V or more, excitation light 8
The wavelength must be in the X-ray region below 500Å. The wavelength resolution of the spectroscopic system is 10 in the above wavelength range.
Since the current value is -4 or less, the wavelength of the excitation light 8 needs to be 5 Å or more in order to obtain an energy resolution (1 eV) that is sufficient to observe changes in the electronic state due to adsorption.
このように、本発明になる装置において、上記のような
性能をもつ分光系を使用すれば、散乱X線のスペクトル
を観測することによつて、表面に吸着した化学種の電子
遷移を、吸着に起因する電子状態の変化を検出するのに
充分な精度で解析することができる。As described above, in the apparatus according to the present invention, if the spectroscopic system having the above-described performance is used, the electron transition of the chemical species adsorbed on the surface can be absorbed by observing the spectrum of the scattered X-ray. The analysis can be performed with sufficient accuracy to detect the change in the electronic state caused by.
励起電子状態は、吸着種の表面での運動や表面化学反応
に対して重要な役割を担つているので、例えば半導体プ
ロセス技術における、プラズマCVD、光CVDなどの
ように、表面の動的な性質を利用した技術の発展のため
に、その振舞いを充分に理解しておくことが必須であ
る。Since the excited electronic state plays an important role in the movement of the adsorbed species on the surface and the surface chemical reaction, the dynamic properties of the surface, such as plasma CVD and photo CVD in the semiconductor process technology, are used. It is essential to fully understand the behavior in order to develop the technology using the.
本発明によれば、通常の光吸収を経た遷移が、対称性の
制約のために禁止されている準位についての知見を得る
ことが可能である。また、光電子分光法の場合、電子の
被占有状態に関する情報が得られるのみであるのに対し
て、本発明では励起電子状態を検出することができる。According to the present invention, it is possible to obtain the knowledge about the level in which the transition that has undergone ordinary light absorption is prohibited due to the restriction of symmetry. Further, in the case of the photoelectron spectroscopy, only the information on the occupied state of the electron can be obtained, whereas the excited electronic state can be detected in the present invention.
さらに、本発明は測定できる情報において上記のような
新しい機能を持つことの他、電子、イオン線などの粒子
線照射を用いず、励起光とわずかにエネルギーの異なる
散乱光を検出することを測定手段としているために、試
料に著しい擾乱を加えることなく試料のありのままの性
質をとらえることが可能であるという特徴も持つてい
る。この特徴は、同一試料について連続的に測定を行
い、その変化を追跡するような動的計測を行う場合に特
に有効に利用できる。Furthermore, the present invention has a new function as described above in the measurable information, and also detects scattered light having a slightly different energy from the excitation light without using particle beam irradiation of electrons, ion beams, etc. Since it is used as a means, it also has a feature that it is possible to capture the natural properties of the sample without adding significant disturbance to the sample. This feature can be particularly effectively used in the case where the same sample is continuously measured and a dynamic measurement for tracking the change is performed.
次に本発明の装置により予測される結果の例を第8図に
示す。第8図は、低抵抗n型シリコン基板上に高抵抗シ
リコン薄膜を成長させるためのモノシラン(SiH4)
を用いたCVD処理の初期におけるラマン散乱のスベク
トルを測定した結果である。励起光1のエネルギーは1
keV(波長は12Å)とした。Next, an example of the result predicted by the device of the present invention is shown in FIG. FIG. 8 shows monosilane (SiH 4 ) for growing a high resistance silicon thin film on a low resistance n-type silicon substrate.
It is a result of measuring the Raman scattering vector in the initial stage of the CVD process using. The energy of excitation light 1 is 1
keV (wavelength is 12Å).
第8図には、真空中、すなわち吸着前のモノシラン(S
iH4)のスペクトルも示してある。真空中でのスペク
トルには、電子がシリコン局在した非縮重状態のピーク
(a1)と、電子が分子全体に分布した三重縮重状態の
ピーク(t2)が現れている。a1のピークは、モノシ
ラン(SiH4)が面方位(100)、(111)のい
ずれのシリコン基板に吸着した場合でもほとんど変化し
ない。これは上述したように、電子がシリコンに局在し
ているため、吸着の影響を受けないことによるものであ
る。FIG. 8 shows that monosilane (S
The spectrum of iH 4 ) is also shown. The spectrum in vacuum shows a non-degenerate state peak (a1) in which electrons are localized in silicon and a triple degenerate state peak (t2) in which electrons are distributed throughout the molecule. The peak of a1 hardly changes even when monosilane (SiH 4 ) is adsorbed on any of the silicon substrates having the plane orientations (100) and (111). This is because, as described above, the electrons are localized in silicon and are not affected by adsorption.
一方、t2のピークの方は、面方位(100)のシリコ
ン基板への吸着では三重の縮重が解け、安定化した一つ
の状態と吸着前とほとんど変わらない二重縮重状態へと
分裂する。そして、(111)のシリコン基板への吸着
では三重縮重は解けないが、吸着方位の相違により、安
定度の異なる二つの三重縮重状態が現れる。On the other hand, at the peak of t2, triple degeneracy is released by adsorption on a silicon substrate having a plane orientation (100), and split into one stabilized state and a double degenerate state that is almost the same as before adsorption. . Then, although triple degeneracy cannot be solved by adsorption of (111) onto a silicon substrate, two triple degenerate states having different stability appear due to the difference in adsorption direction.
このように、本発明の装置によれば、吸着条件の差によ
る電子状態の変化を詳しく解析できるため、各処理条件
での最適な成膜条件を容易に決定することが可能になる
ことが予測される。As described above, according to the apparatus of the present invention, the change in the electronic state due to the difference in the adsorption condition can be analyzed in detail, so that it is predicted that the optimum film forming condition under each processing condition can be easily determined. To be done.
第1図はラマン散乱の原理を説明する図、第2図は本発
明の一実施例になる装置の基本構成図、第3図は本発明
の一実施例の一部分を説明する図、第4図は本発明の別
の実施例の一部分を説明する図、第5図は本発明のさら
に別の実施例になる装置の基本構成図、第6図、および
第7図は第5図における実施例の入射および散乱X線の
状態を説明する図、第8図は本発明の装置により予測さ
れる結果の例を示す図である。 1……励起光、2,3……ラマン散乱光、4……始状
態、5……中間状態、6,7……終状態、A……励起光
供給部、8……励起光、9……試料台、10……試料、
11……散乱光、12,13……スリツト、14……検
出用回折格子、15……光検出器、16……マグネツ
ト、17……軌道放射光、18……プラズマX線源、1
9……励起用回折格子、20……スリツト、21……結
像線。FIG. 1 is a diagram illustrating the principle of Raman scattering, FIG. 2 is a basic configuration diagram of an apparatus according to an embodiment of the present invention, FIG. 3 is a diagram illustrating a part of the embodiment of the present invention, and FIG. FIG. 5 is a diagram for explaining a part of another embodiment of the present invention, FIG. 5 is a basic configuration diagram of an apparatus according to still another embodiment of the present invention, and FIGS. 6 and 7 are implementations in FIG. FIG. 8 is a diagram for explaining incident and scattered X-ray states in the example, and FIG. 8 is a diagram showing an example of a result predicted by the apparatus of the present invention. 1 ... Excitation light, 2,3 ... Raman scattered light, 4 ... Start state, 5 ... Intermediate state, 6,7 ... End state, A ... Excitation light supply unit, 8 ... Excitation light, 9 …… Sample stand, 10 …… Sample,
11 ... scattered light, 12,13 ... slit, 14 ... detection diffraction grating, 15 ... photodetector, 16 ... magnet, 17 ... orbital radiation, 18 ... plasma X-ray source, 1
9 ... Excitation diffraction grating, 20 ... Slit, 21 ... Imaging line.
Claims (9)
の電子状態を得るために、所定の波長を有する該X線を
選択する分光手段と、表面に化学種が吸着された試料を
設置する試料台と、該試料に臨界角より小さい視射角で
該X線を照射する手段と、該試料の表面から分散した該
X線の波長を分光する分光系と、該分散したX線を検出
する検出器からなることを特徴とする固体表面の状態分
析装置。1. An X-ray source for generating X-rays, a spectroscopic means for selecting the X-rays having a predetermined wavelength in order to obtain an electronic state at a solid-vapor interface, and a chemical species adsorbed on the surface. A sample table on which the sample is placed, a means for irradiating the sample with the X-ray at a glancing angle smaller than the critical angle, a spectroscopic system for dispersing the wavelength of the X-ray dispersed from the surface of the sample, A solid surface condition analyzer comprising a detector for detecting dispersed X-rays.
状態分析装置において、上記X線源と、上記分光手段
と、上記試料台と、上記分光系と、上記検出器とが真空
容器に収納されていることを特徴とする固体表面の状態
分析装置。2. A solid surface state analyzing apparatus according to claim 1, wherein the X-ray source, the spectroscopic means, the sample stage, the spectroscopic system, and the detector are provided. A solid surface condition analyzer characterized by being housed in a vacuum container.
態分析装置において、上記X線源として、軌道輻射光源
を用いることを特徴とする固体表面の状態分析装置。3. The solid surface state analyzing apparatus according to claim 1, wherein an orbital radiation source is used as the X-ray source.
状態分析装置において、上記X線源として、プラズマX
線源を用いることを特徴とする固体表面の状態分析装
置。4. The solid state condition analyzer according to claim 1, wherein the X-ray source is plasma X
A solid surface condition analyzer characterized by using a radiation source.
状態分析装置において、上記X線の波長が、5Åから5
00Åの範囲であることを特徴とする固体表面の状態分
析装置。5. The solid state condition analyzer according to claim 1, wherein the X-ray wavelength ranges from 5Å to 5Å.
A solid surface condition analyzer characterized by being in the range of 00Å.
状態分析装置において、上記分散したX線の検出を、上
記試料に対して小さい視射角で検出することを特徴とす
る固体表面の状態分析装置。6. The solid surface state analyzer according to claim 1, wherein the dispersed X-rays are detected with a small glancing angle with respect to the sample. Surface condition analyzer.
状態分析装置において、上記試料が、上記分散したX線
の分散方向に対して平行に配置されたことを特徴とする
固体表面の状態分析装置。7. The solid surface state analyzing apparatus according to claim 1, wherein the sample is arranged in parallel with a dispersion direction of the dispersed X-rays. State analyzer.
状態分析装置において、上記分散したX線の検出を、上
記分散したX線の分散方向に対して垂直な方向から検出
することを特徴とする固体表面の状態分析装置。8. A solid surface condition analyzer according to claim 1, wherein the detection of the dispersed X-rays is performed from a direction perpendicular to the dispersion direction of the dispersed X-rays. A solid surface condition analyzer characterized by the following.
状態分析装置において、上記X線の入射方向、あるいは
入射方向に近い方向に分散される上記分散したX線を検
出することを特徴とする固体表面の状態分析装置。9. The apparatus for analyzing the state of a solid surface according to claim 1, wherein the dispersed X-rays dispersed in the incident direction of the X-rays or in a direction close to the incident direction are detected. Characteristic solid state analyzer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59065714A JPH0656367B2 (en) | 1984-04-04 | 1984-04-04 | Solid surface condition analyzer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59065714A JPH0656367B2 (en) | 1984-04-04 | 1984-04-04 | Solid surface condition analyzer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60210746A JPS60210746A (en) | 1985-10-23 |
| JPH0656367B2 true JPH0656367B2 (en) | 1994-07-27 |
Family
ID=13294959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59065714A Expired - Lifetime JPH0656367B2 (en) | 1984-04-04 | 1984-04-04 | Solid surface condition analyzer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0656367B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06100511B2 (en) * | 1986-05-02 | 1994-12-12 | 株式会社日立製作所 | Scanning stress measurement method |
| JPH0820317B2 (en) * | 1988-11-25 | 1996-03-04 | 株式会社日立製作所 | Stress measuring method and device |
-
1984
- 1984-04-04 JP JP59065714A patent/JPH0656367B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60210746A (en) | 1985-10-23 |
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