JPH0656869B2 - Lead bend method and device in manufacturing process of electronic device - Google Patents

Description

Detailed Description of the Invention [Industrial applications]

The present invention relates to a lead bend method in a manufacturing process of a dual-in-line type electronic device and an apparatus used for the same, and more specifically, a high-quality lead bend method by a roller bend method can be efficiently used without complicating the apparatus. The present invention relates to an electronic device that can be manufactured to improve the manufacturing efficiency of the electronic device.

[Prior art]

In this type of electronic device, a die bonding process of attaching a chip of the electronic device to a predetermined position on a lead frame, a wire bonding process of connecting a bonding pad on the chip to a lead, and a predetermined region surrounding the chip with a resin. It is manufactured through a resin packaging step of sealing, a marking step of printing a product number or the like on the surface of the package, a lead cutting step of cutting the leads from the frame, and a lead bending step of bending the leads into a predetermined shape. FIG. 5 schematically shows a state before the lead cutting step in the manufacturing process of the dual-in-line type electronic device on which the present invention is based. From this state, in the lead cutting process, unnecessary parts,
That is, the dam bar connecting the leads or the island support is cut by a cut press to take out a semi-finished product D in which the leads extend linearly from the package as shown in FIG. 6 from the lead frame F. In the lead bend process, the lead is usually bent downward to obtain a product as shown in FIG. The transition from the lead cutting process to the lead bending process is usually performed by sliding a semi-finished product dropped on a guide located below the lead cutting process to the lead bending position by sliding it laterally. As a method of the lead bend, as shown in FIG. 8, a so-called ironing bend method in which a spatula-shaped ironing jig is applied to a lead placed on a mold to bend while rubbing, and as shown in FIG. In addition, there is a so-called roller bend system in which a roller R acts on a lead placed on a mold to bend the lead. In the above-mentioned ironing bend method, since the lead L is bent while being rubbed, there is a problem in the durability of the ironing jig and the bent lead L is apt to suffer from ironing scratches. There is a tendency to adopt the roller bend method that does not have the concern. However, in the case where the roller bend method is adopted, the two front and rear rollers R arranged so as to be sandwiched between the front and rear of the package occupy a considerable space in the front-rear direction, and the lead frames F are separated one by one in front of the lead bend. The product can be adopted only by a so-called single device configuration in which the product is taken out on the guide, and the production efficiency is poor. Further, in order to simply increase the production efficiency, it is conceivable to take out the above-mentioned semi-finished products two by two in a row in the lead cutting process and simultaneously lead bend these two semi-finished products. In that case, the bend roller R is used. Occupies a considerable amount of space in the front-rear direction.
There is a problem in that a mechanism for expanding the space to a necessary space for arranging the sets is required, and the entire apparatus becomes very complicated. The present invention has been devised under the circumstances as described above, and provides a method for roller-bending a plurality of leads of a semi-finished product before lead bending without complicating the apparatus configuration, and an apparatus therefor. The task is to provide.

[Means for solving the problem]

In order to solve the above-mentioned problems, in the lead bend method of the present invention, the lead frames are intermittently sent at N pitch intervals on a conveying path provided with cutting and ejecting means arranged at N positions for each N + 1 pitch, and each lead frame is fed. After the pitch feed, the cutting and taking-out means is operated to take out N semi-finished products having leads before bending from the lead frame, and the leads of these N semi-finished products are taken out of these semi-finished products in the taken-out state. Bending is performed by N roller bending means arranged at N + 1 pitch intervals corresponding to the intervals. An apparatus for using this method is configured such that a lead path is intermittently fed by N pitches, a lead path is arranged at N + 1 pitch intervals in the longitudinal direction of the lead path, and the lead frame is actuated after each lead pitch to bend. N cutting and taking-out means for taking out a semi-finished product having a front lead from a lead frame, a shooter for carrying the taken-out semi-finished product to a predetermined lead bend position, and each half carried by the shooter to the lead bend position. And N roller bending means for bending the lead of the product. The above N represents an integer of 2 or more.

[Action]

For example, when the leads of two semi-finished products are bent, the above N becomes 2. First, the pitch feeding device feeds two pitches, that is, the first and second electronic devices on the lead frame onto the transport path. At this time, the first cutting and taking-out means on the upstream side of the conveying path is positioned so as to correspond to the second electronic device. When the first cutting and ejecting means operates,
The second electronic device is taken out of the lead frame. At this time, the first electronic device is still carried on the lead frame. Subsequently, the pitch feeding device feeds the lead frame by 2 pitches further onto the transport path. Then, the first
The fourth electronic device reaches the second cutting and taking-out device located at a pitch of 3 downstream from the first cutting and taking-out device, and the fourth electronic device reaches the first cutting and taking-out device. To do. Then, when the first and second cutting and ejecting means are activated, the first electronic device and the fourth electronic device are separated from the lead frame. At this time, the third electronic device is still carried on the lead frame. Further, the pitch feeding device further feeds the lead frame by 2 pitches onto the transport path. Then, the third electronic device reaches the second cutting and extracting means, the sixth electronic device reaches the first cutting and extracting means, and the third and sixth electronic devices are connected to each other. At the same time, the lead frame is taken out. In this way, the first cutting and ejecting device is an even-numbered electronic device, the second cutting and ejecting device is an odd-numbered electronic device,
There is a space of 3 pitches between the electronic device taken out from the lead frame and taken out by the first cutting and taking out means and the electronic device taken out by the second cutting and taking out means. The intervals of these three pitches are enough to arrange the roller bend means at two positions in the front-rear direction. As described above, for example, the first and fourth electronic devices simultaneously taken out from the lead frame are laterally conveyed as they are to the lead bend position,
Moreover, the leads of these two electronic devices are bent by the two roller bending means without any problems.
The electronic device that is lead-bended and completed in this way is sent to the next step, for example, the inspection step.

【effect】

As described above, according to the lead bend method of the present invention, the leads of the plurality of electronic devices that are respectively taken out from the plurality of positions sufficiently separated in the feed direction of the lead frame are roller-bended. The roller bend means can be arranged at a sufficient distance that is equivalent to the distance between the devices. Therefore, the electronic device can be easily transported from the electronic device take-out device from the lead frame to the roller bend means without complicating the device structure. In this way, the efficiency of the high-quality lead bend by the roller is doubled, and the manufacturing efficiency of the electronic device in which the appearance quality is maintained high is dramatically improved.

[Explanation of Examples]

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. In the following, a case will be described in which the lead frames are intermittently fed by 2 pitches and the semi-finished product is bent from each of the lead frames by 2 pieces. As shown in FIG. 1, the lead frame F, which has undergone the resin packaging process, is carried by the pitch feeding means (not shown) on the conveying path 1 by two pitches, that is, the electronic device D carried on the lead frame F. Is intermittently fed by a distance that is twice the pitch interval. In the middle of the transport path 1, cutting and taking-out means 2a and 2b are arranged at three positions at three pitch intervals, one in front of the lead frame F and one in the front of the lead frame F. The electronic device is not taken out from the lead frame F by a single cutting press, but actually, the lead cutting process for separating the tip end of the lead and the dam bar or the tie bar, the support cutting for separating the island support and the side frame. The cutting and taking-out means 2a and 2b in the present invention finally lead the semi-finished product to the lead frame. It is the process of separating from. An electronic device that is cut off and dropped by the cutting device 2a and 2b is received below the cutting and taking-out device 2a and 2b, and the electronic device D is conveyed to the roller bend position of the roller bend device 3a and 3b located on the side thereof. A shooter 4 is arranged. As the shooter, as well shown in FIG. 2, a guide rail having an abutment portion 4a for receiving leads extending in the front and rear direction from the package portion, a central groove 4b for accommodating the package portion, and this guide rail. The electronic device D that has fallen upward can be simply configured by the protruding bar 4c that pushes in the longitudinal direction of the guide rail. Roller bend means for bending the front and rear leads of the electronic device D downward are provided on the extension of the guide rails. These roller bend means 3a, 3b
Is a receiving jig 5 having a cross section equivalent to that of the guide rail.
And a pair of rollers 6 and 6 which are supported at appropriate intervals in the front-rear direction and can be vertically moved by the elevating means. Then, when the electronic device before the lead bend is placed on the receiving jig 5 and the rollers 6 and 6 are moved downward, the lead L is pressed against the side surface of the receiving jig 5 by the rollers 6 and 6. It can be bent almost at right angles downward. Next, the continuous operation of the apparatus of this example will be described. First, a process in which two electronic devices D on the lead frame F are taken out will be described with reference to FIG. First, the lead frame F is fed by two pitches by the pitch feeding means, and the state shown in FIG. 3 (a) is obtained. At this time, the first electronic device D1 and the second electronic device D
2 is sent out on the conveyance path 1, and the second electronic device D2 reaches the position corresponding to the upstream first cutting and taking-out means 2a of the two cutting and taking-out means. In this state, the first cutting and taking-out means 2a is operated, and the second electronic device D2 is taken out from the lead frame F and dropped on the shooter 4 as shown in FIG. 3 (b). At this time, the first electronic device D1 is still carried on the lead frame F. Next, the lead frame F is further fed by two pitches,
The state becomes as shown in FIG. 3 (c). At this time, the first electronic device D1 left on the lead frame in the above process has reached the position corresponding to the second cutting and ejecting means 2b, and the fourth electronic device D4 has the above-mentioned first electronic device D4. The position corresponding to one cutting and taking-out means 2a is reached. In this state, the first cutting and taking-out means 2a and the second cutting and taking-out means 2b are operated, and the fourth electronic device D4 and the first electronic device D1 lead as shown in FIG. 3 (d). It is taken out of the frame F and dropped on each shooter. At this time, the third electronic device D3 is still carried on the lead frame F. Furthermore, when the lead frame F is sent out by 2 pitches,
As shown in FIGS. 3 (e) and 3 (f), the sixth electronic device and the third electronic device D3 are taken out and dropped on each shooter. In this manner, the first cutting and ejecting means 2a takes charge of taking out even-numbered electronic devices, and the second cutting and taking-out means 2 takes charge of taking out odd-numbered electronic devices. It is taken out from the lead frame F. Then, the first and second cutting and extracting means 2 described above.
The electronic devices D dropped onto the two shooters 4 corresponding to a and 2b are sequentially conveyed to the roller bend positions of the roller bend means 3a and 3b by the projecting rods 4c, and then the leads thereof are read as described above. L is roller-bended to obtain a finished product as shown in FIG. The electronic device D thus lead-bended and completed is carried to the next inspection step, for example. As described above, according to the lead bend method of the present invention and the apparatus used for the same, it is possible to efficiently perform lead bend with a high appearance quality by the roller bend method, and to avoid complication of the apparatus. Of course, the scope of the present invention is not limited to the embodiments described above. That is, in the embodiment, two electronic devices are taken out from the lead frame and the lead bends are made in parallel. However, three electronic devices or more electronic devices are taken out and these are made in parallel. You can also lead bend. For example, if you take out three electronic devices and lead bend them,
As shown in FIG. 4, the cutting and ejecting means 2c, 3n-1th electronic device is in charge of taking out the 3n−2nd (n is an integer of 1 or more. The same applies below) electronic device. The cutting and taking-out means 2d for taking charge of the 3nth electronic device, and the cutting and taking-out means 2e for taking out the 3n-th electronic device are arranged at an interval of 3 + 1 = 4 pitches. The device may be configured with the three roller bend means arranged at. The first cutting and taking-out means and the second cutting and taking-out means do not have to operate at the same time.

[Brief description of drawings]

FIG. 1 is an overall schematic configuration diagram of an embodiment of the apparatus of the present invention, FIG.
The figure is its cross-sectional view, and FIGS. 3 (a) to 3 (f) are explanatory views of operation,
FIG. 4 is an explanatory view of another embodiment of the present invention, FIG. 5 is a plan view of the lead frame after the packaging process, FIG. 6 is a side view of a semi-finished product before lead bend, and FIG. 7 is a lead bend. FIG. 8 is a side view of the subsequent product, FIG. 8 is an explanatory view of an ironing bend method, and FIG. 9 is an explanatory view of a roller bend method. 1 ... conveyance path, 2a, 2b ... cutting and removing means, 3
a, 3b ... Roller bend means, F ... Lead frame, L ... Lead, D ... Electronic device (semi-finished product).

Claims (2)

[Claims] 1. A lead frame is intermittently sent at intervals of N pitches on a conveying path provided with cutting and ejecting means arranged at N points for each N + 1 pitch (N is an integer of 2 or more; the same applies hereinafter in this section). After each pitch of the frame has been fed, the cutting and take-out means is operated to take out the N semi-finished products having the leads before bending from the lead frame, and the N semi-finished products in the state of being taken out. A lead bending method in a manufacturing process of an electronic device, characterized in that N roller bending means arranged at N + 1 pitch intervals corresponding to the intervals of the semi-finished products are bent. 2. A transport path for intermittently feeding the lead frame by N pitches (N is an integer of 2 or more; the same applies to the following in this section), and a lead frame arranged at N + 1 pitch intervals in the longitudinal direction of the transport path. Of N cutting and taking-out means for taking out the semi-finished product having the lead before bending from the lead frame by operating after each pitch feed, and N shooters for conveying the taken-out semi-finished product to a predetermined lead bend position. A lead bend device in a manufacturing process of an electronic device, comprising: N roller bend means for bending a lead of each semi-finished product conveyed to the lead bend position by the shooter.