JPH0657738B2 - One-part epoxy resin composition - Google Patents
One-part epoxy resin compositionInfo
- Publication number
- JPH0657738B2 JPH0657738B2 JP61111812A JP11181286A JPH0657738B2 JP H0657738 B2 JPH0657738 B2 JP H0657738B2 JP 61111812 A JP61111812 A JP 61111812A JP 11181286 A JP11181286 A JP 11181286A JP H0657738 B2 JPH0657738 B2 JP H0657738B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- latent
- anhydride
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 37
- 229920000647 polyepoxide Polymers 0.000 title claims description 37
- 239000000203 mixture Substances 0.000 title claims description 21
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 9
- 239000003208 petroleum Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 claims description 7
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical group ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- -1 alicyclic carboxylic acid Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、金属との密着性に優れ、安定性のよい一液性
エポキシ樹脂組成物に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a one-component epoxy resin composition having excellent adhesion to a metal and good stability.
（従来の技術） エポキシ樹脂は、電気特性、耐湿性および接着性に優
れ、しかもポリエステル樹脂などに比較して硬化時の収
縮が小さいという特性を有するため、電気部品、半導体
素子、集積回路の絶縁封止用等として広く使用されてい
る。(Prior Art) Epoxy resin has excellent electrical characteristics, moisture resistance, and adhesiveness, and has a property that shrinkage upon curing is smaller than that of polyester resin, etc., and therefore, insulation of electrical parts, semiconductor elements, and integrated circuits. Widely used for sealing.
エポキシ樹脂の中でも、特にカルボン酸無水物硬化剤を
使用したものは、低粘度で作業性が良いため広く使用さ
れているが、比較的金属に対する密着力或いは接着力に
乏しく、金属ケースと樹脂、金属と金属との界面をこの
エポキシ系樹脂で接着又は封止すると、その金属界面で
剥離が発生するおそれがある。Among epoxy resins, those using a carboxylic acid anhydride curing agent are widely used because of their low viscosity and good workability, but they have relatively poor adhesion or adhesion to metals, and metal cases and resins, If the interfaces between metals are adhered or sealed with this epoxy resin, peeling may occur at the metal interfaces.
またエポキシ樹脂の一般的な硬化剤として、ほかに、ポ
リアミン類、有機二塩基酸無水物およびフェノール樹脂
が使用されているが、これらの硬化剤はエポキシ樹脂と
混合した場合の可使時間が数分ないし数日と短いため、
エポキシ樹脂と硬化剤とを別々に保管しておき、使用直
前に混合する多液性であり、そのため予備分散−秤量−
混合−脱気の予備作業工程が必要であった。このような
作業性の悪さを改善させたものとして、潜在性硬化剤と
して三フッ化ほう素のアミン錯体またはジシアンジアミ
ドを用いた一液性エポキシ樹脂組成物がある。しかし、
三フッ化ほう素のアミン錯体で、数ケ月の可使時間を有
し、しかも120℃〜150℃で速やかに硬化する利点を持っ
ているが、硬化時にアミンガスを発生しやすく、このた
め特に半導体素子を含む電子部品の封止剤としては素子
を汚染する点から使用できないという欠点がある。In addition, polyamines, organic dibasic acid anhydrides, and phenolic resins are also used as general curing agents for epoxy resins, but these curing agents have several pot life when mixed with epoxy resins. Because it is as short as a few minutes or a few days,
Epoxy resin and curing agent are stored separately, and they are multi-liquid in which they are mixed immediately before use. Therefore, preliminary dispersion-weighing-
A preliminary work step of mixing-degassing was required. The one-component epoxy resin composition using an amine complex of boron trifluoride or dicyandiamide as a latent curing agent is one of those which has improved such poor workability. But,
It is an amine complex of boron trifluoride, has a pot life of several months, and has the advantage that it cures quickly at 120 ° C to 150 ° C, but it tends to generate amine gas during curing, which makes it especially suitable for semiconductors. There is a drawback in that it cannot be used as a sealant for electronic parts including an element because it contaminates the element.
また、ジシアンジアミドは単独で使用する場合は170℃
以上という高い硬化温度を要するという欠点がある。When dicyandiamide is used alone, 170 ℃
There is a drawback that a high curing temperature as described above is required.
（発明が解決しようとする問題点） 本発明は、上記の欠点を解消するためになされたもので
あり、金属との密着性、接着性に優れ、室温付近で優れ
た作業性と潜在性を有し可使時間が長く、かつ100〜150
℃の温度で速やかに硬化できる一液性エポキシ樹脂組成
物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention has been made in order to eliminate the above-mentioned drawbacks, and has excellent adhesiveness to metal, excellent adhesiveness, and excellent workability and potential near room temperature. Long working life and 100-150
It is intended to provide a one-pack type epoxy resin composition which can be rapidly cured at a temperature of ° C.
［発明の構成］ （問題点を解決するための手段と作用） 本発明者は、上記の目的を達成しようと鋭意研究を重ね
た結果、ノルボネン環を有する化合物と潜在性ヒドラジ
ン系触媒を用いるならば、密着性に優れ、可使時間が長
いことを見いだし本発明を完成したものである。即ち、
本発明は、カルボン酸無水物系硬化剤を含むエポキシ樹
脂に、石油のＣ５〜Ｃ９留分から得られるノルボネン環
を有する石油樹脂、及び硬化促進剤として潜在性ヒドラ
ジン系触媒を配合することを特徴とする絶縁封止用の一
液性エポキシ樹脂組成物である。そして潜在性ヒドラジ
ン系触媒をエポキシ樹脂組成物に対して0.5〜5.0重量％
配合することが好ましい組成物である。[Structure of the Invention] (Means and Actions for Solving Problems) As a result of intensive studies to achieve the above-mentioned object, the present inventor found that if a compound having a norbornene ring and a latent hydrazine-based catalyst are used. Thus, the present invention has been completed by discovering that the adhesiveness is excellent and the pot life is long. That is,
According to the present invention, an epoxy resin containing a carboxylic acid anhydride-based curing agent is mixed with a petroleum resin having a norbornene ring obtained from a C 5 to C 9 fraction of petroleum, and a latent hydrazine-based catalyst as a curing accelerator. It is a characteristic one-component epoxy resin composition for insulating and sealing. And the latent hydrazine-based catalyst is 0.5 to 5.0% by weight with respect to the epoxy resin composition.
It is a preferable composition to be blended.
本発明に用いるエポキシ樹脂としては、ビスフェノール
Ａ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、
フェノールノボラック型エポキシ樹脂、クレゾールノボ
ラック型エポキシ樹脂、脂環式エポキシ樹脂、含複素環
エポキシ樹脂、水添ビスフェノールＡ型エポキシ樹脂、
脂肪族系エポキシ樹脂、芳香族，脂肪族もしくは脂環式
のカルボン酸とエピクロルヒドリンとの反応によって得
られるエポキシ樹脂、スピロ環含有エポキシ樹脂等が挙
げられる。市販品の例としては、シェル化学社製の商品
名“エピコート”８０７，８２７，８２８，８３７，１
００１，１００４、チバガイギー社製の商品名“アラル
ダイト”ＣＹ−１７５，１８２，１８３、ダウケミカル
社製の商品名“ＤＥＮ”４３１，４３８、同じく“ＤＥ
Ｒ”３３２、ダイセル化学社製の商品名“セロキサイ
ド”２０２１、旭電化工業社製の商品名“アデカレジ
ン”ＥＰ４０８０等がある。これらのエポキシ樹脂は単
独もしくは２種以上混合して使用する。エポキシ樹脂の
硬化剤として用いるカルボン酸無水物の例としては、無
水フタル酸、無水テトラヒドロフタル酸、無水3,6−エ
ンドメチレンテトラヒドロフタル酸、無水ヘキサヒドロ
フタル酸、無水メチルヘキサヒドロフタル酸、無水コハ
ク酸、無水アジピン酸、無水マレイン酸、ピロメリット
酸二無水物等が挙げられ、これらは単独もしくは２種以
上混合して用いる。The epoxy resin used in the present invention includes bisphenol A type epoxy resin, bisphenol F type epoxy resin,
Phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, hydrogenated bisphenol A type epoxy resin,
Examples thereof include an aliphatic epoxy resin, an epoxy resin obtained by reacting an aromatic, aliphatic or alicyclic carboxylic acid with epichlorohydrin, and a spiro ring-containing epoxy resin. Examples of commercially available products include "Epicote" 807,827,828,837,1 manufactured by Shell Chemical Co., Ltd.
001, 1004, product name "Araldite" CY-175, 182, 183 manufactured by Ciba Geigy, product name "DEN" 431, 438 manufactured by Dow Chemical Co., and also "DE"
R "332, trade name" Celoxide "2021 manufactured by Daicel Chemical Co., Ltd., trade name" Adeka Resin "EP 4080 manufactured by Asahi Denka Kogyo Co., Ltd. These epoxy resins may be used alone or in combination of two or more. Examples of the carboxylic acid anhydride used as a curing agent for phthalic anhydride include phthalic anhydride, tetrahydrophthalic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, and succinic anhydride. , Adipic anhydride, maleic anhydride, pyromellitic dianhydride, etc., and these may be used alone or in admixture of two or more.
本発明に用いるノルボネン環を有する石油樹脂は、石油
のＣ５〜Ｃ９留分から得られる汎用の樹脂である。具体
的な市販品としては、セロキサイド４０００（ダイセル
化学社製、商品名）、タッキロール１０００（住友化学
工業社製、商品名）、クイントン１５００，１０００，
１３００（日本ゼオン社製、商品名）等が挙げられ、こ
れらは単独もしくは２種以上混合して用いる。The petroleum resin having a norbornene ring used in the present invention is a general-purpose resin obtained from a C 5 to C 9 fraction of petroleum. As specific commercially available products, Celoxide 4000 (manufactured by Daicel Chemical Co., Ltd., trade name), Tacky Roll 1000 (manufactured by Sumitomo Chemical Co., Ltd., trade name), Quinton 1500, 1000,
1300 (manufactured by Nippon Zeon Co., Ltd.) and the like, and these may be used alone or in admixture of two or more.
本発明に硬化促進剤として用いる潜在性ヒドラジン系触
媒としては、例えば味の素社製、商品名“アミキュア”
シリーズがあり、品番ＰＮ−２３，ＭＹ−２４，ＢＡＤ
Ｈ，ＣＴＤＨ等が挙げられ、これらは単独もしくは２種
以上混合して用いる。潜在性ヒドラジン系触媒の配合割
合は、カルボン酸無水物硬化剤を含むエポキシ樹脂組成
物に対して0.5〜5.0重量％配合することが望ましい。配
合割合が0.5重量％未満の場合は、硬化に著しく時間を
要し実用的でなく、また5.0重量％を超えると可使時間
が短くなり、更に硬化組成物の特性が低下し好ましくな
い。従ってその範囲は上記の通り限定するのがよい。Examples of the latent hydrazine-based catalyst used as the curing accelerator in the present invention include, for example, the product name “Amicure” manufactured by Ajinomoto Co., Inc.
There is a series, product number PN-23, MY-24, BAD
H, CTDH, etc. may be mentioned, and these may be used alone or in admixture of two or more. The compounding ratio of the latent hydrazine-based catalyst is preferably 0.5 to 5.0% by weight with respect to the epoxy resin composition containing the carboxylic acid anhydride curing agent. If the blending ratio is less than 0.5% by weight, it takes a long time to cure and is not practical, and if it exceeds 5.0% by weight, the pot life is shortened and the properties of the cured composition are further deteriorated, which is not preferable. Therefore, the range should be limited as described above.
本発明の一液性エポキシ樹脂組成物は、前述したカルボ
ン酸無水物を含むエポキシ樹脂、ノルボネン環を有する
石油樹脂、および潜在性ヒドラジン系触媒を混合撹拌均
一化して容易に得られるが、本発明の主旨に反しない限
り、必要に応じて顔料、可塑剤、着色剤、充填剤、揺変
剤、その他の添加剤等を適宜選択して配合することがで
きる。こうして得られた組成物は、電気部品、半導体素
子、集積回路等の電気絶縁や封止用として広く使用する
ことができる。The one-component epoxy resin composition of the present invention can be easily obtained by mixing and homogenizing the above-mentioned epoxy resin containing a carboxylic acid anhydride, a petroleum resin having a norbornene ring, and a latent hydrazine-based catalyst. As long as it does not violate the principle of the above, a pigment, a plasticizer, a colorant, a filler, a thixotropic agent, other additives and the like can be appropriately selected and blended as necessary. The composition thus obtained can be widely used for electrical insulation and sealing of electric parts, semiconductor elements, integrated circuits and the like.
（実施例） 次に本発明を実施例によって説明するが、本発明はこれ
らの実施例によって限定されるものではない。(Examples) Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples.
実施例１ エポン８２８（シェル化学社製エポキシ樹脂、商品名）
80ｇ、セロキサイド４０００（ダイセル化学社製ノルボ
ネン環を有する化合物、商品名）20ｇ、硬化剤の無水ヘ
キサハイドロフタル酸100ｇ、および硬化促進剤として
ＭＹ−２４（味の素社製、商品名）５ｇを均一に混合撹
拌し、一液性エポキシ樹脂組成物を得た。Example 1 Epon 828 (epoxy resin manufactured by Shell Chemical Co., trade name)
Uniformly 80 g, Celoxide 400 (a compound having a norbornene ring manufactured by Daicel Chemical Co., Ltd.), 100 g of hexahydrophthalic anhydride as a curing agent, and 5 g of MY-24 (a product of Ajinomoto Co., Inc.) as a curing accelerator. By mixing and stirring, a one-pack type epoxy resin composition was obtained.
実施例２〜３ 第１表に示した組成によって、実施例１と同様にしてそ
れぞれ一液性のエポキシ樹脂組成物を得た。Examples 2 to 3 In the same manner as in Example 1, one-pack type epoxy resin compositions were obtained with the compositions shown in Table 1.
比較例１〜２ 第１表に示した組成によって、実施例１と同様にしてそ
れぞれエポキシ樹脂組成物を得た。Comparative Examples 1 and 2 Epoxy resin compositions were obtained in the same manner as in Example 1 with the compositions shown in Table 1.
実施例１〜３および比較例１〜２に得られたエポキシ樹
脂組成物についてＪＩＳ−Ｃ−２１０５に従って、絶縁
特性、密着性および安定性等の試験を行ったので、その
結果を第１表に示した。The epoxy resin compositions obtained in Examples 1 to 3 and Comparative Examples 1 to 2 were tested for insulation properties, adhesion, stability and the like according to JIS-C-2105. The results are shown in Table 1. Indicated.
いずれも本発明の顕著な効果が認められた。In all cases, the remarkable effect of the present invention was recognized.
［発明の効果］ 本発明の一液性エポキシ樹脂組成物は、ノルボネン環を
有する石油樹脂、潜在性ヒドラジン系触媒を配合したこ
とによって、金属との良好な密着性を有し、室温付近に
おける良好な作業性と可使時間に優れたもので、電気部
品、半導体素子、ＩＣの電気絶縁ならびに封止用等とし
て好適なものである。 [Effects of the Invention] The one-pack type epoxy resin composition of the present invention has good adhesion to a metal by mixing a petroleum resin having a norbornene ring and a latent hydrazine-based catalyst, and is good at room temperature. It has excellent workability and pot life, and is suitable for electrical insulation and sealing of electric parts, semiconductor elements and ICs.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location H01L 23/31
Claims (2)
樹脂に、石油のＣ５〜Ｃ９留分から得られるノルボネン
環を有する石油樹脂、及び硬化促進剤として潜在性ヒド
ラジン系触媒を配合することを特徴とする絶縁封止用の
一液性エポキシ樹脂組成物。1. An epoxy resin containing a carboxylic anhydride curing agent, a petroleum resin having a norbornene ring obtained from a C 5 to C 9 fraction of petroleum, and a latent hydrazine catalyst as a curing accelerator. A one-pack type epoxy resin composition for insulating and sealing.
組成物に対して0.5〜5.0重量％配合する特許請求の範囲
第１項記載の絶縁封止用の一液性エポキシ樹脂組成物。2. A one-pack type epoxy resin composition for insulation and sealing according to claim 1, wherein the latent hydrazine catalyst is blended in an amount of 0.5 to 5.0% by weight based on the epoxy resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111812A JPH0657738B2 (en) | 1986-05-17 | 1986-05-17 | One-part epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61111812A JPH0657738B2 (en) | 1986-05-17 | 1986-05-17 | One-part epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62270616A JPS62270616A (en) | 1987-11-25 |
| JPH0657738B2 true JPH0657738B2 (en) | 1994-08-03 |
Family
ID=14570777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61111812A Expired - Lifetime JPH0657738B2 (en) | 1986-05-17 | 1986-05-17 | One-part epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0657738B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022101508A (en) * | 2020-12-24 | 2022-07-06 | Dic株式会社 | Two-component curable epoxy resin composition, cured product and lining agent |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57137318A (en) * | 1981-02-20 | 1982-08-24 | Ajinomoto Co Inc | One-can type epoxy resin composition |
| JPS6060126A (en) * | 1983-09-13 | 1985-04-06 | Toshiba Corp | Epoxy composition |
| JPS6072954A (en) * | 1983-09-30 | 1985-04-25 | Dainippon Toryo Co Ltd | Long-period rustproof coating composition |
-
1986
- 1986-05-17 JP JP61111812A patent/JPH0657738B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022101508A (en) * | 2020-12-24 | 2022-07-06 | Dic株式会社 | Two-component curable epoxy resin composition, cured product and lining agent |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62270616A (en) | 1987-11-25 |
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