JPH0658204B2 - Sample plane position measuring device - Google Patents
Sample plane position measuring deviceInfo
- Publication number
- JPH0658204B2 JPH0658204B2 JP60189702A JP18970285A JPH0658204B2 JP H0658204 B2 JPH0658204 B2 JP H0658204B2 JP 60189702 A JP60189702 A JP 60189702A JP 18970285 A JP18970285 A JP 18970285A JP H0658204 B2 JPH0658204 B2 JP H0658204B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- sample
- measuring device
- semiconductor laser
- sample surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は、試料面の位置を光学的に測定する試料面高さ
測定装置に係わり、特に半導体製造装置におけるウエハ
やマスク等の試料面の位置を測定するのに適した試料面
位置測定装置に関する。Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a sample surface height measuring device for optically measuring the position of a sample surface, and particularly to the position of a sample surface such as a wafer or a mask in a semiconductor manufacturing apparatus. The present invention relates to a sample surface position measuring device suitable for measuring the.
LSI製造装置、例えば電子ビーム露光装置において、
半導体ウエハやマスク基板等の試料にパターンを描画形
成する場合、試料の反りその他の要因により試料表面の
位置(光学系に対する距離)が変動すると、描画パター
ンに誤差が生じる。そこで従来、試料の面の変動量を測
定し、該変動量に応じてその補正を行う方法を採用して
いる。In an LSI manufacturing apparatus such as an electron beam exposure apparatus,
When a pattern is formed by drawing on a sample such as a semiconductor wafer or a mask substrate, if the position of the sample surface (distance to the optical system) changes due to warpage of the sample or other factors, an error occurs in the drawing pattern. Therefore, conventionally, a method has been adopted in which the amount of fluctuation of the surface of the sample is measured and the correction is performed according to the amount of fluctuation.
試料面位置測定装置としては、第6図に示す如く光学的
手法を利用したものがある(特開昭56−2632号公
報)。この装置では、レーザ光源Lから放射された光を
レンズL1によりスポツト状に集束して試料面上に照射
し、その反射光をレンズL2によつて検出器D上に結像
させる。そしてこの検出器Dの検出出力を演算処理する
ことによつて、試料表面の高さ位置を測定している。As a sample plane position measuring device, there is one using an optical method as shown in FIG. 6 (Japanese Patent Laid-Open No. 56-2632). In this apparatus, the light emitted from the laser light source L is focused in a spot shape by the lens L 1 and irradiated on the sample surface, and the reflected light is imaged on the detector D by the lens L 2 . The height position of the sample surface is measured by calculating the detection output of the detector D.
そして、従来は光源として上記例のごとくレーザ光源を
用い、被測定面に対して平行なS偏向とそれに直角なP
偏向との和である光源を用いていた。然しながら、被測
定面上に形成されたレジスト膜に露光を行なう場合、P
偏向はレジスト膜の表面で反射する光量よりもレジスト
膜内へ入射する光量の方が大きくなる。この時、レジス
ト膜の下の半導体基板の状態が反射率の高いアルミニウ
ムの場合などが蒸着されている時、レジスト表面で反射
する光量にAl表面の反射光が合算され、正確な表面の
情報が得られないという欠点があつた。Conventionally, a laser light source is used as a light source as in the above example, and an S deflection parallel to the surface to be measured and a P deflection perpendicular thereto
It used a light source that is the sum of the deflection. However, when the resist film formed on the surface to be measured is exposed, P
The deflection is larger in the amount of light entering the resist film than in the amount of light reflected on the surface of the resist film. At this time, when the state of the semiconductor substrate under the resist film is aluminum with high reflectance, the amount of light reflected on the resist surface is summed with the reflected light on the Al surface to obtain accurate surface information. There was a drawback that it could not be obtained.
このような欠点を防止する1つの方法として特特開昭56
-101112公報に示されているように被測定面にS偏向の
みを用いて測定する方法があるが偏向フイルタを入射光
側に入れなければならないという欠点があつた。As one method for preventing such a defect, Japanese Patent Laid-Open No.
Although there is a method of measuring only the S-deflection on the surface to be measured as shown in Japanese Patent Laid-Open No. 101112, there is a drawback that the deflection filter must be placed on the incident light side.
本発明は上記問題に鑑み、偏光フイルターを入れること
なしにS偏向が主な光を照射する光学系を提供すること
にある。In view of the above problems, the present invention is to provide an optical system that irradiates light mainly for S-polarization without inserting a polarization filter.
本発明の目的を達成するために、光源には半導体レーザ
ーを用いることとし、この半導体レーザの発光特性に注
目し、半導体レーザの設置方法の変更することによつ
て、上記問題を低減させるものである。In order to achieve the object of the present invention, a semiconductor laser is used as a light source, paying attention to the emission characteristics of this semiconductor laser, and changing the installation method of the semiconductor laser to reduce the above problems. is there.
本発明によれば、P偏向とS偏向からなる光源を偏向フ
イルタによつてS偏向のみに分離することなく同様な効
果が得られるため、構造が簡単でフイルターによる透過
率の低減効果の生じない試料面位置測定装置を提供する
ことができる。According to the present invention, since the same effect can be obtained without separating the light source consisting of P-deflection and S-deflection into only S-deflection by the deflection filter, the structure is simple and the effect of reducing the transmittance by the filter does not occur. A sample surface position measuring device can be provided.
通常用いられている光斜入射形試料面測定装置を第1図
に示す。光源11から出た光はスリツト12を通つてミラー
13で反射、レンズ15によつて集光され、試料面上でスリ
ツト像を結像する。FIG. 1 shows a generally used oblique-incidence type specimen surface measuring device. The light emitted from the light source 11 passes through the slit 12 and is mirrored.
It is reflected by 13 and is condensed by the lens 15 to form a slit image on the sample surface.
試料面から反射した光は、再度レンズ32で集光され、ミ
ラー33で反射し、検出器35に入射する。The light reflected from the sample surface is condensed again by the lens 32, reflected by the mirror 33, and incident on the detector 35.
ここで一般に円偏向を行なつている光源を第1図に示し
た装置で使用した場合第2図に示すような、S偏向成分
の反射率カーブRs、P偏向成分の反射率カーブRPとな
る。Here, as shown a light source commonly circular deflection line summer in Figure 2 when used in the apparatus shown in FIG. 1, curve reflectance for S-polarized component R s, the curve reflectivity of P polarized component R P Becomes
光斜入射形試料面位置検出器では、一般に入射角は20〜
80°程度が使用される。このため図示したようにP偏向
成分の反射率が低い、すなわち、透過率が高い領域で使
用されるため、例えば第3図に示すようにレジスト膜下
層の面に反射率の高いAlなどがコートされている場合
そこで反射率し、P偏向成分が検出器35に入り正確な位
置測定ができない。In general, the incident angle is 20-
About 80 ° is used. Therefore, as shown in the figure, since it is used in a region where the reflectance of the P-polarized component is low, that is, the transmittance is high, for example, as shown in FIG. 3, the surface of the resist film lower layer is coated with Al or the like having high reflectance. If so, there is reflectance and the P-polarized component enters the detector 35, and accurate position measurement cannot be performed.
そこで偏向フイルターを用いてP偏向をカツトすること
が行なわれているが、本発明では光源11に半導体レーザ
を用いることによつて解決している。すなわち、半導体
レーザから発射する光は直線偏向であることに注目し、
第5図に示すように半導体レーザの取付において自由に
放射光軸回りに回転可能なようにしておく。Therefore, a P-deflection is cut using a deflection filter, but in the present invention, the problem is solved by using a semiconductor laser for the light source 11. That is, note that the light emitted from the semiconductor laser is linearly polarized,
As shown in FIG. 5, the semiconductor laser is mounted so that it can be freely rotated around the radiation optical axis.
測定すべき面に対して、例えば非常に厚いガラス面(第
4図に示すように)で検出器35に入射する光量が最大と
なるように半導体レーザを回転して調整する。The semiconductor laser is rotated and adjusted so that the amount of light incident on the detector 35 is maximized with respect to the surface to be measured, for example, on a very thick glass surface (as shown in FIG. 4).
この場合、先に説明したようにS偏向の反射波がもどつ
てくることになる。In this case, the S-polarized reflected wave is returned as described above.
このように半導体レーザが直線偏向していることに注目
し、その方向を自由に設定することによつて従来の問題
を解決することができる。By paying attention to the fact that the semiconductor laser is linearly deflected in this way and freely setting the direction, the conventional problems can be solved.
このような試料面位置測定装置は半導体を製造するさま
ざまな装置に使用することができる。Such a sample surface position measuring device can be used in various devices for manufacturing semiconductors.
第1図は、試料面位置測定装置を示す概略図、第2図は
S偏向及びP偏向の反射率を示す特性図、第3図は反射
光による誤差の説明図、第4図は調整を示すための説明
図、第5図は従来の測定装置を示す概略図、第6図は公
知の測定装置を示す概略図である。 11……光源、12……アパーチヤ、13……ミラ 15……レンズ、16……入射光、21……テーブル 22……試料、31……反射光、32……レンズ 33……ミラー、34……スリツト、35……検出器。FIG. 1 is a schematic diagram showing a sample surface position measuring device, FIG. 2 is a characteristic diagram showing reflectance of S deflection and P deflection, FIG. 3 is an explanatory diagram of errors due to reflected light, and FIG. FIG. 5 is a schematic diagram showing a conventional measuring device, and FIG. 6 is a schematic diagram showing a known measuring device. 11 …… light source, 12 …… aperture, 13 …… Mira 15 …… lens, 16 …… incident light, 21 …… table 22 …… sample, 31 …… reflected light, 32 …… lens 33 …… mirror, 34 …… Slit, 35 …… Detector.
Claims (1)
束光を照射する光照射部と、試料の表面で反射された反
射光を検出する光検出部とを備え、該反射光を光電検出
部によって受光することによって試料面の位置測定を行
なう試料面位置測定装置において光照射部内の光源とし
て直線偏向を有する半導体レーザを用い、この半導体レ
ーザの直線偏向方向を試料面と平行となる様に回転調整
して前記半導体レーザを取付けたことを特徴とする試料
面位置測定装置。1. A light irradiation section for irradiating the surface of a sample to be measured with focused light from an oblique direction, and a light detection section for detecting reflected light reflected on the surface of the sample, and photoelectrically reflecting the reflected light. In a sample surface position measuring device that measures the position of a sample surface by receiving light by a detection unit, a semiconductor laser having linear deflection is used as a light source in a light irradiation unit, and the linear deflection direction of this semiconductor laser is parallel to the sample surface. A device for measuring the position of a sample surface, wherein the semiconductor laser is mounted by adjusting the rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60189702A JPH0658204B2 (en) | 1985-08-30 | 1985-08-30 | Sample plane position measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60189702A JPH0658204B2 (en) | 1985-08-30 | 1985-08-30 | Sample plane position measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6250602A JPS6250602A (en) | 1987-03-05 |
| JPH0658204B2 true JPH0658204B2 (en) | 1994-08-03 |
Family
ID=16245762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60189702A Expired - Lifetime JPH0658204B2 (en) | 1985-08-30 | 1985-08-30 | Sample plane position measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0658204B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0227607B2 (en) * | 1983-10-31 | 1990-06-19 | Tokyo Shibaura Electric Co | ICHISOKUTEISOCHI |
| JPS60162901A (en) * | 1984-02-02 | 1985-08-24 | Riide Denki Kk | Noncontacting displacement measuring instrument |
-
1985
- 1985-08-30 JP JP60189702A patent/JPH0658204B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6250602A (en) | 1987-03-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |