JPH0660810B2 - Solder image processing device on ceramic substrate - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an image processing apparatus for a solder portion attached to various substrates, and more particularly to an image of a solder portion three-dimensionally attached to a ceramic substrate. And a device for processing.

(Prior Art) Conventionally, in this type of image processing apparatus, in order to prevent a shadow from being created in an image of a solder portion, JP-A-61-61
As described in Japanese Patent Laid-Open No. 294302, uniform diffused illumination by a dome is adopted, or in Japanese Patent Laid-Open No. 61-
As disclosed in Japanese Patent No. 293657, there is one in which a multi-point switching illumination is adopted so that an image of a solder portion is recognized in white.

(Problems to be Solved by the Invention) By the way, in such a configuration, the light reflectance is very high because the solder portion has a silver metallic color. Therefore, when the substrate surface around the solder portion has a color having a high contrast with the solder portion, such as a printed circuit board, the image of the solder portion can be clearly recognized in white.

However, if the periphery of the solder part has a silver color like a silver conductor or has a white color like a ceramic substrate, the light reflectance around the solder part is very high as in the solder part. As a result, the solder portion and the surrounding portion have similar colors. Therefore, the image of the solder portion can be obtained only as an image having a very poor contrast with the surrounding portion. This means that the inspection of the solder portion on the ceramic substrate cannot be done quickly and reliably. Further, since the outer dimension of the solder portion is usually several hundred μm or less, the image of the solder portion has to be enlarged, and as a result, the contrast of the image becomes worse due to the decrease of the light amount.

Also, JP-A-61-294302 or JP-A-6-294302
The illumination method as disclosed in Japanese Patent Laid-Open No. 1-293657 also has a drawback that a complicated structure is required for uniform diffused illumination and a complicated control is required for multipoint switching illumination.

Therefore, in order to deal with the above-mentioned problems, the present invention effectively utilizes a lighting method in which an image of a solder portion can be shaded, so that a solder image with high contrast is always obtained. It is intended to provide an image processing method.

(Means for Solving Problems) In solving the problems, the structural features of the present invention are as follows.
As shown in FIG. 1, a ceramic substrate 1, a conductor film 1 a provided on a part of the upper surface of the ceramic substrate 1, and a solder portion 2 three-dimensionally attached to a part of the upper surface of the ceramic substrate 1 are provided. The upper surface 1b of the ceramic substrate 1 and the upper surface 1c of the conductor film have the same light reflectivity as the solder portion 2, and on the ceramic substrate for processing the image of the solder portion 2 attached on the ceramic substrate 1. In a solder image processing apparatus, a light projecting means 3 for selectively projecting light, and when the light is projected from the light projecting means 3 while being supported above the solder portion 2, the light is substantially drooped on the top of the solder portion 2. The upper fiber ring light guide 4 for irradiating light, and when the light is projected from the light projecting means 3 while being coaxially supported below the upper fiber ring light guide 4, the light is laterally distributed to the middle abdomen of the solder portion 2. Light from the ring The lower fiber ring light guide 5 and the upper fiber ring light guide 4, which is supported above the upper fiber ring light guide 4, includes a plane image including the solder portion 2 and is photographed as a first image when the upper fiber ring light guide 4 is irradiated. The television camera 6 which sometimes shoots as the second image, and the solder portion other than the light specular reflection portion on the top of the solder portion of the first image is black,
First binarizing means 7 for binarizing the first image with a first threshold value that makes the other parts white, and solder other than the light-reflecting portion of the entire circumference middle abdomen of the second image. Second binarizing means 8 for binarizing the second image with a second threshold value such that a part is black and the other parts are white, and first and second binarizing means 7, 8 The image synthesizing means 9 for synthesizing each binarized image by each binarizing means according to 1) as the planar image with priority to black is provided.

(Operation) With the above configuration of the present invention, however, if the upper fiber ring light guide 4 irradiates the solder portion 2 and the ceramic substrate 1 with light from the light projecting means 3 in a substantially drooping manner, the solder portion 2 Becomes a silver color, the remaining portion of the solder portion 2 becomes a shadow, and the upper surface of the ceramic substrate 2 becomes white. In such a state, the television camera 6
When a plane image composed of the solder portion 2 and the ceramic substrate 1 is photographed as the first image, the first binarizing means 7 binarizes the first image with the first threshold value.

Further, the lower fiber ring light guide 5 is provided with the light projecting means 3.
When the solder portion 2 and the ceramic substrate 1 are laterally irradiated with light from, the middle portion of the entire circumference of the solder portion 2 becomes silver, the remaining portion of the solder portion 2 becomes shade, and the upper surface of the ceramic substrate 1 becomes white. Become. In such a state, the television camera 6 is configured such that the solder portion 2 and the ceramic substrate 1 are
When a plane image consisting of is taken as the second image,
Binarizing means 8 binarizes the second image with the second threshold value.

After that, the image synthesizing unit 9 synthesizes each of the above-mentioned binarized images as a plane image of the solder portion 2 with priority on black.

(Effect) As described above, the upper surface of the ceramic substrate 1 is a flat surface, whereas the solder portion 2 has a raised three-dimensional outer shape, so that the upper surface of the ceramic substrate 1 is less likely to be shaded, and the solder portion 2 Paying attention to the fact that the outer surface is likely to be shaded, even if the solder portion 2 has a color similar to that of the ceramic substrate 1 as the background, the black portions of the first and second images (that is, , Shadow areas) are combined with each other to obtain a planar image of the solder portion 2 as a binarized image with high contrast and faithful to the color of the ceramic substrate 1 without complicated image processing. As a result, the inspection of the amount of solder, the outer shape, the area, the defects, the holes, etc., of the highly dense and minute solder portion on the ceramic substrate 1 can be quickly and accurately realized at low cost.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings.
In the figure, reference numeral 10 indicates a ceramic substrate, and an upper surface 11 of the ceramic substrate 10 has a structure shown in FIGS.
As shown in the figure, a silver conductor thick film 20 made of silver paste is formed. Further, the solder portion 30 is formed on the upper surface of the thick silver conductor film 20 so as to have a three-dimensional shape as shown in FIGS. 2 and 4. In this case, the upper surface 11 of the ceramic substrate 10 has a white color, and the upper surface 21 of the silver conductor thick film 20 and the surfaces of the solder portions 30 have a silver metallic color.

The fiber ring light guide 40 is used for the ceramic substrate 1.
The fiber ring light guide 40 is supported immediately above 0 in parallel with it, and the central axis of the fiber ring light guide 40 coincides with the apex 31 of the solder portion 30. Further, the series of optical fibers 41 to 41 (only two optical fibers 41, 41 are shown in FIG. 2) of the fiber ring light guide 40 have their respective inner end portions 41 a in the entire circumference of the solder portion 30. The optical fibers 41 to 41 are fitted into the ring body 42 so as to face the abdomen 32 while being inclined from the side, and each of the optical fibers 41 to 41 has its outer end portion 41b (one light beam in FIG. 2). Only the outer end of the fiber is shown), and light is projected from the light projector 50 to irradiate the middle portion 32 of the entire circumference of the solder portion 30 in an annular shape. However, the light projector 50 is supported so as to oppose the outer end portion 41b of each optical fiber 41 with a gap.

The fiber ring light guide 60 is supported above and parallel to the fiber ring light guide 40.
The central axis of the fiber ring light guide 60 coincides with the central axis of the fiber ring light guide 40. Further, a series of optical fibers 61 to 61 of the fiber ring light guide 60 (in FIG. 2, two optical fibers 61, 61
(Only 61 is shown), each inner end portion 61a is connected to the solder portion 3
The optical fibers 61 to 61 are fitted in the ring body 62 so as to face the top of 0 (the portion including the apex 31) in a substantially drooping manner. The respective optical fibers 61 to 61 have their outer end portions 61b (see FIG. 2). (Only the outer end portion of one optical fiber is shown), light is projected from the light projector 70 and the top of the solder portion 30 is substantially drooped. However, the projector 70 uses each optical fiber 61.
It is supported directly above the light projector 50 and in parallel with it so as to face the outer end portion 61b with a gap.

The shutter 80 is composed of a rotary electric motor 81 supported behind both the projectors 50 and 70, and a shutter member 83 pivotally supported by a rotary shaft 82 extending from the rotary electric motor 81 between the projectors 50 and 70. Cage, shutter member 83
Is a rotating shaft 82 associated with the rotation of the rotary motor 81 in the positive direction.
The projector 5 rotates downward according to the rotation of the
The light projection from 0 to the outer end portion 41b of each optical fiber 41 is blocked. Further, the shutter member 83 rotates upward in response to the rotation of the rotary shaft 82 accompanying the rotation of the rotary electric motor 82 in the opposite direction, and enters the second switching state, whereby the projector 70 and each optical fiber 6 are rotated.
The light projection into the outer end portion 61b of No. 1 is blocked. The industrial television camera 90 includes a fiber ring light guide 60.
Is coaxially supported immediately above, and the image receiving portion 91 of the television camera 90 passes through the central axes of the fiber ring light guides 60 and 40 and faces the solder portion 30, the silver conductor thick film 20, and the ceramic substrate 10. is doing. Then, the television camera 90 photographs the solder portion 30, the thick silver conductor film 20, and the ceramic substrate 10 as a plane image viewed from above and generates an image reception signal.

The microcomputer 100 executes the computer program in accordance with the flowchart shown in FIG. 3 in cooperation with the television camera 90, and during this execution,
A drive circuit 110 connected to the rotary motor 81 and a C connected to a cathode ray tube 130 (hereinafter, referred to as CRT 130).
The arithmetic processing required for each control of the RT controller 120 is performed. The drive circuit 110 rotates the rotary motor 81 in the forward direction (or the reverse direction) under the control of the microcomputer 100. The CRT controller 120 controls the CRT 13 under the control of the microcomputer 100.
A sync signal and a video signal necessary for displaying 0 are generated. CR
T130 displays the content of the video signal on the display surface 130 according to the synchronizing signal and the video signal from the CRT controller 120.
a (see FIGS. 7 and 11).

In the present embodiment configured as described above, when the device of the present invention is in the operating state, both projectors 50 and 70 are in the projecting state, and the microcomputer 100 executes the computer program at step 200a according to the flowchart of FIG. Start execution. Next, in step 210, the microcomputer 100 generates a first switching output signal required to put the shutter 80 in the first switching state, and in response thereto, the rotary motor 81 is driven by the drive circuit 110 to be positive. And the shutter member 83 is brought into the first switching state.

Then, the light emitted from the light projector 50 to the optical fibers 41 to 41 of the fiber ring light guide 40 is blocked by the shutter member 83, and the light emitted from the light projector 70 is transmitted to the optical fibers 61 to 41 of the fiber ring light guide 60.
It is incident on 61 from each outer end portion 61b thereof. Thus, the light thus entering each optical fiber 61 is emitted from the inner end portion 61a of each optical fiber 61, and the solder portion 3
0, the silver conductor thick film 20 and the ceramic substrate 10 are incident from above in a substantially pendant shape. Therefore, the top of the solder portion 30 becomes silver, the remaining portion of the solder portion 30 becomes shade, the upper surface of the thick silver conductor film 20 becomes silver, and the upper surface of the ceramic substrate 10 becomes white.

In such a state, the television camera 90
Solder portion 30, silver conductor thick film 20, and ceramic substrate 10
When the image is captured as a plane image, the television camera 90 generates the plane image (hereinafter referred to as the first image) as an image reception signal. Then, the microcomputer 100
However, in step 210a, an image receiving signal is input from the television camera 90, and in step 210b, the solder portion other than the light specular reflection portion on the top of the solder portion of the first image is black and the other portions are white. The first binarizing means for binarizing the first image with a first threshold is the first
The white and silver parts of the image are binarized as "1" and the remaining shadow part is "0", and this first binarized image (see FIG. 5) is temporarily stored. .

After that, the microcomputer 100 operates the shutter 80.
When a second switching output signal required to bring the switch to the second switching state is generated, the rotary electric motor 81 is driven by the drive circuit 110 to rotate in the reverse direction, and the shutter member 83 is set to the second switching state. Then, the light emitted from the light projector 70 to the respective optical fibers 61 to 61 of the fiber ring light guide 60 is blocked by the shutter member 83, and the light emitted from the light projector 50 is transmitted to the respective optical fibers 4 of the fiber ring light guide 40.
The light enters from 1 to 41 from its outer end portion 41b. Then,
The light thus entering each optical fiber 41 is emitted from the inner end portion 41a of each optical fiber 41 and laterally enters the solder portion 30, the silver conductor thick film 20, and the ceramic substrate 10. Therefore, the middle portion of the solder portion 30 is silver in color, the remaining portion of the solder portion 30 is in shadow, the upper surface of the silver conductor thick film 20 is silver, and the ceramic substrate 1
The upper surface of 0 becomes white.

When the television camera 90 photographs the solder portion 30, the thick silver conductor film 20 and the ceramic substrate 10 as a plane image in such a state, the television camera 90
Generates the same plane image (hereinafter referred to as the second image) as an image receiving signal. Then, the microcomputer 100
In step 220a, an image receiving signal is input from the television camera 90, and in step 220c, the solder portion other than the light reflecting portion of the solder abdomen of the second image is black, and the other portions are white. A second binarizing unit that binarizes the second image with a second threshold value sets the white portion and the silver portion of the second image to "1" and the remaining shadow portion to "1". It is binarized as "0" and used as a second binarized image (see FIG. 6).

The microcomputer 100 then proceeds to step 23.
At 0, the first binary image at step 210c is combined with the second binary image at step 220c with black priority (that is, logical product) to form a combined image, and at step 240, The composite image is converted into display data, and this display data is generated as a display output signal in step 250. Then, the CRT controller 120 generates the content of the display output signal from the microcomputer 100 as a video signal together with the synchronization signal,
In response to this, the CRT 130 displays a plane image of the solder portion 30 in black on its display surface 130a as shown in FIG.

As described above, the upper surfaces of the ceramic substrate 10 and the thick silver conductor film 20 are flat, whereas the upper surfaces of the ceramic substrate 10 and the thick silver conductor film 20 have a three-dimensional outer shape in which the solder portion 30 is raised. Paying attention to the fact that it is difficult for shade to form on the outer surface of the solder portion 30
Even if the solder portion 30 has a color similar to that of the ceramic substrate 10 and the silver conductor thick film 20 which are the background, each black portion (that is, each shaded portion) of the above-mentioned first and second images.
By synthesizing the two with each other, the planar image of the solder portion 30 is binarized with high contrast and faithful to the colors of the ceramic substrate 10 and the silver conductor thick film 20 without complicated image processing for removing reflection noise. Obtained as an image.
As a result, the inspection of the amount of solder, the outer shape, the area, the defects, the holes, etc., of the highly dense and finely soldered portions on the ceramic substrate can be quickly and accurately realized at low cost.

In addition, in the above-described embodiment, the case where the plane image of the solder portion 30 is substantially circular has been described. However, the present invention is not limited to this. For example, in the case of the solder portion 30A having a plane image as shown in FIG. Also, as shown in FIGS. 9 to 11, similarly to the case shown in FIGS. 5 to 7, the first and second binarized images and the composite binarized image can be obtained.

Further, in carrying out the present invention, when the white portions of the above-mentioned first and second images are binarized with “0” and the remaining portion with “1”, the logical sum of both binarized images is obtained. If this is the case, the binarized image synthesis is given priority to black.

Further, in carrying out the present invention, the composite image in step 230 may be recorded on the data sheet by an appropriate printing mechanism without being limited to the CRT 130.

[Brief description of drawings]

FIG. 1 is a diagram corresponding to the configuration of the invention described in the claims, FIG. 2 is an overall configuration diagram showing an embodiment of the device of the present invention, and FIG. 3 is a flow chart showing the operation of the microcomputer in FIG. FIG. 4 is a plan view of the ceramic substrate, silver conductor thick film and solder portion in FIG. 2, FIG.
FIG. 6 is an explanatory view of the first image, FIG. 6 is an explanatory view of the second image, FIG. 7 is a display example of the solder portion, FIG. 8 is a plan view showing a modification of the solder portion, and FIG. 9 is the same. FIG. 10 is an explanatory diagram of a first image in a modified example, FIG. 10 is an explanatory diagram of the same second image, and FIG. 11 is a display exemplifying diagram of the modified example. Explanation of symbols 10 ... Ceramic substrate, 20 ... Silver conductor thick film, 30,
30A ... Solder part, 40, 60 ... Fiber ring light guide, 50, 70 ... Projector, 80 ... Shutter, 90 ... Television camera, 100 ... Microcomputer.

Claims (1)

[Claims] 1. A ceramic substrate, a conductor film provided on a portion of an upper surface of the ceramic substrate, and a solder portion three-dimensionally attached to a portion of an upper surface of the ceramic substrate,
An upper surface of the ceramic substrate and an upper surface of the conductor film have a light reflectance similar to that of the solder portion, and a solder image processing apparatus on a ceramic substrate for processing an image of a solder portion attached on the ceramic substrate. A projecting means for selectively projecting light, and an upper fiber ring light which is supported above the solder portion and irradiates the light on the top of the solder portion in a substantially drooping manner when projected from the projecting means. A guide and a lower fiber that is coaxially supported below the upper fiber ring light guide and irradiates the light from the light projecting means in an annular manner from the side to the middle abdomen of the entire solder portion. A ring light guide and a plane image that is supported above the upper fiber ring light guide and includes the solder portion are used to display a plane image of the upper fiber ring light guide. A television camera that shoots as a first image during shooting, and shoots as a second image when illuminating the lower fiber ring light guide, and a solder portion other than the specular reflection portion on the top of the solder portion of the first image is black, First binarizing means for binarizing the first image with a first threshold value that makes the other part whiter, and solder other than the light-reflecting portion of the solder whole circumference abdomen of the second image. Second binarizing means for binarizing the second image with a second threshold value such that a part is black and the other part is white; and each of the two binarizing means by the first and second binarizing means. An image synthesizing unit for synthesizing each binarized image by the binarizing unit as the plane image with black priority, and a solder image processing apparatus on a ceramic substrate.