JPH0660827B2 - Operation monitoring equipment for plant equipment - Google Patents

Description

TECHNICAL FIELD The present invention relates to an operation monitoring device for evaluating damage such as corrosion and fatigue formed in a structural member of plant equipment, and particularly to a nuclear power plant piping and the like. The present invention relates to an operation monitoring apparatus suitable for collecting signals from various sensors provided in equipment for detecting pressure, temperature, strain, etc., recording operation history data, and evaluating damage.

[Conventional technology]

In a conventional nuclear power plant, various sensors for detecting pressure, temperature, flow rate, etc. are provided in equipment such as piping, and the state quantities of these are measured. Depending on the measurement location, the sensor is connected to a dot recording recorder to record the measurement data on the chart paper.

[Problems to be Solved by the Invention]

By the way, the design life of the present nuclear power plant is allowed up to 40 years in heat cycle, and when the number of operating years increases, how much design heat cycle has been consumed or fatigue damage has been consumed. It is reasonable to evaluate whether the damage is large and issue an alarm if the damage is large, and increase the number of operating years if the damage is small enough, so-called extending the life.

However, conventionally, the measurement data measured by various sensors is only used for operation control and monitoring, and is not used for operation history management or damage evaluation. The measurement data recorded on the paper is not stored in a data-processed form, and there is a problem that the operation history of the equipment of the nuclear power plant is managed and damage evaluation based on the actual operation record cannot be performed.

The purpose of the present invention is to manage the operation history of plant equipment,
It is an object of the present invention to provide a plant equipment operation monitoring device capable of performing equipment damage evaluation.

[Means for Solving the Problems]

The present invention, in order to achieve the above object, pressure applied to the plant equipment, temperature, in the operation monitoring device of the plant equipment for evaluating damage such as fatigue and corrosion formed by strain, pressure, temperature, A sensor for detecting a state quantity such as distortion, collecting data of the state quantity from the sensor, a microcomputer for compressing the data, and connected to the microcomputer via an interface,
An operation monitoring apparatus, comprising: a host computer that records the compressed state quantity data transferred from the microcomputer as operation history data.

Then, in this operation monitoring device, the host computer preferably further performs stress analysis of the plant equipment using the recorded operation history data based on a stress analysis database stored in advance, and the analyzed stress The damage of the plant equipment is analyzed from the change, and the cumulative damage is recorded and evaluated.

The operation monitoring apparatus preferably further includes a host computer connected to the host computer via an interface and performing a detailed stress analysis using the operation history data transferred from the host computer. The damage of the plant equipment is analyzed again from the stress change obtained by the detailed stress analysis, and the accumulated damage is replaced with the accumulated damage recorded in the host computer and recorded and evaluated.

Further preferably, the higher-level computer is further adapted to analyze the operating state of the plant equipment from changes in the recorded operating history data, and record the operating state as operating state history data, and preferably The host computer analyzes the damage of the plant equipment using the recorded operating state history data, and records and evaluates the accumulated damage.

[Action]

In the operation monitoring device of the present invention configured in this way, when the state amount data from the sensor is collected, and the rate of change of the collected state amount data is smaller than a predetermined value,
Also, even if the rate of change of data exceeds a predetermined value, if the rate of change of data is within a certain rate of change, the data is discarded and the data is compressed, so that the saved data is significantly compressed. Can be achieved. As for the data to be left, the data immediately before the data change rate is changed by leaving the previous data that changes when the data change rate exceeds a predetermined value. Is left, and data compression processing is performed so that the change pattern of the state quantity can be seen. Therefore, by recording the compressed state quantity data as operation history data, it becomes possible to manage the operation history of the plant equipment, and the damage history of the plant equipment can be evaluated using the operation history data. it can.

In addition, data collection and compression processing are performed by a microcomputer, and data recording and other processing are performed by a higher-level computer. Also, because of the compression processing, it is possible to provide a dedicated small-sized data processing device with a microcomputer for each sensor, and the processing device is of a size that is composed of a few substrates, so that the system The whole becomes small, and it becomes possible to house a large number of microcomputers and their processing devices in one console rack, for example, and install them in one corner of the control room or measurement room of a nuclear power plant. Moreover, since the entire system becomes small, the system can be constructed at low cost.

Further, in the computer, the stress analysis of the plant equipment is performed using the recorded operation history data, the damage of the plant equipment is analyzed from the stress change analyzed, and the cumulative damage is recorded and evaluated by recording. Damage of plant equipment can be evaluated online directly from the recorded operation history data. Further, since the stress analysis here is performed based on the stress analysis database stored in advance, it is simple but can be performed at a relatively high speed.

Furthermore, by installing a host computer that performs detailed stress analysis using the operation history data transferred from the host computer, it is possible to judge that the damage has increased by the host computer's damage evaluation, or if the earthquake load exceeds the expected value. When added, high-accuracy stress analysis can be performed in addition to simple stress analysis on the host computer, and detailed damage evaluation can be performed based on the results to accurately evaluate damage. be able to.

In this case, too, the detailed stress analysis is performed by the host computer, such that the host computer and the host computer perform the function division, so that normal damage evaluation is performed by the personal computer-level host computer and the maintenance management is performed. The time to use a large-sized host computer with huge cost is drastically shortened, and when necessary, highly accurate stress analysis is performed by the host computer to perform accurate damage evaluation, and to function economically as an operation monitoring device. Can be increased.

Furthermore, by analyzing the operating state of the plant equipment from the change in the recorded operating history data in the host computer and recording the operating state as operating state history data,
You can save not only the driving history but also the driving status history,
More detailed operation history management can be performed, and the damage of plant equipment is analyzed using this recorded operation state history data, and the cumulative damage is recorded and evaluated. Separately, secondary damage evaluation according to the conventional concept can be performed, and operation monitoring can be performed using this as a guideline to further improve the function of the operation monitoring device.

〔Example〕

 An embodiment of the present invention will be described below with reference to FIG.

In high temperature pressure equipment such as piping of a nuclear power plant, sources of stress are internal pressure, temperature distribution, vibration due to earthquake, etc.
The environment such as water quality affects it. Therefore, in stress evaluation of equipment, a pressure sensor, a temperature sensor, a strain gauge, an acceleration sensor, an environmental sensor such as a dissolved oxygen concentration, and the like must be installed around the evaluation target portion. In FIG. 1, a large number of pressure sensors 2, temperature sensors 3, strain gauges 4, acceleration sensors 5, flow rate sensors 6, environment sensors 7, etc. are arranged around the pipe nozzle 1. Amplifiers 8 to 13 that amplify the signals of the sensors are connected to the respective sensors. The analog signal amplified by the amplifiers 8 to 13 is A
The signals are converted into digital signals by the / D converters 14 to 19. Next, the signal converted into the digital signal is taken into the microcomputer 20. However, because of complexity, only the microcomputers connected to the sensors 2 and 7 are shown in FIG.

The microcomputer 20 is provided with a waveform analyzer 21 that analyzes the waveform of a digital signal and compresses the data, and two buffer memories 22 and 23 that temporarily record the processed digital signal. There is. Further, in some cases, two storage memories 2 as shown by phantom lines
4,25 are attached.

Here, the outline of the function of the waveform analyzer 21 will be described. Assuming the case of temperature as the captured data, for example, the data is collected at time intervals TS = 1 second. Start the measurement at the operation start time t0 and change the temperature at time ti to Ti
Then, the temperature at ti + 1 is Ti + 1, and the temperature difference ΔT = | Ti + 1-Ti | between them is smaller than the value Tc preset as the data compression processing reference value, that is, | Ti + 1-T.
If i | <Tc, it is determined that the temperature change is small, and the temperature Ti + 1 at time ti + 1 is discarded. Next, when | Ti + 2 −Ti |> Tc where Ti + 2 is the measured temperature at time Ti + 2, it is determined that the temperature change is large, and the temperature Ti + 2 at time Ti + 2 is determined. Is again stored as data as temperature Ti + 1 at time ti + 1. That is, since the rate of temperature change is small in the steady operation state, most of the data is discarded and the number of data recorded as data is significantly reduced. On the other hand, in the transient operation state, almost all of the measured data remains as data. If such an operation is repeated over the entire operating time, the steady state occupies most of the operating time under normal operating conditions, so most of the recorded data is the transient operating state. It means time data.

However, if steady operation continues for a long time, no data will be left on the contrary for a long time. Therefore, it is also necessary to leave data at every certain time Td. Also,
On the contrary, in the case of a relatively slow transient response such as starting and stopping even in the transient operation state, the rate of change is almost constant.Therefore, after compressing the data, review the data, If only the data that has jumped out of a certain value Te is left and the portion within the constant rate of change is subjected to compression processing, a considerable amount of data can be compressed. In the end, it seems that all the measured data will be retained only when the rate of change of frequency is several tens of Hz, such as an earthquake load, which is extremely fast.

The waveform analyzer 21 analyzes the data waveform of the digital signal as described above and performs data compression processing.

The two buffer memories 22 and 23 have a function of temporarily recording the processed digital signal, and the waveform analyzer 21
The data determined to be left in step S1 is sequentially transferred to the buffer memory 22 and recorded in time series. Here, assuming that the capacity of the buffer memory 22 is 16 Kbytes, 12-bit A / D converters 14 to 19 are adopted, and 2 bytes are allocated to each of the input data and the time, and 4 bytes per data. In this case, a total of 4096 data can be recorded per sensor. Assuming the seismic load and assuming the frequency to be f = 20Hz, in order to avoid missing the peak value in the stress analysis, 1
Since 10 points of data are required per cycle, the data sampling time interval Ts is about 5 ms. Therefore, 20 seconds of data can be recorded. Buffer memory 22
If the capacity is 32 Kbytes, data can be recorded for about 40 seconds. In the case of a normal earthquake, the duration is 10 seconds, so 16 Kbytes of memory is sufficient.

When the data recorded in the buffer memory 22 becomes full, the host computer 27 via the interface 26
Transferred to. By the way, it is unknown when an earthquake will occur that requires continuous data recording. On the other hand, if an earthquake occurs at the time when the buffer memory 22 becomes almost full, the memory will become full during continuous recording of data, making it impossible to record data. Therefore, it is preferable to provide two buffer memories as in the present embodiment. When the buffer memory 22 is full, data is recorded in the buffer memory 23, and the data in the buffer memory 22 is stored in the computer 27 during that time.
Transfer to. Next, when the buffer memory 23 becomes full, data recording is performed again in the buffer memory 22, while the data in the buffer memory 23 is stored in the computer 27.
Transfer to. By doing so, it becomes possible to record data continuously without dead time.

Further, the data recorded in the buffer memory 22 is not transferred to the host computer 27 not when it is full, but when, for example, 2048 data which is half of the recordable 4096 data is accumulated. It is preferable to transfer. In this case, when it is determined that the data is in the steady state in the previous stage, the computer 27 is used as it is.
If it is determined that the earthquake is not in a steady state due to an earthquake, it is not transferred, data recording is continued, and after a certain period of time has passed, a steady state is reached and then the data is transferred. However, even in this case, if the earthquake continues for 10 seconds or more, the buffer memory 22 becomes full and data cannot be recorded. Therefore, it is preferable to provide two buffer memories. This makes it possible to record data continuously without dead time, even in the case of a considerably long earthquake.

Furthermore, since the data in the buffer memories 22 and 23 cannot be read while the higher-level computer 27 is performing the processing described later, the buffer memory 2 is also used for this purpose.
It is preferable to transfer 2 and 23 at the time when half of the recordable data amount is accumulated. That is, when it is determined that the computer 27 is in a data readable state before the data is half full, the data is transferred to the computer 27 as it is, and when it is determined that the data is not readable. It is assumed that the data is not transferred but is continuously recorded, and after a certain period of time has passed, the data becomes readable and then transferred.

When the computer 27 is not in a data readable state, the transfer timing of the buffer memories 22 and 23 is not adjusted as described above, but two computers are used as indicated by phantom lines in FIG. You may respond by providing the strange memories 24 and 25. That is, in this case, data is once transferred from the buffer memory to the two storage memories 24 and 25, and is transferred from the storage memories 24 and 25 to the computer 27 after the computer 27 becomes ready to read the data.

The computer 27 records changes in the pressure, temperature, etc. of the equipment transferred from the microcomputer 20 as operation history data. The data recorded in time series is processed and classified into steady operation data and transient operation data. Since the operation data analyzer 31 is provided and the stress state is analyzed in the design heat cycle for the steady operation state, it is not necessary to perform detailed stress analysis again. Therefore, the steady operation data is recorded in the steady operation history database. The data in the transient operation history database recording circuit 42 is recorded in the circuit 41 and the data in the transient operation state in which there is a possibility that the detailed stress analysis may need to be performed.

The computer 27 is also provided with an operating state analyzer 28 that determines the operating state of the device from changes in data such as the pressure and temperature of the device. This is the data of pressure, temperature, etc.
It has a function of recognizing and identifying operation patterns such as withstand voltage test, start-up, rated output operation, stop, etc. by comparing with those data in the design heat cycle stored in advance in the operation state database storage circuit 33. , A database of the results of the operation state history database storage circuit 34
To remember. Further, the computer 27 is provided with a damage degree analyzer 32 according to the driving state, which is designed for each driving pattern previously stored in the fatigue damage analysis database storage circuit 35 according to the driving state from the analyzed driving pattern. Calculate the fatigue damage by integrating the fatigue cumulative coefficient calculated in. The calculation result is the CR of the computer 27
It is output to T at any time. Although not shown, the calculation result may be stored in the fatigue damage database storage circuit according to the operating condition.

The above-described fatigue damage analysis is a simple fatigue damage analysis according to the conventional concept. The computer 27 can be provided with a function of performing another simple analysis of fatigue damage. That is, the results of the stress analysis by the finite element method under the condition that the pressure and temperature of the equipment are simulated and the design heat cycle condition is changed to some extent are stored in the stress analysis database recording circuit 43 as a database. . At this time, the stress value is made into a database in the form of an approximation formula such as an n-order approximation or an exponential approximation using pressure and temperature as variables and parameters. The computer 27 reads out the stress calculation formula of the corresponding part from the stress analysis database recording circuit 43 and transfers it to the stress waveform analyzer 29. The stress waveform analyzer 29 detects the pressure stored in the transient operation history database storage circuit. The temperature is converted into stress by the stress calculation formula, and the stress waveform is recorded in the stress history database recording circuit 44. Further, the stress waveform is analyzed by, for example, the rainflow method to obtain the stress peak. The damage degree analyzer 30 reads the SN curve under various conditions stored in the fatigue strength database storage circuit 45 from the analyzed stress change and fatigue damage φ for each stress waveform.
f is analyzed, and as the cumulative damage, the sum of damages is obtained by, for example, φf = Σ (ni / Nfi) according to the linear damage rule, and is recorded in the fatigue damage database recording circuit 46 with time t.

In addition, the damage degree analyzer 30 also evaluates damage with respect to stress corrosion cracking. That is, the stress history database storage circuit 44
The stress waveform is read from the stress corrosion crack database under the various conditions stored in the stress corrosion crack database storage circuit 47, and the corrosion damage φSCC for each stress waveform is read.
And further calculate the sum of damages by φSCC = Σ (ti / Tri) according to the linear damage law as their cumulative damage,
It records in the corrosion damage database recording circuit 48 with time t. At this time, unlike fatigue, calculation for each time is necessary, so for example, it is assumed that the corrosion damage is calculated in units of one hour.

The calculation results of the above fatigue damage and corrosion damage are displayed on a part of the CRT screen of the computer 27 at any time, and the result of the simple analysis of fatigue damage from the above-mentioned operating condition and the fatigue damage and the corrosion damage by this calculation are displayed. An alarm will be displayed on the screen when any damage in the analysis results becomes significant. At the same time, the data such as pressure and temperature recorded in the steady operation history database recording circuit 41 and the transient operation history database recording circuit 42 are transferred to the large-sized host computer 50 via the interface 49 and stored in advance. Detailed stress analysis is performed by the finite element method using the mesh data of the equipment as shown in FIG. In this case, the steady operation history is almost the same as that calculated in the design heat cycle in terms of accuracy, so only the transient operation history needs to be analyzed.

The stress value analyzed by the host computer 50 is transferred to the computer 27, and the stress waveform is corrected and stored in the stress history database recording circuit 44 again in the area of the operating time which has been analyzed in detail. Further, in the computer 27, from the corrected stress data, in the same manner as described above,
Fatigue damage is calculated by the SN curve under various conditions stored in the fatigue strength database storage circuit 45, and corrosion damage is calculated by the stress corrosion cracking curve under various conditions stored in the stress corrosion cracking database storage circuit 47. Then, the data is recorded again in the fatigue damage database recording circuit 46 and the corrosion damage database recording circuit 48 with time t. These calculation results are immediately displayed on the CRT screen of the computer 27.

The configuration and the function of the operation monitoring apparatus of the present embodiment have been described above. Next, an example of the operation of the operation monitoring apparatus will be described with a flowchart for the purpose of further clarifying the function of the operation monitoring apparatus.

First, the outline of the overall operation of the operation monitoring device will be described with reference to FIG. In step S1, data is collected from the sensors 2 to 7 such as the pressure sensor and the temperature sensor. In step S2, data waveform analysis and data compression processing are performed. Step S3
Then, the compressed data is transferred to the host computer 27. The work of steps S1 to S3 is performed by the microcomputer 20.

Next, in step S4, the operating state is analyzed from the change state of pressure and temperature. In step S5, a time series history of the analyzed operating conditions is created as a database and stored in a storage circuit. In step S6, an operation history database for storing the change state of pressure and temperature in a raw form is created.
In step S7, stress analysis is performed based on changes in pressure and temperature, and in step S8, the analyzed stress history is created as a database and stored in a memory circuit. In step S9, fatigue damage is analyzed based on the analyzed operating state history and stress history, and in step S10, each fatigue damage database is created. In step S11, the corrosion damage is analyzed based on the analyzed stress history, and in step S12
Create a corrosion damage database. In step S13, cumulative damage is evaluated for each of fatigue damage and corrosion damage. If the cumulative damage is small, the process returns to step S1 to collect data again. If the cumulative damage is large, an alarm indicating that the damage is large is output in step S14, and the recorded data such as temperature and pressure is transferred to the host computer 50 in step S15. To do. The computer 27 performs the work from step S4 to step S15.

Next, detailed stress analysis is performed in step S16, and step S1
At 7, the detailed stress data is transferred to the computer 27. The operations of steps S16 and S17 are performed by the host computer 50.

Next, in step S18, the stress history database is corrected by the transferred detailed stress data, and the fatigue database is corrected by performing fine fatigue damage analysis, and it is determined in step S19 whether or not to continue the measurement, If the measurement is to be continued, the process returns to step S1 to collect data again. The work of steps S18 and S19 is performed by the computer 27.

As described above, in the operation monitoring apparatus of this embodiment, the functions executed by the three computers of the microcomputer 20, the host computer 27, and the host computer 50 are shared. FIG. 4 shows a flowchart summarizing the functions to be executed from the viewpoint of division of roles.

Next, step S1 performed by the microcomputer 20.
5th example of data collection / compression processing work in step S3
This will be described with reference to the flowcharts shown in FIGS.

In step S21 shown in FIG. 5, data from sensors 2 to 7 such as a pressure sensor and a temperature sensor are collected. Step S2
2, the analog data amplifiers 8 to 13 and A /
Amplification and A / D conversion by D conversions 14 to 19 are performed. In step S23, the digital data is converted into numerical values of pressure and temperature by passing through a ROM for linearization described later.
Next, in step S24, the waveform analyzer 21 analyzes the waveform of the data, that is, the state of change, and in step S25, it is not necessary to leave the data in detail in the state where there is little change near the steady state. Data compression processing. In step S26, the data is recorded in the buffer memory 22 or 23. When the data in the buffer memory 22 or 23 is full, in step S27, the compressed data is transferred to the computer 27. In step S28, it is determined whether or not the instruction from the computer 27 is to continue the measurement,
If it is continued, the process returns to step S21 to collect data.

An example of the data compression processing, recording and transfer operations performed in steps S25 to S27 will be described with reference to the flowchart shown in FIG. In step S31, the sampling interval Ts, the data compression processing reference value Tc, and the data storage interval Td are set. In step S32, the measurement is started, and in step S33, J = 1 is set as a flag for selecting one of the buffer memories 22 and 23 for temporarily recording the compressed data, and step S34 is set. Then, the data is recorded in the buffer memory 22. In step S35, I = 1 is set in order to retain the first data after the start of measurement. In step S36, it is determined whether or not the measurement is continued. If the measurement is continued, step S3 is performed.
Proceed to 7 and collect data in the form of time (t, T). In step S38, it is determined whether or not I = 1, and I =
If it is 1, it is determined that the collected data is the first data after the start of measurement, and in step S39 (t (I), T
Data is recorded as (I)) = (t, T) (where I = 1). At the same time, (tk, Tk) = (t, T), I
= I + 1 is set. Next, returning to steps S36 and 37, the next data is collected, and if I = 1 is not satisfied in step S38, the data storage interval is determined in step S40. In other words, if there is little change in the continuously collected data, the equipment whose operation is being monitored is in a steady operation state, and it is not necessary to keep the data. First, it is determined whether or not Td or more has elapsed from the previous measurement time. If the difference from tk temporarily recorded in step S38 is Td or more, that is, t-tk≥Td, the data (t (I), T
(I)) = (t, T) is saved and at the same time (tk, Tk)
= (T, T) and I = I + 1 are reset. Step S42
Then, the rate of change of the data is discriminated, and if the difference between the measured data T and the data Tk provisionally recorded in step S41 is smaller than the data compression processing reference value Tc, no data is left and steps S36 and S37 are performed. Return to and continue data collection. However, when the difference between the measured data T and the temporarily stored data Tk becomes larger than the data compression processing reference value Tc in step S42, in step S43,
It is determined whether the previous data has been recorded. If the previous data is recorded at t-tk = Ts, the data (t
(I), T (I)) = (t, T) is saved, and at the same time (t)
k, Tk) = (t, T) and I = I + 1 are set again. If t-tk = Ts is not satisfied and the previous data is not recorded, in step S45, in order to leave the previous data temporarily stored, (t (I), T
(I)) = (tk, Tk) is saved, and at the same time, the temporarily saved data is reset to (tk, Tk) = (t, T), and I = I
Set to +1.

Repeat the above steps to save the data,
Since the buffer memory 22 has a capacity limit as described above, in this example, in step S46, the number I of stored data is compared with the capacity If of the buffer memory 22, and if I does not exceed If, The process returns to steps S36 and 37 to continue the measurement. If I exceeds If,
In step S47, it is determined whether or not the buffer memory 22 or 23 in which the data is recorded is J = 1, and J = 1.
If so, it is determined that the buffer memory 22 is full, and J = 2 is set in step S48. Then, the buffer memory is switched from step S49 to record the data in the buffer memory 23. Buffer memory 2
While recording data in 3, the data in the buffer memory 22 is transferred to the host computer 27 in step S50. Next, if I exceeds If in step S46, it is confirmed in step S47 that J = 2, and step S5
At 1, the data in the buffer memory 23 is transferred to the host computer 27. Then, in step S33, J = 1 is reset and the compressed data is recorded in the buffer memory 22. By performing these series of steps, it is possible to continuously compress the measured data such as pressure and temperature, and send only the data necessary for the damage analysis to the host computer.

Next, an example of operation state monitoring, stress analysis and damage analysis performed by the computer 27 will be described with reference to the flowchart shown in FIG.

In FIG. 7, in step S61, the data transferred from the data collection / compression processing microcomputer 20 is accepted. In step S62, the operating condition analyzer 2
Driving state 8 memory that stores the data received and the data such as pressure and temperature values or rate of change corresponding to various operating states such as start-up, steady operation, scrum, stop, etc. The operating state data of the circuit 33 is compared, the operating state is analyzed, and its time-series change is recorded in the storage circuit 34 as an operating state history database in step S64. Then, in step S65, the damage level analyzer 32 is driven, the damage level is analyzed using the damage table of the damage analysis database 35 which is calculated and stored in advance for each operating state, and the cumulative damage is calculated in step S66. It is evaluated, and if the degree of damage is large, an alarm is issued in step S81. If the degree of damage is small, the process returns to step S62 to continue the operation state analysis.

The above is the damage evaluation by confirming the operation state, but next, the damage evaluation by more detailed stress analysis is performed. That is, in step S67, the operation data analyzer 31 is driven to analyze the change state of data such as pressure and temperature, and the time during which data is recorded only at the data storage interval Td shown in FIG. 6 continues. If it is, it is determined that the equipment being monitored is in a steady operation state during the duration, and those data are left at fine time intervals, and if the state where the change is vigorous continues. , The monitored device is determined to be in the transient operation state during the duration, and in steps S68 and 69, the storage circuit 41 and the steady operation history database and the transient operation history database, respectively.
42.

In step S70, the waveform analyzer 29 is driven, and the stress is analyzed from the relationship between the stress and the pressure change, temperature change, etc. based on the stress analysis database stored in the stress analysis database storage circuit 43, and in step S72. This is recorded in the memory circuit 44 as a database of stress history. In step S73, the damage level analyzer 30 is driven, and fatigue damage is analyzed according to the Miner's rule, for example, based on the database of fatigue strength under various environments stored in the fatigue strength database storage circuit 45, and in step S75. It is recorded in the memory circuit 46 as a database of fatigue damage. Similarly, in step S76, the corrosion damage is analyzed based on the database stored in the stress corrosion cracking database storage circuit 47, and is recorded in the circuit 48 as the corrosion damage database in step S78. Next, in step S79, the cumulative damage of fatigue damage and corrosion damage is evaluated.If the damage is small, it is determined in step S80 whether or not to continue the measurement. If it is continued, the process returns to step S61 to monitor the operation. If the damage is continued and the damage is large, an alarm is output in step S81, and the host computer 5 is output in step S82.
Data for detailed analysis is transferred to 0.

FIG. 8 shows a detailed flowchart of the operation state monitoring and damage analysis performed in steps S61 to S66.
In step S101, the data transferred from the data collection / compression processing microcomputer 20 is accepted.
In step S102, the operating state analyzer 28 is driven, in step S103 the rate of change of the received data is calculated, and in step S105 it is determined whether the rate of change is large or small.
When it is determined that the rate of change is small, the process proceeds to step S106, where it is determined that the current operating state is a steady output operation such as 100% rated output operation or other constant output operation, and in step S107, start, steady operation, Steady-state operation data is read from the operation state database storage circuit 33 in which data such as pressure and temperature values corresponding to various operation states such as scrum, stop, etc., or rate of change is stored, and step S108
Then, the received data is compared with the read data, and the output and time are recorded in step S109.

If it is determined in step S105 that the rate of change is large, the process proceeds to step S110, and it is further determined whether the rate of change is constant, and if it is determined to be constant, the process proceeds to step S111, in which the current operating state is It is determined that an unsteady operation such as an overload test, test operation, start-up, normal stop, and operation state change is in progress, and in step S111, the operation state database storage circuit 33
The unsteady operation data is read from, the data change patterns are compared in step S113, the patterns are classified in step S114, and the patterns and time are recorded in step S115.

When it is determined in step S110 that the rate of change is not constant, the process proceeds to step S116, and it is determined that the current operating state is during transient operation such as scrum I, scrum II, etc., and in step S117 the operating state database Memory circuit 33
The transient operation data is read from, the data change patterns are compared in step S118, the patterns are classified in step S119, and the pattern and time are recorded in step S120.

Next, in step S121, the data recorded in steps S109, S115, and S120 is processed in time series, and in step S122, it is recorded in the memory circuit 34 as an operating state history database. Then, in step S123, the damage degree analyzer 32 is driven, the damage degree is analyzed using the damage table of the damage analysis database 35 which is calculated and stored in advance for each operating state, and the cumulative damage is evaluated in step S125. Then, if the degree of damage is large, an alarm is issued in step S81 in FIG. If the degree of damage is small, the process returns to step S102 to continue the operation state analysis.

Finally, an example of the detailed stress analysis performed by the large-sized host computer 50 and an example of the damage analysis by the computer 27 thereafter will be described with reference to the flowchart shown in FIG.

In step S91, data such as pressure and temperature for detailed analysis is received from the computer 27. In step S92, the FEM analysis trace mesh data of the device or the part of the device to be analyzed is read and time changes such as pressure and temperature are input together with the boundary conditions, and in step S93, F
Perform EM stress analysis. Then, the stress data analyzed in step S94 is transferred to the computer 27. The computer 27 receives the stress data from the host computer and uses it to modify the stress history database stored in the memory circuit 44 in step S95.
In step S96, the corrected stress history database is used to calculate fatigue damage based on the fatigue strength database as in step S73 of FIG. 7, and in step S97, the fatigue damage database stored in the memory circuit 46 is corrected. . Then, in step S98, the cumulative damage level is evaluated, and if the damage level is large, an alarm is output in step S99, and if it is small, it is determined in step S100 whether or not to continue the measurement. Returning to step S61 in FIG. 7, operation monitoring is continued.

10 to 12 show an example of the result of simulating the function of the waveform analyzer 21 that analyzes the waveform of the digital signal attached to the microcomputer 20 and compresses the data. The vertical axis indicates temperature T (° C), and the horizontal axis indicates arbitrary time t (h
r). Both white and black circles are simulated data of the measured raw data.

First, in FIG. 10, for such data, T
When c = 5 ° C. and Td = 5 hr are set, the black circles connected by the solid line become the compressed data. In the steady state, the data is greatly compressed, and even in the transient response state, minute temperature fluctuations are ignored and the data is compressed. However, if the temperature at time ti is Ti and the temperature at time ti + 1 is Ti + 1,
When the temperature difference ΔT = | Ti + 1-Ti | <Tc during this period, the temperature Ti + 1 at time ti + 1 is discarded and the temperature at time ti + 2 is set to Ti + 2 | Ti + 2-Ti |>. When Tc is reached, the temperature Ti + 2 at the time ti + 2 is left as the data Ti + 1 at the time ti + 1 again as a data, so that the transient operation when the steady operation state is transited to the transient operation state is performed. As a result, the data just before entering is discarded, and the rate of temperature change apparently becomes small. Tenth
This is the case with the third, fifth, seventh, and twelfth data from the left in the figure. Therefore, it is necessary to retain the data immediately before the change rate becomes large. For example, (t0, T
(0), (t1, T1), (t2, T2), (t3, T3), (t4, T4), when the time-series changes occur, | T1-T0 | <Tc, | T2
-T1 | <Tc, | T3-T2 | <Tc, | T4-T3 |
If> Tc, discard only (t2, T2) and (t0, T0), (t1, T2)
1), (t3, T3) and (t4, T4) are left. FIG. 11 shows the result of such data processing, and the black circles in the figure are the compressed data.

Also, even in a transient operation state, the rate of change is relatively constant when the response is relatively slow, such as starting and stopping.Therefore, after compressing the data, review the data, and change the value to a value higher than the constant rate of change. If the data that is out of Te is left and the portion within the constant rate of change is compressed, a considerable amount of data can be compressed. FIG. 12 shows the result of this processing. In the figure, in the temperature decreasing state at the right end, the descending speed is slightly slower immediately after the start of the descending, and the descending speed becomes faster after approaching the normal temperature, but if such a process is performed, the temperature seems to fall in two stages. It turns out that the data is compressed considerably.

As described above, according to the operation monitoring device of the present embodiment, the microcomputer 20 causes the temperature from the sensor,
By collecting data such as pressure and compressing the data, the stored data can be significantly compressed, and the compressed data such as temperature and pressure can be stored in the host computer 27.
By recording as operation history data in, it becomes possible to manage the operation history of the platonic equipment, and it is possible to evaluate damage to the platonic equipment using the operation history data.

Further, the host computer 27 analyzes the stress of the platonic device using the recorded operation history data, analyzes the damage of the platonic device from the analyzed stress change, and records and evaluates the accumulated damage, It is possible to assess damage to Plato equipment directly online from recorded operational history data. Further, since the stress analysis here is performed based on the stress analysis database stored in advance, it is simple but can be performed at a relatively high speed.

Further, the host computer 27 analyzes the operating state of the platonic equipment from the changes in the recorded operating history data, and records the operating state as operating state history data, so that not only the operating history but also the operating state history is saved. Since it is possible to perform more detailed operation history management, the damage of plant equipment is analyzed using this recorded operation state history data, and the accumulated damage is recorded and evaluated to obtain the above-mentioned stress analysis results. In addition to the damage evaluation, a secondary damage evaluation according to the conventional concept can be performed, and operation monitoring can be performed using this as a guide, thereby further improving the function of the operation monitoring device.

Further, the host computer 5 for performing detailed stress analysis using the operation history data transferred from the host computer 27.
By setting 0, if the damage is judged to have become large in the damage evaluation by the high-level computer 27, or if an earthquake load larger than expected is applied, what is a simple stress analysis by the high-level computer 27? Separately, high-accuracy stress analysis can be performed, and detailed damage evaluation based on the result can accurately evaluate damage.

Further, according to the operation monitoring apparatus of the present embodiment, the microcomputer 20 performs the data collection and compression processing, and the data recording and other processing are performed by the host computer 27. By sharing the roles of the functions executed by and, it becomes possible to provide a dedicated data processing device with a small microcomputer for each sensor for data collection and compression processing. Since the size of the system is small enough to be composed of one board, the whole system becomes small. For example, a single console rack houses a large number of microcomputers and their processing devices, and this is installed in the control room or measurement room of a nuclear plant. It can be installed in one corner. Moreover, since the entire system becomes small, the system can be constructed at low cost.

Furthermore, the simple stress analysis is performed by the host computer 27, and the detailed stress analysis is performed by the host computer 50.
The normal damage evaluation is performed by the host computer 27 of the personal computer class, and the large-scale host computer 5 with enormous maintenance costs.
It is possible to significantly reduce the time for using 0, perform highly accurate stress analysis with the host computer 50 when necessary, perform accurate damage evaluation, and economically enhance the function as an operation monitoring device.

Another embodiment of the present invention will be described with reference to FIGS.

The operation monitoring device shown in Fig. 1 has all the functions from data collection to detailed stress analysis and damage evaluation, but a simpler configuration is possible if only the operation status monitoring function is provided. Yes, FIGS. 13 to 19 show such an embodiment. Note that in FIGS. 13 to 16, for simplification of the drawing, only the system of one of the sensors 2 to 7 shown in FIG. 1 is shown, and the system of the other sensors is omitted. .

FIG. 13 shows the simplest configuration, which is a sensor for detecting pressure, temperature, strain, etc., for example, a pressure sensor 2, an amplifier 8 for amplifying the signal of the sensor, an A / D for converting the amplified analog signal into a digital signal. It comprises a converter 14, a microcomputer 20 having a waveform analyzer 21 for compressing measured data, an interface 26, and a computer 27 having an operation history database storage circuit 50 attached thereto. The microcomputer 20 collects the data and transfers the data compressed by the waveform analyzer 21 to the upper computer 27 via the interface 26, and the computer 27 records the data in the storage circuit 51 as an operation history database. To do.

Also in this embodiment, as in the embodiment of FIG. 1, by compressing the data such as temperature and pressure from the sensor,
Saved data can be significantly compressed. Further, in this embodiment,
Even though the compressed data is recorded only as operation history data, even in this case, it is possible to manage the operation history of the plant equipment using this recorded operation history data, and to use the operation history data appropriately. It can be taken out at any time to evaluate damage to plant equipment.

In the embodiment shown in FIG. 14, a pressure and a microcomputer 20 of the embodiment shown in FIG. 13 are additionally provided with a buffer memory 22. The microcomputer 20 collects data and records the data compressed by the waveform analyzer 21 in the buffer memory 22 in time series. When the buffer memory 22 is full, the interface 2
The data is transferred to the upper converter 27 via 6 and stored again in the measurement data buffer memory 22 that has been compressed again.

The embodiment of FIG. 15 is obtained by further attaching a second buffer memory 23 to the microcomputer 20 of the embodiment of FIG. The microcomputer 20 collects data and records the data compressed by the waveform analyzer 21 in the buffer memory 22 in time series. When the buffer memory 22 is full, the subsequent data is recorded in the buffer memory 23, while the data in the buffer memory 22 is transferred to the upper converter 27 via the interface 26. Then the buffer memory 2
When 3 is full, the next data is recorded again in the buffer memory 22, while the data in the buffer memory 23 is transferred to the upper converter 2 via the interface 26.
Transfer to 7. By repeating this, even when the transient response continues for a long time, it is possible to continuously compress the measurement data and transfer it to the host computer 27.

In the embodiment shown in FIG. 16, two storage memories 24 and 25 are further attached to the microcomputer 20 of the embodiment shown in FIG. The microcomputer 20 collects the data and records the data compressed by the waveform analyzer 21 continuously in a time series by alternately using the two buffer memories 22 and 23. While the data is being transferred to the host computer 27, the data can be recorded in another buffer memory so that the data can be measured without being lost. However, the computer 27 performs other data processing,
Alternatively, since the data in the buffer memory cannot be transferred while the calculation is being performed, the two storage memories 24 and 25 cannot be transferred.
To temporarily transfer the recording and transfer the data in the storage memories 24 and 25 when the converter 27 becomes empty.

In the embodiment of FIG. 17, the sensors 2 to 7 for detecting pressure, temperature, strain, etc., the amplifiers 8 to 13 for amplifying the signal of the sensor,
A microcomputer 2 having a multiplexer 51 for switching signals from a large number of sensors, an A / D converter 52 for converting an amplified analog signal into a digital signal, a waveform analyzer 21 and a buffer memory 22.
0, the GP-IB interface 5 for controlling the multiplexer 51 by the microcomputer 20.
3, an interface 26, and a computer 27 having an operation history database storage circuit 50 attached thereto. This is a system configuration that corresponds to a case where the reaction speed is slow even though it is a transient response, and switches the sensor to be measured by the multiplexer 51 which is controlled by the microcomputer 20 via the GP-IB interface 53, and fetches data. The waveform analyzer 21 compresses the data and records the data in the buffer memory 22. As a method of collecting data, there is a method of measuring from each sensor at a certain time interval and collectively recording the time and the data of each sensor as one data. In this case, if the amount of change in the data of any one sensor is large, the other data will be recorded together.
Therefore, in FIG. 17, there are 6 sensors, and if 2 bytes are applied to each, 14 bytes in total make up one data. Alternatively, 4 for each sensor.
There is a method of recording in bytes, but the former method of recording all in a batch and which method has a smaller amount of data over the entire operating time depends on the operating conditions.

The system shown in FIG. 18 includes sensors 2 to 5 which detect relatively long data sampling intervals due to pressure and temperature, and sensors 6 and 7 which detect extremely short data sampling intervals such as strain and acceleration. This is the configuration of the operation monitoring device separately configured. That is, on the sensor side that detects a data collection interval that is relatively long, the sensors 2 to 5, the amplifiers 8 to 11, the multiplexer 51, the A / D converter 52, and the waveform analyzer 2 are connected.
1, a microcomputer 20 having a buffer memory 22 attached thereto, and a GP-IB interface 53.
In the sensor side that detects the data collection interval that is extremely short, the sensors 6, 7 and the amplifiers 12, 13, A
/ D converters 18, 19 and a waveform analyzer 21 and two buffer memories 22, 2 provided exclusively for each system
3 is attached to the computer 20, and all the microcomputers 20 are connected to the computer 27 via the interface 26. In this case, it is desirable that each sensor be time-sequentially compressed and recorded with 4 bytes, and the computer 27 collectively reconstructs them.

In the embodiment shown in FIG. 19, the data of the sensors 2 to 5 that detect a relatively long data sampling interval due to pressure, temperature, etc. is not stored in the microcomputer but in the upper computer 27.
Is directly controlled by the multiplexer 51 via the GP-IB interface 53. Therefore, in this case, the data converted from the analog signal to the digital signal by the A / D converter 52 is directly transferred to the computer 27 via the GP-IB interface 53. The configuration on the sensor side for detecting an object having an extremely short data sampling interval is the same as that of the embodiment shown in FIG.

Finally, a more specific circuit configuration of the data collection and compression processing section, which mainly comprises a sensor and a microcomputer, in the operation monitoring apparatus of this embodiment will be described with reference to FIG. Note that FIG. 20 also shows only one system.

The data collection and compression processing part of the operation monitoring device is pressure,
A sensor 2 for detecting temperature and the like, an amplifier 8 for amplifying the signal of the sensor, an A / D converter 14 for converting the amplified analog signal into a digital signal, and a linear for correcting the signal from the sensor into a proportional relationship with the measurement data. ROM for rise
62, buffer memories 22 and 23 for temporarily recording the collected data, and a program ROM 6 containing a program for collecting the data and processing the data
5. DIP switches 66 to 6 capable of setting the on-circuit data sampling interval time TS, the data compression reference value TC, the time interval Td for recording without compressing the data, etc.
8, switches 69 and 7 for instructing start and stop of data collection
Microcomputer 20 having 0 attached thereto, and a GP-IB interface 71 and a computer 27.
Composed of.

In the linearization ROM 62, by writing linearization data for correcting the signal from the sensor to the ROM address in proportion to the measurement data as ROM data, the data input from the A / D converter 14 is buffered at high speed. It is possible to record in 22 and 23.

The data collection interval time Ts and the data compression reference value T
c, the setting of the time interval Td for always recording without compressing the data, and the instruction to start and stop the data collection are described in GP-
Computer 27 via BI interface 71
It is also possible to carry out with respect to the microcomputer 20. In addition, a time measuring counter is provided inside the microcomputer 20. For example, in 16 bits,
If the data collection interval time Ts is 1 second, the maximum is 65,
It is measured up to 535 seconds, but if it exceeds that time, it will be re-measured from 0 seconds, so that adjustment is unnecessary in the computer 27 for long-time measurement.

〔The invention's effect〕

As described above, according to the operation monitoring device of the present invention, the signals of various sensors provided in the device are measured online, and the data is compressed and recorded, whereby the stored data can be significantly compressed. There is an effect that the history of the operating state can be managed, and further fatigue damage and corrosion damage can be evaluated.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing the overall configuration of an operation monitoring apparatus according to an embodiment of the present invention, and FIG. 2 is an example of a mesh diagram used when analyzing damage in detail in a portion to be evaluated,
FIG. 3 is a flow chart showing an outline of the overall operation of the operation monitoring apparatus of FIG. 1, and FIG. 4 is a flow chart showing the flow chart shown in FIG. 3 separately for each computer type, and FIG. 6 is a flowchart showing the details of the processing work performed by the microcomputer, FIG. 6 is a flowchart showing the details of the data collection and compression processing work out of the work performed by the microcomputer, and FIG. 7 is a host computer. 8 is a flowchart showing the details of the processing work carried out in FIG. 8, FIG. 8 is a flowchart showing the details of the analysis of the driving condition and the damage evaluation according to the driving condition among the works carried out by the host computer, and FIG. 2 is a flowchart showing the details of the detailed stress analysis and subsequent processing work performed in FIG. 11, FIG. 11 and FIG. 12 are diagrams showing the degree of compression when the measured data is compressed, and FIG. 13 to FIG. 19 are the configurations of the operation monitoring apparatus according to other embodiments of the present invention. FIG. 2 is a schematic diagram showing
FIG. 0 is a diagram showing a device configuration of a system that performs data collection and compression processing of the operation monitoring device. Description of reference numerals 1 ... Piping nozzle (plant equipment) 2-7 ... Sensor 8-13 ... Amplifier 14-19 ... A / D converter 20 ... Microcomputer 21 ... Waveform analyzer 22, 23 ... Buffer Memory 26 ...... Interface 27 ...... Host computer 28 ...... Operating state analyzer 29 ...... Waveform analyzer 30 ...... Damage degree analyzer 31 ...... Operation data analyzer 32 ...... Damage degree analyzer 33 ...... Operating state database Memory circuit 34 ... Operating state history database memory circuit 35 ... Fatigue damage analysis database memory circuit 41 ... Steady operation history database memory circuit 42 ... Transient operation history database memory circuit 43 ... Stress analysis database memory circuit 44 ... Stress History database memory circuit 45 …… Fatigue strength database memory circuit 46 …… Fatigue loss Database storage circuit 47 ...... stress corrosion cracking database storage circuit 48 ...... corrosion damage database storage circuit 49 ...... interface 50 ...... host computer

Claims (15)

[Claims] Claim: What is claimed is: 1. A plant equipment operation monitoring apparatus for evaluating damage such as fatigue and corrosion formed by pressure, temperature, strain, etc. applied to plant equipment, in which state quantities such as pressure, temperature, strain, etc. A sensor for detecting, a microcomputer for collecting the state quantity data from the sensor and compressing the data, and a microcomputer which is connected to the microcomputer via an interface and transferred from the microcomputer. A host computer for recording state quantity data as operation history data, wherein the microcomputer, as a means for compressing the collected data, has a rate of change of the collected state quantity data smaller than a predetermined value. When the data is discarded, the previous data that changes when the rate of change of the data exceeds a predetermined value remains Both have waveform analysis means for discarding the data and compressing the data when the rate of change of the data is within a constant rate of change even if the rate of change of the data exceeds a predetermined value. And operation monitoring equipment. 2. The plant equipment operation monitoring apparatus according to claim 1, wherein the host computer further uses the recorded operation history data based on a stress analysis database stored in advance to identify the plant equipment. An operation monitoring device characterized by performing stress analysis, analyzing cumulative damage of plant equipment from the analyzed stress change, and recording and evaluating the cumulative damage. 3. The plant equipment operation monitoring apparatus according to claim 2, further comprising a detailed stress analysis, which is connected to the host computer via an interface and uses the operation history data transferred from the host computer. A host computer is provided, and the cumulative damage of the plant equipment is analyzed again from the stress change subjected to the detailed stress analysis by the host computer, and the cumulative damage is replaced with the cumulative damage recorded in the computer and recorded and evaluated. Operation monitoring device characterized by. 4. The operation monitoring apparatus for plant equipment according to claim 1, wherein the host computer further analyzes an operation state of the plant equipment from a change in the recorded operation history data,
An operation monitoring device characterized by recording the operation state as operation state history data. 5. The plant equipment operation monitoring apparatus according to claim 4, wherein the computer further analyzes damage to the plant equipment using the recorded operation state history data and records the accumulated damage. An operation monitoring device characterized by evaluation. 6. A plant equipment operation monitoring apparatus for evaluating damage such as fatigue and corrosion formed by pressure, temperature, strain, etc. applied to plant equipment, wherein the pressure, temperature,
First means for detecting a state quantity such as distortion; second means for sampling the state quantity data from the first means and compressing the data; and the compression processing from the second means. Third means for recording the data of the state quantity thus processed as operation history data, and fourth means for analyzing the operation state of the plant equipment from the change in the data of the state quantity subjected to the compression process from the second means. And a fifth means for recording the operating state analyzed by the fourth means as operating state history data, wherein the second means has a predetermined rate of change in the collected state quantity data. When the data change rate exceeds a predetermined value, the data is discarded, the previous data that changes when the data change rate exceeds a predetermined value is left, and even when the data change rate exceeds the predetermined value, the data When the rate of change is within a certain rate of change Operation monitoring apparatus characterized by compressing processing data the collected by discarding over data. 7. The plant equipment operation monitoring apparatus according to claim 6, further comprising: analyzing damage to the plant equipment using the operating state history data recorded by the fifth means, and recording the accumulated damage. Based on the sixth means for evaluating and the stress analysis database stored in advance, the stress analysis of the plant equipment is performed using the operation history data recorded by the third means, and the stress change analyzed Analyzing damage to plant equipment and recording the cumulative damage,
And a seventh means for evaluating the operation monitoring device. 8. The plant equipment operation monitoring apparatus according to claim 7, further comprising: eighth means for performing detailed stress analysis using the operation history data recorded by the third means. The damage of the plant equipment is newly analyzed from the stress change subjected to the detailed stress analysis by the means, and the cumulative damage is replaced with the cumulative damage recorded in the seventh means and recorded and evaluated. Operation monitoring device. 9. The plant equipment operation monitoring apparatus according to claim 6, wherein said second means is constituted by a microcomputer, and said third to fifth means are connected to said microcomputer via an interface. An operation monitoring device comprising a host computer. 10. The operation monitoring apparatus for plant equipment according to claim 7, wherein said second means comprises a microcomputer, and said third to seventh means are connected to said microcomputer via an interface. An operation monitoring device comprising a host computer. 11. A plant equipment operation monitoring apparatus according to claim 8, wherein said second means is composed of a microcomputer, and said third to seventh means are connected to said microcomputer via an interface. An operation monitoring apparatus comprising a host computer, wherein the eighth means is a host computer connected to the host computer via an interface. 12. Pressure, temperature applied to plant equipment,
In a plant equipment operation monitoring device for evaluating damage such as fatigue and corrosion formed by strain, etc., pressure, temperature, a sensor for detecting state quantities such as strain, an amplifier for amplifying the signal of the sensor, An A / D converter that converts an analog signal amplified by the amplifier into a digital signal; a microcomputer that additionally has a waveform analyzer that analyzes the waveform of the digital signal and performs data compression processing; Connected to the operation history database memory circuit for recording the state quantity data transferred from the microcomputer as operation history data, and the operation history data recorded in the operation history database memory circuit to the stress of the plant equipment. Waveform analyzer that converts the stress waveform to A stress history database storage circuit for recording as stress history data, a first damage degree analyzer that analyzes the damage of plant equipment from changes in the stress waveform of the stored stress history data, and obtains the cumulative damage. A high-order computer having a damage database storage circuit attached to record it as damage data, wherein the waveform analyzer discards the data when the rate of change of the collected state quantity data is smaller than a predetermined value, When the rate of change of data exceeds a predetermined value, the previous data that has changed is left, and even if the rate of change of data exceeds a predetermined value, the rate of change of data is within a fixed rate of change. In this case, the operation monitoring device is characterized in that the collected data is compressed by discarding the data. 13. The plant equipment operation monitoring apparatus according to claim 12, further comprising an operation history data from said operation history database storage circuit of said host computer, which is connected to said host computer via an interface. A host computer for performing stress analysis is provided, and damage of plant equipment is analyzed again from changes in the stress waveform subjected to detailed stress analysis by this host computer, and the cumulative damage is recorded in the damage database storage circuit of the computer. An operation monitoring device characterized by being replaced with data for recording. 14. The plant equipment operation monitoring apparatus according to claim 12, wherein the host computer analyzes an operation state of the plant equipment based on a change in the state quantity data.
The operating state history database storage circuit that records the analyzed operating state as operating state history data, analyzes the damage to the plant equipment using the operating state history data recorded in the operating state history database storage circuit, and accumulates the accumulated damage. An operation monitoring device comprising a second damage degree analyzer for evaluating 15. The plant equipment operation monitoring apparatus according to claim 12, wherein the host computer analyzes a change state of state quantity data transferred from the microcomputer to bring the plant equipment into a steady operation state. There is further an operation data analyzer that determines whether there is a transient operation state or not, and classifies the data of the state quantity into steady operation data and transient operation data, wherein the operation history database storage circuit stores in the steady operation data. From a steady operation history database storage circuit that records the classified state quantity data as steady operation history data, and a transient operation history database storage circuit that records the state quantity data classified as transient operation data as transient operation history data Therefore, the stress waveform analyzer is configured to change the transient operation history recorded in the transient operation history database storage circuit. Converts the data into stress of the plant equipment, operation monitoring apparatus characterized by analyzing the stress wave.