JPH0661630A - Printed wiring board - Google Patents

Abstract

PURPOSE:To provide a printed wiring board in which a discrete component can be soldered with good characteristics by making required through holes in so-called solid patterned part or a part patterned with a predetermined width. CONSTITUTION:In a printed wiring board 1 in which a through hole 2 is made at an appropriate point of a solid pattern, a slit 5 having required shape is provided for the solid pattern or the pattern having predetermined width on the periphery of the through hole for the purpose of thermal insulation.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board, and more particularly to a printed wiring board having improved soldering characteristics for discrete parts such as insertable parts, which are so-called solid pattern parts and widths. The present invention relates to a printed wiring board in which a required through hole is provided in a wide pattern portion, and discrete components such as the insertable component can be soldered with good characteristics.

[0002]

2. Description of the Related Art In a general printed wiring board, a plurality of slits are provided on a solid pattern around a through hole so as to retain heat (such a heat retaining portion is usually called a thermal land). It is a conventionally known technique, for example, as seen in Japanese Utility Model Laid-Open No. 3-21864. FIG. 5 is an illustration of a conventional technique of this type. In FIG. 5, the printed wiring board 1
Is provided with a solid pattern 3 on at least one surface thereof, and through holes 2 for inserting leads of parts, for example, are formed at appropriate places, and a conductive layer is plated around the through hole 2 as required. It is provided by the method. The conductive portion of the through hole 2 is the solid pattern 3
A plurality of slits 5 (having a predetermined width) are provided so as to be separated from each other. In parts such as the power supply part and the ground part, a solid pattern part and a wide pattern part are formed for that purpose, and even in other parts where a large current flows, a pattern part having a considerably wide pattern part is formed. It is prepared. Further, such solid pattern portions or wide pattern portions are usually provided with through holes for soldering discrete components. By the way, when soldering discrete components as described above, in a solid pattern portion or a wide pattern portion as before, heat is diffused to such a portion, so-called when soldering. Solder soldering may be worse. Such a drawback can be eliminated by providing the thermal land as described above, but such elimination can be made only when performing a flow soldering operation or a solder dip operation. However, as surface mounting and densification of components on a printed wiring board progress, it becomes impossible to use the above-mentioned flow soldering operation and solder dip operation, and there are more cases where soldering is performed manually. However, when soldering manually, the temperature of the soldering iron that is normally used causes the above-mentioned solder wicking to worsen, and it is necessary to raise the working temperature considerably, resulting in work efficiency. Will be worse. In particular, when the component must be replaced due to damage or the like, it takes a lot of time and effort to remove the component, because it is nothing but manual work.

[0003]

As described above, in the above-mentioned prior art, as the surface mounting and the densification of the components on the printed wiring board progress, the soldering by hand increases. However, when soldering by hand like this, the temperature of the soldering iron that is normally used will not increase the above-mentioned solder rise, and it is necessary to considerably raise the temperature during work. Next to
Work efficiency may deteriorate. In particular, when parts must be replaced due to damage or the like, there is a problem that it takes a lot of time and effort to remove the parts because there is no other means by manual work. In addition, even if the temperature of the soldering iron to be used is raised, the solder wicking is poor and only reliable soldering can be achieved.In addition, the through hole land and the side part of the discrete component are actually soldered, and There is also a problem that solder often does not enter the through holes.

The present invention has been made in order to solve the above-mentioned problems, and it is desirable to provide a discrete component such as an insertable component by providing a required through hole in a solid pattern portion or a wide pattern portion. An object of the present invention is to provide a printed wiring board that can be soldered with characteristics.

[0005]

SUMMARY OF THE INVENTION A printed wiring board according to the present invention is a printed wiring board in which through holes are formed at appropriate positions of a solid pattern, and a single annular slit heat is formed on the solid pattern around the through holes. It is characterized by being provided for insulation. That is, in a through hole provided in a solid pattern or a wide pattern, the through hole is cut out in the pattern, and a connection land is provided around the cut out through hole.

[0006]

The printed wiring board according to the present invention is a printed wiring board in which through holes are punched at appropriate positions in a solid pattern, and is provided on the solid pattern around the through holes for a single annular slit thermal insulation. It is characterized by that. That is, according to the present invention, since the through hole is provided so as to be cut away from the pattern, the solder rising is remarkably improved. Further, when the component is replaced, the solder is absorbed, and the pattern and the through hole are notched, so that the component can be replaced more easily.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic explanatory view of an embodiment of a printed wiring board according to the present invention. Here, FIG. 1A is a side sectional view of the above embodiment, and FIG.
[Fig. 3] is a top view of the above-mentioned embodiment. Further, FIG. 1C and FIG. 1D are both exemplification diagrams showing a state in which appropriate components are mounted in the above-described embodiment. First, in FIGS. 1A and 1B, a solid pattern 3 is provided on at least one surface of a printed wiring board 1, and a through hole 2 for inserting a lead of a component is provided at an appropriate position. Is perforated, and a conductive layer is provided around it by plating or another required method. The slit 5 (having a predetermined width) is provided so that the conductive portion of the through hole 2 is separated from the solid pattern 3.
Further, a resist 6 of a certain predetermined material is provided so that the land 4 remains in the vicinity of the conductive portion of the through hole 2 of the solid pattern 3. Next, in FIGS. 1C and 1D, the leads 8 of the electronic component 7 are inserted into the through holes 2 and then the solder 9 is filled as necessary to achieve the desired connection / fixing. At this time,
First, as shown in FIG. 1 (C), the first soldering work is performed with the slit 5 left, and then, as shown in FIG. 1 (D), the slit 5 is also covered with the following soldering operation. Soldering work will be performed.

FIG. 2 is an illustration of another aspect of the printed wiring board in the above embodiment. In FIG. 2, a wide pattern 3A is provided on at least one surface of the printed wiring board 1, and a through hole 2 for inserting a lead of a component, for example, is bored at an appropriate tip portion thereof, and the periphery thereof is formed. If necessary, a conductive layer is provided by plating or another required method. The width of the pattern 3A here is preferably equal to the diameter of the through hole 2. The conductive portion of the through hole 2 is the pattern 3
A slit 5 (having a predetermined width) is provided so as to be separated from A, and the land 4A is left in the vicinity of the conductive portion of the through hole 2 of the pattern 3A.
A resist 6 made of a predetermined material is provided.

FIG. 3 is a schematic explanatory view of another embodiment of the printed wiring board according to the present invention. 3A is a side sectional view of the above embodiment, and FIG. 3B is a top view of the above embodiment. In FIG. 3, at least one inner layer solid pattern 3B is provided inside the printed wiring board 1. A through hole 2 for inserting a lead of a component is bored at an appropriate position, for example, and a conductive layer is provided around the hole by plating or another required method as required. Then, a slit 5 (having a predetermined width) is provided so that the conductive layer of the through hole 2 is separated from the inner layer solid pattern 3B, and a via hole 2A described later that follows the inner layer solid pattern 3B is formed. A resist 6 of a certain predetermined material is provided so that the land 4 remains in the vicinity. The above-mentioned inner layer solid pattern 3B is connected to the via hole 2A so as to be electrically connected to an external conductive portion (for example, land 4). Also, the via hole 2
As is well understood from FIG. 2 (B), A can be scattered in an appropriate number around the ring-shaped land 4.

FIG. 4 is a schematic explanatory view of another embodiment of the printed wiring board according to the present invention. In FIG. 4 (A), four substantially oval patterns 3A are provided on at least one surface of the printed wiring board 1 so as to face each other so as to sandwich a through hole 2 for inserting a lead of a component, for example. It is provided. In addition, this through hole 2
A conductive layer is provided around the substrate by plating or other required technique, if necessary. One via hole 2A is provided at each of the distal ends of the pattern 3A. The shape of the land 4 is arranged so as to be separated from the tip portion of the pattern 3A. 4B is the same as that in FIG. 4A except for the number of patterns in which via holes are provided and the mutual positional relationship, and further detailed description will be given. Omit it.

[0011]

As described in detail above, the printed wiring board according to the present invention is a printed wiring board having through holes formed in the ground of a solid pattern, and a plurality of slits are formed on the solid pattern around the through holes. It is characterized by being cut out for heat retention. According to the present invention having such a feature, since the through hole is provided so as to be cut away from the pattern, the solder rising is remarkably improved. Further, when the component is replaced, the solder is absorbed, and the pattern and the through hole are notched, so that the component can be replaced more easily.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view of an embodiment of a printed wiring board according to the present invention.

FIG. 2 is an explanatory diagram relating to another aspect of the printed wiring board in the above embodiment.

FIG. 3 is a schematic explanatory view of another embodiment of the printed wiring board according to the present invention.

FIG. 4 is a schematic explanatory view of another embodiment of the printed wiring board according to the present invention.

FIG. 5 is an illustration of a conventional technique of this kind.

[Explanation of symbols]

 1: Printed wiring board; 2: Through hole; 3: Solid pattern; 4: Land; 5: Slit; 6: Resist;

Claims (2)

[Claims] 1. A printed wiring board in which through holes are formed at appropriate positions in a solid pattern, wherein a single annular slit is provided for thermal insulation on the solid pattern around the through holes. Wiring board. 2. A printed wiring board in which a through hole is formed at an end of a pattern having a predetermined width, a slit is provided between the pattern and the through hole, and the width of the pattern is the through hole. A printed wiring board having a diameter equal to that of the printed wiring board.