JPH0661787B2 - Laminated board manufacturing method - Google Patents
Laminated board manufacturing methodInfo
- Publication number
- JPH0661787B2 JPH0661787B2 JP63051833A JP5183388A JPH0661787B2 JP H0661787 B2 JPH0661787 B2 JP H0661787B2 JP 63051833 A JP63051833 A JP 63051833A JP 5183388 A JP5183388 A JP 5183388A JP H0661787 B2 JPH0661787 B2 JP H0661787B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- thickness
- resin
- plate
- laminated board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電気機器、計算機器、通信機器等に用いられる
電気用積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a method for producing an electrical laminate for use in electric equipment, computing equipment, communication equipment and the like.
従来、電気用積層板は樹脂含浸基材、金属箔からなる積
層体を金属プレートに挟んだものを１〜15組重ねた外側
にクッション材を介してキャリア板を配し熱盤間に挟み
加熱加圧積層成形して得られるものであるが、金属プレ
ートとしては全て同じ厚みのものを用いていた。Conventionally, electrical laminates are made by stacking 1 to 15 pairs of laminates consisting of resin-impregnated base material and metal foil sandwiched between metal plates, and a carrier plate is placed on the outside with a cushioning material sandwiched between them and heated. It was obtained by pressure lamination molding, but all metal plates having the same thickness were used.
従来の技術で述べたように金属プレートとして全て同じ
厚みのものを用いると、熱盤に最近接する電気用積層板
表面にシワが発生する。本発明は従来の技術における上
述の問題点に鑑みてなされたもので、その目的とすると
ころは表面にシワのない電気用積層板の製造方法を提供
することにある。If metal plates having the same thickness are used as described in the prior art, wrinkles occur on the surface of the electrical laminate that is closest to the hot platen. The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a method for manufacturing an electrical laminate having no wrinkles on the surface.
本発明は樹脂含浸基材、金属箔からなる積層体を金属プ
レート、クッション材、キャリア板を用いて積層成形す
るに際し、クッション材に接触する金属プレート厚を、
非接触金属プレート厚より50〜200％厚くすることを特
徴とする積層板の製造方法のため積層板表面のシワをな
くすることができたもので、以下本発明を詳細に説明す
る。The present invention is a resin-impregnated base material, a metal plate, a cushion material, when laminating a laminate composed of a metal foil using a carrier plate, the thickness of the metal plate in contact with the cushion material,
The wrinkles on the surface of the laminated plate can be eliminated by the manufacturing method of the laminated plate, which is characterized by making the thickness of the non-contact metal plate 50 to 200% thicker.
本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メラミン樹脂、ポリイミド、ポリブタジエ
ン、ポリアミド、ポリアミドイミド、ポリスルフオン、
ポリフェニレンサルフアイド、ポリフェニレンオキサイ
ド、ポリブチレンテレフタレート、ポリエーテルエーテ
ルケトン、弗化樹脂等の単独、変性物、混合物等が用い
られ必要に応じて粘度調整に水、メチルアルコール、ア
セトン、シクロヘキサノン、スチレン等の溶媒を添加し
たもので、基材としては、ガラス、アスベスト等の無機
繊維やポリエステル、ポリアミド、ポリビニルアルコー
ル、アクリル等の有機合成繊維や木綿等の天然繊維から
なる織布、不織布、マット、或いは紙又はこれらの組合
せ基材等である。金属箔としては銅、アルミニゥム、
鉄、ニッケル、亜鉛等の単独、合金、複合品であり、必
要に応じて接着面を化学処理及び又は物理処理し更に必
要に応じて接着剤層を設けたものである。金属プレート
としては積層体間に存在するものとしては厚さ１〜５mm
の鉄、アルミニゥム、銅、ニッケル等の単独、合金、複
合品であり、必要に応じて表面に離型層を設けることが
できるが、クッション材に接触する金属プレート厚を、
非接触金属プレート厚より50〜200％厚くすることが必
要である。即ちクッション材接触金属プレート厚が非接
触金属プレート厚より50％未満のプラス厚であると熱盤
に最近接する積層板は過熱気味となり表面にシワが発生
し、プラス厚が200％をこえると熱盤から離れた位置の
積層板が過熱不足気味になるからである。クッション材
としてはゴム、合成樹脂、紙、布、板、合板、樹脂含浸
紙布のように弾性を有するものであればよい。キャリア
板については従来のものをそのまま用いることができ
る。The resin of the resin-impregnated base material used in the present invention, phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyetheretherketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used to adjust viscosity as necessary, such as water, methyl alcohol, acetone, cyclohexanone, and styrene. A solvent is added, and the base material is woven fabric, non-woven fabric, mat, or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol and acrylic, and natural fibers such as cotton. Alternatively, it is a combination base material or the like. As the metal foil, copper, aluminum,
It is an iron, nickel, zinc or the like alone, an alloy or a composite product, and the adhesive surface is chemically and / or physically treated as necessary, and an adhesive layer is provided if necessary. As a metal plate, it is between 1 and 5 mm thick if it exists between laminated bodies.
Of iron, aluminum, copper, nickel, etc., an alloy or a composite product, and a release layer can be provided on the surface if necessary, but the thickness of the metal plate that contacts the cushioning material
It should be 50-200% thicker than the non-contact metal plate thickness. That is, if the thickness of the cushioning contact metal plate is less than 50% of the thickness of the non-contact metal plate, the laminated plate closest to the hot plate will overheat and wrinkles will occur on the surface. This is because the laminated plate located away from the board tends to be overheated. The cushioning material may be elastic, such as rubber, synthetic resin, paper, cloth, board, plywood, or resin-impregnated paper cloth. A conventional carrier plate can be used as it is.
以下本発明を実施例にもとずいて説明する。The present invention will be described below based on examples.
実施例１ 厚さ0.2mmのガラス布に、エポキシ樹脂（シエル化学株
式会社製、品名エピコート1001）100重量部（以下単に
部と記す）、ジシアンジアミド４部、ベンジルジメチル
アミン0.2部、メチルオキシトール100部からなるエポキ
シ樹脂ワニスを乾燥後樹脂量が50重量％（以下単に％と
記す）になるように含浸、乾燥して得た樹脂含浸基材７
枚の上下面に厚さ0.035mmの銅箔を夫々配設した積層体1
0組の夫々の間に厚さ２mmのステンレス鋼製金属プレー
トに挟み、更に再外層のクッション材接触金属プレート
として厚さ４mmのステンレス鋼製金属プレートを配し、
厚さ３mmの布入りゴム板をクッション材として介して厚
さ５mmの鉄製キャリア板を夫々配設してから熱盤間に挟
み、成形圧力40kg/cm2、165℃で120分間積層成形して10
枚の厚さ1.6mmの両面銅張積層板を得た。Example 1 A glass cloth having a thickness of 0.2 mm was coated with 100 parts by weight (hereinafter simply referred to as "part") of an epoxy resin (manufactured by Shell Chemical Co., Ltd., product name Epicoat 1001), 4 parts of dicyandiamide, 0.2 part of benzyldimethylamine, and 100 parts of methyloxitol. Resin-impregnated base material 7 obtained by impregnating an epoxy resin varnish consisting of 10 parts by weight so that the amount of resin is 50% by weight (hereinafter simply referred to as%) and drying.
A laminated body in which 0.035 mm thick copper foils are placed on the upper and lower surfaces of each sheet 1
It is sandwiched between stainless steel plates with a thickness of 2 mm between each set of 0, and a stainless steel metal plate with a thickness of 4 mm is arranged as a cushion outer contact metal plate of the outer layer.
Place a 5mm thick iron carrier plate through a 3mm thick cloth-filled rubber plate as a cushioning material, sandwich between the hot plates, and laminate molding for 120 minutes at a molding pressure of 40kg / cm 2 and 165 ° C. Ten
A 1.6 mm-thick double-sided copper-clad laminate was obtained.
実施例２ クッション材接触金属プレートとして厚さ３mmのステン
レス鋼製金属プレートとを用いた以外は実施例１と同様
に処理して両面銅張積層板を得た。Example 2 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that a metal plate made of stainless steel having a thickness of 3 mm was used as the cushion contact metal plate.
実施例３ クッション材接触金属プレートとして厚さ５mmのステン
レス鋼製金属プレートとを用いた以外は実施例１と同様
に処理して両面銅張積層板を得た。Example 3 A double-sided copper clad laminate was obtained in the same manner as in Example 1 except that a metal plate made of stainless steel having a thickness of 5 mm was used as the cushion contact metal plate.
比較例１ クッション材接触金属プレートとして厚さ２mmのステン
レス鋼製金属プレートを用いた以外は実施例１と同様に
処理して両面銅張積層板を得た。Comparative Example 1 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that a stainless steel metal plate having a thickness of 2 mm was used as the cushion contact metal plate.
比較例２ クッション材接触金属プレートとして厚さ７mmのステン
レス鋼製金属プレートを用いた以外は実施例１と同様に
処理して両面銅張積層板を得た。実施例１乃至３と比較
例１乃び２の積層板表面シワ発生率は第１表のようであ
る。Comparative Example 2 A double-sided copper-clad laminate was obtained in the same manner as in Example 1 except that a metal plate made of stainless steel having a thickness of 7 mm was used as the cushion-contact metal plate. The occurrence rates of wrinkles on the surface of the laminated plates of Examples 1 to 3 and Comparative Examples 1 and 2 are shown in Table 1.
〔発明の効果〕 本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有する積層板の製造方法におい
ては、積層板表面のシワ発生率が大巾に低下する効果を
有している。 [Advantages of the Invention] The present invention is configured as described above. In the method for manufacturing a laminated plate having the structure described in claim 1, it has an effect of significantly reducing the wrinkle occurrence rate on the surface of the laminated plate.
Claims (1)
属プレート、クッション材、キャリア板を用いて積層成
形するに際し、クッション材に接触する金属プレート厚
を、非接触金属プレート厚より５０〜200％厚くするこ
とを特徴とする積層板の製造方法。1. When laminating a laminate comprising a resin-impregnated base material and a metal foil by using a metal plate, a cushion material, and a carrier plate, the thickness of the metal plate that contacts the cushion material is 50 than the thickness of the non-contact metal plate. ~ 200% thicker, a method for manufacturing a laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63051833A JPH0661787B2 (en) | 1988-03-04 | 1988-03-04 | Laminated board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63051833A JPH0661787B2 (en) | 1988-03-04 | 1988-03-04 | Laminated board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01225518A JPH01225518A (en) | 1989-09-08 |
| JPH0661787B2 true JPH0661787B2 (en) | 1994-08-17 |
Family
ID=12897864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63051833A Expired - Lifetime JPH0661787B2 (en) | 1988-03-04 | 1988-03-04 | Laminated board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0661787B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5642622A (en) * | 1979-09-14 | 1981-04-20 | Hitachi Chem Co Ltd | Manufacture of lamination sheet |
-
1988
- 1988-03-04 JP JP63051833A patent/JPH0661787B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01225518A (en) | 1989-09-08 |
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