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JPH0663979B2 - Crack and crack detector - Google Patents
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JPH0663979B2 - Crack and crack detector - Google Patents

Crack and crack detector

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Publication number
JPH0663979B2
JPH0663979B2 JP63174295A JP17429588A JPH0663979B2 JP H0663979 B2 JPH0663979 B2 JP H0663979B2 JP 63174295 A JP63174295 A JP 63174295A JP 17429588 A JP17429588 A JP 17429588A JP H0663979 B2 JPH0663979 B2 JP H0663979B2
Authority
JP
Japan
Prior art keywords
cracks
detected
crack
circuit
detectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63174295A
Other languages
Japanese (ja)
Other versions
JPH0224538A (en
Inventor
一義 安西
明 芝山
Original Assignee
有限会社安西総合研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 有限会社安西総合研究所 filed Critical 有限会社安西総合研究所
Priority to JP63174295A priority Critical patent/JPH0663979B2/en
Publication of JPH0224538A publication Critical patent/JPH0224538A/en
Publication of JPH0663979B2 publication Critical patent/JPH0663979B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 技術分野 本発明は、穀類、豆類等の被検物のヒビ、ワレを検出す
るための装置に関する。
Description: TECHNICAL FIELD The present invention relates to an apparatus for detecting cracks and cracks in a test object such as grains and beans.

技術的背景 穀類、豆類等においては、その脱穀、乾燥、搬送等の過
程で、ヒビ、ワレが発生し、その品質の低下の原因とな
っている。そのため、それらを検出する装置が望まれて
いるが、適正に作動する装置はこれまで開発されていな
い。
Technical background Grains and beans are cracked and cracked during the process of threshing, drying, and transportation, which causes the deterioration of quality. Therefore, a device that detects them is desired, but a device that operates properly has not been developed so far.

発明の目的 本発明は、上記の点に鑑み、穀類、豆類等に発生したヒ
ビ、ワレを適正に検出するための装置を提供することを
目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object thereof is to provide an apparatus for appropriately detecting cracks and cracks generated in grains, beans, and the like.

発明の構成 すなわち、本発明に係る検出装置は、穀類、豆類などの
ヒビ、ワレを検出するための装置において、穀類、豆類
などの被検物に対して検査光を当てるための照射装置
と、該照射装置と被検物とを相対的に移動する移動手段
と、上記移動方向において、上記照射装置の前後に配置
され、被検物から反射される光をそれぞれ所定の角度範
囲において受光し、その強度を検出する第1及び第2の
検出器とを有し、第1及び第2の検出器によって検出さ
れた検出光の強度の比が所定のしきい値を越えることに
より応答して被検物のヒビ、ワレを検出するようにした
ことを基本的特徴としている。
Structure of the invention That is, the detection device according to the present invention, a device for detecting cracks, such as cereals, beans, cracks, an irradiation device for applying inspection light to a test object such as cereals, beans, Moving means for relatively moving the irradiation device and the object to be inspected, and arranged in front of and behind the irradiation device in the movement direction, and receives light reflected from the object to be inspected in respective predetermined angular ranges, A first and a second detector for detecting the intensity, and responding when the ratio of the intensities of the detection light detected by the first and the second detector exceeds a predetermined threshold value. The basic feature is that cracks and cracks in the specimen are detected.

また、本発明は、上記基本的構成に加えて、第1及び第
2の検出器によって検出された検出光の強度の比を算出
する割り算回路と、割り算器により算出された比を微分
する微分回路と、を有しており、該微分回路により出さ
れた微分値が一定のしきい値を越えることに応答して被
検物のヒビ、ワレを検出するようにしたことを特徴とす
るヒビ、ワレ検出装置を提供する。
Further, in addition to the basic configuration described above, the present invention provides a division circuit for calculating the ratio of the intensities of the detection lights detected by the first and second detectors, and a differentiation for differentiating the ratio calculated by the divider. And a circuit for detecting a crack or a crack in the test object in response to the differential value generated by the differentiating circuit exceeding a certain threshold value. Provide a crack detecting device.

発明の作用及び効果 本発明に係る検出装置は上記の如く構成されるものであ
り、その原理的作用を添付図面の第1図ないし第4図に
基づき説明する。
Action and Effect of the Invention The detection device according to the present invention is configured as described above, and its principle action will be described with reference to FIGS. 1 to 4 of the accompanying drawings.

第1図において、検査光Bは垂直下方に向けられ、被検
物Oの面が水平面に対してγの角度をなし、また、該被
検物の面が完全拡散面であるとすると、反射角(すなわ
ち、法線Nに対してなす角)θをなす反射光Rの強度
は、当該反射角の余弦に比例したものなる。
In FIG. 1, the inspection light B is directed vertically downward, the surface of the object to be inspected O makes an angle of γ with respect to the horizontal plane, and it is assumed that the surface of the object to be inspected is a perfect diffusion surface. The intensity of the reflected light R forming an angle θ (that is, the angle formed with respect to the normal line N) is proportional to the cosine of the reflection angle.

第2図において、被検物が右から左に搬送されるものと
し、該被検物の搬送方向における検査光の前後におい
て、それぞれ角度φをなす範囲の反射光を第1及び第2
の検出器1、2によって受光し、その強度を検出すると
すると、 それぞれの検出器1、2におい検出される検出信号D1,D
2は次のようになる。
In FIG. 2, it is assumed that the object to be inspected is conveyed from right to left, and the reflected light in the range that forms an angle φ before and after the inspection light in the conveying direction of the object to be inspected is the first and the second.
When the light is received by the detectors 1 and 2 of the above, and its intensity is detected, the detection signals D1 and D detected by the detectors 1 and 2
2 becomes as follows.

ただし、−π/2+φ<γ<π/2−φ R:反射率 I:入射率の強度 そこで、第3図に示すような被検物Oとしての豆を当該
第3図において、右から左に移送するとすると、検出器
1、2によって検出される被検物からの反射光の強度D
1,D2は、第4図(a)及び(b)に示すようなる。
However, −π / 2 + φ <γ <π / 2−φ R: reflectance I: intensity of incident rate Therefore, a bean as the test object O as shown in FIG. 3 is changed from right to left in FIG. When it is transferred to the detector, the intensity D of the reflected light from the object detected by the detectors 1 and 2 is
1 and D2 are as shown in FIGS. 4 (a) and 4 (b).

そこで、D1,D2の比D3、すなわちD1/D2を求めれば、第
4図(c)の如くなりる。この信号D3は、上記の式から
の分からように、被検物の色、つまり、反射率の違いに
よって影響されず、検査表面の凹凸に応じた信号とな
る。
Therefore, if the ratio D3 of D1 and D2, that is, D1 / D2 is obtained, it becomes as shown in FIG. 4 (c). As can be seen from the above equation, the signal D3 is not affected by the color of the test object, that is, the difference in reflectance, and becomes a signal according to the unevenness of the inspection surface.

第4図(c)から分かるように、D3の値は、豆のヒビC
の部分、並びに、当該豆の始端及び終端において大きく
変化する。
As can be seen from Fig. 4 (c), the value of D3 is the crack C of beans.
, And the beginning and end of the beans.

従って、信号D3に基づき、被検物のヒビを検出すること
が出来るのである。(ここで、本発明においては、被検
物の上記の如き始端及び終端におけるD3によって、当該
検出装置がそこにヒビ、ワレが有るかの如く誤作動しな
いようにするための手段が必須であるごとくにも考えら
れるが、被検物が比較的大きなものである場合には、検
査の対象となる面に上記の如き始端や終端が含まない場
合もあり、従って、本発明に係る検出装置としては、そ
のそうな手段は必須のものではない。) また、信号D3の微分値をとれば、第4図(f)の如くな
る。この微分値は、上記比の信号D3に比べて、その変化
が大きく、従って、この信号を用いることにより被検物
のヒビ、ワレをより適正に検出することが出来るのであ
る。
Therefore, the crack of the test object can be detected based on the signal D3. (Here, in the present invention, a means for preventing the detection device from malfunctioning as if there is a crack or a crack by the D3 at the start end and the end as described above of the test object is essential. Although it can be considered as a matter of particularity, when the object to be inspected is relatively large, the surface to be inspected may not include the above-mentioned starting end and terminating end, and therefore, as a detection device according to the present invention. However, such means is not essential.) Further, if the differential value of the signal D3 is taken, it becomes as shown in FIG. 4 (f). This differential value has a greater change than the signal D3 having the above ratio, and therefore, by using this signal, cracks and cracks in the test object can be detected more appropriately.

尚、上述した被検物の始端及び終端における誤動作の問
題は、次のようにして回避することが出来る。
The above-mentioned problem of malfunction at the start end and the end of the test object can be avoided as follows.

すなわち、検出器1,2からの信号D1、D2を加算すれば、
第4図(d)に示す如き信号となり、従って、該信号が
一定L3以上になったときだけ、当該検出装置がヒビ、ワ
レの検出作業をするようにする手段を設ければよいので
ある。
That is, if the signals D1 and D2 from the detectors 1 and 2 are added,
A signal as shown in FIG. 4 (d) is obtained. Therefore, it is only necessary to provide a means for causing the detection device to detect cracks and cracks only when the signal becomes equal to or more than a certain level L3.

以上から分かるように、本発明に係る検出装置において
は、検出器1、2からの検出信号D1、D2の比D3、若しく
は、該信号D3の微分値に基づき、被検物のヒビ、ワレを
適正に検出することが出来るのである。
As can be seen from the above, in the detection device according to the present invention, cracks and cracks in the test object are detected based on the ratio D3 of the detection signals D1 and D2 from the detectors 1 and 2, or the differential value of the signal D3. It can be detected properly.

実施例 次に、第5図ないし第7図に示した本発明の実施例に係
る検出装置につき説明する。
Embodiment Next, a detection device according to an embodiment of the present invention shown in FIGS. 5 to 7 will be described.

第5図において、Oで示すのは被検物としての豆であ
る。被検物Oは、図示しないベルトコンベア等の搬送手
段により、第5図の右から左に搬送される。
In FIG. 5, O is a bean as a test object. The inspection object O is conveyed from right to left in FIG. 5 by a conveyor such as a belt conveyor not shown.

検出装置10は、搬送される被検物に検査光を当てる照明
装置12と、被検物の搬送方向において、照明装置12の前
後に配置された第1及び第2の反射光検出器14、16を有
している。この実施例においては、照明装置12してレー
ザ装置を用いており、また、第1及び第2の検出器14、
16は、それぞれ、集光レンズ20、22、20′,22′並びに
センサ23、23′を有している。
The detection device 10 includes an illuminating device 12 that applies inspection light to a conveyed test object, and first and second reflected light detectors 14 arranged in front of and behind the illuminating device 12 in the transfer direction of the test object. Has 16. In this embodiment, a laser device is used as the illumination device 12, and the first and second detectors 14,
16 has condenser lenses 20, 22, 20 ', 22' and sensors 23, 23 ', respectively.

第1及び第2の検出器14、16は、被検物からの反射光の
所定の角度範囲を受光して、その強度に比例した信号を
増幅器24、26に送る。増幅器により増幅された信号は上
述した信号D1,D2(第4図)に対応するものであり、割
り算回路に送られてD1とDとの比、すなわち、D1/D2=
D3が発生される。割り算回路からの信号D3は微分回路30
に送られて微分され、第1及び第2の比較器32、34に送
られる。第1の比較器32、34は、それぞれ所定のしきい
値L1、L2を設定しており、それぞれの比較器に送られて
くる微分値信号がそれらのしきい値を越えると、それぞ
れ出力信号(第4図g)をOR回路36に送る。
The first and second detectors 14 and 16 receive a predetermined angle range of the reflected light from the test object and send a signal proportional to the intensity to the amplifiers 24 and 26. The signal amplified by the amplifier corresponds to the above-mentioned signals D1 and D2 (Fig. 4), and is sent to the division circuit and the ratio of D1 and D, that is, D1 / D2 =
D3 is generated. The signal D3 from the division circuit is the differentiation circuit 30
To the first and second comparators 32 and 34. The first comparators 32 and 34 respectively set predetermined threshold values L1 and L2, and when the differential value signals sent to the respective comparators exceed those threshold values, the output signals are respectively output. (Fig. 4g) is sent to the OR circuit 36.

また、増幅器24、26からの信号D1,D2は加算器40に送ら
れ、該加算器で加算された信号が比較器42に送られる。
比較器には、しきい値L3が設定されており、比較器42か
らの値が該しきい値を越えると出力信号(第4図e)を
AND回路に送る。
The signals D1 and D2 from the amplifiers 24 and 26 are sent to the adder 40, and the signals added by the adder are sent to the comparator 42.
A threshold value L3 is set in the comparator, and when the value from the comparator 42 exceeds the threshold value, the output signal (Fig. 4e) is output.
Send to AND circuit.

比較器42及びOR回路36はAND回路44に接続されており、
該回路は比較器42及びOR回路からの信号を同時に入力し
たときに、すなわち、被検物が豆である場合を例にとれ
ば、当該豆の始端及び終端付近の部分を除いた部分に検
査光が当てられているときで、D3の微分値が所定のしき
い値L1若しくはL2を越えたときに、信号(第4図h)を
発する。従って、この信号によって、被検物にヒビ、ワ
レがあることを検出することが出来る。
The comparator 42 and the OR circuit 36 are connected to the AND circuit 44,
When the signals from the comparator 42 and the OR circuit are input at the same time, that is, when the object is a bean, for example, the circuit is inspected in the part excluding the part near the start end and the end of the bean. A signal (FIG. 4h) is emitted when the differential value of D3 exceeds a predetermined threshold value L1 or L2 when the light is applied. Therefore, it is possible to detect that there is a crack or a crack in the test object by this signal.

第6図に示すのは、被検物をベルトコンベアなどで搬送
するのではなく、シュート50から落下させて検出を行う
例を示している。
FIG. 6 shows an example in which an object to be inspected is not conveyed by a belt conveyor or the like but dropped from a chute 50 for detection.

また、第7図は、照明装置としてのレーザ装置から発射
されるレーザを走査ミラー60で被検物上を走査するよう
にし、当該被検物の面全体を検査することが出来るよう
にした例を示している。
Further, FIG. 7 shows an example in which a laser emitted from a laser device as an illuminating device is used to scan an object to be inspected by a scanning mirror 60 so that the entire surface of the object to be inspected can be inspected. Is shown.

上述した実施例に係る装置は、上記「発明の構成」の項
で述べた第2番目の発明に対応するものであるが、この
装置から微分回路を除き、割り算回路の出力信号を第1
及び第2の比較器32、34に直接入力するようにして第1
番目の発明と対応する構成としても、同様の検出作用を
行うことが出来る。
The device according to the above-described embodiment corresponds to the second invention described in the section "Structure of the Invention", but the output signal of the division circuit is changed to the first signal by removing the differentiating circuit from this device.
And the first comparator by directly inputting to the second comparators 32 and 34.
The same detection operation can be performed even with the configuration corresponding to the second invention.

【図面の簡単な説明】[Brief description of drawings]

第1図は、被検物に対する入射光と反射光の強度の関係
を示すための説明図、 第2図は、反射光と第1及び第2の検出器との関係を示
す図、 第3図は、被検物、入射光及び検出器の関係を示す図、 第4図aないし第4図hは、第3図における、検出器が
検出した反射光の強度を示す信号D1及びD2、並びに、こ
れら信号が本発明に係る装置において処理される各段階
における信号を示す図、 第5図は、本発明の1実施例に係る装置の概要図、 第6図は、第2の実施例に係る装置の一部を示す図、 第7図は、第3の実施例に係る装置の一部を示す図であ
る。 12……照射装置; 14、16……第1及び第2の検出器; 28……割り算回路; 30……微分回路。
FIG. 1 is an explanatory view for showing the relationship between the intensity of incident light and reflected light with respect to the test object, and FIG. 2 is a view showing the relationship between reflected light and the first and second detectors. The figures show the relationship between the object to be inspected, the incident light and the detector, and FIGS. 4a to 4h show the signals D1 and D2 showing the intensity of the reflected light detected by the detector in FIG. And diagrams showing signals at each stage where these signals are processed in the device according to the present invention, FIG. 5 is a schematic diagram of the device according to one embodiment of the present invention, and FIG. 6 is a second embodiment. FIG. 7 is a diagram showing a part of the device according to the third embodiment, and FIG. 7 is a diagram showing a part of the device according to the third embodiment. 12 ... Irradiation device; 14, 16 ... First and second detectors; 28 ... Division circuit; 30 ... Differentiation circuit.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】穀類、豆類などのヒビ、ワレを検出するた
めの装置において、 穀類、豆類などの被検物に対して検査光を当てるための
照射装置と、 該照射装置と被検物とを相対的に移動させる移動手段
と、 上記移動方向において、上記照射装置の前後に配置さ
れ、被検物から反射される光を所定の角度範囲で受光
し、その強度を検出する第1及び第2の検出器と、 第1及び第2の検出器によって検出された検出光の強度
の比を算出する割り算回路と、 割り算回路により算出された比を微分する微分回路と、 第1及び第2の検出器によって検出された検出光の強度
の和を算出する加算器と、を含み、 前記微分回路の微分値が第1の所定のしきい値を越え且
つ前記加算器の出力が第2の所定のしきい値を越えるこ
とに応答して被検物のヒビ、ワレを検出するようにした
ことを特徴とする、ヒビ、ワレ検出装置。
1. A device for detecting cracks and cracks in grains, beans, etc., and an irradiation device for applying inspection light to an inspection object, such as grains, beans, etc., and the irradiation device and the inspection object. And a moving means for moving the light relative to each other in the moving direction, the first and the first being arranged in front of and behind the irradiation device to receive light reflected from the object to be inspected within a predetermined angle range and detect its intensity. Second detector, a division circuit for calculating the ratio of the intensities of the detected light detected by the first and second detectors, a differentiation circuit for differentiating the ratio calculated by the division circuit, and first and second An adder for calculating the sum of the intensities of the detection lights detected by the detectors, the differential value of the differentiating circuit exceeds a first predetermined threshold value, and the output of the adder has a second value. In response to exceeding a predetermined threshold value, cracks or cracks in the object are detected. An apparatus for detecting cracks and cracks, which is characterized by detecting cracks.
JP63174295A 1988-07-13 1988-07-13 Crack and crack detector Expired - Lifetime JPH0663979B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63174295A JPH0663979B2 (en) 1988-07-13 1988-07-13 Crack and crack detector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63174295A JPH0663979B2 (en) 1988-07-13 1988-07-13 Crack and crack detector

Publications (2)

Publication Number Publication Date
JPH0224538A JPH0224538A (en) 1990-01-26
JPH0663979B2 true JPH0663979B2 (en) 1994-08-22

Family

ID=15976173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63174295A Expired - Lifetime JPH0663979B2 (en) 1988-07-13 1988-07-13 Crack and crack detector

Country Status (1)

Country Link
JP (1) JPH0663979B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003057187A (en) * 2001-08-10 2003-02-26 Yamamoto Co Ltd Rice crack detection method and device
JP4801953B2 (en) * 2005-08-30 2011-10-26 第一実業ビスウィル株式会社 Powder inspection equipment
EP1830176A1 (en) * 2006-03-02 2007-09-05 FOSS Analytical AB Device and method for optical measurement of small particles such as grains from cereals and like crops
JP7641876B2 (en) * 2021-10-07 2025-03-07 株式会社クボタ Inspection Equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51111387U (en) * 1975-03-05 1976-09-08
JPS56145337A (en) * 1980-04-15 1981-11-12 Furukawa Electric Co Ltd:The Detecting method for surface flaw of long body
JPS6046190U (en) * 1983-09-09 1985-04-01 コ−ア電子工業株式会社 Device that sorts granular materials based on reflectance and size

Also Published As

Publication number Publication date
JPH0224538A (en) 1990-01-26

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