JPH0665082B2 - Circuit board connection structure - Google Patents
Circuit board connection structureInfo
- Publication number
- JPH0665082B2 JPH0665082B2 JP60097808A JP9780885A JPH0665082B2 JP H0665082 B2 JPH0665082 B2 JP H0665082B2 JP 60097808 A JP60097808 A JP 60097808A JP 9780885 A JP9780885 A JP 9780885A JP H0665082 B2 JPH0665082 B2 JP H0665082B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- circuit board
- connection
- lead frame
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Combined Controls Of Internal Combustion Engines (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は回路基板の接続構造に係り、特に、厚膜回路基
板をリードフレームに接続するに好適な回路基板の接続
構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board connection structure, and more particularly to a circuit board connection structure suitable for connecting a thick film circuit board to a lead frame.
厚膜回路基板をリードフレームに接続するに際しては、
従来、特開昭56−101073号公報に記載されている方法が
採用されていた。ところが、この方法では、基板とリー
ドフレームとの接続が機械的固定と電気的接続とを兼ね
た一点の半田付けで行われているため、組み立て作業に
おける機械的ストレスに対する配慮や使用中における熱
応力に対する余裕が少ない欠点があつた。When connecting the thick film circuit board to the lead frame,
Conventionally, the method described in JP-A-56-101073 has been adopted. However, in this method, the connection between the board and the lead frame is made by soldering at one point, which serves both mechanical fixing and electrical connection, so consideration for mechanical stress during assembly work and thermal stress during use are required. There was a shortcoming that I could not afford it.
本発明は、前記従来の課題に鑑みて為されたものであ
り、その目的は、機械的ストレスや熱的ストレスに対す
る耐力の向上を図ることができる回路基板の接続構造を
提供することにある。The present invention has been made in view of the above conventional problems, and an object thereof is to provide a circuit board connection structure capable of improving the proof stress against mechanical stress and thermal stress.
本発明の回路基板の接続構造は、回路基板上に回路パタ
ーンと電気的に接続された第１の接続用パターンと、前
記第１の接続用パターンから離隔した第２の接続用パタ
ーンとを形成し、前記第１の接続用パターンと前記第２
の接続用パターンとを各接続用パターン間の距離よりも
長い導電性リードフレームで接続し、前記第２の接続用
パターンと外部端子とを前記導電性リードフレームと一
体に形成された導電性リードフレームによって接続し、
前記導電性リードフレームは前記外部端子とは溶接によ
り接合され、前記第１の接続用パターン及び前記第２の
接続用パターンとは半田付けにより接合されていること
を特徴とするものであって、この構成により前記目的を
達成するようにしたものである。In the circuit board connection structure of the present invention, a first connection pattern electrically connected to the circuit pattern and a second connection pattern separated from the first connection pattern are formed on the circuit board. The first connection pattern and the second connection pattern.
Of the connecting pattern and the connecting pattern are connected by a conductive lead frame longer than the distance between the connecting patterns, and the second connecting pattern and the external terminal are integrally formed with the conductive lead frame. Connect by frame,
The conductive lead frame is joined to the external terminal by welding, and the first connecting pattern and the second connecting pattern are joined by soldering, With this configuration, the above-mentioned object is achieved.
以下、本発明の好適な実施例を図面に基づいて説明す
る。Preferred embodiments of the present invention will be described below with reference to the drawings.
第１図乃至第３図には、本発明の好適な実施例の構成が
示されている。第１図乃至第３図において、プラスチツ
クで成形されたハウジング１には厚膜回路で形成された
回路基板２が装着されており、リードフレーム３ａ，３
ｂ，３ｃがそれぞれ外部端子４ａ，４ｂ，４ｃと接続さ
れている。又、端子５ａ，５ｂ，６ａ，６ｂは空気流量
を検出するための熱線抵抗ＨＷ、及び空気温度検出抵抗
ＣＷとリードＬとを介して接続されている。そして端子
５ａ，５ｂ，６ａ，６ｂと回路基板２はそれぞれワイヤ
Ｗを介して接続されている。なおＣはカバーであり、Ｄ
はハウジング１と回路基板２とを固定するための接着剤
である。1 to 3 show the construction of a preferred embodiment of the present invention. 1 to 3, a circuit board 2 formed of a thick film circuit is mounted on a housing 1 formed of plastic, and lead frames 3a, 3
b and 3c are connected to external terminals 4a, 4b and 4c, respectively. The terminals 5a, 5b, 6a, 6b are connected to each other via a heat wire resistance HW for detecting the air flow rate, an air temperature detection resistance CW and a lead L. The terminals 5a, 5b, 6a, 6b and the circuit board 2 are connected via wires W, respectively. C is a cover and D
Is an adhesive for fixing the housing 1 and the circuit board 2.
回路基板２上の接続用パターンを構成する接続部Ｐ２，
Ｐ３は導体ＣＯ１，ＣＯ２と半田付けによつて接続され
る。そして導体ＣＯ２は回路基板２の回路パターンと接
続されており、導体ＣＯ２と導体ＣＯ１とは離れて形成
されている。このため、接続部Ｐ２と接続部Ｐ３とを接
続するに際しては、互いに機械的ストレスの影響を受け
ないように、各接続部Ｐ２，Ｐ３との間の距離よりも長
いリードフレーム３を介して、溶接によつて接続されて
いる。なお接続部Ｐ２はリードフレーム３を介して外部
端子に接続されている。The connection portion P2 forming the connection pattern on the circuit board 2
P3 is connected to the conductors CO1 and CO2 by soldering. The conductor CO2 is connected to the circuit pattern of the circuit board 2, and the conductor CO2 and the conductor CO1 are formed separately. Therefore, when connecting the connecting portion P2 and the connecting portion P3, the lead frame 3 longer than the distance between the connecting portions P2 and P3 is used so as not to be affected by mechanical stress. It is connected by welding. The connecting portion P2 is connected to the external terminal via the lead frame 3.
第４図及び第５図には、本発明に係る回路基板の接続構
造が適用された熱線式空気流量センサの構成が示されて
いる。第４図において、Ｂは空気通路、例えば自動車の
エアクリーナと吸気管の間の吸気通路で、その流量Ｑの
一部Ｑはバイパス通路ＢＹに入り、空気流量センサＭの
熱線抵抗ＨＷ、空気温度検出抵抗ＣＷを経て下流で再び
Ｑと合流する。熱線抵抗ＨＷと空気温度検出抵抗ＣＷに
よつて、第５図に示す回路を構成すれば、熱線抵抗ＨＷ
と空気温度検出抵抗ＣＷの関係は次の(１)式で示され
る。FIG. 4 and FIG. 5 show the structure of a hot-wire air flow sensor to which the circuit board connection structure according to the present invention is applied. In FIG. 4, B is an air passage, for example, an intake passage between an air cleaner of an automobile and an intake pipe, and a part Q of the flow rate Q enters the bypass passage BY, and the heat wire resistance HW of the air flow sensor M and the air temperature detection. It merges with Q again downstream via the resistance CW. If the circuit shown in FIG. 5 is configured by the heat ray resistance HW and the air temperature detecting resistance CW, the heat ray resistance HW
And the air temperature detection resistance CW are represented by the following equation (1).
即ち、空気の温度変化を補償し、(１)式が成り立つよう
に差動増幅器Ａ、トランジスタＴが動作し、熱線抵抗Ｈ
Ｗへの供給電力を制御することができる。一方、熱線抵
抗ＨＷの消費電力と空気ｑの流速Ｖｑの間には次の(２)
式の関係がある。 That is, the differential amplifier A and the transistor T are operated so that the temperature change of the air is compensated and the equation (1) is established, and the heat wire resistance H
The power supplied to W can be controlled. On the other hand, between the power consumption of the heat wire resistance HW and the flow velocity Vq of the air q, the following (2)
There is an expression relationship.
Ｉｎ２×ＨＷ＝Ｃ１＋Ｃ２（ρＶｑ）ｎ (２) Ｃ１，Ｃ２，ｎ：定数 ρ：空気の密度 Ｉｎ：ＨＷに流れる電流 従つて出力電圧Ｖｏは次の(３)式となり、第６図に示さ
れる特性を得ることができる。 In 2 × HW = C1 + C2 (ρVq) n (2) C1, C2, n: constant [rho: density of the air In: Current accordance connexion output voltage V o that flows in the HW become the following equation (3), in Figure 6 The properties shown can be obtained.
ただしＱ＝Ｋｑ，ｑ＝ρＶｑ・Ｓ Ｋ：Ｑとｑの分流率 Ｓ：バイパス通路ＢＹの断面積 以上のように本実施例によれば、外部端子４とリードフ
レーム３の溶接時に、リードフレーム３に力を加えて機
械的ストレスを与えても、電気的接続部Ｐ２，Ｐ３にダ
メージを与えることがない。又使用中のストレス、例え
ば冷間時にエンジン始動を行つて熱衝撃を与えても熱ス
トレスに対しても耐力の向上を図ることができる。 However, Q = Kq, q = ρVq · S K: Dividing ratio of Q and q S: Cross-sectional area of bypass passage BY As described above, according to this embodiment, when the external terminal 4 and the lead frame 3 are welded, Even if a force is applied to 3 to give a mechanical stress, the electrical connection parts P2 and P3 are not damaged. Further, it is possible to improve the proof stress against the stress during use, for example, even if the engine is started during cold and a thermal shock is given, the thermal stress is improved.
以上説明したように、本発明によれば、回路パターンと
電気的に接続された第１の接続用パターンと、外部端子
に接続される第２の接続用パターンとを各接続用パター
ン間の距離よりも長い導電性リードフレームで接続する
ようにしたため、機械的ストレスや熱的ストレスに対す
る耐力の向上を図ることができ、信頼性の向上に寄与す
ることができるという優れた効果が得られる。As described above, according to the present invention, the distance between each connection pattern is defined by the first connection pattern electrically connected to the circuit pattern and the second connection pattern connected to the external terminal. Since the connection is made with a longer conductive lead frame, it is possible to improve the proof stress against mechanical stress and thermal stress, and it is possible to obtain an excellent effect that it can contribute to the improvement of reliability.
第１図は本発明の一実施例を示す平面図、第２図は第１
図の側面断面図、第３図は第１図の要部拡大図、第４図
は本発明が適用された熱線式空気流量センサの構成説明
図、第５図は熱線式空気流量センサの回路図、第６図は
熱線式空気流量センサの出力特性図である。 １…ハウジング、２…回路基板、３…リードフレーム、
４…外部端子、Ｐ１…溶接接続部、Ｐ２…固定接続部、
Ｐ３…電気的接続部。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
FIG. 3 is a side sectional view of the drawing, FIG. 3 is an enlarged view of a main part of FIG. 1, FIG. 4 is a configuration explanatory view of a hot-wire air flow sensor to which the present invention is applied, and FIG. 5 is a circuit of the hot-wire air flow sensor. FIG. 6 and FIG. 6 are output characteristic diagrams of the hot wire type air flow rate sensor. 1 ... Housing, 2 ... Circuit board, 3 ... Lead frame,
4 ... External terminal, P1 ... Welding connection part, P2 ... Fixed connection part,
P3 ... Electrical connection.
Claims (1)
された第１の接続用パターンと、前記第１の接続用パタ
ーンから離隔した第２の接続用パターンとを形成し、前
記第１の接続用パターンと前記第２の接続用パターンと
を各接続用パターン間の距離よりも長い導電性リードフ
レームで接続し、前記第２の接続用パターンと外部端子
とを前記導電性リードフレームと一体に形成された導電
性リードフレームによって接続し、前記導電性リードフ
レームは前記外部端子とは溶接により接合され、前記第
１の接続用パターン及び前記第２の接続用パターンとは
半田付けにより接合されていることを特徴とする回路基
板の接続構造。1. A first connecting pattern electrically connected to a circuit pattern and a second connecting pattern separated from the first connecting pattern are formed on a circuit board, and the first connecting pattern is formed. The connection pattern and the second connection pattern are connected by a conductive lead frame longer than the distance between the connection patterns, and the second connection pattern and the external terminal are connected to the conductive lead frame. The conductive lead frame is integrally connected, the conductive lead frame is joined to the external terminal by welding, and the first connecting pattern and the second connecting pattern are joined by soldering. A circuit board connection structure characterized by being provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60097808A JPH0665082B2 (en) | 1985-05-10 | 1985-05-10 | Circuit board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60097808A JPH0665082B2 (en) | 1985-05-10 | 1985-05-10 | Circuit board connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61256787A JPS61256787A (en) | 1986-11-14 |
| JPH0665082B2 true JPH0665082B2 (en) | 1994-08-22 |
Family
ID=14202065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60097808A Expired - Lifetime JPH0665082B2 (en) | 1985-05-10 | 1985-05-10 | Circuit board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0665082B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH089896Y2 (en) * | 1990-10-25 | 1996-03-21 | 三菱電機株式会社 | Molded parts for electronic devices |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5021674A (en) * | 1973-06-25 | 1975-03-07 | ||
| JPS55165584A (en) * | 1979-06-08 | 1980-12-24 | Nippon Electric Co | Electric part and method of bending lead wire of electric part |
-
1985
- 1985-05-10 JP JP60097808A patent/JPH0665082B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61256787A (en) | 1986-11-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000353778A (en) | Power semiconductor module | |
| JPH073352B2 (en) | Thermal air flow meter | |
| JP2001339109A (en) | Current detection device equipped with a ball element | |
| US6781358B2 (en) | Hall-effect current detector | |
| JP2002202327A (en) | Current detector equipped with hall element | |
| JPH06186254A (en) | Chip-type resistor for current detection | |
| JP3379240B2 (en) | Four-terminal shunt resistor | |
| JPH0665082B2 (en) | Circuit board connection structure | |
| JP2004340891A (en) | Pressure sensor device | |
| JPH0421767U (en) | ||
| JPS6281087A (en) | Lead frame connection structure | |
| JPS6180074A (en) | Magnetic sensor with terminal for detecting current | |
| JP2001153701A (en) | Heat generating resistance type air flow rate measuring apparatus | |
| JP3664758B2 (en) | Air flow measurement device | |
| JPS6082952A (en) | Oxygen concentration detector | |
| JPS6286871A (en) | Semiconductor pressure sensor | |
| JPH06109508A (en) | Support structure of temperature-sensitive resistor, housing of its circuit, and air flow meter using these | |
| JP3304227B2 (en) | Lead wire and odor sensor using the same | |
| JPS635241Y2 (en) | ||
| JPS63117075U (en) | ||
| JPH0521845Y2 (en) | ||
| JPS5832366U (en) | Gas rate sensor heat wire pair wiring circuit | |
| JPH054023U (en) | Gas rate sensor | |
| JPH07234142A (en) | Support structure for thermal resistance element | |
| JPH0666621U (en) | Pressure sensor |