JPH0665083B2 - Electronic components for surface mounting - Google Patents

Description

The present invention relates to a surface mounting electronic component such as a connector which can be surface mounted on a mounting substrate.

[Prior Art] Various surface mount connectors (hereinafter simply referred to as connectors) have been developed. As an example thereof, as shown in FIGS. 8A and 8B, there is one in which a terminal lead 51 is projected from a side surface of a connector main body 50 and a curved elastic adhesive portion 52 is formed in this tail portion.

When such a connector is surface-mounted on the mounting substrate 53, if it is placed on one plate surface of the mounting substrate 53 and the connector body 50 is pressed, the elasticity (restoring force) of the elastic bonding portion 52 of the terminal lead 51 mounts the connector. Since it strongly adheres to the substrate 53, if the surface mounting is performed in this state, the elastic adhesive portion 5
2 and the pad printed on the mounting substrate 53 are reliably bonded by soldering.

For this reason, the connector shown in FIG. 8 is more often used than the conventional terminal lead whose tail portion does not have elasticity.

[Problems to be Solved by the Invention] However, in the connector of FIG. 8, since the restoring force of the elastic bonding portion 52 of the terminal lead 51 directly acts on the mounting substrate 53, the mounting substrate 53 is caused by the restoring force. May be warped, and in some cases, the contact with the mounting substrate 53 becomes uncertain, resulting in poor reliability. Also, the terminal lead 5
It is very difficult to hold them in an aligned state until 1 is surface-mounted, and in reality, as shown in FIG. 8B, the terminal leads 51 are mostly in an unaligned state.
In this case, before the surface mounting on the mounting substrate 53,
As shown in FIG. 7D, it is necessary to align the terminal leads 51 with the pads in which a plurality of pads 54 are printed in a line on the surface of the mounting substrate 53. The distance A between the pads 54 in FIG. 7 (d) is conventionally 1.27 mm, for example.
However, it has recently become even narrower than that, for example, 0.
Since it is about 635 mm, it is not easy and troublesome to align the terminal leads 51 in accordance with the distance between the pads 54, and the distance between the pads 54 should be equal to each other.
Therefore, it is difficult to secure a desired insulation distance.

In view of the above circumstances, the present invention enables surface mounting by accurately and surely abutting on a pad of a printed circuit board in a state where the elastic contact portions at the ends are aligned, and surface mounting at high density. It is an object of the present invention to provide a surface mount electronic component having such a configuration.

[Means for Solving the Problems] In order to achieve such an object, in an electronic component of the present invention, a plurality of pads are formed in a zigzag pattern in which two pads are alternately arranged in two rows and extend in the width direction, Leads protruding from one side surface of the main body extend to positions where the elastic contact portions of the tip end face the pads, and intermediate portions from the side surface of the main body to the elastic adhesive portions are arranged in a row at a predetermined pitch in the width direction. The intermediate portion is held by the adjusting member in a line, and the adjusting member is positioned and fixed to the printed circuit board.

[Operation] By using the surface-mounting electronic component having such a configuration, the middle portion of the lead protruding from the side surface of the main body is held by the compensating member in a state of being aligned in one row in the width direction, and in this held state The compensation member is positioned and fixed on the printed circuit board. Therefore, the elastic contact portion located at the tip of the lead can be accurately brought into contact with each pad on the printed circuit board while being aligned, and the elastic contact portion and the pad can be accurately joined.

In addition, since the plurality of pads are formed in a zigzag pattern in which two rows are alternately arranged on the printed circuit board and extend in the width direction, and each elastic contact portion extends to a position facing the pad, the pads and the contact portions are not separated from each other. It is possible to reduce the pad interval and arrange them at high density while ensuring the insulation distance between them.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is an exploded perspective view showing the configuration of the first embodiment of the present invention. Here, the connector is given as an object to be surface-mounted on the mounting substrate 1, but the present invention is not limited to this, and other electronic components may be used.

As shown in FIG. 1, the connector body 4 includes a housing 2
And a plurality of terminal leads 3, the terminal leads 3 project from one side surface of the housing 2, and the tail portions are surface mountable to the mounting substrate 1, and a plurality of elastic adhesive portions curved in a substantially U shape. There are two rows of 5 in a staggered arrangement.

The compensation mechanism 6 includes a compensation member 7 that aligns and holds a space (intermediate portion) between the elastic adhesive portion 5 located at the tip of the terminal lead 3 and the embedded fixing portion in the housing 2 located on the base side of the terminal lead 3. In order to fix this to the mounting substrate 1, a rectifying member fixing boss 8 included in the rectifying member 7 and a boss insertion hole 9 formed in the mounting substrate 1 so that the boss 8 can be inserted and fixed.

The compensation member 7 is made of an insulating material and has a rectangular cross section as shown in the front view and the side view of FIGS.
A plurality of lead insertion holes 10 for inserting the terminal leads 3 are formed side by side in the width direction in parallel with each other on the opposite side surfaces, and the ends are tapered at both ends and the central portion of the bottom surface. Each member fixing boss 8 is formed.

On one plate surface of the mounting board 1, a plurality of soldering pads 1 for soldering the elastic adhesive portions 5 of the terminal leads 3 are mounted.
1 is printed in two rows in a staggered arrangement, and a plurality of patterns 12 are printed on each pad 11 at equal intervals. The mounting board 1 is formed with a plurality of body mounting holes 13 and a plurality of body fixing boss insertion holes 14.

The housing 2 is provided with a board mounting hole 15, a panel mounting hole 16, and a body fixing boss 17 for locking both when a plug (not shown) and a connector (receptacle) shown in the drawing are fitted. The lock portion 18 is formed.

The connector having such a structure is mounted on the mounting board 1 as shown in FIG.
Before surface-mounting on, make the following preparations. That is, first, with the plurality of terminal leads 3 inserted and fixed in the lead insertion holes 10 of the compensating member 7, the connector body 4 incorporated in the housing 2 is prepared. Next, the body fixing boss 17 of the prepared connector body 4 is inserted and fixed in the body fixing boss insertion hole 14 formed in the mounting board 1. After that, both are fixed to the board mounting hole 15 of the housing 2 and the main body mounting hole 13 of the mounting board 1 by hooks, screws or the like not shown. Finally, the compensation member 7
The fixing member fixing boss 8 is inserted into the boss insertion hole 9 of the mounting substrate 1 and fixed.

In this way, by inserting and fixing the adjusting member fixing boss 8 into the boss insertion hole 9, the elastic bonding portions 5 of the terminal leads 3 respectively inserted and fixed to the adjusting member 7 are mounted on the mounting substrate 1.
Since they are pressed substantially evenly with respect to each other, even if the contact pressure of each elastic adhesive portion 5 is considerably smaller than that of the conventional example shown in FIG. The problem of is eliminated and reliability is improved.

In addition, before the surface mounting of each terminal lead 3, the adjusting member 7
Since it is inserted and fixed in the lead insertion hole 10, the arrangement of the elastic adhesive portions 5 is hardly disturbed, and therefore it is not necessary to align the elastic adhesive portions 5 so that the solder pads 11 are aligned with each other. Mounting work is easy and workability is improved.

Further, even in the case of a two-piece connector including a plug and a receptacle, since the retraction member 7 absorbs the retraction force when inserting the two, the elastic bonding portion 5 and the soldering portion of the mounting substrate 1 are not inserted into the insertion portion. Since it is not overwhelmed, surface mounting is possible even with a two-piece connector with a large number of poles.

Further, since the lead insertion hole 10 is formed as the compensating member 7, the compensating member fixing bosses 8 are formed on the outer peripheral surface of the compensating member 7 at both axial end portions and intermediate positions thereof as shown in the figure. Or, since the desired number can be formed at any position on the outer peripheral surface of the compensating member 7, it is possible to prevent the center position of the compensating member 7 from being deformed due to warping, etc., and thus even the one having a large number of terminal leads 3 can be used. .

Furthermore, by making the compensation member 7 thin, for example, or by using a material having excellent flexibility, even if the mounting substrate 1 warps for some reason, it can be used without problems.

Also, the plurality of pads 11 are arranged in two rows in a staggered arrangement,
In addition, since the elastic adhesive portions 5 are arranged in a zigzag corresponding to the pads 11, a desired insulation distance can be secured between the pads 11 and the intervals between the pads 11 can be narrowed. FIG. 7 is a diagram for explaining this, (a) is a plan view showing only the mounting substrate 1, and (b) and (c) are for explaining the relationship between the mounting substrate 1 and the elastic bonding portion 5, respectively. FIG. 3 is a side view and a plan view of FIG. (D) is a plan view of a conventional mounting substrate 53. As is clear from this figure, the conventional example has a plurality of pads 5 as shown in FIG.
4 are only arranged in one row, pad 54
The insulating distance is determined by the mutual distance A, and if the mutual distance A of the pads 54 is narrowed to, for example, 0.635 m, the originally required insulating distance may not be secured. In contrast,
When the pads 11 are arranged in two rows in a staggered arrangement as in (a) and (c), the insulation distance can be managed by the inter-row distance B of the pads 11 regardless of the mutual distance A of the pads 11. For this reason, it is possible to secure a desired insulation distance between the pads 11 and to narrow the intervals between the pads 11.

FIG. 4 shows a second embodiment of the present invention. In the above-mentioned embodiment, the terminal lead 3 is projected to one side with respect to the connector body 4, but in this embodiment, the terminal lead 3 is projected to both sides of the connector body 4. Also in this embodiment, the compensating member 7 is the same as in the above-mentioned embodiments.
It goes without saying that the compensation member fixing boss 8 is inserted and fixed in the mounting board 1.

FIG. 5 shows another example of the above-mentioned correction member 7,
(A) and (b) are respectively a front view and a side view of the compensating member 27. In the above-mentioned embodiment, the hole 10 is formed for inserting and fixing the terminal lead 3. In this example, the terminal lead is inserted. The common groove 29 is formed. The boss 28 for fixing the compensation member is formed as in the above-described embodiment. In the case of the compensating member 7 of FIG. 5, the compensating member 7 can be used immediately before the surface mounting on the mounting substrate 1, so that the mounting work is easier than the compensating member 7 of FIG.

The present invention is not limited to the above-described embodiment, and may be configured as follows, for example. FIG. 6 is a cross-sectional view (a vertical cross-sectional view of FIG. 1) for explaining one of these, in which the terminal lead 3 is protected on the upper part of the compensating member 7 and the compensating member 7 is press-fitted into the mounting substrate 1. A cover 30 having an L-shaped cross section is provided for applying a pressing force to the compensation member 7 when the elastic bonding portion 5 is surface-mounted on the mounting substrate 1 and then fixed to, for example, a side plate of the housing 2. is there. Further, the fixing of the compensating member 7 and the terminal lead 3 may be performed by insert molding instead of inserting and fixing after the compensating member 7 is manufactured. Further, as a means for fixing the compensating member 7 or 27 to the mounting board 1, the boss is not tapered as described above, but is formed into a hook shape, or the mounting board fixing member is inserted into the mounting board and then fused. Or you may use a caimmel.

In the above-described embodiment, the plurality of pads 11 are arranged in two rows in a zigzag arrangement, and the elastic adhesive portions 5 are arranged in two rows in a zigzag arrangement. However, the present invention is not limited to this.
1 is 3 rows or more in a staggered arrangement, and 3 elastic adhesive parts 5
It is needless to say that the same effect as that of the above-described embodiment can be obtained even when the number of rows is more than one and the arrangement is zigzag.

[Effects of the Invention] As described above, according to the present invention, the middle portions of the plurality of leads protruding from one side surface of the main body are held by the compensating member in a line, and the compensating member is Since it is configured to be positioned and fixed on the printed circuit board, the elastic contact portions located at the tips of the leads accurately contact the pads on the printed circuit board while being aligned,
The elastic contact portion and the pad can be joined accurately.

In addition, since a plurality of pads are formed on the printed circuit board in a zigzag pattern alternately extending in two rows and extending in the width direction, the leads extend to the position where the elastic contact portions at the tips face the pads. The pads can be arranged at a high density while maintaining the insulation distance, and the mounting portion can be made compact.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing the structure of a first embodiment of a surface mounting electronic component according to the present invention, FIG. 2 is a diagram for explaining the compensation member of FIG. 1, and FIG. 3 is FIG. 4 is a front view showing a second embodiment of the present invention, and FIG. 5 is a view for explaining another example of the compensation member of the present invention. FIG. 6 is a cross-sectional view for explaining a modification of the present invention, FIG. 7 is a view for explaining the function and effect of the embodiment of the present invention, and FIG. 8 is an example of a conventional surface mount connector. FIG. 1 ... Mounting board, 2 ... Housing, 3 ... Terminal lead, 4 ...
Connector body, 5 ... Elastic adhesive portion, 6 ... Compensation mechanism, 7 ... Compensation member, 8 ... Compensation member fixing boss, 9 ... Boss insertion hole, 1
DESCRIPTION OF SYMBOLS 1 ... Soldering pad, 12 ... Pattern, 13 ... Main body mounting hole, 14 ... Main body fixing boss insertion hole, 15 ... Board mounting hole, 16 ... Panel mounting hole, 17 ... Main body fixing boss.

Claims (1)

[Claims] 1. An elastic adhesive portion located at the tip of a plurality of elastic leads projecting from one side surface of a main body is soldered to a plurality of pads on the surface of a printed circuit board to be surface-mounted. In the surface-mount electronic component, the plurality of pads are formed in a zigzag pattern alternately arranged in two rows on the printed circuit board and extending in the width direction, and the lead is located at a position where each of the elastic contact portions faces the pad. Extending to, and the intermediate portion from the side surface of the main body to the elastic adhesive portion are arranged in a row at a predetermined pitch in the width direction, and the intermediate portion is held in a state of being arranged in a row by a compensating member, An electronic component for surface mounting, wherein the compensating member is positioned and fixed to the printed circuit board.