JPH0666362B2 - Film carrier tape - Google Patents
Film carrier tapeInfo
- Publication number
- JPH0666362B2 JPH0666362B2 JP63190462A JP19046288A JPH0666362B2 JP H0666362 B2 JPH0666362 B2 JP H0666362B2 JP 63190462 A JP63190462 A JP 63190462A JP 19046288 A JP19046288 A JP 19046288A JP H0666362 B2 JPH0666362 B2 JP H0666362B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- bonding
- film
- film carrier
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
- Packages (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Advancing Webs (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はフィルムキャリアテープに関し、特に高密度実
装を要求されるフィルムキャリアテープの構造に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a film carrier tape, and more particularly to the structure of a film carrier tape that requires high-density mounting.
従来のフィルムキャリアテープは第２図に示すように、
搬送及び位置決め用のスプロケットホール（図示せず）
と半導体チップ（以下ＩＣチップという）１１が入る孔
４を有するポリイミド等の絶縁フィルム１０をベースフ
ィルムとし、この絶縁フィルム１０上に銅等の金属箔を
エポキシ系の絶縁性接着剤２により固着したのちパター
ニングし、孔４上に突出するフィンガー３Ａと電気選別
のためのパッド（図示せず）を有するリード３を形成し
た構造となっていた。The conventional film carrier tape is as shown in FIG.
Sprocket holes (not shown) for transport and positioning
An insulating film 10 made of polyimide or the like having a hole 4 into which a semiconductor chip (hereinafter referred to as an IC chip) 11 is used as a base film, and a metal foil made of copper or the like is fixed on the insulating film 10 by an epoxy-based insulating adhesive 2. After that, patterning is performed to form a lead 3 having a finger 3A protruding above the hole 4 and a pad (not shown) for electrical selection.
そして、このフィルムキャリアテープは、ＴＡＢ（Ｔａ
ｐｅ Ａｕｔｏｍａｔｅｄ Ｂｏｎｄｉｎｇ）方式と呼
ばれる接続方法によってＩＣチップ１１と接続される。
すなわち、フィンガー３Ａの先端部とＩＣチップ１１の
表面に設けられたバンプ１２とを熱圧着法または共晶法
等によりボンディングし、フィルムキャリアテープの状
態で電気選別やバイアス試験を実施し、次にフィンガー
３Ａを含むリードを所望の長さに切断する。このときリ
ードの数が多い多数ピンの場合はリードの切断部、すな
わちアウターリード部がばらばらになるのを防止するた
め、フィルムキャリアテープを構成している絶縁フィル
ム１０をアウターリードの外端に残す方法が用いられる
ことが多い。ついで、例えばプリント基板や一般のリー
ドフレーム上のボンディングパッドにアウターリードボ
ンディング（以下ＯＬボンディングという）を行なう。And, this film carrier tape is TAB (Ta
The IC chip 11 is connected by a connection method called a pe Automated Bonding method.
That is, the tips of the fingers 3A and the bumps 12 provided on the surface of the IC chip 11 are bonded by a thermocompression bonding method, a eutectic method, or the like, and electrical selection or a bias test is performed in the state of the film carrier tape. The lead including the finger 3A is cut into a desired length. At this time, in the case of a large number of pins with a large number of leads, the insulating film 10 forming the film carrier tape is left on the outer ends of the outer leads in order to prevent the cut parts of the leads, that is, the outer lead parts, from being separated. Methods are often used. Then, for example, outer lead bonding (hereinafter referred to as OL bonding) is performed on a bonding pad on a printed circuit board or a general lead frame.
上記のようなフィルムキャリアテープは、ボンディング
がリードの数と無関係に一度で可能であるため、スピー
ドが速いこと、またボンディングの組立と電気選別作業
の自動化がはかれ、量産性が優れている等の利点を有し
ている。Since the film carrier tape as described above can be bonded at one time regardless of the number of leads, it has a high speed, and the assembly of the bonding and the automation of the electric selection work are performed, and the mass productivity is excellent. Have the advantages of.
上述した従来のフィルムキャリアを使用するＩＣチップ
のインナーリードボンディング（以下ＩＬボンディング
という）においては、フィルムキャリアのリード３とＩ
Ｃチップ上のバンプ１２との接着には約４００〜５００
℃の熱が必要である。この熱でＩＬボンディングを行な
うと、熱がリード３を介してフィルムキャリアの絶縁フ
ィルム１０に伝わり、絶縁フィルム１０の熱収縮が起こ
る。In the inner lead bonding (hereinafter referred to as IL bonding) of the IC chip using the conventional film carrier described above, the leads 3 and I of the film carrier are used.
Approximately 400 to 500 for adhesion with bump 12 on C chip
℃ heat is required. When the IL bonding is performed by this heat, the heat is transferred to the insulating film 10 of the film carrier through the leads 3 and the insulating film 10 is thermally contracted.
この収縮量は、例えばポリイミドフィルムの場合、ＩＬ
ボンディングの時間は数秒であるが、熱が約４００〜５
００℃のため約０．３％の熱収縮が起こり、例えば１０
mmの長さの場合、３０μｍの収縮が起こる。ここでＯＬ
ボンディング部のリード数が２００〜３００本以上、ピ
ッチが１５０μｍ以下のとき、端リード部は２２．５〜
３３．８μｍ収縮してしまうため、ＯＬボンディングの
とき、隣りのボンディング用のパットとショートしてし
まうという欠点がある。This shrinkage amount is
Bonding time is a few seconds, but heat is about 400-5
About 0.3% heat shrinkage occurs at 00 ° C.
With a length of mm, a shrinkage of 30 μm occurs. OL here
When the number of leads in the bonding part is 200 to 300 or more and the pitch is 150 μm or less, the end lead part is 22.5 to
Since it shrinks by 33.8 μm, there is a drawback in short-circuiting with an adjacent bonding pad during OL bonding.
本発明のフィルムキャリアテープは、半導体チップ用の
孔を有する金属箔からなるベースフィルムと、このベー
スフィルム上に形成された絶縁膜と、この絶縁膜上に絶
縁性接着剤により固着され前記孔上に突出するリードと
を含んで構成される。The film carrier tape of the present invention comprises a base film made of a metal foil having holes for semiconductor chips, an insulating film formed on the base film, and an insulating adhesive fixed on the insulating film to form holes on the holes. And a lead protruding to the.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の断面図である。FIG. 1 is a sectional view of an embodiment of the present invention.
第１図において、フィルムキャリアテープを構成するベ
ースフィルムは例えば３５〜７０μｍ厚の銅箔１からな
っており、この銅箔１上には蒸着法等により厚さ０．５
〜２μｍの、例えばＡｌ２Ｏ３等の絶縁膜５が形成され
ている。更にこの絶縁膜５上にはエポキシ系の接着剤２
を介して、例えば３５μｍ厚の銅箔からなるリード３が
形成されている。In FIG. 1, a base film forming a film carrier tape is made of, for example, a copper foil 1 having a thickness of 35 to 70 μm, and a thickness of 0.5 is formed on the copper foil 1 by a vapor deposition method or the like.
An insulating film 5 of, for example, Al 2 O 3 having a thickness of 2 μm is formed. Further, an epoxy adhesive 2 is formed on the insulating film 5.
The lead 3 made of, for example, a copper foil having a thickness of 35 μm is formed via the.
このように構成された本実施例によれば、銅箔１をベー
スフィルムとして採用しており、更に銅箔１上に絶縁膜
５を設けているため、ＩＬボンディングを行った場合の
熱の伝導性、放熱性、及び機械的強度が向上するため
に、熱によるフィルムキャリアテープの収縮は接着剤２
の影響のみとなり、その熱収縮は０．００８％以下にお
さえることが可能である。このため、プリント基板上等
のＯＬボンディングパッドとＩＣのリードのＯＬボンデ
ィング部との正確な位置合せを行なうことができるた
め、ＯＬボンディング時に隣のＯＬボンディングパッド
とのショートはほとんど発生することはなくなる。ま
た、ポリイミド等の絶縁性フィルムに対してベースフィ
ルムとして金属箔を使用することは、価格的にも安価に
なるという利点がある。According to the present example configured as described above, since the copper foil 1 is adopted as the base film and the insulating film 5 is further provided on the copper foil 1, heat conduction in the case of IL bonding is conducted. Shrinkage of the film carrier tape due to heat is improved by the adhesive 2 in order to improve heat resistance, heat dissipation and mechanical strength.
However, the heat shrinkage can be suppressed to 0.008% or less. Therefore, the OL bonding pad on the printed circuit board and the like can be accurately aligned with the OL bonding portion of the IC lead, so that a short circuit with an adjacent OL bonding pad hardly occurs during the OL bonding. . In addition, the use of a metal foil as a base film for an insulating film such as polyimide has the advantage of being inexpensive.
またベースフィルムとして銅箔は、この表面にＡｌ２Ｏ
３等の絶縁膜５を形成することで表面のリード３との電
気的絶縁性の向上がはかれ、フィルムキャリアの状態で
電気的選別を実施する製品の場合でも、電気的ショート
発生の心配はないという利点もある。In addition, a copper foil as a base film has Al 2 O on its surface.
By forming the insulating film 5 such as 3 on the surface, the electrical insulation from the lead 3 on the surface is improved, and even in the case of a product in which electrical selection is performed in the state of a film carrier, there is no fear of electrical short circuit. There is also the advantage of not having it.
尚、上記実施例では、ベースフィルムとして銅箔を用い
た場合について説明したが、アルミニウム箔等他の金属
箔を用いることができる。In addition, in the said Example, although the case where copper foil was used as a base film was demonstrated, other metal foils, such as aluminum foil, can be used.
以上説明したように本発明は、フィルムキャリアテープ
を構成するベースフィルムとして銅等の金属箔を使用
し、更にこの上に絶縁膜を設けることにより、ＩＬボン
ディングを行った場合の熱によるフィルムキャリアテー
プの熱収縮量を減少させることができる。従ってリード
のＯＬボンディング部寸法がＩＬボンディング前後でほ
とんど変化しないため、プリント基板上等のＯＬボンデ
ィング部パッドとＩＣリードのＯＬボンディング部との
正確な位置合せが実施できるため、隣りのＯＬボンディ
ングパッドとのショートはほとんど発生することはなく
なる。INDUSTRIAL APPLICABILITY As described above, the present invention uses a metal foil such as copper as a base film constituting a film carrier tape, and further provides an insulating film on the base foil, so that the film carrier tape is heated by heat when IL bonding is performed. The amount of heat shrinkage can be reduced. Therefore, the size of the OL bonding portion of the lead hardly changes before and after the IL bonding, and therefore the OL bonding portion pad on the printed circuit board and the IC lead OL bonding portion can be accurately aligned with each other so that the adjacent OL bonding pad The short circuit of will almost never occur.
第１図は本発明の一実施例の断面図、第２図は従来のフ
ィルムキャリアテープの断面図である。 １……銅箔、２……接着剤、３……リード、３Ａ……フ
ィンガー、４……孔、５……絶縁膜、１０……絶縁フィ
ルム、１１……ＩＣチップ、１２……バンプ。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional film carrier tape. 1 ... Copper foil, 2 ... Adhesive, 3 ... Lead, 3A ... Finger, 4 ... Hole, 5 ... Insulating film, 10 ... Insulating film, 11 ... IC chip, 12 ... Bump.
Claims (1)
るベースフィルムと、このベースフィルム上に形成され
た絶縁膜と、この絶縁膜上に絶縁性接着剤により固着さ
れ前記孔上に突出するリードとを含むことを特徴とする
フィルムキャリアテープ。1. A base film made of a metal foil having a hole for a semiconductor chip, an insulating film formed on the base film, and fixed on the insulating film with an insulating adhesive and protruding above the hole. A film carrier tape including a lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63190462A JPH0666362B2 (en) | 1988-07-28 | 1988-07-28 | Film carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63190462A JPH0666362B2 (en) | 1988-07-28 | 1988-07-28 | Film carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0239448A JPH0239448A (en) | 1990-02-08 |
| JPH0666362B2 true JPH0666362B2 (en) | 1994-08-24 |
Family
ID=16258520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63190462A Expired - Lifetime JPH0666362B2 (en) | 1988-07-28 | 1988-07-28 | Film carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0666362B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0493040A (en) * | 1990-08-08 | 1992-03-25 | Nec Corp | Film carrier tape |
| US6007668A (en) * | 1992-08-08 | 1999-12-28 | Shinko Electric Industries Co., Ltd. | Tab tape and method for producing same |
| US5738928A (en) * | 1992-08-08 | 1998-04-14 | Shinko Electric Industries Co., Ltd. | Tab tape and method for producing same |
| US9232634B2 (en) | 2011-01-17 | 2016-01-05 | Canon Components, Inc. | Flexible circuit board for mounting light emitting element, illumination apparatus, and vehicle lighting apparatus |
| JP2013150019A (en) * | 2013-05-08 | 2013-08-01 | Canon Components Inc | Flexible circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57120361A (en) * | 1981-01-17 | 1982-07-27 | Sanyo Electric Co Ltd | Structure of film substrate |
-
1988
- 1988-07-28 JP JP63190462A patent/JPH0666362B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0239448A (en) | 1990-02-08 |
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