JPH0666386B2 - Wafer tape mounting method and apparatus - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a technique effectively applied to a so-called wafer tape mount in which a wafer is attached to a tape when dividing the wafer.

BACKGROUND ART In a semiconductor device manufacturing process, there is a so-called wafer dividing process in which a semiconductor wafer having a predetermined circuit layer formed on its surface is divided into pellets. Here, the wafer is provided to the process in a state in which it is attached to a tape stretched on a frame made of metal or the like. The reason why the wafer is provided in the state of being tape-mounted in this manner is to ensure the retention of each pellet after division and to facilitate the transfer.

By the way, as a mechanism for tape-mounting a wafer in order to provide it to the above process, the following method can be considered.

That is, FIG. 5 is a schematic view showing the outline of the tape mounting mechanism. According to the tape mount mechanism 51, the wafer 52 is first subjected to position correction, that is, alignment, at the position A. As a method of this alignment, for example, a method of aligning the orientation flat 52a of the wafer 52 in a predetermined direction using a positioning pin or the like can be considered. The wafer 52 thus aligned is placed on the mount stage 53 in a state where the front and back surfaces are inverted by 180 ° by a vacuum suction arm (not shown), that is, the wafer surface is brought into contact with the stage surface. It At the same time, a ring-shaped frame member 54 made of a metal member is transferred and placed on the mount stage 53 at a predetermined position. After that, the mount stage 53 moves up while the wafer and the frame member are still mounted. This mount stage 5
3, the adhesive tape 58 stretched by the supply roller 56 and the winding roller 57 from above the mount stage 53 via the plurality of guide rollers 55a to 55c is pushed downward by the tape mount chamber 59. . At this time, the adhesive surface 58a of the adhesive tape 58 is the lower surface, that is, the mount stage 5
It is the 3rd side, and this tape mount chamber 59
By the pressing operation of, the frame member 54 and the wafer 52 are attached to the adhesive surface 58a of the adhesive tape 58 with the back surface side up. When the wafer 52 and the frame member 54 are attached to the adhesive surface 58a of the adhesive tape 58 in this way, the adhesive tape 58 is moved along the frame member 54 by a tape cutter (not shown) provided in the tape mount chamber 59. It is cut to complete the wafer tape mounting process.

By the way, in such a wafer tape mounting method,
Since the wafer 52 is placed on the stage in a state where the surface side, which is the circuit forming surface, is in surface contact with the stage surface 53a of the mount stage 53, if foreign matter such as silicon pieces exists on the stage surface 53a. It has been clarified by the present inventor that the surface of the wafer 52 may be damaged, resulting in a defective product.

Further, as shown in FIG. 5, since the alignment of the wafer 52 is performed at the position A apart from the mount stage 53,
The present inventor has also revealed that it is difficult to secure an accurate position with the frame member 54 when the wafer 52 is placed on the stage 53.

That is, this means that the wafer 52 is attached to the adhesive tape 58 without being accurately positioned, and the frame member 5
No. 4 is to be attached. First, if there is a large positional deviation, dicing (cutting) of the wafer 52 is performed.
When the wafer 5 is cut, accurate cutting cannot be performed and the wafer 5
2 will result in poor cutting. And second,
It was clarified that even if the positional deviation is minute, the collet may damage the corners of the pellet when the pellet is sucked by the collet.

Note that examples described as the wafer division technique include Industrial Research Institute Co., Ltd., “IC implementation technology” (edited by the Japan Microelectronics Association) issued on January 15, 1980, P100 to P101.

[Object of the Invention] An object of the present invention is to provide a technique capable of tape-mounting a wafer without damaging the surface of the wafer.

Another object of the present invention is to provide a technique capable of accurately positioning the wafer and the frame member.

The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[Outline of the Invention] The outline of a typical one of the inventions disclosed in the present application will be briefly described as follows.

That is, the surface of the wafer is covered with a protective tape, the surface of the wafer is pressed to fix the wafer on the tape, the position of the wafer on the tape is recognized, and the frame member is detected based on the recognition information. After moving by a predetermined amount for positioning, the frame member is placed so as to maintain a predetermined positional relationship with the wafer on the tape, and the tape is cut into a predetermined shape corresponding to the frame shape. When the wafer is attached to the tape, the wafer surface can be pressed through the protective tape, and the wafer can be tape-mounted without damaging the wafer surface.

Further, since the wafer and the frame member can be aligned on the mounting position of the frame member, the wafer and the frame member can be accurately positioned.

[Embodiment 1] FIG. 1 is a schematic view showing an outline of a wafer tape mounting apparatus which is an embodiment of the present invention, FIG. 2 is a schematic view showing a mechanism for supplying a wafer to an adhesive tape, and FIG. ) Is a plan view showing the wafer mount frame obtained in this embodiment, and (b) is a plan view.
It is the bb sectional view taken on the line in (a) figure.

The wafer tape mounting apparatus 1 according to the first embodiment includes a supply cartridge 2 on the loader side and a storage cartridge 3 on the unloader side. The wafer 4 is transferred between the cartridges 2 and 3 while The tape is mounted by the mechanism.

A belt mechanism 6 as a wafer transfer means is provided between the supply cartridge 2 and the laminating roller 5. As shown in FIG. 2, a stopper pin 7 is protruded from the end of the belt mechanism 6 at its end. The guide arm 8 is attached so as to be vertically movable. The laminating roller 5 is composed of a pair of rollers 5a and 5b which rotate so as to sandwich the wafer 4, and an adhesive tape 10 supplied from an adhesive tape supply roller 9 is provided on the lower roller 5b for about half a circumference with the adhesive surface as an upper surface. The protective tape 12 from the protective tape supply roller 11 is wound around the upper roller 5a for about 1/4 round. Here, both the adhesive tape 10 and the protective tape 12 are made of, for example, a polyester resin, and the adhesive tape 10 has one surface coated with an adhesive. The adhesive tape 10 also functions as a transfer system for adhering the wafer 4 to the adhesive surface and transferring the wafer 4 between the processes as the adhesive tape 10 advances.

On the other hand, the protective tape 12 is taken up by a protective tape take-up roller 15 provided above the peeling roller 14 mounted immediately in front of the frame mount mechanism 13 when viewed from the wafer advancing direction. ing.

The frame mount mechanism 13 is composed of a mount stage 16 provided below the advancing adhesive tape 10, a position recognition camera 17, and a frame member holding means (not shown) that can be finely moved in the X, Y and θ directions. As shown in FIGS. 3 (a) and 3 (b), the frame member 18 held by the means has a ring shape made of a metal member such as a stainless alloy. For example, the wafer 4 has a diameter of 125.
In the case of mm, the maximum diameter L of the frame member is about 195 mm, and the ring width M can be about 15 mm, that is, the inner diameter of the ring can be about 165 mm.

A tape cutting mechanism 19 is provided in front of the frame mount mechanism 13 in the wafer advancing direction. The tape cutting mechanism 19 includes a cutter mount 20 having a vacuum suction port 20a and a pressure sensitive adhesive tape 10 while rotating a substantially central portion of the frame portion from the back surface side with respect to the frame member 18 in a circular shape along the frame shape. And a tape cutter 21 for cutting (broken line portion in FIG. 3 (a)).

The guide roller 2 is provided on the front side of the tape cutting mechanism 19.
Remaining adhesive tape 10b that has been cut into a predetermined shape through 2
A take-up roller 23 for taking up the paper is provided. Further, a belt mechanism 24 is installed between the guide roller 22 and the storage cartridge 3.

Next, the operation of the first embodiment will be described.

The wafer 4 taken out from the supply cartridge 2 is on the surface,
That is, when it is transferred to the guide arm 8 via the belt mechanism 6 with the circuit forming surface as the upper surface, the stopper pin 7 temporarily stops the movement. Here stopper pin 7
Is the wafer orientation flat 4a (Fig. 3
Since a plurality of wafers 4 transferred from the belt mechanism 6 are in the direction in which the orientation flat 4a side contacts the stopper pins 7, the wafers 4 are transferred to the belt mechanism 6 in a direction corresponding to (a) in FIG. Next, as shown by the broken line in FIG. 2, the tip end of the guide arm 8 inclines downward while the stopper pin 7 is released from above the guide arm 8. As a result, the wafer 4 on the guide arm 8 slides on the guide arm 8 to bring the orientation flat 4a into contact with the lower roller 5b side of the laminating roller 5. Here, the lower roller 5
Since the adhesive tape 10 to which the adhesive tape supply roller 9 is supplied is partially wrapped around b with the adhesive surface on the outer peripheral side, the wafer 4 attaches its orientation flat 4a to the adhesive tape 10. In this state, the adhesive tape 10 is inserted between the rollers 5a and 5b as the adhesive tape 10 advances.

In this way, the back surface of the wafer 4 is attached to the adhesive surface side of the adhesive tape 10 while being pressed by the upper and lower rollers 5a and 5b. At this time, since the protective tape 12 is interposed between the surface of the wafer 4, that is, the upper roller 5a that presses the circuit forming surface side and the wafer surface, if the upper roller 5a that presses the circuit forming surface has a silicon piece. It is possible to prevent the circuit surface of the wafer surface from being directly damaged even if foreign matter such as the above is attached. Further, since the protective tape 12 is constantly supplied to the upper roller 5a by a new tape surface from the protective tape supply roller 11, there is no risk of damage to the wafer surface due to adhesion of foreign matter to the protective tape 12. The protective tape 12 is peeled off from the surface of the wafer 4 by the peeling roller 14 immediately before being sent to the frame mount mechanism 13, and is wound up by the protective tape take-up roller 15. In this way, by peeling the protective tape 12 from the surface of the wafer 4 immediately before the frame mounting mechanism 13, the resolution of the position recognition camera 17 is improved and the position recognition accuracy can be kept high in the frame mounting process. it can. The protective tape 12 may be wound up by the winding roller 15 and then cleaned on the wafer contacting side of the tape surface for reuse.

When the wafer 4 attached to the adhesive tape 10 is sent to the frame mount mechanism 13, the frame member 18
Is aligned with. In this alignment,
First, the position recognition camera 17 recognizes the position of the wafer 4 on the adhesive tape 10. Next, based on the recognition information, the position of the frame member 18 is moved and adjusted in the X, Y and θ directions by the frame member holding means (not shown). Here, for example, when the ring-shaped frame member 18 is used, the alignment of the frame member 18 is performed so that the wafer 4 is positioned at the center of the ring inner diameter. With the position being adjusted by the alignment, the frame member 18 descends and the adhesive tape 10 around the wafer 4 is moved.
It is stuck on the sticky side of. As described above, in the first embodiment, the frame member 1 is provided immediately before the attachment of the frame member 18.
Since the positional relationship between the wafer 8 and the wafer 8 is aligned, the positional relationship with the wafer 4 can be maintained accurately when the frame member 18 is attached.

When the frame member 18 is attached around the wafer 4 on the adhesive tape 10 as described above, the wafer 4 is transferred to the tape cutting mechanism 19. In the tape cutting mechanism 19, the cutter mount 20 descends at a predetermined position to perform vacuum suction on the frame member 18 and the wafer 4. While maintaining the suction state in this way, the tape cutter 21 moves upward from below the advancing path of the adhesive tape 10, that is, from the surface opposite to the adhesive surface, and the adhesive tape is moved along the ring width of the frame member 18. Is cut into a disc shape (portion indicated by a broken line in FIG. 3 (a)). In this way, the disk-shaped adhesive tape 10a
A so-called wafer mount frame 25 having the frame member 18 and the wafer 4 adhered thereto can be obtained (FIGS. 3 (a) and (b)). After that, the wafer mount frame 25 is transferred onto the belt mechanism 24 while being vacuum-sucked by the cutter mount 20, and is housed in the housing cartridge 3 on the unloader side.

[Embodiment 2] FIG. 4 is a schematic view showing a tape cutting mechanism portion of a wafer tape mounting apparatus according to another embodiment of the present invention.

In the tape cutting mechanism 41 of the second embodiment, the adhesive tape 10
The cutter mount 42 is provided downward with respect to the wafer 4 and the frame member 18 attached to the surface of the tape, while the tape cutter 43 is provided upward. That is, when the wafer 4 with the frame member 18 attached to the periphery is transferred onto the cutter mount 42, the tape cutter 43 descends, and the frame member 1 is moved.
The adhesive tape 10 is cut along the outer peripheral edge of 8.

As described above, in the second embodiment, by cutting the adhesive tape 10 from above the frame member 18, the cutting of the adhesive tape 10 can be completed without performing vacuum suction by the cutter mount 42.

[Effect] (1). After the wafer is attached and fixed on the tape while covering the surface of the wafer with the protective tape, the position of the wafer on the tape is recognized, and the frame member is moved by a predetermined amount based on the recognition information. A wafer tape mounting method in which the frame member is attached to the wafer on the tape so as to maintain a predetermined positional relationship after the positioning is performed, and the tape is cut into a predetermined shape corresponding to the frame shape. Thus, when the wafer is attached to the tape, the wafer surface can be pressed through the protective tape, and the wafer can be tape-mounted without damaging the wafer surface.

(2) The frame member and the wafer can be aligned at the same position by adhering the frame member on the tape on which the wafer is adhered after the frame member is moved by a predetermined amount for positioning. Therefore, the alignment accuracy can be accurately ensured, and the positional deviation between the frame member and the wafer can be prevented.

(3). Due to the above (2), it is possible to prevent the positional deviation between the frame member and the wafer, so that it is possible to prevent a cutting failure when the wafer is divided.

(4). By peeling the protective tape from the surface of the wafer immediately before the frame mounting mechanism, the resolution of the position recognition camera is improved, and highly accurate alignment can be performed.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Nor.

For example, in the embodiments, the frame member has been described as a ring-shaped member made of a metal member such as a stainless alloy, but it may be a plastic member, and the shape is not limited to the ring-shaped member, and may be, for example, a rectangular member. May be.

[Brief description of drawings]

FIG. 1 is a schematic view showing an outline of a wafer tape mounting apparatus which is Embodiment 1 of the present invention, FIG. 2 is a schematic view showing a wafer supply mechanism to an adhesive tape of Embodiment 1, and FIG. 3 (a). FIG. 3 is a plan view showing a wafer mount frame obtained in Embodiment 1, FIG. 3 (b) is a sectional view taken along line bb of FIG. 3 (a), and FIG. 4 is a wafer according to Embodiment 2 of the present invention. FIG. 5 is a schematic diagram showing a tape cutting mechanism portion of a tape mounting device, and FIG. 5 is a schematic diagram showing an outline of a tape mounting mechanism that can be considered as background art. 1 ... Wafer tape mounting device, 2 ... Supply cartridge, 3 ... Storage cartridge, 4 ... Wafer, 5 ...
Laminating roller, 5a ... upper roller, 5b ... lower roller, 6 ... belt mechanism, 7 ... stopper pin, 8 ...
… Guide arm, 9… Adhesive tape supply roller, 10…
... Adhesive tape, 11 ... Protective tape supply roller, 12 ...
... Protective tape, 13 ... Frame mounting mechanism, 14 ...
… Peeling roller, 15 …… Protective tape winding roller, 1
6 ... Mount stage, 17 ... Position recognition camera, 1
8 ... Frame member, 19 ... Tape cutting mechanism, 20 ...
… Cutter mount, 20a …… Vacuum suction port, 21 ……
Tape cutter, 22 ... Guide roller, 23 ... Take-up roller, 24 ... Belt mechanism, 41 ... Tape cutting mechanism, 42 ... Cutter mount, 43 ... Tape cutter, 51 ... Tape mounting mechanism, 52 ... ... wafer,
52a ... Orientation flat, 53 ... Mount stage, 53a ... Stage surface, 54 ... Frame member, 55a-c ... Guide roller, 56 ... Supply roller, 57 ... Winding roller, 58 ... Adhesive tape ,
59: Tape mount chamber.

Claims (7)

[Claims] 1. A method for recognizing the position of a wafer on a tape by adhering and fixing the back surface of the wafer onto the tape by pressing the front surface of the wafer while the front surface of the wafer is covered with a protective tape. After the frame member is moved by a predetermined amount based on the information and positioned, the frame member is placed so as to maintain a predetermined positional relationship with the wafer on the tape, and the tape is predetermined according to the frame shape. A wafer tape mounting method characterized by cutting into a shape. 2. The wafer tape mounting method according to claim 1, wherein the supply of the protective tape to the surface of the wafer is performed by a roller which rotates in synchronization with the advancing speed of the adhesive tape. 3. The wafer tape mounting method according to claim 1, wherein the protective tape on the surface of the wafer is peeled off before the position is recognized. 4. The wafer tape mount according to claim 1, wherein the wafer adhered and fixed on the tape is conveyed between the respective steps by the unwinding and winding operations of the tape. Method. 5. A means for adhering and fixing a wafer on an adhesive tape, a position recognizing means for recognizing the position of the wafer adhered and fixed on the tape, and recognition information from the position recognizing means. A wafer tape mounting apparatus comprising: a sticking unit that moves a frame member by a predetermined amount and sticks it on a tape; and a tape cutting unit that cuts the tape into a predetermined shape corresponding to the shape of the frame member. 6. The wafer tape mounting apparatus according to claim 5, wherein the means for adhering and fixing the wafer onto the adhesive tape comprises surface protection means for the wafer. 7. The wafer tape mounting apparatus according to claim 6, wherein the wafer surface protecting means is a protective tape attaching mechanism.