JPH0667999B2 - Resol type phenol resin manufacturing method - Google Patents
Resol type phenol resin manufacturing methodInfo
- Publication number
- JPH0667999B2 JPH0667999B2 JP63150987A JP15098788A JPH0667999B2 JP H0667999 B2 JPH0667999 B2 JP H0667999B2 JP 63150987 A JP63150987 A JP 63150987A JP 15098788 A JP15098788 A JP 15098788A JP H0667999 B2 JPH0667999 B2 JP H0667999B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- resol
- type phenol
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000005011 phenolic resin Substances 0.000 title claims description 10
- 229920003987 resole Polymers 0.000 title description 18
- 239000003822 epoxy resin Substances 0.000 claims description 30
- 229920000647 polyepoxide Polymers 0.000 claims description 30
- 230000018044 dehydration Effects 0.000 claims description 10
- 238000006297 dehydration reaction Methods 0.000 claims description 10
- 150000002989 phenols Chemical class 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 3
- 125000000623 heterocyclic group Chemical group 0.000 claims description 3
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 208000005156 Dehydration Diseases 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- 150000001299 aldehydes Chemical class 0.000 description 8
- 239000012778 molding material Substances 0.000 description 8
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N methanol Natural products OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000011134 resol-type phenolic resin Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 p-alkylphenol Chemical compound 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、レゾール型フェノール樹脂の製法に関す
る。TECHNICAL FIELD The present invention relates to a method for producing a resol-type phenol resin.
フェノール樹脂は,その分子構造が直線型か立体型かに
よりノボラック型とレゾール型とに大別され、それぞれ
の有する特性の違いから、工業的にも異なる用途を有し
ている。たとえば、後者のレゾール型フェノール樹脂
は、そのまま熱硬化、あるいは酸触媒下で常温硬化して
不溶不融になる性質を有することから、主として積層材
料用ワニス,塗料,接着剤,注型品,成形材料等として
幅広く用いられている。Phenolic resins are roughly classified into novolac type and resol type depending on whether the molecular structure is linear type or three-dimensional type, and they have industrially different uses due to the difference in their characteristics. For example, the latter resol-type phenolic resin has the property of being insoluble and infusible when it is heat-cured as it is or when it is cured at room temperature in the presence of an acid catalyst. Widely used as a material.
上記どちらの型のフェノール樹脂になるかは、その製法
により決定され、酸触媒の存在下、アルデヒドに対して
フェノールを過剰にして反応させると、ノボラック型に
なる。それに対し、アンモニア等のアルカリ触媒の存在
下でフェノール類に対し過剰のアルデヒド類を反応さ
せ、生成した初期縮合物をさらに脱水縮合させると、架
橋反応が進行して固形のレゾール型フェノール樹脂(レ
ゾールまたはレゾール樹脂)が得られる。Which type of phenolic resin is used is determined by its production method, and when an excess amount of phenol is reacted with an aldehyde in the presence of an acid catalyst, a novolak type is obtained. On the other hand, when excess aldehydes are reacted with phenols in the presence of an alkali catalyst such as ammonia and the resulting initial condensate is further dehydrated and condensed, a crosslinking reaction proceeds and solid resol-type phenol resin (resole Alternatively, a resol resin) can be obtained.
ところで、従来から上記固形レゾール樹脂は、樹脂製造
の際に、樹脂取り出し時の熱安定性に欠け、樹脂がゲル
化してしまう、という問題を有していた。さらに、固形
レゾール樹脂を使用した成形材料では、射出成形時のシ
リンダー安定性および貯蔵安定性に欠る、という欠点も
あった。By the way, conventionally, the above solid resol resin has a problem that it lacks thermal stability when the resin is taken out at the time of resin production and the resin gels. Further, the molding material using the solid resol resin has a drawback that it lacks in cylinder stability and storage stability during injection molding.
以上の事情に鑑み、この発明は、軟化点が高く熱安定性
に優れ、製造上の樹脂取り出し時にもゲル化しにくいレ
ゾール型フェノール樹脂の製法を提供することを課題と
する。In view of the above circumstances, it is an object of the present invention to provide a method for producing a resol-type phenol resin having a high softening point, excellent thermal stability, and being less likely to gel during resin removal during production.
上記課題を解決するため、この発明は、アルカリ触媒の
存在下でフェノール類に対し過剰のアルデヒド類を付加
縮合させた後、脱水してレゾール型フェノール樹脂を得
るにあたり、同脱水工程時に、生成した初期縮合物100
重量部(以下、「部」と記す)に対し、ビスフェノール
A系エポキシ樹脂、ビスフェノールF系エポキシ樹脂、
ノボラック型エポキシ樹脂、臭素化エポキシ樹脂、脂環
式エポキシ樹脂および複素環式エポキシ樹脂から選ばれ
る少なくとも1つのエポキシ樹脂を3〜50重量部添加す
るようにする。In order to solve the above problems, the present invention is produced by addition-condensing excess aldehydes to phenols in the presence of an alkali catalyst, and then dehydrating to obtain a resole-type phenol resin, which is produced during the dehydration step. Initial condensate 100
With respect to parts by weight (hereinafter referred to as “parts”), bisphenol A epoxy resin, bisphenol F epoxy resin,
3 to 50 parts by weight of at least one epoxy resin selected from novolac type epoxy resin, brominated epoxy resin, alicyclic epoxy resin and heterocyclic epoxy resin is added.
仮に、エポキシ樹脂が最初から添加されていれば、フェ
ノール類とアルデヒド類との付加縮合反応が阻害されて
しまうし、脱水縮合が進んだ段階では、エポキシ樹脂を
添加してもレゾール樹脂とうまく混ざらない(相溶性が
悪い)、という問題が生じる。したがって、この発明で
は、脱水工程時にエポキシ樹脂を添加するようにしてい
る。If the epoxy resin was added from the beginning, the addition condensation reaction between the phenols and the aldehydes would be hindered, and at the stage of dehydration condensation, even if the epoxy resin was added, it would be mixed well with the resole resin. There is a problem that there is no compatibility (poor compatibility). Therefore, in this invention, the epoxy resin is added during the dehydration step.
上記エポキシ樹脂の添加量は、フェノール−アルデヒド
のメチロール型初期縮合物100部に対し3〜50部に設定
される。添加量が3部に満たない場合は、この発明にお
けるエポキシ樹脂の添加効果が得られず、他方50部を越
えると、上記相溶性が低下して、強度が落ちる。The amount of the epoxy resin added is set to 3 to 50 parts based on 100 parts of the phenol-aldehyde methylol type initial condensate. If the addition amount is less than 3 parts, the effect of adding the epoxy resin in the present invention cannot be obtained, and if it exceeds 50 parts, the compatibility is lowered and the strength is lowered.
得られたレゾール樹脂には、上記範囲内でエポキシ樹脂
が添加されているため、エポキシ樹脂固有の電気絶縁性
や耐熱性等の特性が付与されて、熱安定性や電気特性が
向上する。Since the epoxy resin is added to the obtained resole resin within the above range, characteristics such as electric insulation and heat resistance peculiar to the epoxy resin are imparted, and thermal stability and electric characteristics are improved.
レゾール樹脂の原料となるフェノール類およびアルデヒ
ド類は、特に限定はされず、任意の化合物を任意の組み
合わせで用いることができる。たとえば、フェノール類
としては、フェノール,クレゾール,キシレノール,ク
ロルフェノール,p−アルキルフェノール,p−フェニルフ
ェノール,ビスフェノールA,レゾルシノールなどが、ア
ルデヒド類としては、ホルムアルデヒドやパラホルムア
ルデヒド,アセトアルデヒド、フルフラール等の一般的
なものが挙げられる。The phenols and aldehydes that are raw materials for the resole resin are not particularly limited, and any compound can be used in any combination. For example, phenols include phenol, cresol, xylenol, chlorophenol, p-alkylphenol, p-phenylphenol, bisphenol A, resorcinol and the like, and aldehydes include general formaldehyde, paraformaldehyde, acetaldehyde, furfural There are things.
反応に用いるアルカリ触媒としては、トリエチルアミン
やトリメチルアミン等の第3アミン、メチルアミンやエ
チルアミン等の第1アミン、ジメチルアミン等の第2ア
ミン、ピリジン、水酸化ナトリウムや水酸化カリウム等
のアルカリ金属水酸化物、水酸化カルシウムや水酸化マ
グネシウム等のアルカリ土類金属水酸化物、アンモニア
等が挙げられるが、これらに限定されることはない。上
記触媒は、単独で、あるいは複数種を併せて用いられ
る。Examples of the alkali catalyst used in the reaction include tertiary amines such as triethylamine and trimethylamine, primary amines such as methylamine and ethylamine, secondary amines such as dimethylamine, pyridine, and alkali metal hydroxides such as sodium hydroxide and potassium hydroxide. Examples thereof include, but are not limited to, alkaline earth metal hydroxides such as calcium hydroxide and magnesium hydroxide, and ammonia. The above catalysts may be used alone or in combination of two or more.
上記フェノール類と、同フェノール類に対し過剰量のア
ルデヒド類との付加縮合反応は、通常の方法に従って行
われ、上記触媒も含めそれらの添加量,反応条件等は特
に限定されない。同反応より、フェノール類に1〜数モ
ルのアルデヒドが付加したメチロール型初期縮合物が得
られる。The addition condensation reaction of the above-mentioned phenols with an excess amount of aldehydes with respect to the above-mentioned phenols is carried out according to a usual method, and the addition amount thereof, reaction conditions and the like including the above-mentioned catalyst are not particularly limited. From the same reaction, a methylol type initial condensate obtained by adding 1 to several moles of aldehyde to phenols can be obtained.
その後、上記初期縮合物を脱水縮合させると、メチレン
結合あるいはジメチレンエーテル結合等による橋かけが
生じ、固体のレゾール樹脂が生成する。この脱水工程時
にエポキシ樹脂を添加することが、この発明の特徴であ
る。After that, when the above initial condensate is dehydrated and condensed, cross-linking due to a methylene bond or a dimethylene ether bond occurs, and a solid resol resin is produced. It is a feature of this invention that an epoxy resin is added during this dehydration step.
添加されるエポキシ樹脂としては、ビスフェノールA系
エポキシ樹脂、ビスフェノールF系エポキシ樹脂、ノボ
ラック型エポキシ樹脂、臭素化エポキシ樹脂、脂環式エ
ポキシ樹脂および複素環式エポキシ樹脂である。これら
は、単独で、あるいは複数種を併せて用いられる。それ
らの樹脂のエポキシ当量や軟化点も、特に限定はされな
いが、たとえば、ビスフェノールA系エポキシ樹脂の場
合はエポキシ当量700〜2000、クレゾールノボラック型
エポキシ樹脂の場合はエポキシ当量200〜1000程度のも
のを用い、そらの軟化点は90〜130℃程度であることが
一層好ましい。The epoxy resin to be added is a bisphenol A epoxy resin, a bisphenol F epoxy resin, a novolac type epoxy resin, a brominated epoxy resin, an alicyclic epoxy resin and a heterocyclic epoxy resin. These may be used alone or in combination of two or more. The epoxy equivalent and softening point of those resins are not particularly limited, but for example, epoxy equivalent of 700 to 2000 in the case of bisphenol A epoxy resin and epoxy equivalent of 200 to 1000 in the case of cresol novolac type epoxy resin. It is more preferable that the softening point thereof is about 90 to 130 ° C.
エポキシ樹脂を添加する以外は、脱水工程は通常の製法
に従って行われる。減圧条件等、特に限定はされない
が、得られた初期縮合物は熱的に不安定であるため、60
℃以下、たとえば40〜50℃程度で脱水が行われるような
圧力を設定することが好ましい。The dehydration step is performed according to a usual production method except that the epoxy resin is added. Although there is no particular limitation such as depressurization conditions, the obtained initial condensate is thermally unstable.
It is preferable to set a pressure at which dehydration is performed at a temperature of not higher than 0 ° C, for example, at about 40 to 50 ° C.
得られた固形レゾール樹脂は、たとえば、ガラス繊維,
木粉,アスベスト,マイカ,炭酸カルシウム等の充填材
や、必要に応じて可塑剤,離型剤,希釈剤,滑剤,着色
剤等の一般的な成形助剤と併せ、こらの成分をミキサや
ブレンダーなどで混合し、ニーダやロールなどを使用し
て混練することにより、成形材料として用いられるよう
になる。混練後、必要に応じて冷却固化し、粉砕して粒
状などにしてもよい。The obtained solid resol resin is, for example, glass fiber,
These ingredients are combined with fillers such as wood powder, asbestos, mica and calcium carbonate, and general molding aids such as plasticizers, mold release agents, diluents, lubricants, colorants, etc., if necessary. By mixing with a blender or the like and kneading with a kneader or roll, it can be used as a molding material. After kneading, it may be cooled and solidified if necessary, and may be pulverized into particles or the like.
なお、この発明の製法に従って得られるレゾール型フェ
ノール樹脂が、各種成形材料以外にも、たとえば、コー
ティング材,ディップ材,注型材料,塗料,接着剤等と
して幅広い用途を有するものであることは言までもな
い。It should be noted that the resol-type phenolic resin obtained according to the production method of the present invention has a wide range of applications as a coating material, a dip material, a casting material, a paint, an adhesive, etc., in addition to various molding materials. There is no end.
つぎに、この発明のさらに詳しい実施例を、比較例と併
せて説明する。Next, more detailed examples of the present invention will be described together with comparative examples.
実施例1〜4 フェノール1molに対し、ホルムアルデヒド1.6molに相当
する量のホルマリン(40%)を添加し、アンモニア水で
pH8〜9に調整したのち、105℃/30分間反応させた。Examples 1 to 4 Formalin (40%) in an amount corresponding to 1.6 mol of formaldehyde was added to 1 mol of phenol, and the mixture was added with aqueous ammonia.
After adjusting the pH to 8-9, the reaction was carried out at 105 ° C for 30 minutes.
その後、得られた初期縮合物に第1表に示した量のエポ
キシ樹脂を添加し、減圧下、40〜50℃で脱水縮合を行っ
て固形レゾール樹脂を得た。なお、エポキシ樹脂として
は、軟化点94℃,エポキシ当量900のビスフェノールA
系エポキシ樹脂(I)、あるいは、軟化点120℃,エポ
キシ当量1800のビスフェノールA系エポキシ樹脂(II)
を用いた。Then, the amount of epoxy resin shown in Table 1 was added to the obtained initial condensate, and dehydration condensation was performed at 40 to 50 ° C. under reduced pressure to obtain a solid resol resin. The epoxy resin is bisphenol A with a softening point of 94 ° C and an epoxy equivalent of 900.
-Based epoxy resin (I) or bisphenol A epoxy resin (II) with a softening point of 120 ° C and an epoxy equivalent of 1800
Was used.
比較例 脱水工程時にエポキシ樹脂を添加しないようにする他
は、上記実施例と同様にして、固形レゾール樹脂を得
た。Comparative Example A solid resol resin was obtained in the same manner as in the above example except that the epoxy resin was not added during the dehydration step.
上記得られた実施例,比較例のレゾール型フェノール樹
脂50部に対し。充填材として木粉(100〜200メッシュ)
40部および炭酸カルシウム5部、離型剤としてステアリ
ン酸亜鉛2部、着色剤1〜2部を加え、ミキサで混合し
たのちコニーダを用いて混練し、成形材料を得た。さら
に同成形材料を、常法に従って成形(圧力100〜200kg/
cm2,温度150〜160℃,時間1〜3分)し、硬化物を得
た。To 50 parts of the resol type phenolic resin obtained in the above Examples and Comparative Examples. Wood powder as filler (100-200 mesh)
40 parts and 5 parts of calcium carbonate, 2 parts of zinc stearate as a release agent, and 1 to 2 parts of a coloring agent were added and mixed in a mixer and then kneaded to obtain a molding material. Further, the same molding material is molded according to a conventional method (pressure 100 to 200 kg /
cm 2 , temperature 150 to 160 ° C., time 1 to 3 minutes) to obtain a cured product.
以上の固形レゾール樹脂の軟化点,110℃におけるポット
ライフ,硬化後の成形材料の絶縁抵抗および射出成形時
のシリンダー内滞留可能時間をそれぞれ測定し、結果を
同じく第1表に示す。The softening point of the solid resol resin, the pot life at 110 ° C., the insulation resistance of the molding material after curing, and the residence time in the cylinder during injection molding were measured, and the results are also shown in Table 1.
第1表にみるように、脱水工程時にエポキシ樹脂を添加
して製造した実施例のレゾール樹脂は、比較例に比べて
幅に熱安定性が向上し、軟化点が高くポットライフの長
いレゾール型になっっている。さらに、このレゾール樹
脂を用いた成形材料は、シリンダー安定性に優れるとと
もに、絶縁抵抗の高い硬化物を与えることが判明した。 As shown in Table 1, the resole resin of the example prepared by adding the epoxy resin during the dehydration step has a wider thermal stability than that of the comparative example, has a high softening point, and has a long pot life. It has become. Further, it has been found that the molding material using this resol resin has excellent cylinder stability and gives a cured product having high insulation resistance.
この発明にかかるレゾール型フェノール樹脂の製法によ
れば、熱安定性が高く電気特性にも優れた固形レゾール
樹脂を得るとができる。したがって、樹脂製造の際の取
り出し時にゲル化等が起こることなく、樹脂取り出しが
容易に行われるようになる。さらに、同レゾール樹脂を
成形材料とした場合には、射出成形時のシリンダー安定
性が向上し、貯蔵安定性にも優れている、という効果を
与える。According to the method for producing a resol-type phenol resin according to the present invention, a solid resol resin having high thermal stability and excellent electric characteristics can be obtained. Therefore, the resin can be easily taken out without causing gelation or the like at the time of taking out the resin during manufacturing. Furthermore, when the same resole resin is used as the molding material, the cylinder stability during injection molding is improved and the storage stability is also excellent.
Claims (1)
し過剰のアルデヒド類を付加縮合させた後、脱水してレ
ゾール型フェノール樹脂を得るにあたり、同脱水工程時
に、生成した初期縮合物100重量部に対し、ビスフェノ
ールA系エポキシ樹脂、ビスフェノールF系エポキシ樹
脂、ノボラック型エポキシ樹脂、臭素化エポキシ樹脂、
脂環式エポキシ樹脂および複素環式エポキシ樹脂から選
ばれる少なくとも1つのエポキシ樹脂を3〜50重量部添
加することを特徴とするレゾール型フェノール樹脂の製
法。1. When an excess aldehyde is added and condensed to phenols in the presence of an alkali catalyst and then dehydrated to obtain a resol-type phenol resin, 100 parts by weight of an initial condensate formed during the dehydration step is used. In contrast, bisphenol A epoxy resin, bisphenol F epoxy resin, novolac type epoxy resin, brominated epoxy resin,
A method for producing a resol-type phenol resin, which comprises adding 3 to 50 parts by weight of at least one epoxy resin selected from an alicyclic epoxy resin and a heterocyclic epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63150987A JPH0667999B2 (en) | 1988-06-17 | 1988-06-17 | Resol type phenol resin manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63150987A JPH0667999B2 (en) | 1988-06-17 | 1988-06-17 | Resol type phenol resin manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01318030A JPH01318030A (en) | 1989-12-22 |
| JPH0667999B2 true JPH0667999B2 (en) | 1994-08-31 |
Family
ID=15508809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63150987A Expired - Lifetime JPH0667999B2 (en) | 1988-06-17 | 1988-06-17 | Resol type phenol resin manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0667999B2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54125294A (en) * | 1978-03-23 | 1979-09-28 | Matsushita Electric Works Ltd | Preparation of phenolic resin |
| JPS55137150A (en) * | 1979-04-13 | 1980-10-25 | Matsushita Electric Works Ltd | Preparing modified phenol resin |
| JPS61296016A (en) * | 1985-06-24 | 1986-12-26 | Hitachi Chem Co Ltd | Production of modified phenolic resin for laminated board |
-
1988
- 1988-06-17 JP JP63150987A patent/JPH0667999B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01318030A (en) | 1989-12-22 |
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