JPH0669105B2 - Solid state relay device - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a solid state relay device such as a photocoupler, which has a higher dielectric strength between an input terminal and an output terminal than a conventional device of this type, and is manufactured. The present invention relates to a solid-state relay device whose process can be easily automated.

[Technical Background of the Invention] FIGS. 4 to 6 show structures of conventionally manufactured solid-state relays such as photocouplers and monolithic solid-state relay devices (SSR).

4 to 6, 1 is a ceramic substrate, 2 is a plate-like frame for mounting a light emitting element, 3 is a light emitting element such as a light emitting diode (LED) mounted on the frame 2, 4
Is a plate-shaped frame for mounting a light receiving element, 5 is a light receiving element such as a phototransistor, an optical thyristor or an optical triac attached to the ceramic substrate or the frame 4,
6 is a layer of a gel-like translucent encapping agent that covers the light emitting element 3 and the light receiving element 5 to form an optical path between both elements, and 7 is connected to the light emitting element 3 via a bonding wire 10. Input lead terminals are provided, 8 is an output lead terminal connected to the light receiving element 5 through a bonding wire 10, and 9 is an envelope (for example, a resin mold portion) formed so as to incorporate the above main parts. .

In each of the conventional solid state relays as described above, the light emitting element 3 is used.
An optical path between the light receiving element 5 and the light receiving element 5 is composed of a gel-like translucent encapsulation agent 6 obtained by dropping or adhering a fluid silicone rubber and hardening it into a gel. In the solid state relay shown in FIGS. 4 and 6, the light emitting element 3
The light receiving element 5 and the light receiving element 5 are arranged apart from each other on the same horizontal plane. However, in the solid-state relay shown in FIG. 5, the light emitting element 3 and the light receiving element 5 are arranged to face each other in the vertical direction. There is.

In recent years, it has become necessary to increase the dielectric strength between the light-emitting element and the light-receiving element in the solid-state relay as described above in order to satisfy the specified standard value from the viewpoint of safety. Therefore, there is a demand for the development of a solid-state relay in which the distance between the light-emitting element and the light-receiving element is made larger than that of the conventional solid-state relay.

[Problems of the Background Art] In the solid-state relay having the conventional structure as described above, since the optical path between the light emitting element and the light receiving element is formed of a gel material that is fluid before curing, the light emitting element and the light receiving element When the distance between the and the gel is larger than that of the conventional one, it becomes difficult for the gel-like substance in the fluidized state before curing to easily fall down, and it is difficult to form a dome-like shape suitable for light transmission. It was impossible to increase the distance between and. Further, since the work is done in a fluid state, it is difficult to automate the manufacturing process. Particularly, in the structure shown in FIG. 5, the operations such as positioning of the light emitting element and the light receiving element and the injection of the encapsulating agent between both elements are more complicated than those shown in FIGS. 4 and 6. Therefore, there is a problem that automation is more difficult.

Therefore, a solid state relay device using a light-transmissive encapping agent filled in a plastic molded frame as an optical path has been devised, but the manufacturing process becomes complicated and automation of the manufacturing process becomes difficult. There was a problem that

[Object of the Invention] An object of the present invention is to provide a solid-state relay device in which the distance between the light-emitting element and the light-receiving element can be made larger than in the conventional solid-state relay device, and the manufacturing process can be simplified and automated easily. Is.

[Outline of the Invention] In the solid state relay device according to the present invention, an acrylic resin is used as an optical path provided between a light emitting element and a light receiving element which are spaced apart from each other and are disposed substantially on the same horizontal plane and facing upward. , A rod-shaped or plate-shaped solid light transmitting member formed of an organic or inorganic material such as quartz glass, having a flat or concave end face shape that overhangs the light emitting element or the light receiving element The optical transmissive encapsulant is used in a space between the both end surfaces of the light transmitting member and the light emitting element and the light receiving element in a spherical or curved shape. It is characterized by being formed.

However, the solid of the solid light transmitting member is used to mean an elastic body (including a rigid body) that does not permanently deform under the action of an external force. Therefore, in the solid-state relay device of the present invention, theoretically, the distance between the light-emitting element and the light-receiving element can be made very large, and as a result, a solid-state relay device having a very large dielectric strength between input and output is realized, and Since the use of the translucent encapsulating agent which is difficult to handle is only required to form the short optical path, the manufacturing process can be easily automated.

Further, the shape of the end surface of the light transmitting member is a flat surface or a concave curved surface that overhangs the light emitting element or the light receiving element. This is because the flat surface or concave curved surface of the overhang coincides with or substantially coincides with the dome-shaped curved surface of the dropped encapsulating agent, so that it is difficult for bubbles to enter and the light transmission area becomes large.

Embodiments of the Invention Embodiments of the present invention will be described below with reference to FIGS. 1 to 3. 1 to 3 are designated by the same reference numerals as those in FIGS. 4 to 6 are the same as those of the conventional solid state relay device. Further, the part indicated by adding the suffix A indicates that it is slightly different from the part of the conventional solid state relay device.

In the solid-state relay device according to the first embodiment of the present invention shown in FIGS. 1 and 2, a PMMA (polyimide) is provided between a frame 2 supporting a light emitting element 3 and a frame 4 supporting a light receiving element 5. A rod-shaped or plate-shaped light transmitting member 11 formed of a material such as methyl methacrylate) or quartz glass is provided in a bridge shape, and both end faces of the light transmitting member 11 are overlaid on the respective elements 3 and 5 as shown in the drawing. It is shaped as an inclined surface so that it becomes a hang. And the light transmission member
Between the end face of 11 and the light emitting element 3 and the light receiving element 5, a translucent encapsulating agent 6 which surrounds the element and is spherical or curved is provided. Further, the resin mold portion 9A for sealing these portions is made of epoxy resin or the like as in the conventional case, but in order to prevent leakage of light from the light transmitting member 11 and the encapsulating agent 6, reflection of white or the like is performed. It is composed of a resin of natural color.

In the solid-state relay device of the present embodiment having the above-described structure, the light emitted from the light emitting element 3 enters the light transmitting member 11 from the transparent encapsulating agent 6 as shown by the arrow in the figure, and then Proceed with total reflection in the light transmitting member 11 as shown by the arrow,
The light passes through the transparent encapsulating agent 6 on the output side and enters the light receiving element 5.

In the solid-state relay device according to the present embodiment, since the light transmitting member 11 is a solid or elastic non-fluid body, most of the light path between the light emitting element 3 and the light receiving element 5 is large even if the distance between the light emitting element 3 and the light receiving element 5 is large. Can be easily passed by the light transmitting member 11, and the gel-like substance may be used for optical coupling only in a small space between the light transmitting member and the light emitting element and the light receiving element. An optical signal can be transmitted from the light emitting element 3 to the light receiving element 5 with high efficiency, and manufacturing can be easily and automatically performed. Further, since both end surfaces of the light transmitting member 11 are flat and have a structure overhanging on both elements, the light transmitting efficiency between the both elements and the light transmitting member is high, and the translucent encapsulating agent is used. The surface tension of 6 can be increased to effectively prevent deformation and sag of the encapsulating agent 6.

FIG. 3 shows another embodiment of the present invention. In the solid-state relay device of this embodiment, both end faces of the light transmitting member 11 facing both elements 3 and 5 serve as a light emitting point or a light receiving point. It is formed in a concave spherical shape or a concave curved surface around the center, and the end surface is arranged on each element 3 and 5 in an overhang shape. Therefore, from the light-transmitting encapsulant 6 covering the light emitting element 3 and the light receiving element 5, the light transmitting member 11
The light is transmitted with high efficiency without reflection, and the structure has a higher light transmission efficiency than that of the embodiment in which the end face is a flat surface as shown in FIG.

The shape of the light transmitting member and the corresponding structure of the member and the light emitting element and the light receiving element are not limited to those in the illustrated embodiment, and various modifications are possible. For example, by appropriately shaping the shape of both end faces of the light transmitting member, light may be incident only on a specific portion of the light receiving element, or light received from a single light emitting element may be simultaneously incident on a plurality of light receiving elements. It can also be configured.

[Effects of the Invention] As will be apparent from the description of the embodiment, the following various effects can be obtained according to the present invention.

(I) A solid-state relay device having a large distance between the light-emitting element and the light-receiving element and thus having a larger withstand voltage between the input and output terminals than the conventional solid-state relay device is realized.

(Ii) Since most of the light passage between the light emitting element and the light receiving element is composed of a solid (including an elastic body) light transmitting member which is not a pre-curing fluid gel substance, the formation of the light passage It is easy to place, and you always get consistent quality products.

(Iii) Since the light transmitting member is solid, it is easy to automate the manufacturing process. Therefore, the manufacturing cost can be reduced as compared with the conventional solid state relay device.

(Iv) Since the end surface of the light transmitting member is overhanging with respect to the light emitting element or the light receiving element, light is transmitted from the light-transmitting encapsulating agent to the light transmitting member with high efficiency and the encapsulating agent is deformed. Drops can be effectively prevented.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an embodiment of a solid state relay device according to the present invention, FIG. 2 is a sectional view taken along the line II-II of FIG. 1, and FIG. 3 is a longitudinal section of a main portion of another embodiment of the present invention. Fig. 4 (a) is a schematic plan view of a conventional solid state relay device, Fig. 4 (b) is a longitudinal sectional view of a main part of Fig. 4 (a), and Fig. 5 is another conventional solid state device. FIG. 6A is a schematic cross-sectional front view of the relay device, FIG. 6A is a plan view of a main part of another conventional solid-state relay device, and FIG. 6B is a vertical side view of FIG. 6A. 1 ... ceramic substrate, 2,4 ... frame, 3 ... light emitting element, 5 ... light receiving element, 6 ... translucent encapsulating agent,
7 ... Input lead terminal, 8 ... Output lead terminal, 9 ...
Resin mold part (envelope), 10 …… bonding wire, 11 …… light transmission member.

Claims (1)

[Claims] 1. A light-emitting element and a light-receiving element, which are separated from each other and arranged on substantially the same horizontal plane and facing upward, are sealed in an envelope, and the light-receiving element is generated by light emitted from the light-emitting element. In a solid-state relay device configured to excite light, a solid-state light having a flat or concave end face shape between the light-emitting element and the light-receiving element that overhangs the light-emitting element or the light-receiving element. The transmission member is provided with its transmission optical axis in the horizontal direction, and a translucent encapsulator is provided between one end surface of the light transmission member and the light emitting element and between the other end surface of the light transmission member and the light receiving element. A solid state relay device characterized in that an optical coupling is formed by a cap agent.