JPH0669114B2 - Circuit board - Google Patents
Circuit boardInfo
- Publication number
- JPH0669114B2 JPH0669114B2 JP30061786A JP30061786A JPH0669114B2 JP H0669114 B2 JPH0669114 B2 JP H0669114B2 JP 30061786 A JP30061786 A JP 30061786A JP 30061786 A JP30061786 A JP 30061786A JP H0669114 B2 JPH0669114 B2 JP H0669114B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- resin
- circuit board
- board
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は回路基板に関し、より詳細にはIC部品等の回路
部品を基板上にセットしやすく構成した回路基板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board, and more particularly to a circuit board configured so that circuit parts such as IC parts can be easily set on the board.
（従来の技術） 従来、表面実装用の回路基板は合成樹脂基板上に形成さ
れた導体回路上の所定位置に、抵抗、コンデンサー、IC
等の回路部品をはんだを介して接合している。(Prior Art) Conventionally, a circuit board for surface mounting has a resistor, a capacitor, an IC at a predetermined position on a conductor circuit formed on a synthetic resin substrate.
And other circuit components are joined via solder.
上記回路部品を導体回路上にセットする際には、マウン
ターを用いて、正確に位置決めして載置し、炉内を通過
させてはんだ付け処理を行う。When setting the above-mentioned circuit component on the conductor circuit, a mounter is used to accurately position and place the circuit component, and it is passed through a furnace for soldering.
第３図は従来の表面実装用の回路基板に、回路部品を取
り付けた状態を示す説明図である。FIG. 3 is an explanatory view showing a state in which circuit components are attached to a conventional surface mounting circuit board.
10はプリント基板であり、エポキシ樹脂等の樹脂により
形成される。11、12、13はプリント基板10上にセットす
る回路部品であり、例えば11は抵抗、12はコンデンサ
ー、13はIC部品である。14はこれらの部品をプリント基
板10の導体回路18上に接合するはんだである。A printed circuit board 10 is formed of a resin such as an epoxy resin. Reference numerals 11, 12, and 13 are circuit components set on the printed circuit board 10. For example, 11 is a resistor, 12 is a capacitor, and 13 is an IC component. Reference numeral 14 is solder that joins these components onto the conductor circuit 18 of the printed circuit board 10.
また、従来のプリント基板にはその樹脂製の基板内に薄
い金属板をコア材として埋設し、プリント基板の放熱効
果を向上させたものもある。In addition, there is a conventional printed board in which a thin metal plate is embedded as a core material in the resin board to improve the heat dissipation effect of the printed board.
（発明が解決しようとする問題点） しかしながら、上述したように、プリント基板に回路部
品をセットする際には、マウンターによって正確に位置
決めしているが、従来、部品をセットした後のハンドリ
ングの途中で、部品がはずれたり、所定の位置からずれ
るという問題点があった。(Problems to be Solved by the Invention) However, as described above, when the circuit components are set on the printed circuit board, they are accurately positioned by the mounter, but conventionally, during the handling after the components are set. However, there is a problem that the parts may come off or may be displaced from a predetermined position.
また、金属板を埋設したプリント基板であっても、樹脂
によって覆われているために放熱効果が低いため、さら
に改善の必要がある。また、従来の表面実装用基板は、
プリント基板等を使用した２次元的な構造であり、両面
に凹凸部を形成するような３次元的な構造には適さない
という問題点がある。Further, even a printed circuit board in which a metal plate is embedded has a low heat dissipation effect because it is covered with resin, and therefore needs further improvement. In addition, the conventional surface mounting board is
This is a two-dimensional structure using a printed circuit board or the like, and there is a problem that it is not suitable for a three-dimensional structure in which uneven portions are formed on both surfaces.
そこで、本発明は上記問題点に鑑みてなされたものであ
り、その目的とするところは、フレキシブルな回路基板
を内部に組入れることにより、３次元的な構造を可能と
し、回路部品のマウントも容易にできる回路基板を提供
するにある。Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to enable a three-dimensional structure by incorporating a flexible circuit board inside and to easily mount a circuit component. In order to provide a circuit board that can be
（問題点を解決するための手段） 本発明は上記問題点を解消するための次の構成をそなえ
る。(Means for Solving Problems) The present invention has the following configuration for solving the above problems.
すなわち、表面に所定の導体回路が形成されたフレキシ
ブル基板の外面を覆うように樹脂成形するとともに、前
記フレキシブル基板に接合する回路部品を載置すべく前
記導体回路の一部を露出させた凹部を前記樹脂成形時に
形成して成ることを特徴とする。That is, resin molding is performed so as to cover the outer surface of a flexible substrate having a predetermined conductor circuit formed on the surface thereof, and a recess is formed by exposing a part of the conductor circuit to mount a circuit component to be joined to the flexible substrate. It is characterized in that it is formed during the resin molding.
（実施例） 以下本発明の好適な実施例を添付図面に基づいて詳細に
説明する。(Examples) Hereinafter, preferred examples of the present invention will be described in detail with reference to the accompanying drawings.
第１図は、本発明に係る回路基板の一実施例を示す説明
図である。FIG. 1 is an explanatory view showing an embodiment of a circuit board according to the present invention.
図では回路基板に抵抗等の回路部品を配置した状態を示
している。The figure shows a state in which circuit components such as resistors are arranged on the circuit board.
11は抵抗、12はコンデンサー、13はIC部品である。11 is a resistor, 12 is a capacitor, and 13 is an IC component.
16は前記各部品を載置して所定の導体回路に接合するフ
レキシブル基板であり、ポリエステルやポリイミドの樹
脂によって形成される。Reference numeral 16 is a flexible substrate on which the above-mentioned components are placed and joined to a predetermined conductor circuit, and is formed of a resin such as polyester or polyimide.
18は前記フレキシブル基板16の表面に形成された薄い金
属箔を所定の回路形状に形成した導体回路であり、フレ
キシブル基板16に接合されている。14は前記回路部品を
接合するはんだである。Reference numeral 18 denotes a conductor circuit in which a thin metal foil formed on the surface of the flexible substrate 16 is formed into a predetermined circuit shape, and is bonded to the flexible substrate 16. 14 is a solder for joining the circuit components.
20は前記フレキシブル基板16および導体回路18の外面を
覆って保護するポリサルフォン、ポリフェニレンサルフ
ァイド、ポリエーテルイミド等の熱可塑性樹脂やエポキ
シ、フェノール等の熱硬化性樹脂等の樹脂で、射出成形
またはトランスファー成形等により成形される。この樹
脂20は抵抗11等の回路部品を載置する部位の導体回路18
が露出するように凹部を形成する。Reference numeral 20 is a resin such as a thermoplastic resin such as polysulfone, polyphenylene sulfide, or polyetherimide or a thermosetting resin such as epoxy or phenol that covers and protects the outer surfaces of the flexible substrate 16 and the conductor circuit 18, and is injection molded or transfer molded. And the like. This resin 20 is used for the conductor circuit 18 in the area where circuit parts such as the resistor 11 are placed.
The recess is formed so as to expose.
22は回路部品が載置される側の裏面の一部分に設けた前
記樹脂20の空隙で、放熱性向上のために設けるものであ
る。Reference numeral 22 denotes a void of the resin 20 provided in a part of the back surface on the side where the circuit component is placed, which is provided to improve heat dissipation.
24はIC部品等の発熱性のたかい部品の下部に設ける金属
製ヒートシンクで、樹脂20の成形時に一体に成形する。Reference numeral 24 denotes a metal heat sink provided under a heat-generating, strong component such as an IC component, which is integrally molded when the resin 20 is molded.
前記フレキシブル基板16はその一端縁を前記樹脂20から
突出する。26はこの一端縁で回路基板を外部装置へ接続
する接続用タブである。The flexible substrate 16 has one end protruding from the resin 20. Reference numeral 26 is a connection tab for connecting the circuit board to an external device at this one edge.
第２図は他の実施例を示す説明図である。FIG. 2 is an explanatory view showing another embodiment.
同図で28は外部装置へ接続するためのコネクタ部、30は
スタンドオフである。これらコネクタ部28およびスタン
ドオフ30は前記樹脂20によりフレキシブル基板16および
導体回路18を覆う際に同時に成形される。In the figure, 28 is a connector portion for connecting to an external device, and 30 is a standoff. The connector portion 28 and the standoff 30 are simultaneously molded when the flexible substrate 16 and the conductor circuit 18 are covered with the resin 20.
ここで、コネクタ部28は樹脂成形されるので、その取り
付け位置および形態は、回路構成あるいは外部装置との
接続のかねあいで適宜位置に配置することができる。Here, since the connector portion 28 is resin-molded, its attachment position and form can be appropriately arranged depending on the circuit configuration or connection with an external device.
上述したように、フレキシブル基板16と導体回路18は柔
軟性に優れているので、平板状の形態ばかりでなく、基
板を折り曲げた形状に形成することもでき、また樹脂成
形によって保型するので、成形形態も自在にできるとい
う特徴がある。As described above, since the flexible substrate 16 and the conductor circuit 18 are excellent in flexibility, it is possible to form not only a flat plate-like form but also a bent form of the substrate, and since the mold is held by resin molding, There is a feature that the molding form can be freely set.
また、外部装置の接続のためのコネクタ部28や、ヒート
シンク24、あるいは放熱のための空隙22等を樹脂成形時
に一体に成形することができ、きわめて効率的な成形を
することができる。Further, the connector portion 28 for connecting an external device, the heat sink 24, the void 22 for heat dissipation, and the like can be integrally molded during resin molding, and extremely efficient molding can be performed.
また、前記フレキシブル基板16は従来のプリント基板に
くらべてはるかに薄く、また、本実施例は放熱のための
空隙２およヒートシンク24を設けたことにより、基板か
らの熱放散性を一層向上させることができる。Further, the flexible board 16 is much thinner than the conventional printed board, and in this embodiment, the gap 2 for heat dissipation and the heat sink 24 are provided to further improve the heat dissipation from the board. be able to.
また、上述した実施例は回路基板の片面に回路部品を配
置するものであるが、回路基板の両面に部品を接合する
ように構成することも容易である。Further, although the circuit components are arranged on one surface of the circuit board in the above-described embodiment, it is easy to configure the components to be bonded to both surfaces of the circuit board.
また、抵抗等の回路部品をセットする部位を樹脂成形す
る際に導体回路の一部が露出する凹部に形成したから、
抵抗等の回路部品は樹脂成形された所定の凹部に入れる
だけで位置決めができ、位置決めが容易であると同時に
部品が所定位置からずれることを防止して確実な接合が
できる。この回路部品の位置決めにマウンターを使用す
る際は、一定程度の精度で基板および導体回路が形成さ
れている必要があるが、樹脂20による一体成形により、
柔軟性を有するフレキシブル基板16を保型して寸法精度
を増し、取り扱いやすくさせるという効果がある。In addition, since the portion where the circuit components such as the resistance are set is formed in the recess where a part of the conductor circuit is exposed when molding the resin,
The circuit component such as the resistor can be positioned simply by inserting it in a predetermined resin-molded concave portion, and the positioning is easy, and at the same time, the component can be prevented from being displaced from the predetermined position for reliable bonding. When using the mounter to position this circuit component, it is necessary that the substrate and the conductor circuit be formed with a certain degree of accuracy.
There is an effect that the flexible substrate 16 having flexibility is held in a mold to increase dimensional accuracy and facilitate handling.
また、上述したように基板材料が柔軟なシート状のもの
であるので、材料を長尺に形成しロール状に巻いて製造
装置にセットすることができ、連続的な量産に適した製
造工程にのせやすく、製造上の効率を高めることができ
るという効果を有する。In addition, since the substrate material is a flexible sheet as described above, the material can be formed into a long length, wound into a roll, and set in the manufacturing apparatus, which is suitable for continuous mass production. It has an effect that it is easy to put on and the manufacturing efficiency can be improved.
（発明の効果） 本発明の回路基板は、上述したように、フレキシブル基
板を樹脂によって保型して成形されているから、回路基
板が薄くコンパクトに形成されるとともに、樹脂成形し
た凹部により回路部品を基板上にマウントしやすくする
ことができる。また、樹脂成形によって多種の形状に成
形することが容易であり、コネクタ等を一体成形するこ
とができる。また、シート状のフレキシブル基板を使用
するから量産に適し、製造上の作業性に優れた回路基板
提供することができるという著効を奏する。(Effects of the Invention) As described above, the circuit board of the present invention is formed by molding the flexible board with resin, so that the circuit board is formed thin and compact, and the circuit component is formed by the resin-molded recess. Can be easily mounted on the substrate. Further, it is easy to mold various shapes by resin molding, and the connector and the like can be integrally molded. Further, since the sheet-shaped flexible substrate is used, it is suitable for mass production, and it is possible to provide a circuit substrate having excellent workability in manufacturing.
以上本発明につき好適な実施例を挙げて種々説明した
が、本発明はこの実施例に限定されるものではなく、発
明の精神を逸脱しない範囲内で多くの改変を施し得るの
はもちろんのことである。Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. Is.
第１図は本発明に係る回路基板の実施例を示す説明図、
第２図は他の実施例を示す説明図、第３図は従来例を示
す説明図である。 10……プリント基板、11……抵抗、 12……コンデンサー、13……IC部品、 14……はんだ、16……フレキシブル基板、 18……導体回路、20……樹脂、 22……空隙、24……ヒートシンク、 26……接続用タブ、28……コネクタ部。FIG. 1 is an explanatory view showing an embodiment of a circuit board according to the present invention,
FIG. 2 is an explanatory view showing another embodiment, and FIG. 3 is an explanatory view showing a conventional example. 10 ... Printed circuit board, 11 ... Resistor, 12 ... Capacitor, 13 ... IC component, 14 ... Solder, 16 ... Flexible board, 18 ... Conductor circuit, 20 ... Resin, 22 ... Void, 24 ...... Heat sink, 26 ...... Connection tab, 28 ...... Connector part.
Claims (1)
シブル基板の外面を覆うように樹脂成形するとともに、
前記フレキシブル基板に接合する回路部品を載置すべく
前記導体回路の一部を露出させた凹部を前記樹脂成形時
に形成して成ることを特徴とする回路基板。1. A resin molding is performed so as to cover an outer surface of a flexible substrate having a predetermined conductor circuit formed on the surface thereof, and
A circuit board, characterized in that a concave portion exposing a part of the conductor circuit is formed at the time of the resin molding in order to mount a circuit component to be joined to the flexible board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30061786A JPH0669114B2 (en) | 1986-12-17 | 1986-12-17 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30061786A JPH0669114B2 (en) | 1986-12-17 | 1986-12-17 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63152195A JPS63152195A (en) | 1988-06-24 |
| JPH0669114B2 true JPH0669114B2 (en) | 1994-08-31 |
Family
ID=17887011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30061786A Expired - Fee Related JPH0669114B2 (en) | 1986-12-17 | 1986-12-17 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0669114B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2796636B2 (en) * | 1989-10-30 | 1998-09-10 | イビデン株式会社 | Substrate for mounting electronic components |
| JPH0559879U (en) * | 1992-01-14 | 1993-08-06 | 株式会社村田製作所 | Circuit board |
| JP2000208905A (en) | 1999-01-14 | 2000-07-28 | Nec Corp | Printed board |
-
1986
- 1986-12-17 JP JP30061786A patent/JPH0669114B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63152195A (en) | 1988-06-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |