JPH067137B2 - Probe card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Field of Industrial Application) The present invention relates to a probe card used for test measurement of electronic components such as semiconductor integrated circuits.

(Prior Art) Generally, a large number of electrodes are arranged in an electronic component such as a semiconductor integrated circuit, and a probe card is used for the test measurement.

FIG. 2 shows such a conventional probe card in which a light transmitting member 2 is formed in the central portion of an insulating substrate 1 made of epoxy resin or the like. In addition, the test probe 3 extended into the through hole 2 from around the light transmitting 2 corresponding to the terminals of an electronic component (not shown) such as a semiconductor integrated circuit has a signal conductor 4 formed of a printed wiring. It is connected to the connection terminal 5 which is arranged at the end of the insulating substrate 1 and is connected to the test and measurement equipment.

Then, the electronic component is arranged in the through hole 2, and the electronic component is electrically connected to the test and measurement device through the test probe 3, the signal conductor 4, and the connection terminal 5, and the test measurement of the electronic component is performed. Be seen.

(Problems to be Solved by the Invention) However, in the conventional probe card described above,
The number of test probes has increased due to the increase in the degree of integration of semiconductor integrated circuits, and the distance between the signal conductors arranged on the insulating substrate has become narrower, causing insulation failure and accurate test measurement. There is a problem that you can not do.

The present invention has been made in response to such conventional circumstances,
An object of the present invention is to provide a probe card capable of performing accurate test measurement without causing insulation failure between the signal conductors even if the signal conductors are arranged close to each other.

[Structure of the Invention] (Means for Solving Problems) That is, the present invention provides an electrically insulating substrate and an electrically insulating substrate which is provided on the insulating substrate and corresponds to an electrode of a semiconductor integrated circuit so that the electrode can be electrically contacted Multiple test probes provided,
One end is connected to these test probes, and the other end is connected to a connection terminal connected to a measuring device for electrically measuring the semiconductor integrated circuit, and a plurality of signal conductors provided on the insulating substrate are provided. In the probe card, since the insulating substrate is formed of bismaleimide-triazine resin, the distance between the plurality of signal conductors through which the measurement signal of the semiconductor integrated circuit is guided increases the integration degree of the semiconductor integrated circuit. Accordingly, it is characterized by having sufficient electrical insulation between the signal conductors even if they are arranged close to each other and become narrower.

(Operation) In the probe card of the present invention, since the signal conductors can be arranged close to each other by using the insulating substrate made of bismaleimide-triazine resin, a highly integrated semiconductor integrated circuit can be obtained. The probe card to be measured can be manufactured in a small size. At the same time, it is possible to reduce the size of the probe card that must be prepared for each type of semiconductor integrated circuit. Therefore, the stock place can be reduced, the prober can be downsized, and the probe card carrier can be reduced in weight. be able to.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a probe card according to an embodiment of the present invention, which is a highly heat-resistant thermosetting resin obtained by reacting a cyanate group of triazine and a terminal unsaturated double bond of bismaleimide to carry out addition polymerization. A through hole 12 is formed in the central portion of the insulating substrate 11 made of the bismaleimide-triazine resin. In addition, from the periphery of the through hole 1 to correspond to terminals of electronic parts (not shown) such as semiconductor integrated circuits, the through hole 1
The test probe 13 extended into 2 is connected to a connection terminal 15 arranged at an end of the insulating substrate 11 and connected to a test and measurement device via a signal conductor 14 made of a printed wiring.

Then, the electronic component is arranged in the through hole 12, and the electronic component is electrically connected to the test and measurement device via the test probe 13, the signal conductor 14, and the connection terminal 15, and the test measurement of the electronic component is performed. Done.

In the probe card of this embodiment having the above structure, the insulating substrate 11 is made of a bismaleimide-triazine resin having a higher insulating property than the conventional epoxy resin or the like.
Even if a large number of test probes 13 are arranged and the signal conductors 14 are arranged close to each other as the integration degree of a semiconductor integrated circuit or the like is improved, insulation failure does not occur between the signal conductors 14 and accurate measurement is possible. Various test measurements can be performed.

[Effects of the Invention] As described above, according to the probe card of the present invention, the signal conductors can be arranged close to each other by using the bismaleimide-triazine resin as the material of the insulating substrate. A probe card for measuring a highly integrated semiconductor integrated circuit can be manufactured in a small size. At the same time, since it is possible to reduce the probe card that must be prepared for each type of semiconductor integrated circuit, it is possible to reduce the stock area, downsize the prober, and reduce the weight of the probe card carrier. The excellent effect of can be brought to the semiconductor measurement process.

[Brief description of drawings]

FIG. 1 is a top view showing a probe card according to an embodiment of the present invention, and FIG. 2 is a top view showing a conventional probe card. 11 ... Insulating substrate, 12 ... Through hole, 13 ... Test probe, 14 ... Signal conductor, 15 ... Connection terminal.

Claims (1)

[Claims] 1. An electrically insulating substrate, a plurality of test probes provided on the insulating substrate so as to correspond to electrodes of a semiconductor integrated circuit and capable of electrically contacting the electrodes, and one end of these test probes. And a plurality of signal conductors provided on the insulating substrate, the other end of which is connected to a connection terminal connected to a measuring device for electrically measuring the semiconductor integrated circuit. Since the substrate is made of bismaleimide-triazine resin, the plurality of signal conductors through which the measurement signals of the semiconductor integrated circuit are guided are arranged close to each other in accordance with an increase in the integration degree of the semiconductor integrated circuit. A probe card having sufficient electric insulation between the signal conductors even if the signal conductor is narrowed.