JPH0671704B2 - Manufacturing method of electroplated whetstone - Google Patents
Manufacturing method of electroplated whetstoneInfo
- Publication number
- JPH0671704B2 JPH0671704B2 JP62173982A JP17398287A JPH0671704B2 JP H0671704 B2 JPH0671704 B2 JP H0671704B2 JP 62173982 A JP62173982 A JP 62173982A JP 17398287 A JP17398287 A JP 17398287A JP H0671704 B2 JPH0671704 B2 JP H0671704B2
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- base metal
- abrasive
- dispersed
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
【発明の詳細な説明】 （イ）産業上の利用分野 本発明は、電着式砥石の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a method for manufacturing an electrodeposition type grindstone.
（ロ）従来の技術 従来の電着式砥石の製造方法として、たとえば特公昭54
−29975号公報に示されるものがある。これに示される
電着式砥石の製造方法は、電着液に対して不溶性であっ
てかつ所定の溶液に対して溶解性を有する粒状の分散密
度調整剤と、砥粒とを目的とする分散密度に応じて均一
に混合し、この混合粒を台金表面に電着によって仮付け
し、次いで上記所定の溶液で分散密度調整剤を溶解除去
し、次いで残った砥粒を、たとえば特開昭58−100689号
公報に示されるような、めっきによって台金に固着する
ことにより電着式砥石を製造するようにしている。分散
密度調整剤と砥粒との混合割合を調整することにより、
最終的に台金に電着される砥粒の分散状態を調整するこ
とができる。(B) Conventional technology As a conventional method for manufacturing an electrodeposition type grindstone, for example, Japanese Patent Publication No.
There is one disclosed in Japanese Patent Publication No. -29975. The method for producing an electrodeposition-type grindstone shown therein is a granular dispersion density adjusting agent that is insoluble in an electrodeposition liquid and has solubility in a predetermined solution, and an objective dispersion for abrasive grains. The mixture is uniformly mixed according to the density, the mixed particles are temporarily attached to the surface of the base metal by electrodeposition, the dispersion density adjusting agent is dissolved and removed with the above-mentioned predetermined solution, and the remaining abrasive particles are then removed by, for example, JP As disclosed in Japanese Patent Laid-Open No. 58-100689, an electrodeposition type grindstone is manufactured by being fixed to a base metal by plating. By adjusting the mixing ratio of the dispersion density modifier and the abrasive grains,
The dispersion state of the abrasive grains finally electrodeposited on the base metal can be adjusted.
（ハ）発明が解決しようとする問題点 しかしながら、上記のような従来の電着式砥石の製造方
法には、分散密度調整剤と砥粒とを混合したものを仮付
けする際、分散密度調整剤が砥粒の固着力を弱め確実な
砥粒の仮付けができない場合がある。また分散密度調整
剤の除去が完全に行われない場合があり、このような場
合には最終的な砥粒の電着の際に砥粒の固着力を弱める
ことになる。また、分散密度調整剤が残存すると、この
残存部があるため研削液をためるチップポケットが少な
くなり、目づまりと同じ状態となり、残存部が脱落する
とき隣接する砥粒も脱落させ、切れ刃数が少なくなるな
どによって研削速度が低下するといった悪影響を及ぼす
ことになる。(C) Problems to be Solved by the Invention However, in the conventional method for producing an electrodeposition type grindstone as described above, when a mixture of a dispersion density adjusting agent and abrasive grains is temporarily attached, the dispersion density adjustment is performed. In some cases, the agent weakens the adhesive strength of the abrasive grains, making it impossible to securely attach the abrasive grains. Further, the dispersion density adjusting agent may not be completely removed, and in such a case, the adhesion force of the abrasive grains is weakened during the final electrodeposition of the abrasive grains. In addition, when the dispersion density modifier remains, the number of chip pockets for accumulating the grinding fluid is reduced due to the presence of this residual part, and it becomes the same state as clogging.When the residual part falls off, the adjacent abrasive grains also drop off, and the number of cutting edges As a result, the grinding speed will be reduced, which will have an adverse effect.
このような問題点を解決するものとして特開昭61−2577
5号公報に示されるように仮付けされた砥粒を機械的に
台金に押込むことが考えられる。しかしながら、めっき
仮付け後の砥粒を機械的に台金に押し込む方法では、せ
っかく仮付けしためっきがはく離するおそれがあり、砥
粒を台金に確実に仮付けすることは困難である。As a means for solving such problems, Japanese Patent Laid-Open No. 61-2577
It is conceivable to mechanically push the temporarily attached abrasive grains into the base metal as shown in Japanese Patent Publication No. However, with the method of mechanically pushing the abrasive grains after the plating is temporarily attached to the base metal, the plating temporarily attached may be peeled off, and it is difficult to reliably attach the abrasive grains to the base metal.
砥粒を台金に固着する方法としては、特開昭61−65775
に示されるような、Ni合金板（台金）の接着材面の裏側
から強力な磁石を作用させることにより台金の接着材面
にダイヤモンド砥粒を磁気吸引させて仮付けした後、台
金の接着材面の裏側に、台金よりも電気伝導度の大き
い、たとえば鋼板を配置し、不活性ガス雰囲気中で放電
させることにより砥粒を台金に接着する方法もあるが、
台金の材質が限定されるだけでなく、放電によって台金
と砥粒の両方が加熱されるため、砥粒の切れ刃面の強度
を低下させるおそれがあるという問題点がある。本発明
は、このような問題点を解決することを目的としてい
る。As a method for fixing the abrasive grains to the base metal, Japanese Patent Laid-Open No. 61-65775
As shown in Fig. 5, the diamond alloy particles are magnetically attracted to the adhesive surface of the base metal by applying a strong magnet from the back side of the adhesive surface of the Ni alloy plate (base metal), and then the base metal There is also a method of adhering the abrasive grains to the base metal by arranging, for example, a steel plate having a higher electric conductivity than the base metal on the back side of the adhesive surface, and discharging in an inert gas atmosphere.
Not only is the material of the base metal limited, but since both the base metal and the abrasive grains are heated by the electric discharge, there is a problem that the strength of the cutting edge surface of the abrasive grains may be reduced. The present invention aims to solve such problems.
（ニ）問題点を解決するための手段 本発明は、ダイヤモンド、CBNなどの光線透過性を有す
る砥粒を用いるとともに、レーザービームを用いて台金
を加熱溶融させて砥粒を仮付けすることにより上記問題
点を解決する。すなわち、本発明による電着式砥石の製
造方法は、台金上に多数の砥粒を分散させ、分散された
砥粒を台金に仮付けし、次いで台金表面をめっきするこ
とにより砥粒を台金に固着する方法を対象にしており、
上記砥粒として、ダイヤモンド、CBNなどの光線透過性
を有する砥粒を用いるとともに、台金の砥粒分散側の面
に砥粒を透過させてレーザビームを照射して台金のみを
溶融させることにより上記仮付けを行うことを特徴とし
ている。また、上記工程に、仮付けされた砥粒を台金に
機械的に押込む工程を加えることもできる。(D) Means for Solving the Problems The present invention uses a light-transmitting abrasive grain such as diamond or CBN, and heat-melts a base metal using a laser beam to temporarily attach the abrasive grain. Solves the above problems. That is, the manufacturing method of the electrodeposition type grindstone according to the present invention, a large number of abrasive grains are dispersed on the base metal, the dispersed abrasive grains are temporarily attached to the base metal, and then the surface of the base metal is plated to obtain the abrasive grains. It is intended for the method of fixing the
As the above-mentioned abrasive grains, diamond, while using an abrasive grain having a light-transmitting property such as CBN, to permeate the abrasive grains to the surface of the base metal on the side where the abrasive grains are dispersed to irradiate a laser beam to melt only the base metal. Is characterized in that the above-mentioned temporary attachment is carried out. Further, a step of mechanically pushing the temporarily attached abrasive grains onto the base metal can be added to the above step.
（ホ）作用 まず、台金上にダイヤモンド、CBNなどの光線透過性を
有する砥粒を所定の分布状態となるように分散させる。
次いで、レーザービームを砥粒上に照射する。レーザー
ビームは砥粒を透過し台金の砥粒との接触部分を加熱す
る。これにより台金が溶融し、砥粒が融着した状態とな
る。こうして砥粒が仮付けされた台金をめっき槽に入
れ、電着めっきする。これにより砥粒が確実に台金に固
着されることになる。なお、レーザービームの照射の
後、めっきする前に、たとえば押圧用ローラ、プレート
などによって砥粒を台金上に押込む工程を追加すること
もできる。この場合、砥粒を押圧する工程が余分に必要
となるが、レーザービームによる台金の溶融が不十分で
あって軟化する程度の場合であっても、砥粒を押込むこ
とにより確実に仮付けすることができる。(E) Action First, light-transmitting abrasive grains such as diamond and CBN are dispersed on the base metal so as to have a predetermined distribution state.
Then, a laser beam is irradiated onto the abrasive grains. The laser beam penetrates the abrasive grains and heats the contact portion of the base metal with the abrasive grains. As a result, the base metal is melted and the abrasive grains are fused. In this way, the base metal to which the abrasive grains are temporarily attached is placed in a plating tank and electroplated. This ensures that the abrasive grains are firmly fixed to the base metal. After the irradiation with the laser beam and before the plating, it is possible to add a step of pressing the abrasive grains onto the base metal by, for example, a pressing roller or a plate. In this case, an extra step of pressing the abrasive grains is required.However, even if the base metal is insufficiently melted by the laser beam and the base metal is softened, the temporary pressing of the abrasive grains ensures the temporary Can be attached.
（ヘ）実施例 第１図に示すように、台金10上に砥粒供給装置12によっ
て砥粒14を散布する。砥粒14としては、ダイヤモンド、
CBNなどの光線透過性を有するものを用いる。砥粒供給
装置12は所定間隔ごとに砥粒14を落下させ、所定の分散
状態とする。なお、砥粒14の分散状態を確実なものとす
るために、テンプレート、すなわち砥粒14が入る穴を所
定どおりに配列した板、を用いることもできる。台金10
上に砥粒14を散布した後、レーザービームを砥粒14上に
照射する。すなわち、レーザー発振器16から発射された
レーザービームを集光レンズ18によって集光し、砥粒14
上に順次照射する。なお、レーザー発振器16及び集光レ
ンズ18は、砥粒14の位置を検出する位置検出器によって
砥粒14の位置を検出し、この位置に順次照射するように
することもでき、またあらかじめ砥粒14の分散パターン
が分かっている場合には順次このパターンどおりレーザ
ー発振器16及び集光レンズ18を移動させて照射していけ
ばよい。砥粒14に照射されたレーザービームは第２図に
示すようにこれを透過し、台金10の表面上に達しこれを
加熱する。このため、砥粒14が直接レーザービームによ
って加熱されるようなことはなく、台金10のみが砥粒14
との接触部周辺の温度が上昇し溶融状態となる。これに
より、砥粒14が台金10の表面に融着した状態となる。こ
うして、台金10上のすべての砥粒14にレーザービームを
照射した後、砥粒14が付着した台金10をめっき槽に入れ
電着めっきを施す。これにより第３図に示すように、台
金10の表面上に形成されためっき層20によって砥粒14が
確実に固着される。(F) Example As shown in FIG. 1, abrasive grains 14 are sprinkled on a base metal 10 by an abrasive grain supply device 12. As the abrasive grains 14, diamond,
Use a light-transmitting material such as CBN. The abrasive grain supply device 12 drops the abrasive grains 14 at predetermined intervals to bring them into a predetermined dispersed state. In order to ensure the dispersed state of the abrasive grains 14, it is also possible to use a template, that is, a plate in which the holes for the abrasive grains 14 are arranged in a predetermined manner. Base metal 10
After spraying the abrasive grains 14 on the upper surface, a laser beam is irradiated onto the abrasive grains 14. That is, the laser beam emitted from the laser oscillator 16 is condensed by the condenser lens 18, and the abrasive grains 14
Irradiate sequentially on top. The laser oscillator 16 and the condenser lens 18 can detect the position of the abrasive grains 14 by a position detector that detects the position of the abrasive grains 14 and sequentially irradiate this position. When the dispersion pattern of 14 is known, the laser oscillator 16 and the condenser lens 18 may be sequentially moved according to this pattern for irradiation. The laser beam applied to the abrasive grains 14 passes through it as shown in FIG. 2, reaches the surface of the base metal 10 and heats it. Therefore, the abrasive grains 14 are not directly heated by the laser beam, and only the base metal 10 has the abrasive grains 14
The temperature around the contact area with and rises to a molten state. As a result, the abrasive grains 14 are fused to the surface of the base metal 10. In this way, after irradiating all the abrasive grains 14 on the base metal 10 with the laser beam, the base metal 10 to which the abrasive grains 14 adhere is placed in a plating tank and electroplating is performed. As a result, as shown in FIG. 3, the abrasive grains 14 are securely fixed by the plating layer 20 formed on the surface of the base metal 10.
なお、上述の実施例では、レーザービームによって台金
10の一部を溶融させて砥粒14を付着させるようにした
が、これに加えて更に第４図に示すような押圧装置22に
よって砥粒14を台金10に機械的に押込むようにすること
もできる。これにより砥粒14はより確実に仮付けされる
ことになる。また加熱が十分でなく台金10の表面が軟化
した程度の状態であっても、確実に砥粒14を仮付けする
ことができる。In addition, in the above-mentioned embodiment, the base metal is used by the laser beam.
Although a part of 10 is melted and the abrasive grains 14 are attached thereto, in addition to this, the abrasive grains 14 may be mechanically pushed into the base metal 10 by a pressing device 22 as shown in FIG. You can also As a result, the abrasive grains 14 are more reliably temporarily attached. Further, even if the heating is not sufficient and the surface of the base metal 10 is softened, the abrasive grains 14 can be reliably temporarily attached.
（ト）発明の効果 以上説明してきたように、本発明によると、砥粒を透過
させてレーザービームを照射することにより加熱された
台金に砥粒を仮付けするようにしたので、レーザービー
ムによって砥粒自体が加熱されることはなく、砥粒の切
れ刃面の強度を低下させることを防止することができ、
また、これに加えて砥粒を台金に機械的に押込むように
したので確実に仮付けを行うことができ、製造途中で砥
粒が台金から脱落することを防止することができる。(G) Effects of the Invention As described above, according to the present invention, the abrasive grains are tentatively attached to the heated base metal by transmitting the abrasive grains and irradiating the laser beam. The abrasive grains themselves are not heated by this, and it is possible to prevent the strength of the cutting edge surface of the abrasive grains from decreasing,
Further, in addition to this, since the abrasive grains are mechanically pushed into the base metal, the temporary attachment can be surely performed, and the abrasive grains can be prevented from falling off the base metal during manufacturing.
第１図は本発明方法を実施している状態を示す図、第２
図は砥粒を透過するレーザービームの状態を示す図、第
３図は本発明方法によって得られる砥石を示す図、第４
図は押圧装置によって砥粒を押圧している状態を示す図
である。 10……台金、12……砥粒供給装置、14……砥粒、16……
レーザー発振器、18……集光レンズ、20……めっき層、
22……押圧装置。FIG. 1 is a diagram showing a state in which the method of the present invention is being carried out, and FIG.
FIG. 3 is a diagram showing a state of a laser beam passing through the abrasive grains, FIG. 3 is a diagram showing a grindstone obtained by the method of the present invention, and FIG.
The figure is a view showing a state in which the abrasive grains are being pressed by the pressing device. 10 …… Base metal, 12 …… Abrasive grain supply device, 14 …… Abrasive grain, 16 ……
Laser oscillator, 18 ... Condensing lens, 20 ... Plating layer,
22 …… Pressing device.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭58−100689（ＪＰ，Ａ) 特開 昭61−65775（ＪＰ，Ａ) 特開 昭61−25775（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-58-100689 (JP, A) JP-A-61-65775 (JP, A) JP-A-61-25775 (JP, A)
Claims (2)
た砥粒を台金に仮付けし、次いで台金表面をめっきする
ことにより砥粒を台金に固着する電着式砥石の製造方法
において、 上記砥粒として、ダイヤモンド、CBNなどの光線透過性
を有する砥粒を用いるとともに、台金の砥粒分散側の面
にレーザービームを砥粒を透過させて照射して台金のみ
を溶融させることにより上記仮付けを行うことを特徴と
する電着式砥石の製造方法。1. An electrodeposition method in which a large number of abrasive grains are dispersed on a base metal, the dispersed abrasive grains are temporarily attached to the base metal, and then the surface of the base metal is plated to fix the abrasive grains to the base metal. In the method for producing a grindstone, as the abrasive grains, diamond, while using a light-transmitting abrasive grains such as CBN, a laser beam is transmitted through the abrasive grains to the surface of the base metal on the side where the abrasive grains are dispersed to irradiate the table. A method for producing an electrodeposition-type grindstone, characterized in that the temporary attachment is performed by melting only gold.
た砥粒を台金に仮付けし、仮付けされた砥粒を台金に機
械的に押込み、次いで台金表面をめっきすることにより
砥粒を台金に固着する電着式砥石の製造方法において、 上記砥粒として、ダイヤモンド、CBNなどの光線透過性
を有する砥粒を用いるとともに、台金の砥粒分散側の面
にレーザービームを砥粒を透過させて照射して台金のみ
を溶融させることにより上記仮付けを行うことを特徴と
する電着式砥石の製造方法。2. A large number of abrasive grains are dispersed on a base metal, the dispersed abrasive grains are temporarily attached to the base metal, the temporarily attached abrasive grains are mechanically pushed into the base metal, and then the surface of the base metal is In the method of manufacturing an electrodeposition type grindstone in which abrasive grains are fixed to a base metal by plating, as the abrasive grains, diamond, an abrasive grain having light transmittance such as CBN is used, and the abrasive grain dispersion side of the base metal is used. A method for producing an electrodeposition type grindstone, characterized in that the temporary attachment is performed by irradiating a surface with a laser beam through an abrasive grain to melt only a base metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62173982A JPH0671704B2 (en) | 1987-07-14 | 1987-07-14 | Manufacturing method of electroplated whetstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62173982A JPH0671704B2 (en) | 1987-07-14 | 1987-07-14 | Manufacturing method of electroplated whetstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420970A JPS6420970A (en) | 1989-01-24 |
| JPH0671704B2 true JPH0671704B2 (en) | 1994-09-14 |
Family
ID=15970601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62173982A Expired - Lifetime JPH0671704B2 (en) | 1987-07-14 | 1987-07-14 | Manufacturing method of electroplated whetstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0671704B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312843A (en) * | 2016-10-31 | 2017-01-11 | 湖南城市学院 | Diamond grinding wheel and production method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002205272A (en) * | 2001-01-09 | 2002-07-23 | Asahi Diamond Industrial Co Ltd | Super abrasive tool and method of manufacturing the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58100689A (en) * | 1981-12-08 | 1983-06-15 | Komatsu Ltd | Manufacturing method of electroplated grindstone |
| JPS6125775A (en) * | 1984-07-10 | 1986-02-04 | Mitsubishi Heavy Ind Ltd | Highly accurate electrodeposition grinding wheel |
| JPS6165775A (en) * | 1984-09-10 | 1986-04-04 | Nippon Chuzo Kk | Manufacture of diamond grinder |
-
1987
- 1987-07-14 JP JP62173982A patent/JPH0671704B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312843A (en) * | 2016-10-31 | 2017-01-11 | 湖南城市学院 | Diamond grinding wheel and production method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6420970A (en) | 1989-01-24 |
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