JPH067571B2 - Semiconductor chip peeling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial field of application) The present invention is used for peeling a particularly large semiconductor chip attached on the surface of an adhesive sheet in a chip mounting process. And optimum semiconductor chip peeling apparatus.

(Prior Art) Generally, a semiconductor chip is attached to an upper surface of an adhesive sheet 3 stretched on a wafer ring 2 in a state of a semiconductor wafer 1 and divided into individual semiconductor chips 4 in a dicing process as shown in FIG. To be done.

In the device for peeling the semiconductor chip 4 from the adhesive sheet 3, first, the push-up pin is raised from below the adhesive sheet, and the push-up pin breaks through the adhesive sheet to lift the semiconductor chip, and then, After vacuum-sucking the semiconductor chip with the suction nozzle from above the semiconductor chip,
The push-up pin is lowered, whereby the semiconductor chip is separated from the adhesive sheet.

In such a peeling device, when the size of the semiconductor chip is very small, for example, in the case of 0.6 mm □ to 1.5 mm □, the adhesive force of the adhesive sheet is small, and therefore the protrusion that breaks through this sheet. The lifting pins allow the semiconductor chip to be sufficiently effectively and easily peeled off from the adhesive sheet.

In other words, the adhesive force per unit area of the adhesive sheet is
When the area of the semiconductor chip is A and the peeling force F is F> p × A, the semiconductor chip can be peeled from the adhesive sheet, but when the size of the semiconductor chip is very small, Since the area A of the semiconductor chip is small, the peeling force F is also small, and as described above, the push-up pin was sufficient.

[Problems to be Solved by the Invention] However, in recent years, the size of semiconductor chips has been increasing, and for example, those having a size of 20 mm □ have also appeared.

When the size of the semiconductor chip is large as described above, the area A of the semiconductor chip is large, so that the above-mentioned p × A is large, and as a result, a remarkably large peeling force F is required. Therefore, when the semiconductor chip is peeled off by the push-up pin, stress is generated in the semiconductor chip by the force applied from the push-up pin to the semiconductor chip, and the semiconductor chip is cracked or chipped, which causes a defect in the semiconductor chip. It is possible.

There is also a peeling means disclosed in JP-A-59-2340. That is, it is a means for bringing a heater having the same area as the semiconductor chip into contact with the portion of the adhesive sheet to which the semiconductor chip is adhered, without using the push-up pin.

When the size of the semiconductor chip is very small, the heat of the heater lowers the adhesive force of the adhesive sheet, and as a result, the above-described adhesive force p per unit area becomes small and the peeling force F can be made small. With this heater means, the semiconductor chip can be easily peeled off.

On the other hand, when the size of the semiconductor chip is large, in such a heater means, the entire area A of the semiconductor chip must be heated by the heater. However, when the size of the semiconductor chip is large, it is extremely difficult to heat the adhesive sheet until the entire surface of the semiconductor chip comes off the sheet. Moreover, in this case, the amount of heat from the heater becomes very large, and there is a possibility that the heat may damage the semiconductor chip. Therefore, such a heater means is used when the size of the semiconductor chip is large.
It was extremely difficult to adopt.

The present invention has been made in view of such circumstances, even if the size of the semiconductor chip is large, without damaging the semiconductor chip, and without affecting the semiconductor chip by heat, It is intended to provide a peeling device capable of easily peeling a semiconductor chip from an adhesive sheet.

[Structure of Invention]

(Means for Solving the Problem) In order to achieve the above object, a semiconductor chip peeling apparatus according to the present invention includes a holder arranged below an adhesive sheet so as to be vertically movable, and a vertically movable inside the holder. A heating block that is freely accommodated and protrudes above the holder to contact a part of the lower surface of the adhesive sheet to which the semiconductor chip is adhered to heat this part, and the upper end surface of the holder around the outside of the heating block. A push-up pin that is arranged on the heating block and contacts the lower surface of the adhesive sheet corresponding to the peripheral edge of the semiconductor chip and pushes up the adhesive sheet, and a holding unit that holds the semiconductor chip during and after the peeling. It is characterized by having.

(Operation) According to the present invention configured as described above, at the time of peeling a semiconductor chip, first, a heater at a predetermined temperature is provided on a part of the lower surface of the adhesive sheet to which the semiconductor chip is attached ( That is, the central part) is contacted and this part is heated.
As a result, the adhesive strength of this central portion is reduced. That is,
The adhesive force p per unit area is smaller in the central portion of the semiconductor chip than in the entire surface thereof. Then, a push-up pin is brought into contact with the outer peripheral portion of the central portion where the adhesive strength is lowered to break it, and the holding means lifts the semiconductor chip to separate it.

In this way, the adhesive strength of the central portion of the adhesive sheet is reduced and then the outer peripheral portion of the adhesive sheet is lifted by the push-up pin.

Therefore, the adhesive force of the central portion first decreases by p × a (a is the area of the heated central portion), and thus the peeling force F required for the push-up pin can be reduced by this reduction amount. Therefore, even if the size of the semiconductor chip is large, stress is not generated in the chip, the chip is not cracked or chipped, and the semiconductor chip can be easily peeled from the adhesive sheet. .

Moreover, there is no fear that the semiconductor chip will be damaged by heating, unlike the means for bringing the heater into contact with the entire surface of the semiconductor chip.

As described above, according to the present invention, the central portion is heated to reduce the adhesive force, and the outer peripheral portion is peeled by the push-up pin to balance the peeling by the heating and the peeling by the pushing, thereby The semiconductor chip can be easily peeled off from the adhesive sheet without damaging the chip and exerting heat on the chip, which is suitable when the size of the chip is large.

(Example) Hereinafter, one example of the present invention will be described in detail with reference to the drawings.

The semiconductor chip 4 is a semiconductor wafer 1 as shown in FIG.
In this state, it is attached to the upper surface of the adhesive sheet 3 stretched on the wafer ring 2, and each semiconductor chip 4 is attached in the dicing process.
Is divided into

Then, each of the semiconductor chips 7 is peeled from the adhesive sheet 3, and this peeling device is provided with a cylindrical holder 5 located below the semiconductor chip 7 to be peeled. A heating block 6 whose upper end surface is smaller than the outer shape of the semiconductor chip 7 is housed inside the holder 5 with its upper end exposed to the outside. A heater 7 for heating of a cartridge type for heating this is built in.

The heating heater 7 is connected to a temperature control power source (not shown), and a heat sensitive element (not shown) is attached to the heating block 6 to control the temperature of the heating heater 7. And is kept at a predetermined temperature.

When the semiconductor chip 4 is peeled from the adhesive sheet 3, the heating block 6 rises to come into contact with the back surface of the adhesive sheet 3 and heat the adhesive sheet 3 to reduce the adhesiveness. This is for heating the adhesive sheet 3 to, for example, several tens of degrees Celsius, which is necessary for reducing the adhesive force of the adhesive sheet 3 without affecting the base material.

That is, the adhesive sheet 3 generally uses a vinyl chloride resin-based base material in many cases, and it is desirable that the set temperature of the heating block 6 be equal to or lower than the melting temperature of the base material of the adhesive sheet 3. Under the condition that the heating time is short, the heating may be performed at the melting temperature or higher, and the heating temperature of the heating block 6 needs to be set so as to match the type of the adhesive sheet 3 used.

Further, the heating block 6 is provided on the upper end surface of the holder 5.
The above-mentioned four push-up pins 8 in total, which are located on the outer side of the above, and whose tips are brought into contact with the peripheral portion of the semiconductor chip 4, are provided.

The push-up pin 8 is used for the adhesive sheet 3 of the semiconductor chip 4.
When it is peeled off, the adhesive sheet 3 is lifted to break through the adhesive sheet 3 and the semiconductor chip 4 is lifted. This pushing operation is performed by a driving mechanism (not shown) that works in conjunction with the heating block 6. Is configured to take place.

Further, the suction nozzle 9 is located immediately above the holder 5 and holds the semiconductor chip 4 to be peeled off by vacuum suction.
(Holding means) is provided.

Next, a usage example of the above embodiment will be described.

First, the semiconductor chip 4 to be peeled off is arranged directly above the holder 5 and directly below the suction nozzle 9 (holding means).
In this state, the adhesive force of the adhesive sheet 3 is reduced, and for example, the heating block 6 heated and held by the heating heater 7 at a temperature of several tens of degrees Celsius is attached to the back surface of the adhesive sheet 3 as shown in FIG. The semiconductor chip 4 is slightly lifted and raised to a predetermined height. At this time, the adhesive sheet 3 is
It is heated by heat conduction from the heating block 6, and this adhesive force is reduced.

Then, as shown in FIG. 3, the holder 5 is raised in association with the drive mechanism for pushing up the heating block 5,
The adhesive sort 3 is pierced by the push-up pin 8 provided on the upper end surface, and the semiconductor chip 4 is lifted and peeled off. At the same time, the upper surface of the semiconductor chip 4 is brought into contact with the lower surface of the suction nozzle 9 (holding means) provided above this, and the vacuum pressure is activated to suck and hold this by vacuum suction.

Next, as shown in FIG. 4, the holder 5 and the heating block 6 are integrally lowered via the drive mechanism and stopped at the initial position, whereby the peeling work of one semiconductor chip 4 is completed. .

In order to peel off the semiconductor chip 7, the adhesive sheet 3 around the semiconductor chip 7 to be peeled off is vacuum-adsorbed to prevent the adhesive sheet 3 from being lifted up so that the push-up pin 8 can easily penetrate. Can be adapted to.

Further, in the above embodiment, the adhesive sheet 3 is heated by using the heat conduction by the heating block 6, but hot air whose temperature is controlled outside is blown out from the nozzle provided inside the heating block. It is also possible to heat the adhesive sheet 3.

〔The invention's effect〕

Since the present invention is configured as described above, with the increase in size of the semiconductor chip, even if the semiconductor chip is also adhered to the adhesive sheet with the adhesiveness proportional to the adhesive area, the adhesive force of this adhesive sheet The semiconductor chip can be reliably removed by lowering it.

Moreover, since it is not necessary to push up the push-up pin with a strong force, not only does it not cause a defect due to damage such as cracking or chipping of the semiconductor chip, but also the workability of the semiconductor chip peeling work deteriorates. I will not do it.

Further, there is an effect that the conventional device can be easily manufactured by using the conventional device as it is and by improving it.

In other words, the present invention balances the peeling due to heating and the peeling due to push-up, so that the semiconductor chip can be easily removed from the adhesive sheet without damaging the chip or affecting the chip with heat. It is peeled off, and is suitable when the chip has a large size.

[Brief description of drawings]

1 to 4 are sectional views showing an embodiment of the present invention in the order of steps, FIG. 5 is a plan view of a holder, and FIG. 6 is a perspective view showing a state in which a semiconductor wafer is held. DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 3 ... Adhesive sheet, 4 ... Semiconductor chip, 5 ... Holder, 6 ... Heating block, 7 ... Heating heater, 8 ... Push-up pin, 9 ... Adsorption nozzle (holding means).

Claims (2)

[Claims] 1. A peeling device for peeling a semiconductor chip attached to an adhesive sheet, comprising: a holder disposed below the adhesive sheet so as to be vertically movable, and vertically movable within the holder. A heating block that is housed and protrudes above the holder to contact a part of the lower surface of the adhesive sheet to which the semiconductor chip is adhered to heat this part, and to the upper end surface of the holder around the outside of the heating block. After the heating by the heating block, a push-up pin that abuts on the lower surface of the adhesive sheet corresponding to the peripheral portion of the semiconductor chip and pushes it up, and a holding means for holding the semiconductor chip during and after the peeling. A peeling device for a semiconductor chip, comprising: 2. The semiconductor chip peeling apparatus according to claim 1, wherein a heater for heating is mounted inside the heating block.