JPH0676269B2 - Laser scribing method for ceramic substrates - Google Patents
Laser scribing method for ceramic substratesInfo
- Publication number
- JPH0676269B2 JPH0676269B2 JP2045970A JP4597090A JPH0676269B2 JP H0676269 B2 JPH0676269 B2 JP H0676269B2 JP 2045970 A JP2045970 A JP 2045970A JP 4597090 A JP4597090 A JP 4597090A JP H0676269 B2 JPH0676269 B2 JP H0676269B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- laser
- laser scribing
- coating
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title claims description 45
- 239000000758 substrate Substances 0.000 title claims description 40
- 238000000034 method Methods 0.000 title claims description 16
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 5
- 239000007888 film coating Substances 0.000 description 14
- 238000009501 film coating Methods 0.000 description 14
- 230000004907 flux Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 229920000298 Cellophane Polymers 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、セラミック基板を分解する際前工程で行われ
るセラミック基板のレーザースクライバーによるスクラ
イブ方法に関する。Description: TECHNICAL FIELD The present invention relates to a method for scribing a ceramic substrate by a laser scriber, which is performed in a previous step when the ceramic substrate is disassembled.
例えばハイブリッドICは、セラミック基板に回路パター
ンを形成し、さらに電子素子を搭載して作成されるが、
個々のハイブリッドICは、数十ミリメータ角板であるの
で、これらが一度に多数得られるように大きなセラミッ
ク板を分割して作製される。For example, a hybrid IC is made by forming a circuit pattern on a ceramic substrate and mounting electronic elements on it.
Since each hybrid IC is a square plate of tens of millimeters, it is manufactured by dividing a large ceramic plate so that many of them can be obtained at one time.
この分割前のいわゆる集合基板から個々のセラミック基
板を分割する手段の一つとして、レーザースクライブ法
が用いられている。これは、レーザーによって集合基板
表面にミシン目状のスリットを形成するものあり、この
スリットを形成した後電子部品を実装してからこのスリ
ットに沿って分割され製品ができあがる。A laser scribing method is used as one of means for dividing an individual ceramic substrate from the so-called collective substrate before the division. In this method, a perforated slit is formed on the surface of the aggregate substrate by a laser, and after forming the slit, electronic components are mounted and then the product is divided along the slit to complete a product.
従来、レーザースクライブ法によるスリットの形成は、
配線や電子素子をはんだ付けするためのはんだ付けラン
ド等の例えば銀ペースト等による厚膜塗膜を形成してか
ら行うものと、この厚膜塗膜を形成する前に行うものと
２通りある。Conventionally, the formation of slits by the laser scribing method
There are two types: one that is performed after forming a thick film coating such as a soldering land for soldering wiring or an electronic element with silver paste or the like, and one that is performed before forming this thick film coating.
しかしながら、後者の厚膜塗膜を形成する前にレーザー
スクライブを行う場合には、これにより生じたスリット
の周縁に溶融したセラミックが盛り上がる等のいわゆる
バリが生じ、これをそのままにして厚膜塗膜を例えばス
クリーン印刷により形成しようとすると、スクリーンに
バリが引っ掛かってスクリーンを損傷する等の問題があ
る。However, when laser scribing is performed before forming the latter thick film coating film, a so-called burr such as swelling of the molten ceramic is generated at the periphery of the slit, which is left as it is, and the thick film coating film is left as it is. However, there is a problem that when the screen is formed by screen printing, burrs are caught on the screen and the screen is damaged.
また、厚膜塗膜を形成した後のセラミック基板にレーザ
ースクライブを行なう場合、上記と同様にスリット周縁
にできたバリについてその除去作業を行なう際に、厚膜
塗膜を損傷することがあるのみならず、レーザーによっ
て高温に熱っせられてセラミックの昇華物が生じ、これ
が厚膜塗膜の電極ランド表面に付着し、電子部品やリー
ド端子をはんだ付けするときにはんだを良く付着しない
という問題がある。In addition, when performing laser scribing on a ceramic substrate after forming a thick film coating, the thick film coating may be damaged when removing the burr formed on the slit periphery in the same manner as above. However, there is a problem that ceramic sublimate is generated by being heated to a high temperature by the laser and adheres to the electrode land surface of the thick film coating, which does not adhere well when soldering electronic parts and lead terminals. is there.
本発明は、上記課題を解決するために、セラミック基板
に複数の回路パターンを有しそれぞれの回路パターンに
電子部品を搭載後各回路パターン毎にセラミック基板を
分割するそのセラミック基板の分割のためのスリットを
形成するレーザースクライブ方法において、上記セラミ
ック基板の少なくとも分割予定線及びその近傍に剥離可
能な有機物を主体とする被覆体又は洗い流し可能な樹脂
膜を接着することにより被覆してから該被覆体又は樹脂
膜を介して上記レーザースクライブによるスリットを形
成し、該スリット形成後上記被覆体又は樹脂膜を除去す
るセラミック基板のレーザースクライブ方法を提供する
ものである。The present invention, in order to solve the above problems, has a plurality of circuit patterns on a ceramic substrate and divides the ceramic substrate for each circuit pattern after mounting an electronic component on each circuit pattern. In a laser scribing method for forming slits, a covering body mainly composed of a peelable organic material or a washable resin film is adhered to at least the planned dividing line of the ceramic substrate and its vicinity, and then the covering body or A laser scribing method for a ceramic substrate, in which a slit is formed by the laser scribing through a resin film, and after the slit is formed, the coating or the resin film is removed.
少なくともセラミック基板の分割予定線及びその近傍に
剥離可能な有機物を主体とした被覆体又は洗い流し可能
な樹脂膜を接着させることにより被覆してからその被覆
体又は樹脂膜を介してレーザースクライブを行ったの
で、そのレーザースクライブを被覆体又は樹脂膜の位置
ずれを生じることなく行うことができる。また、そのレ
ーザースクライブによって形成されるスリットの周縁に
セラミックのバリが生じ難いのみならず被覆体又は樹脂
膜のレーザー照射部分は有機物が分解・揮発して残留し
難く、仮に残留しても少なく、軟らかいので変形容易で
あるとともに、レーザーの熱によるセラミックの昇華が
抑制されてその飛散が抑制され、たとえ飛散したとして
も厚膜塗膜の電極ランドに付着しないようにできる。At least the planned dividing line of the ceramic substrate and the vicinity thereof were covered with a peelable organic substance-based coating or a washable resin film for coating, and then laser scribing was performed through the coating or the resin film. Therefore, the laser scribing can be performed without causing the displacement of the coating or the resin film. Further, not only is ceramic burrs less likely to occur on the periphery of the slit formed by the laser scribing, but also the laser-irradiated portion of the coating or resin film is less likely to remain due to decomposition and volatilization of organic substances, and even if it remains, it will be small, Since it is soft, it can be easily deformed, and the sublimation of the ceramic due to the heat of the laser is suppressed to prevent its scattering, and even if it scatters, it can be prevented from adhering to the electrode land of the thick film coating film.
また、上記被覆体又は樹脂膜はレーザースクライブを行
った後除去でき、上記したようにそのレーザー照射部の
溶融物が残留しても少なく、変形容易であるので、厚膜
塗膜の回路パターン形成前にレーザースクライブを行う
ときはその回路パターン形成時にセラミック基板に段差
を生ぜず、硬い突起も生じないようにすることができ、
その回路パターン形成後レーザースクライブを行うとき
はこの回路パターンを露出し、例えばその電極ランドに
はんだペーストを塗布するときにも段差を生じたり、硬
い突起を生じないようにすることができる。In addition, the above-mentioned coating or resin film can be removed after performing laser scribing, and even if the melted material in the laser irradiation portion remains as described above, it is easy to deform, so that circuit pattern formation of a thick film coating film is possible. When laser scribing is performed before, it is possible to prevent a step from being generated on the ceramic substrate when forming the circuit pattern and to prevent hard protrusions.
When the laser scribing is performed after the circuit pattern is formed, the circuit pattern is exposed so that even when the solder paste is applied to the electrode land, a step or a hard protrusion can be prevented.
次に本発明の実施例を図面に基づいて説明する。 Next, an embodiment of the present invention will be described with reference to the drawings.
第１図（イ）中、１は集合セラミック基板、２は厚膜塗
膜からなる電極ランド、３は電極ランド以外の配線や抵
抗体等を被覆するガラス層である。なお、電極ランド、
配線、抵抗体等により回路パターンが形成される。In FIG. 1 (a), 1 is a collective ceramic substrate, 2 is an electrode land made of a thick film coating, and 3 is a glass layer for covering wirings other than the electrode land, resistors and the like. The electrode land,
A circuit pattern is formed by wiring, resistors, and the like.
この状態の集合セラミック基板１の図示想像線のところ
にレーザーのスクライブを行ってスリットを形成すると
きは、同図（ロ）に示すようにレーザースクライブを行
おうとする個所にセロテープ（商品名）４を貼着し、集
合セラミック基板１の表面をマスキングする。When laser scribing is performed on the imaginary line of the assembled ceramic substrate 1 in this state to form slits, a cellophane tape (trade name) 4 is provided at the position where laser scribing is to be performed, as shown in FIG. And the surface of the assembled ceramic substrate 1 is masked.
これにレーザー光を照射すると、同図（ハ）に示すよう
に、レーザーが照射された部分のセロテープ４が溶解
し、分解・揮散するとともに集合セラミック基板１にス
リット５がミシン目状に入る。この操作を第３図（イ）
の点線で示すところに行なう。When this is irradiated with laser light, the cellophane tape 4 in the portion irradiated with the laser is dissolved, decomposed and volatilized, and the slits 5 are perforated in the aggregate ceramic substrate 1 as shown in FIG. This operation is shown in Fig. 3 (a).
Do as indicated by the dotted line.
この後、図示省略したが、厚さ100μｍのアクリル系粘
着テープを上記張り合わせたセロテープで溶融せず残っ
ている部分に張り付けて剥がすようにすると、その接着
力でセロテープが剥がれる。このようにし第１図（ニ）
に示すようにレーザースクライブによるスリットが集合
セラミック基板１に形成される。After that, although not shown in the drawings, when the 100 μm-thick acrylic adhesive tape is adhered to the remaining portion without melting with the adhered cellophane tape and peeled off, the cellophane tape is peeled off due to its adhesive force. In this way, Fig. 1 (d)
As shown in FIG. 3, a slit by laser scribing is formed in the assembled ceramic substrate 1.
そして、電極ランド２にクリームはんだをはんだスクリ
ーンを用いて印刷し、その後電子部品をこの電極に載置
し、リフローはんだ装置によりはんだ付けを行なう。Then, cream solder is printed on the electrode land 2 by using a solder screen, and then an electronic component is placed on this electrode and soldering is performed by a reflow soldering device.
第１図は集合セラミック板の片面実装の場合であるが、
両面実装の場合には同様のことを集合セラミック基板の
裏面についても行なっても良い。Figure 1 shows the case of single-sided mounting of an aggregate ceramic plate.
In the case of double-sided mounting, the same thing may be performed on the back surface of the collective ceramic substrate.
このようにして得られたセラミック集合基板をその表面
に形成したミシン目のスリットに沿って機械的に分割す
る。これにより第３図（ロ）に示す電子部品を搭載した
セラミック基板６、６…ができあがる。The ceramic aggregate substrate thus obtained is mechanically divided along the perforation slits formed on the surface thereof. As a result, the ceramic substrates 6, 6, ... With the electronic components shown in FIG. 3B are completed.
上記はセロテープを用いたが、メンディングテープ、両
面紙粘着テープ、両面セロハン粘着テープ、導電性粘着
テープ、プリント基板用粘着テープ等の剥離可能でレー
ザーの当たった個所が溶融し、分解・揮散する有機物を
主体とする被覆体を用いても良い。The above used cellophane tape, but mending tape, double-sided paper adhesive tape, double-sided cellophane adhesive tape, conductive adhesive tape, adhesive tape for printed circuit boards, etc. that can be peeled and melted at the laser hit point, decomposed and volatilized You may use the coating body which has an organic substance as a main component.
また、第２図に示すように、第１図（イ）と同様な回路
パターンを形成した集合セラミック基板に第２図（ロ）
に示すように、レーザーによるスクライブをする面にフ
ラックスを塗布してその塗膜４′でセラミック基板表面
をマスキングし、電極ランド表面を保護する。Further, as shown in FIG. 2, a collective ceramic substrate having a circuit pattern similar to that of FIG.
As shown in (4), flux is applied to the surface to be scribed by the laser to mask the surface of the ceramic substrate with the coating film 4'to protect the surface of the electrode land.
その後、同図（ハ）に示すように、レーザースクライバ
ーによって集合セラミック基板にスリット５′をミシン
目状に入れる。次いで集合セラミック基板を洗浄し、フ
ラックス膜を洗い流し、同図（ニ）に示すレーザースク
ライブされた集合セラミック基板を得る。After that, as shown in FIG. 6C, a slit 5'is formed in a perforated shape on the aggregate ceramic substrate by a laser scriber. Then, the aggregate ceramic substrate is washed and the flux film is washed away to obtain the laser-scribed aggregate ceramic substrate shown in FIG.
必要により集合セラミック基板の裏面についも同様のこ
とを行った後、クリームはんだをスクリーン印刷により
電極ランドに印刷し、これに電子部品を載せてリフロー
はんだ装置によりはんだ付けを行なう。If necessary, the same process is performed on the back surface of the assembled ceramic substrate, cream solder is printed on the electrode lands by screen printing, electronic components are placed on the electrode lands, and soldering is performed by a reflow soldering device.
この後第１図の場合と同様にスリットに沿って集合セラ
ミック基板を分割することにより電子部品を搭載したセ
ラミック基板ができあがる。Thereafter, as in the case of FIG. 1, by dividing the collective ceramic substrate along the slit, a ceramic substrate on which electronic components are mounted is completed.
上記フラックスとしては非ハロゲン活性化ロジンフラッ
クス、ハロゲン含有弱活性化ロジンフラックス、活性化
ロジンフラックス等が用いられる。As the above flux, non-halogen activated rosin flux, halogen-containing weakly activated rosin flux, activated rosin flux and the like are used.
また、他の有機物を主体とした洗い流し可能な樹脂膜を
上記フラックス膜と同様に用いても良い。Further, a washable resin film mainly composed of another organic substance may be used similarly to the above flux film.
上記は電極ランド等の回路パターンの厚膜塗膜を形成し
た後レーザースクライブを行ったが、この厚膜形成前に
レーザースクライブしようとする面に上記と同様の被覆
体又はフラックス膜や樹脂膜を形成することによりマス
キングし、その後レーザースクライブを行ってスリット
を形成しても良く、この場合には熱っせられて昇華する
セラミック成分の飛散が抑制されるので、スリットの周
縁にバリが生じ難い。したがって、この後スクリーン印
刷を行ってもスクリーンを損傷する等のことがない。本
発明はこの場合も含む。In the above, laser scribing was performed after forming a thick film coating of a circuit pattern such as an electrode land, but before this thick film formation, the same coating or flux film or resin film as above was applied to the surface to be laser scribed. Masking may be performed to form the slit, and then laser scribing may be performed to form the slit. In this case, since scattering of the ceramic component that is heated and sublimes is suppressed, burrs are less likely to occur at the periphery of the slit. Therefore, even if the screen printing is performed thereafter, the screen is not damaged. The present invention also includes this case.
本発明によれば、レーザーのスクライブによるスリット
を形成する前に少なくともそのスリットを形成する個所
及びその近傍に剥離可能な有機物を主体とする被覆体又
は洗い流し可能な樹脂膜を接着することにより被覆し、
レーザースクライブを行った後はその被覆体又は樹脂膜
を除去できるようにしたので、そのレーザースクライブ
を被覆体又は樹脂膜の位置ずれを生じることなく行うこ
とができるため、取扱いが容易である。また、そのレー
ザースクライブによって形成されるスリットの周縁にセ
ラミックのバリが生じ難いのみならず、上記被覆体又は
樹脂膜のレーザー照射部分も有機物が分解・揮発して残
留し難く、仮に残留しても少なく、軟らかく変形容易で
あるので、セラミック基板にレーザースクライブを行っ
た後に回路パターンを例えばスクリーン印刷により形成
する場合、あるいは回路パターン形成後レーザースクラ
イブを行った後例えば電極ランドにはんだペーストをス
クリーン印刷する場合のいずれにも段差を生じることが
ないだけではなく、スクリーンを破るような硬い突起も
生じないから、スクリーンが基板表面に密着することに
より均一厚さの厚膜塗膜を基板の所定個所に良く密着し
た状態で形成することができ、厚膜塗膜の印刷精度を損
なうことがない。According to the present invention, before forming a slit by laser scribing, at least a portion where the slit is formed and its vicinity are covered by adhering a covering body mainly composed of a peelable organic material or a washable resin film. ,
Since the coating or the resin film can be removed after performing the laser scribing, the laser scribing can be performed without causing the displacement of the coating or the resin film, and thus the handling is easy. Further, not only is ceramic burrs less likely to occur at the periphery of the slit formed by the laser scribing, but the organic matter is less likely to be decomposed and volatilized to remain in the laser-irradiated portion of the coating body or the resin film. Since it is small and soft and easy to deform, when a circuit pattern is formed by, for example, screen printing after performing laser scribing on a ceramic substrate, or after performing circuit scribing and then laser scribing, for example, screen printing a solder paste on an electrode land. Not only will there be no step in either case, but also no hard protrusions that break the screen will occur, so that the screen will adhere to the substrate surface and a thick film of uniform thickness will be applied to the substrate at predetermined locations. It can be formed in a state of good adhesion, impairing the printing accuracy of thick film coatings. That there is no.
また、レーザーの熱によるセラミックの昇華が抑制され
てその飛散が抑制され、たとえ飛散したとしても、回路
パターン形成後レーザースクライブを行うときはその飛
散物が厚膜塗膜の電強ランドに付着しないようにでき、
しかもこの回路パターンを露出させて後工程において電
子部品のはんだ付けを行うことを防げないようにするこ
とができる。Further, the sublimation of the ceramic due to the heat of the laser is suppressed and its scattering is suppressed, and even if it scatters, the scattered matter does not adhere to the strong land of the thick film coating when the laser scribing is performed after the circuit pattern is formed. You can
Moreover, it is possible to prevent the circuit pattern from being exposed and soldering the electronic component in the subsequent process.
このようにして従来のようなバリを取り除く工程を減ら
し、電子部品を電極ランドに接続する性能も損なわない
ようにすることができる。In this way, it is possible to reduce the conventional process for removing burrs and prevent the performance of connecting electronic components from the electrode lands from being impaired.
第１図（イ）〜（ニ）は本発明の一実施例の方法を示す
断面工程図、第２図（イ）〜（ニ）はその他の実施例の
方法を示す断面工程図、第３図（イ）は分割線を示す説
明図、同（ロ）はその分割状態を示す説明図である。 図中、１は集合セラミック基板、２は厚膜塗膜からなる
電極ランド、３はガラス層、４は被覆体としてのセロテ
ープ、４′は樹脂膜としてのフラッスク膜、５、５′は
スリットである。1 (a) to 1 (d) are sectional process drawings showing a method of one embodiment of the present invention, and FIGS. 2 (a) to (d) are sectional process drawings showing a method of another embodiment, and FIG. FIG. 9A is an explanatory diagram showing a division line, and FIG. 9B is an explanatory diagram showing the division state. In the figure, 1 is an aggregate ceramic substrate, 2 is an electrode land made of a thick film coating, 3 is a glass layer, 4 is cellophane as a coating, 4'is a flash film as a resin film, and 5'is a slit. is there.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 1/02 Ｇ 7047−4Ｅ 3/00 Ａ 6921−4Ｅ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 1/02 G 7047-4E 3/00 A 6921-4E
Claims (1)
しそれぞれの回路パターンに電子部品を搭載後各回路パ
ターン毎にセラミック基板を分割するそのセラミック基
板の分割のためのスリットを形成するレーザースクライ
ブ方法において、上記セラミック基板の少なくとも分割
予定線及びその近傍に剥離可能な有機物を主体とする被
覆体又は洗い流し可能な樹脂膜を接着することにより被
覆してから該被覆体又は樹脂膜を介して上記レーザース
クライブによるスリットを形成し、該スリット形成後上
記被覆体又は樹脂膜を除去するセラミック基板のレーザ
ースクライブ方法。1. A laser scribing method in which a plurality of circuit patterns are provided on a ceramic substrate, electronic components are mounted on the respective circuit patterns, and then a ceramic substrate is divided into each circuit pattern to form slits for dividing the ceramic substrate. In the above-mentioned laser, at least the dividing line of the ceramic substrate and the vicinity thereof are covered with a peelable organic substance-based coating or a washable resin film to cover the ceramic substrate, and then the laser beam is applied through the coating or resin film. A laser scribing method for a ceramic substrate, wherein a slit is formed by scribing, and the coating or resin film is removed after the slit is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045970A JPH0676269B2 (en) | 1990-02-28 | 1990-02-28 | Laser scribing method for ceramic substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2045970A JPH0676269B2 (en) | 1990-02-28 | 1990-02-28 | Laser scribing method for ceramic substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03252384A JPH03252384A (en) | 1991-11-11 |
| JPH0676269B2 true JPH0676269B2 (en) | 1994-09-28 |
Family
ID=12734085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2045970A Expired - Lifetime JPH0676269B2 (en) | 1990-02-28 | 1990-02-28 | Laser scribing method for ceramic substrates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0676269B2 (en) |
Cited By (1)
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|---|---|---|---|---|
| JP2007173867A (en) * | 2007-03-20 | 2007-07-05 | Koa Corp | Substrate for electronic component, and method for manufacturing electronic component |
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| JPH10305420A (en) | 1997-03-04 | 1998-11-17 | Ngk Insulators Ltd | Processing method of base material composed of oxide single crystal and method of manufacturing functional device |
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| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
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| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| CN108069386B (en) * | 2017-12-22 | 2024-04-16 | 深圳华美澳通传感器有限公司 | Ceramic substrate structure and cutting method |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63112078A (en) * | 1986-10-29 | 1988-05-17 | Hitachi Ltd | Working method for hole of groove |
-
1990
- 1990-02-28 JP JP2045970A patent/JPH0676269B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173867A (en) * | 2007-03-20 | 2007-07-05 | Koa Corp | Substrate for electronic component, and method for manufacturing electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03252384A (en) | 1991-11-11 |
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