JPH0676971B2 - Circuit pattern inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a printed wiring board comprising an insulating substrate in which curing of an epoxy resin is completed in an insulating base material and a circuit pattern formed on the insulating substrate. It relates to a method for inspecting a circuit pattern of a wiring board such as.

[Conventional technology]

BACKGROUND ART Epoxy resins have been widely used as resins for laminated boards and the like. As a method for inspecting a circuit pattern of a printed wiring board made of such a laminated board, a direct conduction method using a probe, a method using reflected light of a metal conductor circuit pattern to which a metallographic microscope is applied, a method using soft X-rays, and the like are conventionally known. However, recently, as a method that enables more accurate and highly efficient inspection, a printed wiring board that does not emit light in response to excitation light is provided by providing the insulating layer with fluorescence that emits fluorescence in response to excitation light. By dividing the circuit pattern part and the part of the insulating pattern exposed between the circuits of the conductor circuit pattern and emitting light with respect to the excitation light, and irradiating the excitation light by utilizing the difference in the light emitting property of these parts. A circuit pattern inspection method for inspecting an abnormal circuit pattern by comparing it with a normal circuit pattern is being tried. The success or failure of this inspection method naturally depends on the high light emitting property imparted to the insulating layer and the integral coupling of the excitation light that strongly excites the light emission. In particular, the light-emitting property imparted to the insulating layer is lower as the layer thickness of the insulating layer is thinner, and also decreases when the blackened insulating layer is included. Therefore, in such a wiring board, the insulating layer strongly emits light. Must be given.

[Problems to be solved by the invention]

Therefore, the present invention relates to a novel method for inspecting a circuit pattern, which can accurately and efficiently inspect a circuit pattern with fluorescence emitted by excitation light, and specifically, has a high fluorescence property imparted to an insulating layer. The point is that this fluorescence is solved by the integral coupling of specific excitation light that strongly excites the fluorescence.

[Means for Solving the Problems]

The method for inspecting a circuit pattern formed on an insulating substrate according to the present invention includes (i) an epoxy resin, and (b) an amount of 5 to 20 parts by weight based on 100 parts by weight of the epoxy resin. The following general formula A diaminodiphenylmethane compound represented by (R ₁ and R ₂ are hydrogen atoms or an alkyl group having 1 to 4 carbon atoms), (c), and a resin composition containing a curing accelerator, the curing of which has been completed in the base material. A wiring board composed of a substrate and a circuit pattern formed on the insulating substrate is irradiated with excitation light of 350 to 500 nm.

The present invention will be described in detail below. The insulating board constituting the wiring board applied to the circuit pattern inspection method of the present invention is an epoxy resin and a diaminodiphenylmethane compound compounded in an amount of 5 to 20 parts by weight based on 100 parts by weight of the epoxy resin. The resin composition containing a curing accelerator is limited to an insulating substrate in which curing is completed in the base material. Here, as the epoxy resin, a bisphenol A-type epoxy resin and a halogenated bisphenol A-type epoxy resin in which flame retardancy is imparted to this, or a novolac-type epoxy resin which is used as a mixture for improving heat resistance and a difficult Illustrative are halogenated novolac type epoxy resins and the like that are imparted with flammability. The reason for limiting the amount of the diaminodiphenylmethane compound blended to 100 parts by weight of such an epoxy resin to 5 to 20 parts by weight is that the lower limit of less than 5 parts by weight causes weak fluorescence to excitation light and an upper limit. Of 20
This is because if the amount is more than parts by weight, the curing speed of the epoxy resin is high and it becomes difficult to use it in a resin varnish. In the present invention, this diaminodiphenylmethane compound is a curing agent that is selectively adopted as a curing agent for epoxy resins, and has a large-scale action as a fluorescent agent that emits fluorescence to light belonging to a specific wavelength. Have at the same time.

As a curing accelerator, a tertiary amine such as benzyldimethylamine, 2-ethyl-4-methylimidazole (2E4M
Imidazoles such as Z) are used, and the mixing ratio thereof is suitably 0.05 to 1 part by weight with respect to 100 parts by weight of the epoxy resin. Explaining along the process until the above components give the solid content of the cured resin as the crosslinking reaction is accelerated in the substrate, the above components are contained in the resin varnish dissolved in the solvent. Here, as the solvent, dimethylformamide (DMF), methyl ethyl ketone (MEK),
Acetone, methyl cellosolve, dimethyl acetamide,
A single or a mixture of zooxane and the like can be used in an amount such that the resin content is 40 to 80% by weight, preferably 55 to 70% by weight. Then, for example, after impregnating the resin varnish thus prepared into a glass cloth base material, the reaction of the epoxy resin is advanced while the catalyst is evaporated by drying to semi-cure the resin composition in the base material to form a prepreg. To do. The type of the base material is not particularly limited. Usually, glass cloth or the like is used. In addition, inorganic fiber cloth such as quartz fiber cloth, high heat resistant organic fiber cloth such as polyimide resin fiber cloth, and the like may be used. The temperature for semi-curing is preferably 140 to 170 ° C. If the temperature exceeds 170 ° C, the reaction of the epoxy resin will proceed too much, and the interlayer adhesive strength of the obtained prepreg will decrease, which will cause the performance of the insulating substrate such as water absorption to deteriorate. A metal foil-clad insulation that can form a circuit pattern by stacking several prepregs obtained in this way on top of metal foil of copper, nickel, aluminum, etc. and thermocompressing them under the usual conditions As a substrate, and then by a subtractive method that is generally used as a circuit forming method,
By etching this metal foil, a wiring board having a circuit pattern formed on an insulating substrate is obtained. Therefore, the insulating substrate is divided into a circuit pattern and an insulating pattern formed by the insulating substrate exposed between the circuits of the circuit pattern. A wiring board having a circuit pattern formed on an insulating substrate by an additive method can also be applied as the wiring board in the present invention.

The wiring board comprising the above insulating substrate and the circuit pattern formed on this insulating substrate in the present invention has a wavelength of 350 to 500.
It utilizes the property of emitting fluorescence especially to the light of nm. That is, while the insulating pattern formed between the circuits of the circuit pattern exhibits remarkable fluorescence with respect to the excitation light of 350 to 500 nm, the circuit pattern utilizes the property of not exhibiting fluorescence to normalize the abnormality of the circuit pattern. It can be determined by comparison with the circuit pattern. In particular, the fluorescent property of the insulating layer is lower as the thickness of the insulating layer is thinner, and it also tends to decrease when a blackened insulating layer is included. Therefore, for example, an insulating substrate of 0.2 mm or less or a blackened insulating substrate is used. In the inspection of the circuit pattern of the wiring board, it is extremely useful to increase the fluorescence intensity of the insulating layer. Specific examples will be given below.

〔Example〕

Example 1 As an epoxy resin, 100 parts by weight of a brominated epoxy resin (Toto Kasei Co., Ltd., YDB-500, epoxy equivalent 500) was used, and 3,3'-diethyl in which R ₁ and R ₂ were ethyl groups in the above diaminodiphenylmethane compound. -4,4'-diaminodiphenylmethane (20 parts by weight), 2E4MZ as a curing accelerator (0.1 parts by weight), and an equivalent amount of MEK and DMF as a solvent were added to the above resin content of 65% by weight. To obtain a resin varnish, which was impregnated with 0.1 mm glass cloth and dried to obtain a prepreg. And on both sides of this prepre,
A copper foil with a thickness of 18 μm is placed, sandwiched between metal plates and thermoformed under a molding pressure of 50 kg / cm ² and a temperature of 170 ° C. for 100 minutes, and the copper foil is etched to form a circuit pattern on an insulating substrate. A wiring board having an insulating pattern in which the insulating substrate was exposed between the circuits of this circuit pattern was obtained. This wiring board was irradiated with excitation light of 350 to 500 nm using a spectrofluorometer, and the maximum value of the fluorescence intensity that appeared at that time is shown in Table 1. In addition, applying a fluorescent pattern inspection device using excitation light of 442 nm to this 300 mm × 500 mm wiring board, conductor width of the circuit pattern, conductor interval, disconnection, short circuit, pinhole, copper remaining,
As a result of inspecting for copper deficiency, the circuit pattern detected as an abnormal portion by the fluorescent pattern inspection device was observed again with a microscope, and as a result, the number of circuit patterns confirmed to be normal, that is, the fluorescent pattern inspection device The results are also shown in Table 1 with the number of erroneous detections as the inspection accuracy.

Example 2 The procedure of Example 1 was repeated except that 14 parts by weight of 3,3′-diethyl-4,4′-diaminodiphenylmethane used in Example 1 and 0.6 part by weight of dicyandiamide were added. I got the result.

Example 3 5 parts by weight of 3,3′-diethyl-4,4′-diaminodiphenylmethane used in Example 1 was used, and dicyandiamide was used.
The same procedure as in Example 1 was carried out except that 1.8 parts by weight was blended, and the results shown in Table 1 were obtained.

Comparative Example 1 Without adding 3,3′-diethyl-4,4′-diaminodiphenylmethane used in Example 1, dicyandiamide 2.
Example 1 was repeated except that 5 parts by weight was blended.
The results in the table were obtained.

As is clear from Table 1, according to the examples of the present invention according to Examples 1 to 3, the fluorescence intensity is increased, and as a result, specifically, the high fluorescence imparted to the insulating layer can be strongly excited, The accuracy of the inspection utilizing this property can also be improved.

Example 4 The prepreg obtained in Example 1 was applied to both surfaces of a 0.5 mm inner layer printed wiring board which was blackened with an insulating substrate obtained by curing the prepreg in Example 1 and a circuit pattern formed on the insulating substrate. Then, a copper foil of 18 μm is further placed on both outer sides of the foil, and the foil is sandwiched between metal plates to be laminated and molded under the heat and pressure conditions of Example 1, and further subjected to etching to obtain a circuit pattern on an insulating substrate. The fluorescence intensity and the circuit pattern were inspected in the same manner as in Example 1. The results are shown in Table 2.

Example 5 Example 4 was repeated except that the inner layer printed wiring board and prepreg of Example 1 used in Example 4 were replaced with the inner layer printed wiring board and prepreg of Example 2, and the results were obtained as a second example. Shown in the table.

Example 6 Example 6 was repeated except that the inner layer printed wiring board and prepreg of Example 1 used in Example 4 were replaced with the inner layer printed wiring board and prepreg of Example 3, and the results were obtained as a second example. Shown in the table.

Comparative Example 2 The procedure of Example 4 was repeated except that the inner layer printed wiring board and prepreg of Example 1 used in Example 4 were replaced with the inner layer printed wiring board and prepreg of Comparative Example 1, and the results obtained were Shown in the table.

As is clear from Table 2, according to the examples of the present invention according to Examples 4 to 6, the fluorescence intensity is increased, and as a result, specifically, the high fluorescence imparted to the insulating layer can be strongly excited, The accuracy of the inspection utilizing this property can also be improved.

〔The invention's effect〕

As described above, the present invention is an accurate combination of the high fluorescence given to the insulating layer and the specific excitation light that strongly excites this fluorescence, and the circuit pattern inspection with the fluorescence emitted by the excitation light with high accuracy. It can be done efficiently.

Claims (1)

[Claims] 1. An epoxy resin; (b) The following general formula, which is blended in an amount in the range of 5 to 20 parts by weight with respect to 100 parts by weight of the epoxy resin. A diaminodiphenylmethane compound represented by (R ₁ and R ₂ are hydrogen atoms or an alkyl group having 1 to 4 carbon atoms), (c), and a resin composition containing a curing accelerator, the curing of which has been completed in the base material. A circuit pattern inspection method comprising irradiating a wiring board composed of a substrate and a circuit pattern formed on the insulating substrate with excitation light of 350 to 500 nm.