JPH0676983B2 - Moisture sensitive element - Google Patents
Moisture sensitive elementInfo
- Publication number
- JPH0676983B2 JPH0676983B2 JP1275016A JP27501689A JPH0676983B2 JP H0676983 B2 JPH0676983 B2 JP H0676983B2 JP 1275016 A JP1275016 A JP 1275016A JP 27501689 A JP27501689 A JP 27501689A JP H0676983 B2 JPH0676983 B2 JP H0676983B2
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- electrode terminal
- electrode
- sensitive element
- acrylic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は感湿素子に係わり、特に外部回路接続用リード
線の接続構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a humidity-sensitive element, and more particularly to a connection structure of a lead wire for connecting an external circuit.
従来、この種の感湿素子は、絶縁性基板の主要面上に対
向する一対の対向電極を形成するとともにこの対向電極
間にアクリル系樹脂からなる感湿膜がサンドウイツチ上
に挾持される構成となつており、この感湿膜の相対温度
に対する電気容量値の変化が対向電極の各電極端子に電
気的に接続される外部回路接続用リード線から取り出さ
れていた。Conventionally, this type of moisture-sensitive element has a structure in which a pair of counter electrodes facing each other is formed on a main surface of an insulating substrate, and a moisture-sensitive film made of an acrylic resin is sandwiched between the counter electrodes on a sandwitch. The change in the electric capacitance value with respect to the relative temperature of the moisture sensitive film is taken out from the external circuit connecting lead wire electrically connected to each electrode terminal of the counter electrode.
しかしながら、このように構成される感湿素子は、対向
電極の各電極端子に外部引き出し用リード線が機械的強
度が大きくかつ信頼の高いエポキシ系の導電性接着剤に
より電気的接続されているので、エポキシ系樹脂が硬化
後、対向電極中の上側電極にひび割れが発生するという
問題があつた。このようにひび割れが発生するのは、エ
ポキシ系樹脂が加熱硬化するとき、体積収縮が起る。こ
の際、感湿膜のアクリル系樹脂とエポキシ系樹脂とは熱
膨張係数などの物性的な違いがあるため、アクリル系樹
脂がエポキシ系樹脂硬化時に引つ張られて結果的に透湿
性の上側電極にひび割れが生ずることになる。However, in the moisture-sensitive element configured in this manner, the lead wire for external extraction is electrically connected to each electrode terminal of the counter electrode by an epoxy-based conductive adhesive having high mechanical strength and high reliability. However, there is a problem that after the epoxy resin is cured, the upper electrode in the counter electrode is cracked. Such cracking occurs when the epoxy resin is heat-cured and causes volume contraction. At this time, since the acrylic resin and the epoxy resin of the moisture-sensitive film have physical properties such as a thermal expansion coefficient, the acrylic resin is stretched when the epoxy resin is cured, and as a result, the moisture permeable upper The electrodes will crack.
このような課題を解決するために本発明は、透湿性上側
電極端子とリード線とを電気的に接続する電極材料にア
クリル敬導電性樹脂を用いるものである。In order to solve such a problem, the present invention uses an acrylic conductive resin as an electrode material for electrically connecting the moisture-permeable upper electrode terminal and the lead wire.
本発明においては、透湿性上側電極端子の電極材料とし
て感湿膜と同じアクリル系導電性樹脂を用いることで熱
硬化後の熱膨張係数などの物性が整合されることにな
る。In the present invention, by using the same acrylic conductive resin as the moisture sensitive film as the electrode material of the moisture permeable upper electrode terminal, the physical properties such as the thermal expansion coefficient after thermosetting are matched.
以下、図面を用いて本発明の実施例を詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明による感湿素子の一実施例を示す平面図
であり、第２図は第１図のII−II′線の断面図である。
これらの図において、１は例えばガラスもしくはアルミ
ナなどからなる絶縁性基板、２はこの絶縁性基板１上の
主要面に成膜された例えばPtを主要膜とする下側電極で
ある。この下側電極２は絶縁性基板１がガラス基板の場
合、Ptを蒸着もしくはスパツタリング法等により約1000
〜10000Åの膜厚に成膜される。また、Ptはガラス基板
に対して密着強度が小さいのでNbもしくはTi等の密着増
強膜をガラス基板とPtとの間に成膜しても良い。2aは下
側電極２と同一材料，同一手段により一体的に絶縁性基
板１の端部に延長して成膜された電極端子、３は下部電
極２上に成膜された例えばアクリル系樹脂からなる感湿
膜であり、この感湿膜３はアクリル系樹脂をスピンコー
ト法により塗布した後、絶縁性基板１がガラス基板の場
合はガラス転移点以上の温度で熱処理を行なつて膜厚が
約5000〜50000Åの厚さで形成される。なお、この感湿
膜３を構成する高分子樹脂材料としては、メチルメタク
リレートの重合物、メチルメタクリレートとビニル基を
２個以上有する化合物との共重合体、エチルメタクリレ
ートの重合物、エチルメタクリレートとビニル基を２個
以上有する化合物との共重合体、メタクリル酸の重合物
などが用いられる。４は感湿膜３上に成膜された例えば
Auなどからなる上側電極であり、この上側電極４はAuを
加熱蒸着法により膜厚100〜500Åの厚さに形成される。
この場合も加熱温度はガラス転移点を目安とする。4aは
上側電極４と同一材料，同一手段により一体的に絶縁性
基板１上の端部に延長して成膜された電極端子、５は下
部電極端子2aおよび上側電極端子4a上にアクリル系導電
性樹脂６により電気的に接続および機械的に固定された
外部引き出し用リード線である。このアクリル系導電性
樹脂６は常温硬化型，加熱硬化型のいずれでも良好な接
続が可能であり、また、その塗布方法はデイスペンサを
用いて供給することにより、電極端子2a,4a上に定量塗
布が可能である。なお、このアクリル系導電性樹脂６と
しては感湿膜３を構成する前記高分子樹脂材料にAg,Ni,
Cu,Auなどの導電体粒子が混入され、溶剤としてトルエ
ンもしくはキシレンなどを用いることもできる。つま
り、アクリル系であれば良い。FIG. 1 is a plan view showing an embodiment of the moisture sensitive element according to the present invention, and FIG. 2 is a sectional view taken along the line II-II ′ of FIG.
In these figures, 1 is an insulating substrate made of, for example, glass or alumina, and 2 is a lower electrode having Pt as a main film formed on the main surface of the insulating substrate 1. When the insulating substrate 1 is a glass substrate, this lower electrode 2 is formed by vapor deposition of Pt or about 1000 by sputtering or the like.
It is deposited to a film thickness of ~ 10000Å. Further, since Pt has a low adhesion strength to the glass substrate, an adhesion enhancing film such as Nb or Ti may be formed between the glass substrate and Pt. 2a is an electrode terminal which is made of the same material as that of the lower electrode 2 and is integrally formed to extend to the end of the insulating substrate 1 by the same means, and 3 is made of, for example, an acrylic resin which is formed on the lower electrode 2. The moisture-sensitive film 3 is formed by applying an acrylic resin by spin coating, and then heat-treating the insulating substrate 1 at a temperature equal to or higher than the glass transition point when the insulating substrate 1 is a glass substrate. It is formed with a thickness of about 5000 to 50000Å. As the polymer resin material constituting the moisture sensitive film 3, a polymer of methyl methacrylate, a copolymer of methyl methacrylate and a compound having two or more vinyl groups, a polymer of ethyl methacrylate, ethyl methacrylate and vinyl. A copolymer with a compound having two or more groups, a polymer of methacrylic acid and the like are used. 4 is formed on the moisture sensitive film 3, for example,
The upper electrode 4 is made of Au or the like, and the upper electrode 4 is formed by depositing Au to a thickness of 100 to 500Å by a heating vapor deposition method.
In this case as well, the heating temperature is based on the glass transition point. 4a is an electrode terminal formed of the same material as the upper electrode 4 by the same means and extending integrally to the end portion on the insulating substrate 1, and 5 is an acrylic conductive material on the lower electrode terminal 2a and the upper electrode terminal 4a. Is a lead wire for external extraction electrically connected and mechanically fixed by a conductive resin 6. This acrylic conductive resin 6 can be connected well either at room temperature or by heat curing, and its application method is to supply a fixed amount on the electrode terminals 2a, 4a by supplying it with a dispenser. Is possible. In addition, as the acrylic conductive resin 6, Ag, Ni,
Conductor particles such as Cu and Au may be mixed, and toluene or xylene may be used as a solvent. That is, any acrylic type may be used.
このような構成によると、透湿性上側電極端子4aとリー
ド線５とを電気的に接続する電極材料として感湿膜３と
物性的に同じアクリル系導電性樹脂６を用いるので、熱
膨張係数などの物性が整合され、このアクリル系導電性
樹脂６の硬化後の透湿性上側電極４へのひび割れの発生
が皆無となる。According to this structure, since the acrylic conductive resin 6 having the same physical properties as the moisture sensitive film 3 is used as the electrode material for electrically connecting the moisture permeable upper electrode terminal 4a and the lead wire 5, the coefficient of thermal expansion, etc. The physical properties are matched, and no cracks are generated in the moisture permeable upper electrode 4 after the acrylic conductive resin 6 is cured.
以上説明したように本発明によれば、透湿性上側電極の
ひび割れの発生が皆無となるので、品質および信頼の高
い感湿素子が得られるという極めて優れた効果を有す
る。As described above, according to the present invention, the moisture-permeable upper electrode is free from cracks, so that the moisture-sensitive element having high quality and high reliability can be obtained.
第１図は本発明による感湿素子の一実施例を示す平面
図、第２図は第１図のII−II′線の断面図である。 １……絶縁性基板、２……下側電極、2a……電極端子、
３……感湿膜、４……上側電極、4a……電極端子、５…
…外部引き出し用リード線、６……アクリル系導電性樹
脂。FIG. 1 is a plan view showing an embodiment of the moisture sensitive element according to the present invention, and FIG. 2 is a sectional view taken along the line II-II 'in FIG. 1 ... Insulating substrate, 2 ... Lower electrode, 2a ... Electrode terminal,
3 ... moisture sensitive film, 4 ... upper electrode, 4a ... electrode terminal, 5 ...
... Lead wire for external drawing, 6 ... Acrylic conductive resin.
Claims (1)
る下側電極と、前記下側電極上に形成されたアクリル系
高分子樹脂からなる感湿膜と、前記感湿膜上に形成され
た電極端子を有する透湿性上側電極と、前記電極端子と
電気的に接続する外部引き出しリード線と、前記透湿性
上側電極端子とリード線との接続部に接着固化されたア
クリル系導電性樹脂とを備えたことを特徴とする感湿素
子。1. A lower electrode having an electrode terminal formed on an insulating substrate, a moisture sensitive film made of an acrylic polymer resin formed on the lower electrode, and formed on the moisture sensitive film. Moisture-permeable upper electrode having a formed electrode terminal, an external lead wire electrically connected to the electrode terminal, and an acrylic conductive resin adhesively solidified at a connection portion between the moisture-permeable upper electrode terminal and the lead wire. A moisture-sensitive element comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1275016A JPH0676983B2 (en) | 1989-10-24 | 1989-10-24 | Moisture sensitive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1275016A JPH0676983B2 (en) | 1989-10-24 | 1989-10-24 | Moisture sensitive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03137555A JPH03137555A (en) | 1991-06-12 |
| JPH0676983B2 true JPH0676983B2 (en) | 1994-09-28 |
Family
ID=17549706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1275016A Expired - Lifetime JPH0676983B2 (en) | 1989-10-24 | 1989-10-24 | Moisture sensitive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0676983B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001088523A1 (en) * | 2000-05-15 | 2001-11-22 | Yamatake Corporation | Humidity sensor |
| US20040194546A1 (en) * | 2001-08-31 | 2004-10-07 | Masashi Kanehori | Capacitive humidity-sensor and capacitive humidity-sensor manufacturing method |
| EP2315013B1 (en) * | 2009-10-21 | 2014-06-18 | Micronas GmbH | Humidity sensor |
| CN106093141A (en) * | 2016-07-29 | 2016-11-09 | 广州奥松电子有限公司 | A kind of humistor based on 5730 encapsulation |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432379A (en) * | 1977-08-16 | 1979-03-09 | Matsushita Electric Ind Co Ltd | Humidity sensor |
| JPS6321545A (en) * | 1986-07-16 | 1988-01-29 | Toshiba Corp | Manufacture of moisture sensor |
-
1989
- 1989-10-24 JP JP1275016A patent/JPH0676983B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03137555A (en) | 1991-06-12 |
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