JPH0680699B2 - Wire bonding equipment - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to an improvement in a wire bonding apparatus.

[Technical background of the invention and its problems]

In general, the wire bonding apparatus is configured to move the bonding tool horizontally in the XY table and move it up and down by the swing mechanism to perform wire bonding at the bonding point. Conventionally, for example, control is performed as follows. That is, the drive mechanism of the tool is roughly classified into a cam drive type and a servo drive type. Among them, the cam drive type is controlled by appropriately setting the cam shape according to the movement locus of the tool and In the case of the drive type, a drive control program is created in advance according to the movement trajectory of the tool, and the movement mechanism is driven according to this program for control.

By the way, in wire bonding, in order to prevent the wire from hanging down or coming into contact with the chip, it is necessary to make the wire stretching shape an optimum shape according to the distance between the first bonding point and the second bonding point. . However, in the conventional wire bonding apparatus, since the movement locus of the tool is determined by appropriately setting the cam shape or the program for servo drive control as described above, the wire stretching shape is newly set. When changing or changing, the cam shape or drive control program must be created accordingly. For this reason, it takes a lot of time and labor to set the stretched shape of the wire, and as a result, the operating rate of the apparatus is lowered.

[Object of the Invention]

It is an object of the present invention to provide a wire bonding apparatus that can set a desired tool movement locus easily and in a short time without changing a cam shape or a drive control program, and thereby can improve the operation rate.

[Outline of Invention]

In order to achieve the above object, the present invention provides an input means for inputting three-dimensional coordinate information for designating a movement trajectory of a tool from a first bonding point to a second bonding point and information for designating a movement form, and a driving device. An information calculation unit and a drive control unit are provided, and the drive information calculation unit sets a tool for each of the first and second bonding points based on the three-dimensional coordinate information and the movement form designation information input by the input unit. XY of the mechanism that moves the
The movement amount and the velocity for each Z-direction component are obtained, and the drive control means drives and controls the mechanism according to the movement amount and the velocity.

Example of Invention

FIG. 1 shows the structure of a wire bonding apparatus according to an embodiment of the present invention, and 10 shows a wire bonding apparatus main body. The wire bonding device body 10 is
It has a tool 11 having a capillary 12 attached to its tip, and this tool 11 is supported by a drive mechanism 13. The rocking mechanism 13 has a servo motor 17 having a rotary encoder 17a as a rocking drive source, and the servo motor 17 moves the tool 11 up and down (Z-axis direction). The swing mechanism 13 is mounted on the XY table 14. The XY table 14 includes servo motors 15 and 16 with rotary encoders 15a and 16a for each of the X axis and the Y axis.
Is driven to move the tool 11 in the horizontal direction. As a result, the tool 11 can be moved in three dimensions, whereby wire bonding is performed on the pad (first bonding point) 22 and the lead frame 23 (second bonding point) of the semiconductor pellet 21.
Reference numeral 24 is a wire stretched between the pad 22 of the semiconductor pellet 21 and the lead frame 23 by bonding.

On the other hand, the present apparatus includes a control circuit 30 for driving and controlling the main body of the wire bonding apparatus. This control circuit
The reference numeral 30 is provided with a microcomputer as a main control section, and is provided with an input control means 31, a drive information calculation means 32, and a drive control means 33 as its main control functions.
Of these, the input control means 31 is, when newly setting or changing the stretched shape of the wire, the coordinate information for designating the movement trajectory of the tool 11 and the information for designating the movement form from the input unit 41 including a keyboard, for example. And are input respectively. Reference numeral 42 is a display for displaying the above-mentioned input information, information indicating the operating state, and the like. Drive information calculation means 32
Is the operation of the XY table 14 and the swinging mechanism 13 for converting the coordinate information and the code information input by the input control means 31 into the X, Y, Z direction components of the tool 11, and driving the tool 11 by this. The drive control information for controlling the quantity and the speed is created. Incidentally, 43 is a storage circuit for storing the drive information of these operation amounts and speeds. The drive control means 33 generates a servo drive control signal according to the drive control information created by the drive information calculation means, and outputs this signal to the servo drive circuits 51, 52, 53 to output the servo motor 1
It drives 5,16,17. In this drive control, the drive control means 33 introduces the detection output of the rotary encoders 15a, 16a, 17a provided in the servo motors 15, 16, 17 and outputs the servo motors 15, 16, 17 from the detection outputs. Each servo drive control signal is created while detecting the operation amount and speed of the and monitoring these detection values.

Next, the operation of the apparatus configured as described above will be described.
Prior to driving the device, the operator
The optimum stretched shape of the wire is determined according to the distance between the pad 22 of 21 and the lead frame 23, and the movement locus and movement form of the tool 11 for obtaining this stretched shape are set.
Then, the coordinate information designating the movement locus and the code information designating the movement form are respectively inputted from the input unit 41. For example, when the pad 22 of the semiconductor pellet 21 and the lead frame 23 are in the positional relationship as shown in FIG. 2, a plurality of points P designating the movement trajectory R of the tool 11 are set to the pad 22 and the lead frame 23, respectively. Bonding point B1, B
Coordinates are made by a line H connecting the two (hereinafter referred to as H axis) and a Z axis representing the height direction, and this coordinate value is input. For example, an arbitrary point Pn on the movement locus is represented by (Zn, Hn) and input. In addition, the movement form of the tool 11 includes the shape of the movement locus (for example, whether it is an arc shape or a straight line between the points P), the speed, and the like, which are coded and input.

When the input operation of the ZH coordinate value and the code information for each point P is performed, the control circuit 30 introduces the ZH coordinate value and the code information by the input control means 31 and temporarily stores them in the internal storage section. Remember. When this input is completed, each point P input by the drive information calculating means 32 is input.
XY from the code information that specifies the ZH coordinate value and movement form of
Servo motors 15, 16 and 17 of table 14 and swing mechanism 13
Drive control information of. That is, first, for each point P
Convert each ZH coordinate value to XYZ coordinate value. For example, the point Pn
The ZH coordinate value (Zn, Hn) of is (Xn, Yn, Z
n). When the coordinate conversion of all points P is completed, the difference between the coordinate values of the points adjacent to each other is obtained, and from this difference and the movement form specified by the code information, the tool 11 is moved from the start time point to the end time point. The rotational movement amount of the servo motors 15, 16 and 17 is calculated for each time T, and this is stored in the storage circuit 43 as drive control information. Thus, the preparation for the bonding operation is completed.

Then, when the control circuit 30 is set to the operation mode in this state, the bonding control by the control circuit 30 is performed every time the substrate on which the semiconductor pellet 21 and the lead frame are mounted is carried into the work stage. That is, when the substrate is loaded, the control circuit 30 first detects the position of the pad 22 of the semiconductor pellet 21 and the lead frame 23, and sets the reference position of the device at this detection position. And then
Drive control information created in advance for each pad and lead frame is read from the storage circuit 43, and drive control signals for the X, Y, and Z axes are generated at fixed time intervals T according to this drive control information, and servo drive is performed. Supply to the circuits 51, 52, 53.
Then, drive signals are generated from these servo drive circuits 51, 52, 53 and are supplied to the servo motors 15, 16, 17, respectively, whereby the servo motors 15, 16, 17 rotate by a predetermined amount and the tool 11 The pad 22 which is the first bonding point B1
From the second bonding point B2 to the lead frame 23. Thus, as shown in FIG. 3, the tool 11 moves in accordance with the movement locus R designated in advance, and as a result, the wire 24 having a desired shape is stretched between the pad 22 and the lead frame 23.

As described above, according to this embodiment, the control circuit 30 is provided with the tool 11
Means for inputting coordinate information for designating the movement locus of each and information for designating the movement form, and means for creating servo motor drive control information for each X, Y, Z axis from the coordinate information and movement form designation information. Since the servo motors 15, 16 and 17 are respectively driven and controlled in accordance with the drive control information, the operator obtains the tension shape when newly setting or changing the tension shape of the wire. Therefore, it is only necessary to input the movement locus of the tool 11 required as a ZH coordinate value.Therefore, it is not necessary to make a cam having a different shape each time or to make a drive control program itself as in the conventional case. It can be handled very easily and in a short time. Therefore, the operating rate of the device can be significantly increased, and the productivity can be improved.

The present invention is not limited to the above embodiment. For example, although the coordinate information is input using the keyboard in the above embodiment, a mark card in which the coordinate information is written may be read. Further, in the above embodiment, the tool 11 is X,
Bonding was performed by moving in the Y and Z directions respectively, but the tool is movable only in the Z direction, and in the XY direction, the semiconductor pellet and the lead frame side are placed on the XY table and moved. Good. In addition, the shape of the movement trajectory of the tool, the structure of the mechanism for moving the tool, the structure of the drive control means, the calculation means of the drive control information, the control procedure and the control content of the control circuit, etc. depart from the scope of the present invention. Various modifications can be implemented within the range not to do.

〔The invention's effect〕

As described in detail above, according to the present invention, the input means for inputting the three-dimensional coordinate information for designating the movement trajectory of the tool from the first bonding point to the second bonding point and the information for designating the movement mode, and the drive An information calculation unit and a drive control unit are provided, and the drive information calculation unit sets a tool for each of the first and second bonding points based on the three-dimensional coordinate information and the movement form designation information input by the input unit. XYZ of the mechanism that moves the
By obtaining the movement amount and speed for each direction component and controlling the drive of the mechanism by the drive control means according to the movement amount and speed, it is easy and short without changing the cam shape or the drive control program. A desired tool movement locus can be set in time, and thus a wire bonding apparatus capable of improving the operating rate can be provided.

[Brief description of drawings]

FIG. 1 is a view for explaining a wire bonding apparatus according to an embodiment of the present invention. FIG. 1 is a schematic configuration diagram of the apparatus, FIG. 2 is an enlarged perspective view of a bonding portion used for operation description, and FIG. FIG. 3 is a side view showing an example of a stretched shape of a wire and a movement trajectory of a tool. 10 ... Wire bonding device body, 11 ... Tool, 12 ... Capillary, 13 ... Oscillating mechanism, 14 ... XY table, 15, 16, 17 ...
Servo motor, 15a, 16a, 17a ... Rotary encoder, 21
… Semiconductor pellets, 22… Pads, 23… Leadframes,
24 ... Wire, 30 ... Control circuit, 31 ... Input control means, 32 ... Drive information calculating means, 33 ... Drive control means, 41 ... Input section, 42 ...
Display unit, 43 ... Storage circuit, 51, 52, 53 ... Servo drive circuit, B1
… First bonding point, B2… Second bonding point.

Claims (1)

[Claims] 1. A wire bonding apparatus for performing wire bonding to each of the bonding points by moving a tool relative to the first bonding point and the second bonding point in a three-dimensional direction, and from the first bonding point to the second bonding point. Input means for inputting three-dimensional coordinate information for designating a locus of movement of the tool to a point and information for designating a movement form, and the third means based on the three-dimensional coordinate information and movement form designation information inputted by the input means. Driving information calculating means for obtaining the moving amount and speed of each of the XYZ direction components of the mechanism for moving the tool relative to each of the first and second bonding points, and the moving amount and speed obtained by this driving information calculating means. And a drive control means for driving and controlling the mechanism according to Packaging equipment.