JPH0680707B2 - Carrier tape - Google Patents

Description

The present invention relates to a carrier tape used for mounting a large number of semiconductor elements in a semiconductor device manufacturing process.

[Conventional technology]

In recent years, the so-called TAB (T) using a tape carrier has been used instead of the wire bonding method that has been widely used in the past as an electrode joining technique for semiconductor elements such as integrated circuit elements.
ape Autemated Bondein) method has been adopted.

A conventional carrier tape used in this type of TAB method has a structure as shown in FIGS. 5 (a) and 5 (b). The figure shows a tape carrier, and 1 is a carrier tape, which is composed of a strip-shaped tape body 2 and a large number of leads 3 formed on the tape body 2. The tape body 2 is made of an insulating synthetic resin having flexibility such as polyamide resin, and has a plurality of central holes in which semiconductor elements are arranged in the central portion in the width direction.
2a are provided at intervals, four holes of the central hole 2a are provided with external lead holes 2c via lead support portions 2b, and bridge portions 2d are provided between the external lead holes 2c to provide lead support. Connect part 2b. A large number of positioning feed holes 2e are provided at predetermined intervals in the longitudinal direction on both side edges of the tape body 2. 3 is a conductive metal material such as a copper material, and is a large number of leads attached and formed on the surface of the tape body 2. The inner lead portion 3a extends from the inner lead support portion 2b to the central hole 2a, and the outer lead hole 2c. It is formed of an external lead portion 3b straddling the tape and a test pad portion 3c attached to the tape body 2.

The bridging portion 2d integrally connects the lead support portions 2b for increasing the positional accuracy of the inner lead portions 3a.

In the carrier tape 1 configured as described above, the semiconductor element 5 is placed in the central hole 2a, and each bump 6 of the semiconductor element 5 is positioned so as to face a predetermined position of each corresponding inner lead portion 3a. The inner lead portion 3a is joined by thermocompression bonding. 14 indicated by a chain line represents a side circumference of the resin encapsulant molded in the subsequent step.

As shown in FIG. 6A, the tape carrier thus configured is placed on the lower mold 8 so that the semiconductor element 5 portion is located in the cavity 10 and clamped with the upper mold 7. The upper die 7 is provided with a cavity 9, a liner 11 and a gate 12.
In this state, an injection resin such as an epoxy resin is injected from the runner 11 into each of the cavities 9 and 10 and cured in the low pressure transfer molding direction. A (see FIG. 5) shows a resin injection method in the gate portion. Thus, the sixth
As shown in FIG. 3B, the semiconductor element 5 part is sealed by the molded resin sealing body 13. If unnecessary resin portions (shown by chain lines) are removed from this state, the tape body 2 is divided into units, and unnecessary portions are removed, a plurality of resin-sealed semiconductor devices can be obtained.

However, in the carrier tape 2 of FIG. 6, the injected resin enters the unnecessary lead holes 2c and requires a troublesome removal work later.

To cope with this, as another conventional example, as shown in FIG. 7, there is one in which a gate corresponding hole 13 reaching the lead supporting portion 2b is provided in the bridging portion 2d of the carrier tape 2.

As shown in FIG. 8 (a), the tape carrier configured as shown in FIG. 7 is placed on the lower die 8 so that the semiconductor element 5 portion is located in the cavity 10 and the upper die 7 clamps the die. Subsequently, an injection resin such as an epoxy resin is injected from the runner 11 in the direction of arrow B (see FIG. 7) through the gate corresponding hole 15 of the gate 12 into the cavities 9 and 10 to be cured. In this way, as shown in FIG. 8B, the semiconductor element 5 part is sealed by the molded resin sealing body 13. If unnecessary resin portions (shown by chain lines) are removed from this state, the tape body 2 is divided into units, and unnecessary portions are removed, a plurality of resin-sealed semiconductor devices can be obtained.

[Problems to be Solved by the Invention]

The conventional carrier tape as described above has a problem that when the resin is injected into the mold, the lead supporting portion 2b is bent and deformed by the pressure of the inflowing resin, or is displaced to the semiconductor element 5 side.

Therefore, the internal lead portion 3a may be cut off or
The joint between the bump 3 and the bump 3a is separated, and in particular, the carrier tape having a small number of leads 3 has many defects due to this.

The present invention has been made to solve such a problem, and an object thereof is to obtain a carrier tape that eliminates defects such as cutting of the internal lead portions 3a and separation from the bumps 6 in a resin sealing step. There is.

[Means for Solving the Problems]

In the carrier tape according to the present invention, a gate-corresponding flow path portion is provided in a bridge portion between the external lead holes of the tape body or a connecting portion provided in the external lead hole so as to communicate with the central hole.

[Action]

In this invention, when the resin is injected into the mold containing the carrier tape, the resin at the gate part of the upper mold has the gate-corresponding flow path part formed in the bridge part or the central connecting part provided in the tape body. The resin is pressed into the cavity through the central hole, and the resin injection pressure does not act on the lead supporting portion of the tape body to prevent deformation and displacement.

〔Example〕

FIGS. 1 (a) and 1 (b) are a plan view and a sectional view of a tape carrier using a carrier tape according to an embodiment of the present invention, and 2a to 2e, 3,3a to 3c, 5,6,14 are This is the same as the above conventional device. The tape main body 22 of the carrier tape 21 is provided with a notch for the gate-corresponding flow passage 23 extending from the bridge portion 2d to the central hole 2a, the width on the tip side is widened, the flow passage cross-sectional area is gradually increased, and the resin is To ensure a smooth infusion,
The injection pressure does not affect the lead support portion 2b.

The gate-corresponding flow path portion 23 of FIG. 1 (a) is shown in an enlarged view in FIG. 1 (c).

A state in which the tape carrier of FIG. 1 (b) is put in a mold is shown in a sectional view in FIG. 2 (a). A cross-sectional view taken along line IIb-IIb in FIG. 1 (c) is shown in FIG. 2 (b), and a cross-sectional view taken along line IIc-IIc is shown in FIG. 2 (c). In both cases, the tape carrier is clamped to the mold. The illustrated state is shown.

The tape carrier configured as shown in FIG. 1 is placed on the lower mold 8 and clamped with the upper mold 7 as shown in FIG. 2 (a). At this time, the outer lead hole 2c side of the bridging portion 2d of the tape body 22 and the outer lead hole 2c side of the lead support portion 2b are closed by the peripheral portions of the runner 11 and the gate 12 of the upper mold 7. ing. Bridge around the gate-corresponding flow path 23
Out of 2d, the outer lead hole 2c side is sandwiched between the upper and lower molds 7 and 8 to prevent resin from flowing out to the outer lead hole 2c, and the upper and lower portions of the gate-corresponding flow path portion 23 as well. Upper and lower mold 7,8
The surface of is a wall, which prevents it from leaking to others (Fig. 2b).

In this state, as shown in FIG. 2 (a), a resin such as an epoxy resin is injected as shown by an arrow c by the low-pressure transfer molding method and is cured. FIG. 2D shows a state in which the tape carrier in which the semiconductor element 5 is sealed by the resin sealing body 13 is taken out from the mold in this manner. From this state, unnecessary resin portions (shown by chain lines) are removed, the tape body 22 is divided into units, and unnecessary portions are removed, whereby a plurality of resin-sealed semiconductor devices are obtained.

FIG. 3 (a) is a plan view of a tape carrier using a carrier tape according to another embodiment of the present invention. The external lead hole 2c of the tape body 22 is provided with a connecting portion 24 for connecting the lead supporting portion 2b, and the connecting portion 24 is provided with a gate-corresponding flow passage portion 25 reaching the central hole 2a, so that the width on the tip side can be widened. ing. The position of the connecting portion 24 with respect to the external lead hole 2c is at the center in the width direction in the drawing, but may be at another position. Upper mold 7
The gate of is at a position corresponding to the connecting portion 24.

Although the above-mentioned gate-corresponding flow path portions 23 and 25 are formed in a notch shape penetrating the tape body 22, they may be formed in a groove shape having a bottom. This is shown as a gate-corresponding flow path portion 26 in a plan view and a sectional view in FIGS. 4 (a) and 4 (b).

〔The invention's effect〕

As described above, according to the present invention, the gate-corresponding flow path portion is provided in the bridging portion between the external lead holes of the tape body of the carrier tape or in the connecting portion to the lead supporting portion provided in the external lead hole. Since the gate of the upper mold was located above this gate-corresponding flow passage, the resin was injected into the mold containing the tape carrier, and the resin passed through the gate-corresponding flow passage to the center. It reaches the hole and is pressed into the cavity, the resin injection pressure does not act on the lead support part of the tape body, deformation and displacement are prevented, the internal lead is cut and the internal lead part and the bump are separated. Will be lost.

[Brief description of drawings]

FIG. 1 (a) is a plan view of a tape carrier using a carrier tape according to an embodiment of the present invention, FIG. 1 (b) is a sectional view taken along the line I--I of FIG. 1 (a), and FIG. (C) is an enlarged view of the gate-corresponding flow passage portion of FIG. 1 (a), and FIG. 2 (a) is a sectional view of the tape carrier of FIG. 1 (b) clamped in a mold, FIG. (B) and (c) of FIG. 1 (c)
It is sectional drawing in the IIb-IIb line and the IIc-IIc line, and shows the state clamped by the metal mold | die. 2 (d) is a cross-sectional view of the semiconductor device before division, which is resin-sealed from the state of FIG. 2 (a) and is taken out, and FIG. 3 (a) is a carrier tape according to the second embodiment of the present invention. FIG. 3 (b) is a plan view of the tape carrier using, and FIG. 3 (b) is a cross-sectional view taken along line III-III of FIG. 3 (a), showing a state where the die is clamped. FIGS. 4 (a) and 4 (b) are a plan view and a sectional view of a gate-corresponding flow path portion showing a carrier tape according to a third embodiment of the present invention, and FIG. 5 (a) uses a conventional carrier tape. A plan view of the tape carrier, FIG. 5 (b) is V of FIG. 5 (a).
6 is a cross-sectional view taken along line -V, FIG. 6 (a) is a cross-sectional view of the tape carrier of FIG. 5 clamped with a mold, and FIG. 6 (b) is a resin seal from the state of FIG. 6 (a). FIG. 7 is a plan view of a tape carrier using another conventional carrier tape, and FIG. 8A is a cross section taken along line VIII-VIII of FIG. The figure shows the mold clamped. FIG. 8 (b) is FIG. 8 (a).
FIG. 3 is a cross-sectional view of the semiconductor device before being divided, which is resin-sealed and taken out from the above state. 2a ... central hole, 2b ... lead support portion, 2c ... external lead hole,
2d ... Cross-linking part, 3 ... Lead, 3a ... Internal lead, 3b ... External lead, 5 ... Semiconductor element, 6 ... Bump, 7 ... Upper mold, 8 ...
Lower mold, 9,10 ... Cavity, 12 ... Gate, 13 ... Resin sealing body, 21 ... Carrier tape, 22 ... Tape body, 23,25,26 ...
Gate-corresponding flow path portion, 24 ... Connection portion In the drawings, the same reference numerals indicate the same or corresponding portions.

 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Seiji Takemura 4-1-1 Mizuhara, Itami-shi, Hyogo Mitsubishi Electric Corporation Kita-Itami Works (72) Inventor Issei Doi 4-1-1 Mizuhara, Itami-shi, Hyogo Mitsubishi Electric Corporation Kita Itami Works

Claims (1)

[Claims] 1. A plurality of central holes which are made of a flexible belt-shaped synthetic resin material and which are arranged at intervals in the longitudinal direction in the central portion in the width direction, and four circumferences of the central holes with a lead supporting portion interposed therebetween. A tape main body having a plurality of external lead holes and a bridge portion left between the external lead holes and connected to the lead support portion, and an internal lead attached and formed on the upper surface of the tape main body. A portion extending from the lead supporting portion to the central hole, the external lead portion includes a plurality of leads straddling the external lead hole, and the semiconductor element is bonded to the lower surface of the tip of each internal lead portion via a bump. In the connecting portion that is formed in the cross-linking portion or the external lead hole in the longitudinal direction and connects to the lead supporting portion, a gate-corresponding flow passage portion that leads to the central hole is formed, and below the gate of the upper mold. To respond Kiyariatepu, characterized in that it was.