JPH0680716B2 - Positioning mechanism for probe card - Google Patents

Description

TECHNICAL FIELD The present invention relates to a probe card positioning mechanism used for measuring various electrical characteristics of an IC chip.

<Prior Art> The applicant of the present invention, as a positioning mechanism of the probe card,
Applied for Japanese Patent Application No. Sho 62-154959.

This mechanism includes a support plate attached to the prober and a probe card attached to the support plate. The support plate is provided with a guide. The probe card is fitted with a stepped hole and the stepped hole. It has a slightly smaller washer and adjusts the positional relationship between the washer and the probe card so that the tip of the probe of the probe card is in a predetermined position with respect to the support plate with the guide inserted into the washer. It is fixed with an adhesive.

<Problems to be Solved by the Invention> However, the above-described probe card positioning mechanism has the following problems.

That is, the position adjustment of the probe card by such a mechanism is possible only within the range of the size difference between the washer and the stepped hole, and fine adjustment after positioning and fixing the washer is not possible. Further, the measuring device can adjust the position by about 10 μm, but it is necessary to adjust the position by about 1.0 μm along with the miniaturization of the IC chip and the high-density integration.

Further, in the case of a measuring device in which a plurality of types of probe cards are exchanged according to the object to be measured, an operator must position the probe card every time the probe card is exchanged. Since this positioning work is performed manually, it must be avoided in the future with the miniaturization and high-density integration of IC chips.

The present invention was devised in view of the above circumstances, and an object thereof is to provide a probe card positioning mechanism capable of automatically performing more precise fine adjustment of the position of the probe card.

<Means for Solving the Problems> A probe card positioning mechanism according to the present invention is a probe card positioning mechanism that associates the position of the tip of a probe of a probe card with the pad of an IC chip. A motherboard to be attached, a probe card movably attached to the motherboard, and a probe card mounted on the motherboard and attached to the X and Y probe cards.
And a probe card moving unit for moving in the θ direction.

<Operation> A probe card corresponding to the IC chip to be measured is attached to the motherboard. That is, the stepped hole of the probe card corresponds to the screw hole of the motherboard, and the screw is screwed into the screw hole through the stepped hole. This probe card is attached by an automatic device (not shown).

Next, the probe card moving unit moves the probe card in the X, Y, and θ directions to align the tip of the probe with the pad of the IC chip.

<Example> Hereinafter, an example according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view of a probe card positioning mechanism according to a first embodiment of the present invention, FIG. 2 is a bottom view of the probe card positioning mechanism, and FIG. 3 shows the probe card movable to a mother board. FIG. 4 is a schematic sectional view showing a mechanism for attachment, FIG. 4 is a schematic sectional view of a positioning mechanism of the probe card according to the second embodiment of the present invention, and FIG. 5 is a bottom view of the positioning mechanism of the probe card. is there.

In the following description, the X direction means the right direction in FIG. 1, and the Y direction means the front direction of the paper surface in FIG. The θ direction means the counterclockwise direction in FIG.

The probe card positioning mechanism according to the first embodiment includes a tip of the probe 30 of the probe card 20 and a pad 61 of the IC chip 60.
Motherboard to be attached to a measuring device not shown
10, a probe card 20 movably attached to this motherboard 10, and mounted on the motherboard 10,
The probe card moving unit 40 is provided for moving the probe card 20 in the X, Y, and θ directions. The probe card moving unit 40 includes a piezoelectric element 41 mounted on the motherboard 10 and a moving amount of the probe card 20. And a power source 42 for applying a voltage according to the above to the piezoelectric element 41.

The mother board 10 is to be attached to a measuring device, and has an opening 11 at the center thereof. The opening 11 is for visually observing the IC chip 60 during measurement.

The probe card 20 has a ring shape as a whole, a ring 22 attached around the opening 21 in the substantially central portion, a plurality of probe needles 30 radially attached to the inclined surface 221 of the ring 22, and a probe. A stepped hole 23 for movably attaching the card 20 to the motherboard 10 and this stepped hole
A screw 24 that penetrates 23 and is screwed to the motherboard 10.
And have.

The three stepped holes 23 are opened, and the head 24 of the screw 24 is
A large diameter portion 231 slightly larger than 1 and a small diameter portion 232 slightly larger than the leg portion 242 of the screw 24 are integrated. On the other hand, the screw 24 is adapted to be screwed into the screw hole 12 formed in the motherboard 10. Therefore, even if the probe card 20 is attached to the motherboard 10 with the screw 24,
As shown in FIG. 3, since there is a gap between the stepped hole 23 and the screw 24, the probe card 20 can be moved by this gap.

The tip of the probe 30 made of tungsten or the like is a portion that contacts the pad 61 of the IC chip 60, and is bent downward. On the other hand, the rear end of the probe 30 is connected to a printed wiring (not shown) formed on the surface of the probe card 20. The end of the printed wiring is connected to a connector (not shown).

Further, one projection 25 projects from the edge of the probe card 20. The projection 25 is in contact with a θ-direction moving element 413 described later.

The piezoelectric element 41 forming the probe card moving unit 40 that moves the probe card 20 in the X, Y, and θ directions is a Y-direction moving element that moves the probe card 20 in the X direction.
411, a Y-direction moving element 412 for moving in the Y-direction, and a θ-direction moving element 413 for rotating the probe card 20 in the θ-direction.

For example, as shown in FIG. 2, the X-direction moving element 411 is directed to the X direction on the side where a voltage is applied and extends, and its end face is in contact with the side face of the probe card 20 so that the mother board 10 has the side face. It is mounted on the back side. The Y-direction moving element 412 is similarly mounted on the back surface side of the motherboard 10.

On the other hand, in the θ-direction moving element 413, the side to which the voltage is applied and which extends is brought into contact with the side surface of the protrusion 25. Therefore, when the θ-direction moving element 413 extends, the probe card 20 rotationally moves in the θ direction.

Next, the operation of the probe card positioning mechanism having the above-described configuration will be described.

The probe card 20 corresponding to the IC chip 60 to be measured is attached to the motherboard 10. That is, the stepped hole 23 of the probe card 20 is made to correspond to the screw hole 12 of the motherboard 10, and the screw 24 is screwed into the screw hole 12 through the stepped hole 23. The probe card 20 is attached by an automatic device (not shown).

Next, the CCD installed above the opening 11 of the motherboard 10
By the camera 70, the tip of the probe 30 and the pad of the IC chip 60
61 and 61 are enlarged and displayed on the monitor 71, and the probe card moving unit 40 is operated so that the both overlap. That is, the voltage applied to the three piezoelectric elements 411, 412, 413 is controlled by the power supply 42 so that the tip of the probe 30 and the pad 61 of the IC chip 60 overlap.

If the tip of the probe 30 and the pad 61 of the IC chip 60 overlap each other, the voltage is continuously applied to the three piezoelectric elements 411, 412, 413 to maintain the position.

It should be noted that the output of the CCD camera 70 may be sent to the image recognition device to automatically control the overlap between the tip of the probe 30 and the pad 61.

In the above-described first embodiment, the piezoelectric element 14 is used for the probe card moving unit 40, but as shown in FIG. 4, three motors, that is, an X-direction moving motor 451 and a Y-direction moving motor 452 are used. , Θ direction moving motor 453.

In this case, output shafts 451a, 4 of each motor 451, 452, 453
Worm gears 451b, 452b, 4 mounted on 52a, 453a
53b and the screw holes 454a (screw holes 454b, 454c are not shown) corresponding to the worm gears 451b, 452b, 453b constitute the probe card moving unit 40.

The X-direction moving motor 451 is located at the same position as the X-direction moving element 411 in the first embodiment and is located in the Y-direction moving motor 452.
Are installed at the same positions as the Y-direction moving element 412 in the first embodiment. On the other hand, the θ-direction moving motor 453 has the
Since the worm gear 453b corresponds to the screw hole formed on the side surface of the probe card 20, the probe card 20 can be rotated in the θ direction.

The relative positional relationship between the motor and the probe card 20 is displaced due to the movement of the probe card 20, but this deviation is caused by the output shafts 451a, 4 of the motors 451, 452, 453.
It is absorbed by the distortion of 52a and 453a. Also, the motor 45
When the rubber mounts 1, 452, 453 are mounted on the mother board 10, the displacement is absorbed by the rubber mount, so that the output shafts 451a, 452a, 453a are not distorted by the displacement.

<Advantages of the Invention> A probe card positioning mechanism according to the present invention includes a motherboard that is attached to a measuring device, a probe card that is movably attached to the motherboard, and the probe card that is mounted on the motherboard and that includes X, Y and Since it has a probe card moving unit that moves in the θ direction, the tip of the probe can correspond to the pad of the IC chip. In particular, if a piezoelectric element is used for the moving part of the probe card, fine alignment of about 1.0 μm can be realized.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of a probe card positioning mechanism according to a first embodiment of the present invention, FIG. 2 is a bottom view of the probe card positioning mechanism, and FIG. 3 shows the probe card movable to a mother board. FIG. 4 is a schematic sectional view showing a mechanism for attachment, FIG. 4 is a schematic sectional view of a positioning mechanism of the probe card according to the second embodiment of the present invention, and FIG. 5 is a bottom view of the positioning mechanism of the probe card. is there. 10 ... Motherboard, 20 ... Probe card, 30 ... Probe, 40
… Probe card moving part, 41… Piezoelectric element, 42… Power supply, 45
1, 452, 453 ... Motor, 60 ... IC chip, 61 ... Pad.

Claims (3)

[Claims] 1. A probe card positioning mechanism that associates a tip of a probe of a probe card with a pad of an IC chip, a motherboard attached to a measuring device, and a probe card movably attached to the motherboard. A probe card positioning mechanism, comprising: a probe card moving unit that is mounted on the motherboard and moves the probe card in X, Y, and θ directions. 2. The probe card moving unit comprises a piezoelectric element mounted on a mother board and a power source for applying a voltage according to the moving amount of the probe card to the piezoelectric element. Probe card positioning mechanism. 3. The probe according to claim 1, wherein the probe card moving unit includes a motor mounted on a mother board and a power source for supplying a current to the motor according to the moving amount of the probe card. Card positioning mechanism.