JPH0680721B2 - Wafer positioning mechanism - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A wafer positioning mechanism of a wafer inspection device in a wafer process of a semiconductor device, which aims to easily and efficiently inspect wafers of different sizes, and a circle centered on a predetermined point. A fixed mounting table having at least three or more bearing holes provided at substantially equal positions on the circumference, and a plate-like plate that is curved in a plan view, and a rotary shaft that fits into the bearing holes at one end is at the other end. Guide pins are projected and fixed to surfaces different from each other, and sliding pins protruding to the same surface as the guide pins are fixed in the vicinity of the middle portion in the longitudinal direction, and the same number of rotary levers as the bearing holes, It is a ring shape having a uniform width in a plan view, and is arranged on the mounting table with a gap corresponding to the thickness of the rotating lever so that it can rotate about the predetermined point in a predetermined angle range. Opposite A guide plate having a guide groove for the sliding pin which is provided at a predetermined angle with respect to a radial direction centered on the predetermined point from the outer peripheral portion to the inner peripheral portion on a surface of the guide plate, As the sliding pin slides along the guide groove along with the rotation, the rotating lever rotates about the rotating shaft, and the guide pin positions the wafer.

[Industrial application field]

The present invention relates to a wafer inspection device in a wafer process of a semiconductor device, and more particularly to a wafer positioning mechanism for easily and efficiently inspecting wafers of different sizes.

[Conventional technology]

FIG. 3 is a diagram showing an example of a wafer positioning mechanism in a conventional inspection apparatus, (A) is a configuration diagram of the entire apparatus, and (B) is an enlarged plan view of a wafer positioning mechanism section.

In FIG. 1A, a carrier 3 in which a plurality of wafers 2 to be inspected are aligned and housed is arranged on the upper surface of an apparatus frame 1 indicated by a two-dot chain line.
A carrier arm 4 for taking out the wafers 2 to be inspected from the carrier 3 one by one and transporting the wafers 2 in the R direction shown in the figure, and a positioning mechanism for receiving the wafers 2 to be inspected from the transport arm 4 and accurately fixing the position of the wafers. A reversing arm 7 for reversing and transferring the wafer 5 set by the part 5 and the positioning mechanism part 5 in the R'direction shown in the figure as indicated by 2'indicated by a broken line on the stage surface of the inspection mechanism part 6 composed of an optical microscope or the like. They are arranged in a predetermined positional relationship.

Further, the positioning mechanism section 5 is provided with a plurality of (two in the case shown) guide pins 5a protruding on the surface at a predetermined interval as shown in the drawing (B) of FIG. Corresponding to, fixed guide 5b integrally fixed to the device base 1
And a movable guide that is provided with two guide pins 5a similar to the fixed guide 5b and that can move in the R ″ direction in the figure while keeping parallel on the same plane so that the distance between the fixed guide 5b and the fixed guide 5b can be changed.
Composed of 5c and. Especially fixed guide 5b and movable guide
An arcuate dent substantially equal to the outer circumference of the wafer 2 to be inspected is formed on the facing surfaces 5b 'and 5c' of 5c. The circumference of the wafer 2 to be inspected is indicated by the arcuate depression and the four guide pins 5a.

Here, after the wafer 2 to be inspected is set at a predetermined position of the positioning mechanism portion 5 shown by the broken line in the figure by the above-mentioned transfer arm 4, the movable guide 5c is moved in the R ″ direction to move the wafer 2 to be inspected as shown in the figure. The wafer 2 is pinched and fixed around it, and thereafter, the wafer 2 to be inspected is moved to the stage portion of the inspection mechanism section 6 by the above-mentioned reversing arm 7 to inspect the wafer 2.

In the wafer positioning mechanism having such a configuration, since the center position (point C in the figure) of the wafer 2 to be tested to be positioned is constant, it is efficient when continuously inspecting wafers of the same size, but wafers of different diameters are used. When inspecting, the fixed guide 5b and the movable guide 5c must be exchanged because the center position of the wafer is deviated.

[Problems to be Solved by the Invention]

The conventional wafer positioning mechanism has a problem that wafers having different outer diameters cannot be continuously transferred to the inspection mechanism section.

[Means for Solving the Problems]

The above-mentioned problems are a fixed mounting table having at least three or more bearing holes provided at substantially equal positions on the circumference around a predetermined point, and a plate shape curved in a plan view, At the other end of the rotary shaft that fits into the bearing hole, guide pins are fixed so as to project on mutually different surfaces, and at the vicinity of the middle portion in the length direction, sliding pins that project on the same surface as the guide pins are fixed. Further, the same number of rotation levers as the bearing holes, and a ring shape having a uniform width in plan view, are arranged on the mounting table with a gap corresponding to the thickness of the rotation levers, and centered around the predetermined point. For the sliding pin that can rotate in a predetermined angle range and that is provided on the surface facing the mounting table from the outer peripheral portion to the inner peripheral portion at a predetermined angle with respect to the radial direction centered on the predetermined point. A guide plate having a guide groove, When the sliding pin slides along the guide groove in accordance with the rotation, the rotation lever rotates about the rotation shaft, and the wafer is positioned by the guide pin. Will be solved by.

[Work]

Instead of the conventional method of positioning the sent-in wafer with a fixed guide, if a mechanism part for fixing the wafer with the same pressing force from the periphery of the wafer is arranged at a predetermined position of the apparatus, a predetermined size can be obtained for a wafer of any outer diameter. Can be easily fixed in position.

According to the present invention, the periphery of the wafer is fixed by at least three or more guide pins which are arranged at a predetermined interval on the circumference of the device pedestal with a predetermined point as a center and which can move in the radial direction at the same time by the same distance. I am trying to do it.

Therefore, regardless of the outer diameter, any wafer can be continuously and easily and accurately positioned at a predetermined position.

〔Example〕

FIG. 1 is a diagram for explaining a wafer positioning mechanism according to the present invention. FIG. 1A is a diagram showing the operating principle and FIG. 1B is a component diagram added for easy understanding.

Note that FIG. 6B shows the case where the component is viewed from the upper surface or the component is viewed from the lower side.

Further, FIG. 2 is a view in which the wafer is fixed by the wafer positioning mechanism according to the present invention.

In FIGS. 1A and 1B, 10 is a predetermined point C in FIG.
It is a circular mounting table having a center at the center, and the bearing hole 10a is provided at a predetermined position (which is divided into six equal parts in the figure) on the circumference of the mounting table 2 around the point C as a center. Is provided.

A curved plate-shaped rotary lever 11 to be assembled on the upper surface of the mounting table 2 has a bearing hole at one end thereof as shown in a perspective view.
10a is fitted with a rotating shaft 11a that rotates smoothly, and the other end is provided with a guide pin 11b projecting to a surface opposite to the rotating shaft 11a,
Further, a sliding pin 11c protruding in the same direction as the guide pin 11b is fixed to a substantially middle portion of the rotary lever 11 in the longitudinal direction.

Therefore, the rotary shaft 11a of the rotary lever 11 is set to P of the mounting table 10 described above.
When inserted in the bearing hole 10a provided at the point, the rotary lever 11 can freely rotate about the point P.

Further, the disc-ring-shaped guide plate 12 which is disposed on the mounting table 10 after the rotation lever 11 is inserted into the mounting table 10 has a peripheral portion formed at a predetermined position on the peripheral portion of the mounting table 10. It is constructed so that it is guided by the inner surface portion 10b 'of 10b and rotates about the point C.

Further, the guide plate 12 is formed in a concentric ring shape centered on the point C as shown in a perspective view seen from below, and the lower surface of the guide plate 12 is divided into six equal parts around the circumference. A guide groove 12 through which the guide pin 11b of FIG. 4 can slide smoothly in the diametrical direction is formed to be inclined in the same direction at a predetermined angle α with respect to the point C, and the guide plate is provided at one location on the outer circumference. A lever 12b integrated with 12 is formed.

Therefore, as described above, a plurality of rotary levers 11 are inserted and mounted on the mounting table 10, respectively, and the guide plates 12 are combined so that the guide grooves 12a thereof fit with the corresponding sliding pins 11c of the rotary levers 11. Arrange.

In this state, the rotary lever 11 moves the rotary shaft 11a and the sliding pin 1
The position is determined by 1c and it does not move.

For example, in the figure, when the sliding pin 11c is at P ₁ indicated by ●, the wafer size fixed by the guide pin 11b is D indicated by the alternate long and short dash line.

When the guide plate 12 is rotated by the lever 12b in the direction of the arrow R in the drawing, the guide groove 12a moves the sliding pin 11c of the rotary lever 11 which rotates about the point P along the groove, and is indicated by, for example, ●. Move to the position of P ₂ . As a result, the guide pin 11b at the other end of the rotary lever 11 rotates about the point P and moves in the direction of R'indicated by the broken line.

In this case, the wafer size to which the guide pin 11b can be fixed is D'shown by the chain double-dashed line.

Further, the diameter of the guide pin 11b on the rotary lever 11 is set to the sliding pin 1
When the diameter is adjusted to 1c, it becomes possible to fit the guide pin 11b into the guide groove 12a formed in the guide plate 12, and in such a configuration, the protruding portion of the sliding pin 11c is to be inspected. Since the wafer 2 is held, the test wafer 2 having a large diameter can be held.

In any case, the wafer center position is point C and does not change depending on the diameter of the wafer.

Therefore, any size wafer can be positioned and fixed by changing the rotation angle of the lever 12b.

As shown in FIG. 2, the guide plate 12 is arranged on the mounting table 10 in FIG. 2, and the rotary lever 11 is assembled between the mounting table 10 and the guide plate 12. In the figure, a part of the rotary lever 11 is exposed on the surface, but the wafer 2 to be inspected is fixed by a guide pin 11b at a predetermined position, that is, a position centered with point C in FIG.

Reference numeral 13 is a cover for protecting the guide plate 12, and a window 13a for the lever 12b of the guide plate 12 is opened in a part thereof.

In the figure, the wafer 2 to be inspected is fixed by the guide pin 11b, but when the lever 12b is reversely rotated in the R ₁ direction in the figure, the guide pin 11b is moved to the outer side, that is, R ₁ ′ in the figure by the operation opposite to that described in FIG. The test wafer 2 can be taken out by opening in the direction.

〔The invention's effect〕

As described above, according to the present invention, it is possible to provide a wafer positioning mechanism that can freely and reliably fix a wafer of any diameter by operating the lever at a predetermined position on the apparatus pedestal.

In the description of the present invention, the lever protruding to the outside is used to operate the rotating lever, but the same effect can be obtained even if the rotating lever is electrically rotated by a control signal from the outside. You can

[Brief description of drawings]

FIG. 1 is a diagram illustrating a wafer positioning mechanism according to the present invention, FIG. 2 is a diagram in which a wafer is fixed by the wafer positioning mechanism according to the present invention, and FIG. 3 is an example of a wafer positioning mechanism in a conventional inspection apparatus. Fig. In the figure, 2 is a wafer to be inspected, 10 is a mounting table, 10a is a bearing hole, 10b is a guide, 10b 'is an inner surface portion, 11 is a rotating lever, 11a is a rotating shaft, 11b is a guide pin, 11c is a sliding pin, 12 is a guide plate, 12a is a guide groove, 12b is a lever, 13 is a cover, and 13a is a window.

Claims (1)

[Claims] 1. A fixed mounting table (10) having at least three or more bearing holes (10a) provided at substantially equal positions on a circumference around a predetermined point, and a plate curved in a plan view. The bearing hole (10a) at one end
The rotating shaft (11a) that fits with the guide pin (11b) at the other end
Bearing protrusions (10c) fixed to the surfaces different from each other, and sliding pins (11c) protruding on the same surface as the guide pins (11b) fixed near the middle portion in the length direction.
a) The same number of rotating levers (11) as in a) and a ring shape having a uniform width in plan view, and arranged on the mounting table (10) with a gap corresponding to the thickness of the rotating levers (11). It can rotate in a predetermined angle range around the predetermined point, and has a predetermined angle with respect to the radial direction centered on the predetermined point from the outer peripheral portion to the inner peripheral portion on the surface facing the mounting table (10). A guide plate (12) having a guide groove (12a) for the sliding pin (11c) provided, and the sliding pin (11) according to the rotation of the guide plate (12).
When c) slides along the guide groove (12a), the rotary lever (11) rotates about the rotary shaft (11a), and the guide pin (11b) positions the wafer. A wafer positioning mechanism characterized by performing.