JPH0680896B2 - Multilayer printed board - Google Patents
Multilayer printed boardInfo
- Publication number
- JPH0680896B2 JPH0680896B2 JP15733786A JP15733786A JPH0680896B2 JP H0680896 B2 JPH0680896 B2 JP H0680896B2 JP 15733786 A JP15733786 A JP 15733786A JP 15733786 A JP15733786 A JP 15733786A JP H0680896 B2 JPH0680896 B2 JP H0680896B2
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- multilayer printed
- prepreg
- layer material
- reference hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 〔概要〕 本発明の多層プリント板は、プリプレグ上に形成される
位置決め用基準穴を、プリプレグを構成する織布の織目
方向と対応させることによって、多層プリント板の積層
時に発生する歪を低減させた点に特徴がある。DETAILED DESCRIPTION OF THE INVENTION [Outline] A multilayer printed board according to the present invention has a positioning reference hole formed on a prepreg, which is made to correspond to a weave direction of a woven fabric forming the prepreg. It is characterized in that the strain generated during lamination is reduced.
本発明は多層プリント板構造の改良に係り、特にプリプ
レグ板積層時の歪を減少させた多層プリント板に関す
る。The present invention relates to an improvement in the structure of a multilayer printed board, and more particularly to a multilayer printed board with reduced strain when laminating a prepreg board.
第4図は従来の多層プリント板の構造を示す要部斜視図
である。FIG. 4 is a perspective view of an essential part showing the structure of a conventional multilayer printed board.
第4図に示すように、多層プリント板は、上下一対の表
面層材2と、少なくとも1枚以上のプリプレグ4および
中間層材3とによって構成されている。なお、プリプレ
グ4は、中間層材3と表面層材2間,或いは中間層材3
と中間層材3間に配設されるボンディング材で、ガラス
繊維,或いは紙繊維等を基材とする織布4aに接着剤を含
浸させたものであることは周知のとおりである。As shown in FIG. 4, the multilayer printed board is composed of a pair of upper and lower surface layer materials 2, and at least one or more prepregs 4 and intermediate layer materials 3. The prepreg 4 is provided between the intermediate layer material 3 and the surface layer material 2 or the intermediate layer material 3
It is well known that the bonding material provided between the intermediate layer material 3 and the intermediate layer material 3 is obtained by impregnating the woven cloth 4a having glass fiber or paper fiber as a base material with an adhesive.
以下第4図を用いて多層プリント板の積層工程を説明す
る。The stacking process of the multilayer printed board will be described below with reference to FIG.
.支持台10上に植立されたガイドピン1に、表面層材
2,プリプレグ4,中間層材3の円形基準穴6を順次挿入し
てそれぞれの位置決めを行う。. On the guide pins 1 set up on the support base 10, the surface layer material
2, the prepreg 4, and the circular reference hole 6 of the intermediate layer material 3 are sequentially inserted to perform the respective positioning.
.位置決めが終了すると上記多層プリント板母材(仮
称)は、ホットプレス装置(図示せず)に送られ、そこ
で上下から押圧され、且つ加熱されて多層プリント板と
なる。. When the positioning is completed, the multilayer printed board base material (tentative name) is sent to a hot press device (not shown), where it is pressed from above and below and heated to form a multilayer printed board.
しかしながら、前記プリプレグを構成する織布4aの縦糸
方向(矢印A-A′方向)の積層時の収縮率は、表面層材
2および中間層材3のそれに比べて非常に大きいため、
積層時,収縮応力がガイドピン1を介して表面層材2お
よび中間層材3の円形基準穴6に作用することとなり、
多層プリント板に歪が発生する。However, the shrinkage rate of the woven fabric 4a that constitutes the prepreg during lamination in the warp direction (arrow AA 'direction) is much larger than that of the surface layer material 2 and the intermediate layer material 3,
At the time of stacking, the contraction stress acts on the circular reference holes 6 of the surface layer material 2 and the intermediate layer material 3 via the guide pins 1,
Distortion occurs in the multilayer printed board.
本発明の多層プリント板は、表面層材2と中間層材3と
の間に配設されたプリプレグ4の3対の基準穴の内、中
央部の一対のみは従来と同じくガイドピン1が嵌合状態
で挿入される円形基準穴6のままとし、多層プリント板
の定尺サイズの長手方向(矢印A-A′)つまり縦糸方向
の両端部に形成された他の2対の基準穴は、横糸方向
(矢印B-B′方向)の寸法よりも縦糸方向の寸法の方が
長い変形基準穴7になっている。In the multilayer printed board of the present invention, the guide pin 1 is fitted in the central pair of the three pairs of reference holes of the prepreg 4 arranged between the surface layer material 2 and the intermediate layer material 3 as in the conventional case. The circular reference hole 6 inserted in the mating state is left as it is, and the other two pairs of reference holes formed at both ends in the longitudinal direction (arrow AA ′) of the standard size of the multilayer printed board, that is, the warp direction are the weft direction. The deformation reference hole 7 is longer in the warp direction than in the (arrow BB 'direction).
このように構成された多層プリント板は、織布4aが収縮
した時でもガイドピン1は変形基準穴7の作用によって
実質的には移動せず、このため、表面層材2ならびに中
間層材3に対するプリプレグ4の収縮応力の影響は少な
くなる。In the multilayer printed board constructed in this way, the guide pin 1 does not substantially move due to the action of the deformation reference hole 7 even when the woven cloth 4a contracts, and therefore the surface layer material 2 and the intermediate layer material 3 The influence of the shrinkage stress of the prepreg 4 on the prepreg 4 is reduced.
従って、本発明を適用すれば、積層時における多層プリ
ント板の歪は大幅に減少する。Therefore, when the present invention is applied, the distortion of the multilayer printed board during lamination is significantly reduced.
以下実施例図に基づいて本発明を詳細に説明する。 The present invention will be described in detail below with reference to the accompanying drawings.
第1図(a),(b)は本発明の多層プリント板の一実
施例を示す要部斜視図と部分拡大図であるが、前記第4
図と同一部分には同一符号を付している。FIGS. 1 (a) and 1 (b) are a perspective view and a partially enlarged view of an essential part showing an embodiment of the multilayer printed board according to the present invention.
The same parts as those in the figure are designated by the same reference numerals.
本発明の多層プリント板は、第1図(a)および(b)
に示すように、プリプレグ4上に形成された3対(6
個)の基準穴の内、中央部の一対のみは従来と同じく直
径dの円形基準穴6となっているが、両端部に形成され
た他の2対の基準穴は、プリプレグ4の縦糸方向(矢印
A-A′方向)の寸法が横糸方向(矢印B-B′方向)の寸法
dよりも大きいd+αの寸法を持つ変形基準穴7になっ
ている。The multilayer printed board of the present invention is shown in FIGS. 1 (a) and 1 (b).
As shown in FIG. 3, three pairs (6
Of the standard holes, only one pair in the central portion is the circular standard hole 6 having the diameter d as in the conventional case, but the other two pairs of standard holes formed at both ends are in the warp direction of the prepreg 4. (Arrow
The deformation reference hole 7 has a dimension of d + α whose dimension in the AA ′ direction is larger than dimension d in the weft direction (arrow BB ′ direction).
このため、第1図(b)の部分拡大図に示すように、積
層時にプリプレグ4が矢印A-A′方向に収縮しても、ガ
イドピン1は変形基準穴7内を矢印A-A′方向に移動し
て収縮応力を吸収するので、積層時,表面層材2および
中間層材3の円形基準穴6には応力が作用しない。Therefore, as shown in the partially enlarged view of FIG. 1 (b), even if the prepreg 4 contracts in the direction of arrow AA 'during stacking, the guide pin 1 moves in the deformation reference hole 7 in the direction of arrow AA'. Since the shrinkage stress is absorbed by the shrinkage, the stress does not act on the circular reference holes 6 of the surface layer material 2 and the intermediate layer material 3 during stacking.
第2図はプリプレグ構造の一実施例を示す平面図であ
る。FIG. 2 is a plan view showing an embodiment of the prepreg structure.
第2図に示すように、プリプレグ4に形成される変形基
準穴7は、多層プリント板の定尺サイズの長手方向,即
ち織布4aの縦糸方向(矢印A-A′方向)の寸法d+αの
方が、横糸方向(矢印B-B′方向)の寸法dよりも長い
矩形型に形成されている(横糸方向,即ち矢印B-B′方
向の寸法は、円形基準穴6の直径dと同じである)。As shown in FIG. 2, the deformation reference hole 7 formed in the prepreg 4 has a dimension d + α in the longitudinal direction of the standard size of the multilayer printed board, that is, in the warp direction (arrow AA ′ direction) of the woven fabric 4a. , Is formed in a rectangular shape longer than the dimension d in the weft thread direction (arrow BB 'direction) (the dimension in the weft thread direction, that is, the arrow BB' direction is the same as the diameter d of the circular reference hole 6).
第3図はプリプレグ構造の変形例を示す要部平面図であ
って、本変形例の場合は、変形基準穴7が小判型の長円
形基準穴7aになっている。FIG. 3 is a plan view of an essential part showing a modification of the prepreg structure. In the case of this modification, the deformation reference hole 7 is an oval reference hole 7a of an oval shape.
本発明の適用により、プリプレグの収縮に起因する多層
プリント板の歪問題が解消されるので、多層プリント板
製造時の作業性と、製品の信頼性とが大幅に向上する。By applying the present invention, the problem of distortion of the multilayer printed board due to the shrinkage of the prepreg is solved, so that the workability in manufacturing the multilayer printed board and the reliability of the product are significantly improved.
第1図(a),(b)は本発明の多層プリント板の一実
施例を示す要部斜視図と部分拡大図、 第2図はプリプレグ構造の一実施例を示す平面図、 第3図はプリプレグ構造の変形例を示す要部平面図、 第4図は従来の多層プリント板の構造を示す要部斜視図
である。 図中、1はガイドピン、 2は表面層材、 3は中間層材、 4はプリプレグ、 4aは織布、 6は円形基準穴、 7は変形基準穴、 7aは長円形基準穴、 をそれぞれ示す。1 (a) and 1 (b) are perspective views and a partially enlarged view of an essential part showing an embodiment of a multilayer printed board of the present invention, and FIG. 2 is a plan view showing an embodiment of a prepreg structure, and FIG. FIG. 4 is a plan view of relevant parts showing a modified example of the prepreg structure, and FIG. 4 is a perspective view of relevant parts showing the structure of a conventional multilayer printed board. In the figure, 1 is a guide pin, 2 is a surface layer material, 3 is an intermediate layer material, 4 is a prepreg, 4a is a woven cloth, 6 is a circular reference hole, 7 is a deformation reference hole, and 7a is an oval reference hole. Show.
Claims (1)
ら両者間に介在させたプリプレグ(4)のそれぞれに基
準穴を設け、該基準穴にガイドピン(1)を挿通して関
係位置の位置決めを行う多層プリント板の構成におい
て、 前記プリプレグ(4)を構成する織布(4a)の縦糸方向
を多層プリント板の定尺サイズの長手方向に合致させる
とともに、該プリプレグ(4)の長手方向の中央部と両
端部とにそれぞれ対向して形成される合計3対の基準穴
の内、中央部の一対の基準孔は前記ガイドピン(1)を
嵌合状態で挿通させる円形基準穴(6)とし、両端部に
形成される2対の基準穴は前記縦糸方向の寸法が横糸方
向の寸法よりも長い変形基準穴(7)としたことを特徴
とする多層プリント板。1. A reference hole is provided in each of a surface layer material (2), an intermediate layer material (3), and a prepreg (4) interposed therebetween, and a guide pin (1) is inserted into the reference hole. In the structure of a multilayer printed board for performing relative position determination by aligning the warp direction of the woven fabric (4a) constituting the prepreg (4) with the longitudinal direction of the standard size of the multilayer printed board, 4) Of the total of 3 pairs of reference holes formed at the center and both ends in the longitudinal direction, the pair of reference holes at the center insert the guide pin (1) in a fitted state. A multilayer printed board characterized in that it is a circular reference hole (6), and the two pairs of reference holes formed at both ends are deformation reference holes (7) whose dimension in the warp direction is longer than that in the weft direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15733786A JPH0680896B2 (en) | 1986-07-03 | 1986-07-03 | Multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15733786A JPH0680896B2 (en) | 1986-07-03 | 1986-07-03 | Multilayer printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6313396A JPS6313396A (en) | 1988-01-20 |
| JPH0680896B2 true JPH0680896B2 (en) | 1994-10-12 |
Family
ID=15647483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15733786A Expired - Fee Related JPH0680896B2 (en) | 1986-07-03 | 1986-07-03 | Multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0680896B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58101519A (en) * | 1981-12-14 | 1983-06-16 | Mitsubishi Electric Corp | Failure detector for analog-to-digital converter |
| JP2621672B2 (en) * | 1991-03-06 | 1997-06-18 | 三菱電機株式会社 | Method for manufacturing curved multilayer wiring board |
| KR20140071755A (en) * | 2012-12-04 | 2014-06-12 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
-
1986
- 1986-07-03 JP JP15733786A patent/JPH0680896B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6313396A (en) | 1988-01-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH05106139A (en) | Three-dimensional woven fabric for composite material | |
| JP4387593B2 (en) | Papermaking belt with reinforcing pile | |
| JPH0680896B2 (en) | Multilayer printed board | |
| US4249977A (en) | Method for making close tolerance laminates | |
| FR2669574B1 (en) | PROCESS AND MACHINE FOR THE MANUFACTURE OF A WATERPROOF COMPLEX SHEET, OF ANY SHAPE, COMPRISING AN INTERNAL REINFORCEMENT, AND SHEET THUS OBTAINED. | |
| JPS6313395A (en) | Manufacture of multilayer printed interconnection board | |
| JPS62109497A (en) | Diaphragm for speaker | |
| JPH11135953A (en) | Multilayer printed wiring board and manufacture thereof | |
| JP3934826B2 (en) | Manufacturing method of multilayer wiring board | |
| JPH071828B2 (en) | Method for manufacturing multilayer printed wiring board | |
| JPS5947973B2 (en) | Manufacturing method of laminates | |
| US12263667B2 (en) | Composite material and method of forming composite material | |
| JP3700495B2 (en) | Welding head | |
| JPS586686Y2 (en) | copper clad laminate | |
| JPH069315B2 (en) | Multilayer printed circuit board and manufacturing method thereof | |
| JPH11163538A (en) | Multilayer printed wiring board and production thereof | |
| JPS6358997A (en) | Copper foil with resin for multilayer printed board | |
| JPH02241091A (en) | Lamination of multilayer laminated board | |
| JPH01139229A (en) | Manufacture of multi layer printed wiring board | |
| KR101782293B1 (en) | Reinforced composite film | |
| JP2544726B2 (en) | Manufacturing method of multilayer printed wiring board | |
| JPH04282894A (en) | Multilayer printed wiring board | |
| JPH0529764A (en) | Method for manufacturing multilayer printed wiring board | |
| JP2001024326A (en) | Manufacture of multilayered printed wiring board | |
| JPS6110981Y2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |