JPH0680950B2 - Lead molding equipment for electronic parts - Google Patents

Description

The present invention relates to an apparatus for molding leads of electronic components mounted on a printed circuit board or the like.

[Conventional technology]

To mount an electronic component on a printed circuit board, the lead of the electronic component is inserted into the lead insertion hole provided on the printed circuit board and soldered, but in order to make it easier to insert the lead into the lead insertion hole Requires the tip of the lead to be thinly molded.

As a conventional lead forming apparatus for electronic parts, there is one which forms a cut surface 26a by cutting the tip of a thin plate-shaped lead 26 into a V shape with a cutting blade as shown in FIG. -18400).

[Problems to be solved by the invention]

However, when the tip of the lead 2 having the round cross section of the electronic component 1 as shown in FIG. 9 is molded by such a lead molding apparatus, as shown in FIG. However, with such a shape, it is difficult to insert the lead 2 into the lead insertion hole.

Therefore, after forming the cut surface 2a, it is conceivable to rotate the electronic component 1 by 90 °, cut the tip of the lead 2 again into a V shape with a cutting blade, and shape the tip of the lead 2 into a quadrangular pyramid. However, the electronic component 1 has a plurality of leads 2 and leads 2
When the pitch of is small, it is practically impossible because the cutting blade and the lead 2 interfere with each other, and even if the pitch of the lead 2 is large and cutting is possible,
It is uneconomical because the same process is repeated twice.

The present invention has been made to solve the above-mentioned problems, and the tip of a lead having a round cross section, a rectangular cross section in which a short side and a long side are substantially equal to each other is formed into a pyramid shape without rotating an electronic component. An object of the present invention is to provide a lead forming device for electronic parts that can be manufactured.

[Means for solving problems]

In order to achieve this object, in the present invention, the first and second molds that are movably supported by the frame, and the first movement that moves at least one of the first and second molds. Means and a groove provided in the first mold,
The second molding die is provided in the lower portion of the first molding die, is located below the groove, has a triangular cross section, and has a surface facing the second molding die facing downward. A first mold part inclined so as to project to the side and a lower part of the second molding mold, which is located at a position facing the first mold part and has a triangular cross section. And the surface facing the first molding die faces the first
Cutting blade having a second mold portion that is inclined so as to project toward the molding die side, and a recess that is movably supported by the frame and that the first and second mold portions should engage with. And second moving means for moving the cutting blade.

[Action]

In this lead molding apparatus for electronic parts, after the electronic parts are supplied so that the leads are located in the grooves, the first moving means closes the first and second molding dies, and the inside of the space formed by the grooves is closed. The lead is sandwiched between the first and second mold parts, and a forming surface and a bulged portion are formed at the tip of the lead. After that, when the cutting blade is moved by the second moving device, the bulged portion is cut. The cutting surface is formed by cutting with a blade, and the tip of the lead is formed into a pyramid shape.

〔Example〕

FIG. 1 is a perspective view showing an electronic component lead forming apparatus according to the present invention, FIG. 2 is a partial sectional front view of the same, FIG. 3 is a sectional view taken along the line AA of FIG. 2, and FIG. FIG. 12 is a perspective view showing a molding die of an electronic component lead molding apparatus, FIG. 12 is a four-sided view of the same, and FIG. 13 is a perspective view showing a molding die of an electronic component lead molding apparatus shown in FIG. 14 and 15 are perspective views, FIG. 15 is a perspective view showing a cutting blade of the lead forming apparatus for electronic parts shown in FIG. 1 and the like, and FIG.
FIG. 18 is a plan view showing a part of the electronic component lead forming apparatus shown in FIG. 1, etc., FIG. 18 is a front view thereof, FIG. 19 is a bottom view thereof, and FIG. 20 is a side view thereof. In the figure, 5
Is a frame, 6 is a guide bar whose both ends are fixed to the frame 5, 7a and 7b are molds movably supported by the guide bar 6, 8 is a groove provided in the mold 7a, and 9 is a mold 7a. In the mold part provided in the lower part, the mold part 9 is located below the groove 8, the cross section of the mold part 9 is triangular, and the surface of the mold part 9 facing the molding die 7b is facing downward. It is inclined so as to project to the molding die 7b side. Reference numeral 10 denotes a protrusion provided on the molding die 7b, and the protrusion 10 is provided at a position to be fitted in the groove 8. Reference numeral 11 denotes a mold portion provided in the lower portion of the molding die 7b, the mold portion 11 is located below the protrusion 10, and the cross-section of the molding portion 11 has a triangular shape and faces the molding die 7a of the molding portion 11. The surface is inclined downward so as to project to the molding die 7a side. 13
Is a cylinder attached to the frame 5, 12 is a cylinder
A molding die 7a is fixed to the tip of the cylinder rod 12 with 13 cylinder rods. A cylinder 14 attached to the frame 5 is a cylinder rod of the cylinder 15, and a molding die 7b is fixed to the tip of the cylinder rod 14. 16
Is a guide bar whose both ends are fixed to the frame 5, 17 is a cutting blade movably supported by the guide bar 16, and 17a is a cutting blade 1
In the recess provided in 7, the recess 17a has a cross-sectional shape of the mold parts 9, 11
The cross-sectional shape is the same as that of FIG. 19 is a cylinder attached to the frame 5,
18 is the cylinder rod of the cylinder 19, and the cylinder rod 18
A cutting blade 17 is fixed to the tip of the.

In this electronic component lead forming apparatus, as shown in FIG. 4 (a), the electronic component 1 is supplied so that the leads 2 are located in the groove 8 and the protrusion 10, and then, as shown in FIG. 4 (b). As shown, extend the cylinders 13 and 15 to form the molds 7a and 7b.
Is closed, the lead 2 is clamped in the space formed by the groove 8 and the protrusion 10, and the mold portions 9 and 11 allow the lead 2 to be held in FIG.
The formation surface 2b and the bulged portion 2c are formed as shown in FIG. After this, as shown in FIG. 4 (c), the cylinder
If you extend 19 and move the cutting blade 17, the part 2c will be the cutting blade.
Cut surface as shown in Fig. 5 (b), cut by 17
2a is formed, and the tip of the lead 2 is shaped into a quadrangular pyramid. Therefore, the lead 2 is inserted in the lead insertion hole of the printed circuit board.
Even if the misalignment amount between the lead insertion hole and the lead 2 becomes large when inserting the lead 2, the pyramid portion at the tip of the lead 2 serves as a guide, so that the lead 2 can be reliably inserted into the lead insertion hole. .

FIG. 6 is a perspective view showing an electronic component inserting / assembling apparatus having the electronic component lead forming apparatus shown in FIGS. 1 to 3;
The figure is a perspective view showing a part of a stick magazine used in the electronic component inserting and assembling apparatus shown in FIG. In the figure, 21 is a lead forming device, 25 is a stick magazine containing a plurality of electronic components 1, and 20 is a plurality of stick magazines.
Can stack and store 25, stick magazine
The electronic component 1 stored in 25 is taken out one by one and supplied to the lead forming device 21, and 23 is the electronic component 1.
A substrate transfer device for transferring a printed circuit board (not shown) on which the lead is mounted, and 24 is a lead forming device 21 for the lead 2
Reference numeral 22 denotes an insertion head of an insertion device 24 for inserting the leads 2 of the molded electronic component 1 into the lead insertion holes of the printed circuit board.

In this electronic component inserting / assembling device, the component supplying device 20
The electronic component 1 is supplied to the lead forming device 21, and the lead 2 is formed by the lead forming device 21.
The electronic component 1 molded by is inserted into the lead insertion hole of the printed circuit board by the insertion device 24.

In the above-mentioned embodiment, the forming dies 7a, 7b and the cutting blade 17 are movably supported by the guide bars 6, 16, but the forming dies 7a, 7b and the cutting blade 17 are movably supported by other means. May be. Also. In the above-mentioned embodiment, the cylinder for moving the forming dies 7a, 7b is used as the first moving means.
Although 13 and 15 are provided and both the molding dies 7a and 7b are moved, a cylinder that moves either one of the molding dies 7a and 7b may be provided. Further, in the above-described embodiment, the cylinders 13, 15, 19 are used as the first and second moving means, but the molding dies 7a, 7b and the cutting blade 17 may be moved by a screw driving moving device or the like. . Further, in the above-described embodiment, the projection 10 is provided on the molding die 7b, but the projection 10 does not necessarily have to be provided.
In addition, in the above-described embodiment, the lead 2 having a round cross section
However, the present invention can also be applied to the case of molding a lead having a rectangular cross section or the like in which the short side and the long side are substantially equal. Further, in the above-described embodiment, the case where the electronic component 1 housed in the stick magazine 25 is supplied to the lead forming apparatus 21 has been described, but the electronic component 1 in which the tips of the leads 2 are sandwiched by the tape is explained.
May be supplied to the lead forming device 21. In this case, if the upper part of the lead 2 sandwiched by the tape is formed, the formation of the lead 2 and the separation of the tape can be performed at the same time.

〔The invention's effect〕

As described above, in the electronic component lead forming apparatus according to the present invention, the tip of the lead having a round cross section, a rectangular cross section having a short side and a long side substantially equal to each other can be formed into a pyramidal shape. The lead can be reliably inserted into the lead insertion hole, and the tip of the lead can be molded without rotating the electronic component, which is economical. As described above, the effect of the present invention is remarkable.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component lead forming apparatus according to the present invention, FIG. 2 is a partially sectional front view of the same, FIG. 3 is a sectional view taken along line AA of FIG. 2, and FIG. FIGS. 5A and 5B are diagrams for explaining the operation of the electronic component lead forming apparatus shown in FIGS.
FIG. 6 is a perspective view showing a process of molding a lead by the electronic component lead molding apparatus shown in FIG. 3 and FIG. 6 is an electronic component insertion having the electronic component lead molding apparatus shown in FIGS. FIG. 7 is a perspective view showing an assembling apparatus, FIG. 7 is a perspective view showing a part of a stick magazine used in the electronic component inserting and assembling apparatus shown in FIG. 6, and FIG. 8 is a conventional electronic component lead forming apparatus. 9 is a perspective view showing a lead of an electronic component, FIG. 9 is a perspective view showing an electronic component, and FIG. 10 is a state in which the lead of the electronic component shown in FIG. 9 is molded by a conventional electronic component lead forming apparatus. FIG. 11 is a perspective view showing a molding die of the electronic component lead molding apparatus shown in FIG. 1 and the like, FIG. 12 is a four-sided view of the same, and FIG. 13 is a diagram of the electronic component shown in FIG. FIG. 14 is a perspective view showing the forming die of the lead forming apparatus, FIG. 14 is the same four-sided view, and FIG. 15 is FIG. Perspective view of a cutting blade of the lead forming apparatus of the electronic components shown, FIG. 16 also tetrahedral view, 17
FIG. 18 is a plan view showing a part of the electronic component lead forming apparatus shown in FIG. 1, etc., FIG. 18 is a front view thereof, FIG. 19 is a bottom view thereof, and FIG. 20 is a side view thereof. 5 ... Frame, 7a, 7b ... Mold 8 ... Groove, 9, 11 ... Mold part 13, 15 ... Cylinder, 17 ... Cutting blade 19 ... Cylinder

Claims (1)

[Claims] 1. A first and second molding dies movably supported by a frame, a first moving means for moving at least one of the first and second molding dies, and the first molding die. A groove provided in the mold and a lower part of the first mold, which is located below the groove, has a triangular cross section, and has a surface facing the second mold downward. A first mold part that is inclined so as to project toward the second mold part toward the first mold part, and a position that is provided in the lower part of the second mold part and that faces the first mold part. A second mold part having a triangular cross section, and a surface facing the first mold is inclined so as to project downward to the first mold side; A cutting blade movably supported by a frame and having a recess to be engaged with the first and second mold parts; Lead forming apparatus of electronic components, characterized by comprising a second moving means for moving the cross blade.