JPH0682726B2 - Appearance inspection device - Google Patents
Appearance inspection deviceInfo
- Publication number
- JPH0682726B2 JPH0682726B2 JP30697686A JP30697686A JPH0682726B2 JP H0682726 B2 JPH0682726 B2 JP H0682726B2 JP 30697686 A JP30697686 A JP 30697686A JP 30697686 A JP30697686 A JP 30697686A JP H0682726 B2 JPH0682726 B2 JP H0682726B2
- Authority
- JP
- Japan
- Prior art keywords
- image
- lead pin
- camera
- inspected
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title claims description 7
- 238000005286 illumination Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000011179 visual inspection Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 101100444142 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) dut-1 gene Proteins 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明はIC,トランジスタ等の電子部品を撮像によって
外観検査することができる外観検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection apparatus capable of visual inspection of electronic parts such as ICs and transistors by imaging.
従来の技術 従来、IC,トランジスタ等の電子部品リードピンを認識
する場合、第4図,第5図に示す外観検査装置が用いら
れた。2. Description of the Related Art Conventionally, when recognizing lead pins of electronic parts such as ICs and transistors, the appearance inspection apparatus shown in FIGS. 4 and 5 has been used.
以下、この従来の外観検査装置について説明する。第4
図において、1は被検査物の電子部品であり、2は同電
子部品1のリードピン、3はリードピン2を照射する照
明源、4はリードピン2から反射されてくる光を検知す
るラインセンサーカメラである。また、第5図(a)
で、5はラインセンサーカメラ4が検知する範囲を示し
たラインセンサーエリア、6は照明源3の光の照射部で
ある。The conventional visual inspection device will be described below. Fourth
In the figure, 1 is an electronic component of an object to be inspected, 2 is a lead pin of the electronic component 1, 3 is an illumination source that illuminates the lead pin 2, and 4 is a line sensor camera that detects light reflected from the lead pin 2. is there. Also, FIG. 5 (a)
Reference numeral 5 is a line sensor area showing a range detected by the line sensor camera 4, and 6 is a light irradiation unit of the illumination source 3.
次に、上記のように構成された外観検査装置の動作につ
いて説明する。照明源3より発光した光はリードピン2
に照射され、ラインセンサーエリア5内での反射光をカ
メラ4で受光する。Next, the operation of the appearance inspection device configured as described above will be described. The light emitted from the illumination source 3 is the lead pin 2
The light reflected by the line sensor area 5 is received by the camera 4.
このカメラ4から第5図(b)に示す出力波形Tを得
て、リードピンピッチP、リードピン本数N、リードピ
ン幅Wを検出していた。The output waveform T shown in FIG. 5B was obtained from the camera 4, and the lead pin pitch P, the number N of lead pins, and the lead pin width W were detected.
発明が解決しようとする問題点 このような従来の構成ではリードピン2の認識を第5図
(b)に示す出力波形Tでみるため、被検査物1のリー
ド外曲がり不良または内曲がり不良の検出が困難であっ
た。また、リードピン2の表面処理状態によって、例え
ば光沢メッキ、ディップ半田処理を施したリードピンで
は、リードピンの表面が丸味を帯びるため、反射光の多
くがラインセンサーカメラ4以外の方向に進み、ライン
センサーカメラ4の受ける光量が少なくなる。このた
め、リードピンピッチP、リードピン幅Wを検出するこ
とが困難になる。また、ラインセンサーカメラ4の代り
に、二次元センサーを有するカメラを用いると、リード
ピンを画像として認識するのでリードピンの丸味による
影響は少なく、リードピンピッチP、リードピン幅Wを
検出することは可能であるが、電子部品1のリードピン
の微妙な外曲がりや内曲がりの状態を検出することはで
きなかった。Problems to be Solved by the Invention In such a conventional configuration, since the recognition of the lead pin 2 is checked by the output waveform T shown in FIG. 5 (b), the defect of the lead outside bend or the inside bend of the DUT 1 is detected. Was difficult. Further, depending on the surface treatment state of the lead pin 2, in the case of a lead pin that has been subjected to gloss plating or dip soldering treatment, the surface of the lead pin is rounded, so most of the reflected light travels in a direction other than the line sensor camera 4, and the line sensor camera The amount of light received by 4 is reduced. Therefore, it becomes difficult to detect the lead pin pitch P and the lead pin width W. When a camera having a two-dimensional sensor is used instead of the line sensor camera 4, the lead pin is recognized as an image, so that the roundness of the lead pin is less affected and the lead pin pitch P and the lead pin width W can be detected. However, it has not been possible to detect a subtle outward bending or inward bending of the lead pin of the electronic component 1.
本発明は、簡単な構成で、リードピンピッチ,リードピ
ン幅,リードピン本数,リードピン形状,リードピン内
曲がり,外曲がり等のリードピンに関する総合的な検査
が可能な外観検査装置を提供することを目的とする。It is an object of the present invention to provide a visual inspection apparatus having a simple structure and capable of comprehensively inspecting lead pins such as lead pin pitch, lead pin width, number of lead pins, lead pin shape, lead pin inward bend, and outward bend.
問題点を解決するための手段 この目的を達成するために本発明の外観検査装置は、被
検査物を撮像するカメラと、被検査物を照射する照明系
と、リードピンからの反射光を前記カメラへ導く画像反
射板と、照明系からの照射光量の調整板とを有し、被検
査物の状態を認識するようになっている。Means for Solving the Problems In order to achieve this object, a visual inspection apparatus of the present invention provides a camera for imaging an object to be inspected, an illumination system for irradiating the object to be inspected, and reflected light from a lead pin to the camera. It has an image reflection plate that guides to, and an adjustment plate for adjusting the amount of light emitted from the illumination system, and recognizes the state of the inspection object.
作用 以上の構成により、被検査物の像がカメラによって撮像
され、被検査物の幅,形状,凹凸など、画像反射板から
の反射画像の明暗を検知することによって、被検査物の
総合的な外観を認識できる。With the above configuration, the image of the inspected object is captured by the camera, and the width, shape, and unevenness of the inspected object are detected to detect the contrast of the reflected image from the image reflection plate, thereby comprehensively checking the inspected object. You can recognize the appearance.
実施例 第1図は本発明の一実施例による外観検査装置側断面図
である。以下に、この機器構成について説明する。Embodiment FIG. 1 is a sectional side view of an appearance inspection apparatus according to an embodiment of the present invention. The device configuration will be described below.
7は二次元センサー、たとえば、電荷結合素子(CCD)
を用いたカメラ、8は高周波蛍光燈の光源、9は光源8
近傍に付設された光源カバー、10は搬送レールカバー、
11は低歪率の画像反射板、12は画像反射板11を所定の傾
斜角度をもって保持する保持板、13は被検査物の搬送レ
ール、14は光源8からの照射光量の調整板である。7 is a two-dimensional sensor, such as a charge coupled device (CCD)
Camera using, 8 is a high-frequency fluorescent lamp light source, 9 is a light source 8
Light source cover attached in the vicinity, 10 is a rail cover,
Reference numeral 11 is a low-distortion image reflection plate, 12 is a holding plate that holds the image reflection plate 11 at a predetermined inclination angle, 13 is a conveyance rail for the object to be inspected, and 14 is an adjustment plate for the amount of light emitted from the light source 8.
以下にこの実施例の動作を説明する。光源8によってリ
ードピン2は照射され、その照射光量を矢印A方向に調
整可能な照射光量の調整板14により調整して、画像反射
板11の反射光としてカメラ7へ導く。その結果、このカ
メラ7は直接画像としてリードピン2の上面の像を検出
し、画像反射板11からの反射画像としてリードピン2の
側面の像を検出する。この検出された像に基づいて、リ
ードピンピッチ,幅,本数を検出する。また、カメラ7
で画像認識した場合に、照明光路Sと前記画像反射板11
の反射率の相互関係は照射光量の調整板14の位置を変化
させ、照射光量を変化させることにより適切な状態に容
易に調整できる。すなわち、カメラ7に映し出されるリ
ードピン画像は照射される光量と画像反射板11の反射率
とによって微妙に変化する。したがって、調整板14を矢
印A方向に変化させ、照射光量を調整することにより、
リードピン2の外曲り、内曲りが供に明瞭に映し出され
る状態をつくり出すことができる。このように照射光量
の調整板14を調整した後に、第2図に示すようにリード
ピンの形状が、正常体2a、外曲がり体2bあるいは内曲が
り体2cである被検査物1をカメラ7の位置で見ると、第
3図の認識画像図の例に示すように、内曲がり不良状態
のリードピン画像15は光の反射率が低いため、反射画像
は暗く画像処理における2値化レベルで正常の状態のリ
ードピンと比較認識することができる。また、外曲がり
不良状態のリードピン画像16は前記内曲がりのリードピ
ン画像15の比較認識と同様で、かつ、前記画像反射板11
を介さずに直接画像16aとして認識することも可能で、
直接画像16aによる画像認識処理を適正2値化レベルに
おいて行なうことにより2方向の検査をすることが可能
であり、非常に精度の高い認識処理が得られるものであ
る。The operation of this embodiment will be described below. The lead pin 2 is irradiated by the light source 8, and the amount of irradiation light is adjusted by the adjustment plate 14 of the amount of irradiation light that can be adjusted in the arrow A direction, and is guided to the camera 7 as the reflected light of the image reflection plate 11. As a result, this camera 7 detects the image of the upper surface of the lead pin 2 as a direct image and the image of the side surface of the lead pin 2 as a reflected image from the image reflecting plate 11. Based on the detected image, the lead pin pitch, width, and number are detected. Also, camera 7
When the image is recognized by the illumination optical path S and the image reflection plate 11
The mutual relation of the reflectance can be easily adjusted to an appropriate state by changing the position of the irradiation light amount adjusting plate 14 and changing the irradiation light amount. That is, the lead pin image displayed on the camera 7 slightly changes depending on the amount of light emitted and the reflectance of the image reflecting plate 11. Therefore, by changing the adjustment plate 14 in the direction of arrow A and adjusting the irradiation light amount,
It is possible to create a state in which the outer bend and the inner bend of the lead pin 2 are clearly displayed together. After adjusting the irradiation light amount adjusting plate 14 in this way, as shown in FIG. 2, the shape of the lead pin is the normal body 2a, the outer curved body 2b or the inner curved body 2c, and the object to be inspected 1 is positioned on the camera 7. As shown in the example of the recognition image diagram of FIG. 3, the lead pin image 15 in the inwardly bent state has a low light reflectance, so the reflected image is dark and the state is normal at the binarization level in the image processing. It can be recognized by comparing with the lead pin. Further, the lead pin image 16 in the outwardly bent state is similar to the comparative recognition of the lead pin image 15 in the inner bend, and the image reflector 11
It is also possible to directly recognize as image 16a without going through
By performing the image recognition process using the direct image 16a at the proper binarization level, it is possible to perform the inspection in two directions, and a highly accurate recognition process can be obtained.
なお照射光量を微妙に調整するためには、第1図に破線
で示すように、調整板14の先端部をテーパ面14aとする
ことも有効である。また、上記実施例では被検査物を撮
像するイメージセンサーとして二次元センサーを用いた
カメラ7を用いているが、このカメラ7は撮像管を用い
たカメラ等を用いることもできる。In order to finely adjust the irradiation light amount, it is also effective to make the tip of the adjusting plate 14 a tapered surface 14a as shown by the broken line in FIG. Further, although the camera 7 using the two-dimensional sensor is used as the image sensor for picking up the image of the object to be inspected in the above embodiment, the camera 7 may be a camera using an image pickup tube or the like.
発明の効果 このように本発明によれば、リードピンへの照射光量の
調整板により照射光量を調整し、画像反射板を介して反
射画像を認識処理しているため、光の反射率と画像反射
板の相互関係において認識精度の高い画像認識処理がお
こなえるという効果を有するものである。As described above, according to the present invention, since the irradiation light amount is adjusted by the irradiation light amount adjustment plate for the lead pin, and the reflection image is recognized through the image reflection plate, the light reflectance and the image reflection This has the effect that image recognition processing with high recognition accuracy can be performed in the mutual relationship of the plates.
第1図は本発明の一実施例における外観検査装置の側断
面図、第2図は同実施例の被検査物の側面図、第3図は
同実施例においてモニター等に写し出される認識画像の
正面図、第4図は従来の外観検査装置側断面図、第5図
は従来の外観検査装置のラインセンサーカメラの出力波
形を説明するための図である。 1……被検査物、7……カメラ、8……光源、11……画
像反射板、14……照射光量の調整板。FIG. 1 is a side sectional view of a visual inspection apparatus according to an embodiment of the present invention, FIG. 2 is a side view of an object to be inspected in the same embodiment, and FIG. 3 is a recognition image projected on a monitor or the like in the same embodiment. FIG. 4 is a front view, FIG. 4 is a sectional side view of a conventional visual inspection apparatus, and FIG. 5 is a diagram for explaining an output waveform of a line sensor camera of the conventional visual inspection apparatus. 1 ... Object to be inspected, 7 ... Camera, 8 ... Light source, 11 ... Image reflector, 14 ... Irradiation light amount adjustment plate.
Claims (1)
画像反射板を介して被検査物を撮像するカメラと、前記
カメラによる撮像可能な光量を被検査物へ照射する照明
系と、前記照明系からの照射光量を調整する調整板とを
そなえた外観検査装置。1. An image reflector having a predetermined inclination angle, a camera for capturing an image of an object to be inspected through the image reflector, and an illumination system for irradiating the object to be inspected with an amount of light that can be captured by the camera. An external appearance inspection device having an adjusting plate for adjusting the amount of light emitted from the illumination system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30697686A JPH0682726B2 (en) | 1986-12-23 | 1986-12-23 | Appearance inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30697686A JPH0682726B2 (en) | 1986-12-23 | 1986-12-23 | Appearance inspection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63158848A JPS63158848A (en) | 1988-07-01 |
| JPH0682726B2 true JPH0682726B2 (en) | 1994-10-19 |
Family
ID=17963526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30697686A Expired - Fee Related JPH0682726B2 (en) | 1986-12-23 | 1986-12-23 | Appearance inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682726B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2577664Y2 (en) * | 1991-11-28 | 1998-07-30 | 株式会社アドバンテスト | IC imaging stage |
| JP5124085B2 (en) | 2005-08-24 | 2013-01-23 | 押尾産業株式会社 | Self-supporting bag and its manufacturing method |
-
1986
- 1986-12-23 JP JP30697686A patent/JPH0682726B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63158848A (en) | 1988-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |