JPH0682770B2 - IC lead molding equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an IC lead forming apparatus, particularly a PLCC (Plastic Lead).
ed Chip Carrier) and SOJ (Small Outline J−lead pack)
The present invention relates to an IC lead forming device having a J-shaped lead terminal called "age".

[Conventional technology]

Conventionally, in the manufacturing process of an IC (hereinafter collectively referred to as PLCC) having a J-shaped lead terminal called PLCC or SOJ,
The lead terminals (hereinafter referred to as leads) are molded by removing the resin dam portion, cutting the tie bar portion, and cutting the lead portion, and then, as shown in FIG. 3 (A), the base portion 2c of the lead is put on the pad 5d and the die 22. Clamped, the lead 2 is bent downward with a lead tip forming punch 21 having a partially arcuate recess 21a, and a part of the J-shaped arc is formed on the lead tip 2b. As shown in FIG. 3B, a step of vertically bending the lead 2 with a vertical bending roller 23 that can freely rotate and roll up and down, and as shown in FIG. 3C, are provided on the curling die 11c. This has been performed by forming the J-shaped lead by contacting the lead tip 2b with the inner surface of the groove 12c having a semicircular cross section that matches the final shape of the lead and causing it to wrap around.

[Problems to be solved by the invention]

However, generally, at the time of lead forming, the lead surface is already plated with solder, and in the above-described conventional lead forming apparatus, the lead surface is scraped by the tip forming punch 21 and the curling die 11c, so that the solder plating is peeled off, or The scraps of the detached solder plating drop and adhere to the inside of the semicircular groove 12c of the curling die and adversely affect the lead molding.The generated scraps of solder adhere to the lead surface during curling and adversely affect the appearance of the product. Was being given. Also, the resin burr existing between the lead and the resin package falls in the mold due to the impact during lead molding, and especially during curling, the dropped resin burr accumulates in the groove of the curling die and leads during molding. It was struck on the surface and had a bad effect on the appearance of the product. Therefore, there are drawbacks that it is necessary to visually inspect for peeling of the plating, scratches of the resin, and the like, and frequently remove the plating scraps and the resin burrs adhering to the punch and the die.

An object of the present invention is to provide a lead forming apparatus that solves the above problems.

[Differences from the Prior Art of the Invention]

In contrast to the above-described conventional lead forming apparatus, the present invention solves the above-mentioned drawbacks. A large arc forming of 120 ° or more is performed at the time of forming the lead tip by using a roller, and it includes the lowest point of the groove of the curling die. By providing an opening in the arc part of 90 ° or more and suctioning from the opening, it is possible to prevent peeling of the plating, adhesion of solder scraps to the functional part, and plating scraps or resin burrs to the leads. It has the original content of.

[Means for solving problems]

The present invention is an apparatus for forming lead terminals projecting on both sides of an IC by bending them inwardly in a J-shape. In the apparatus, the first roller is attached to the tip of the lead terminal of the IC to be processed, which is bent and fixed in one direction by a die and a pad. Means for performing arc forming of 120 ° or more in the opposite direction to the one direction by the pressing force of, and means for bending the lead terminal formed in the first step in the opposite direction by the pressing force of the second roller, An IC having a J-shaped lead terminal formed by a die having an opening formed in an arc portion of about 90 ° including the lowest point of a groove having a semicircular cross section. It is a lead forming device.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

(Embodiment 1) As shown in FIG. 1 (A), an IC lead forming apparatus of the present invention has a tip of a lead of an IC to be processed in which a lead terminal of the IC to be processed is bent and fixed in one direction by a die and a pad. A first bending means for forming an arc of 90 ° or more in the direction opposite to the one direction by the pressing force of the tip bending roller 6; and the first step as shown in FIG. 1 (B). Second bending of the lead in the opposite direction by the pressing force of the obliquely downward bending roller 9
The bending means and a die having an opening in an arc portion of about 90 ° including the lowest point of the groove 12a having a semicircular cross-sectional shape as shown in FIG. And a third bending means for forming the shape.

The first bending means is a pad as shown in FIG.
5a, the lead pushing die 4, the processed IC receiving die 3 biased upward by the spring 8a, and the tip of the lead of the IC bent obliquely upward by the pad 5a and the die 4.
2a and a first tip bending roller 6 that rolls on the upper surface of the roller 2a to form an arc shape. Reference numeral 7a is a roller holder for holding the tip bending roller 6.

The second bending means is a pad as shown in FIG. 1 (B).
5b, an oblique downward bending die 10, and an oblique downward bending roller 9 for rolling the oblique downward bending roller 9 on the IC lead to bend the lead obliquely downward.

The third bending means is a pad as shown in FIG. 1 (C).
5c, a curling die 11a provided with a suction port 13a at the bottom of a groove 12a having a semicircular cross section, and an ejector pin 14 held by a spring 8b at the center of the curling die 11a.

First, in the lead tip forming portion, as shown in FIG. 1 (A), the processed IC receiving die 3 which can be lowered via the spring 8a, the inclined surface 4a and the upper corner portion 4b thereof are fixed to have an arc-shaped cross section. When the resin package 1 of the IC to be processed is pushed down while pushing the root portion 2c of the lead with the pad 5a having the same inclined surface 5a ′ as the inclination of the die 4, the lead 2 is pushed up by the lead pushing die 4 Is lifted diagonally upward and clamped. Thereafter, the tip bending roller 6 provided on the roller holder 7a that vertically descends together with the pad 5a descends and comes into contact with the lead tip 2a while rotating, so that the lead tip 2a is provided at the upper corner 4b of the die 4. 120 ° to 150 ° following the arcuate part
It is formed into a circular arc shape.

Next, as shown in FIG. 1 (B) at the obliquely downward bent portion,
Die 10 having pad 5b descending and having inclined surface 10a downward
After clamping the root part 2c of the lead together with the pad 5b
The diagonal downward bending roller 9 provided on the roller holder 7b that vertically descends with it comes into contact with the lead 2 formed diagonally upward while rotating and descends until the lead is clamped by the inclined surface 10a of the die 10, The leads 2 of the IC to be processed are formed obliquely downward.

After the lead is bent vertically in the next step, a curling die is formed at the J-shaped lead forming part as shown in FIG. 1 (C).
11a is provided with a groove 12a having a semicircular cross section, and the suction port 13a is provided in an arc portion of about 90 ° including the lowest point of the groove 12a, whereby the resin package 1 is pushed down by the pad 5c and descends. Accordingly, the lead is guided by the groove 12a, and the tip 2a thereof gradually wraps around the back surface of the resin package 1 along the groove 12b to form a J-shaped lead. If the arc shape of the lead tip is less than 90 ° as in the conventional case, the J-shaped lead cannot be formed because the lead tip collides with the inside of the suction port without following the groove 12b during curling. It was not possible to provide a large suction port for sucking burrs and the like inside the groove of the die, but in this embodiment, the lead tip 2a is previously arc-shaped at 120 ° or more, so that the curling die 11a About 90 in groove 12a
Even if the suction port 13a of about ° is provided, the resin burr that falls during curling can be sucked in without hindering lead molding.
Since the lead is not driven, the place where the lead comes into contact with the die during curling and the molding amount are reduced compared to the conventional case, so that the amount of solder plating adhered to the die is remarkably small.

(Embodiment 2) FIG. 2 is a schematic sectional view of a curling portion of a lead forming apparatus according to a second embodiment of the present invention. By providing the suction port 13a having a width larger than that of the opening 12c 'provided in the groove 12c of the die 11b, there is an advantage that the suction capability of resin burrs or the like is increased.

〔The invention's effect〕

As described above, the IC lead forming apparatus according to the present invention,
When forming the tip of the lead, bend the lead diagonally upward and at the same time rotate the roller to make a larger arc shape of 120 ° or more on the tip of the lead, and in the next process, form the lead diagonally downward with the roller. The peeling is eliminated, the lead molding amount in the curling portion is also reduced, and the adhesion of the solder plating to the die is reduced. Furthermore, in the curling die, since the openings for suction of about 90 ° are provided near the bottom of the groove, the number of places where the leads directly contact the die during molding is reduced, so peeling of solder plating is further reduced, Since it is possible to suck resin burrs that have fallen from the opening during molding, it is possible to prevent resin cutting and plating scraps from attaching to the leads, and reduce the number of work steps such as visual inspection and removal of plating scraps and resin debris. It has a great effect on improving product quality and automation of equipment.

[Brief description of drawings]

1 (A), (B), and (C) are schematic cross-sectional views of the first embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of the second embodiment of the present invention, and FIG. ), (B), and (C) are conventional schematic cross-sectional views. 1 ... Resin package, 2 ... Lead terminals 2a, 2b ... Lead tip, 2c ... Lead root 3 ... Processed IC receiving die, 4 ... Lead pushing die 5a, 5b, 5c, 5d, 5e, 5f …… Pat, 6 …… Lead tip bending roller 7a, 7b …… Roller holder, 8a, 8b, 8c …… Spring 9 …… Diagonal downward bending roller, 10 …… Diagonal downward bending die 11a, 11b,… Curling die, 12a, 12b, 12c Groove 13a Suction port, 14 Ejector pin 21 ... Tip forming punch, 22 ... Diagonal bending die 23 ... Vertical bending roller, 24 ... Die

Claims (1)

[Claims] 1. An apparatus for bending and forming lead terminals projecting on both sides of an IC inwardly in a J-shape, the first terminal being attached to a tip of a lead terminal of an IC to be processed, which is bent and fixed in one direction by a die and a pad. Means for performing arc forming of 120 ° or more in the direction opposite to the one direction by the pressing force of the roller of
And a means for bending the lead terminal formed in the step of the second step in the opposite direction by the pressing force of the second roller, and an opening at an arc portion of about 90 ° including the lowest point of the groove having a semicircular cross-sectional shape. And a die for forming a lead terminal into a J-shape with a die provided with.