JPH0685471B2 - Cooling structure for electronic equipment rack - Google Patents
Cooling structure for electronic equipment rackInfo
- Publication number
- JPH0685471B2 JPH0685471B2 JP60-505110A JP50511085A JPH0685471B2 JP H0685471 B2 JPH0685471 B2 JP H0685471B2 JP 50511085 A JP50511085 A JP 50511085A JP H0685471 B2 JPH0685471 B2 JP H0685471B2
- Authority
- JP
- Japan
- Prior art keywords
- fan
- unit
- cooling
- shelf
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20554—Forced ventilation of a gaseous coolant
- H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum
- H05K7/20581—Cabinets including a drawer for fans
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】
技術分野
本発明は、複数枚のプリント板を収容したシェルフユニ
ットを複数段に積層した通信装置、交換装置等の電子装
置用架の冷却構造に関し、特にファンを用いた強制空冷
式冷却構造に関する。[Detailed Description of the Invention] Technical Field: The present invention relates to a cooling structure for racks for electronic devices such as communication devices and exchange devices, in which shelf units each containing a plurality of printed circuit boards are stacked in multiple stages, and in particular to a forced air-cooling type cooling structure using a fan.
背景技術
通信装置等の電子装置において、１つの機能を有するシ
ェルフユニット内に複数枚のプリント板を収容し、この
シェルフユニットを上下関係に複数段積重ねキャビネッ
ト内又はフレームに装着して１つの機能を有する架を構
成する。シェルフユニット内の各プリント板を長期間安
定して機能させるためにシェルフユニットを冷却しなけ
ればならない。近年プリント板上の部品の高密度実装配
置および部品自体の高集積化に伴い、プリント板および
プリント板収容シェルフの発熱密度が増大している。例
えば、第17図に示すように、従来のプリント板において
は黒丸で示すように10W/lの発熱密度であったが、近年
の技術向上により消費電力が1/2になり容積が1/4になる
と、白丸で示すように発熱密度は20W/lと２倍になる。BACKGROUND ART In electronic devices such as communications equipment, multiple printed circuit boards are housed in a single shelving unit with a single function. These shelving units are stacked vertically in a cabinet or frame to form a single rack. The shelving units must be cooled to ensure stable operation of the printed circuit boards within the shelving units over a long period of time. In recent years, the heat generation density of printed circuit boards and their storage shelves has increased due to the high-density mounting and integration of components on printed circuit boards. For example, as shown in Figure 17, a conventional printed circuit board had a heat generation density of 10 W/L (as indicated by the black circle). However, with recent technological advances, power consumption has been reduced by half and the volume by a quarter, resulting in a heat generation density of 20 W/L (as indicated by the white circle).
このような発熱密度の大きいプリント板を収容したシェ
ルフユニットを冷却するためには、ファンを用いた強制
空冷式冷却構造が用いられている。このような冷却方式
において、有効な放熱効果を得るためには、温度ととも
にプリント板を通過する風速が大きな要素となる。To cool a shelf unit that houses such high-heat-density printed circuit boards, a forced air-cooling structure using a fan is used. In this cooling method, the temperature and the air speed passing through the printed circuit boards are important factors in achieving effective heat dissipation.
従来の冷却構造を第15図および第16図に示す。上下２段
に積重ねられたシェルフユニット101の上段に冷却ユニ
ット102が設けられている。このような３つのユニット
からなる積層体を１つの冷却ブロックとしてこの冷却ブ
ロックをさらに複数段（図の例では２段）に重ねキャビ
ネット（図示しない）内に収容して全体として架105を
構成する。シェルフユニット101内には第16図に示すよ
うに多数のプリント板103が並列して収容されている。
冷却ユニット102内には４つのファン（送風機）が吹出
方向を前面にして設けられている。これらのファン104
により、各２段のシェルフユニット毎に、矢印Ａ（第15
図）で示すように、外気を２段のシェルフユニットの下
側より取入れ２段のシェルフユニットを通過させて架の
前面より前面扉（図示しない）を通して排気している。A conventional cooling structure is shown in Figures 15 and 16. Shelf units 101 are stacked in two levels, one above the other, with a cooling unit 102 provided in the upper level. A stack of three such units is used to form a single cooling block, and these cooling blocks are further stacked in multiple levels (two levels in the example shown), housed in a cabinet (not shown) to form a rack 105 as a whole. A large number of printed circuit boards 103 are housed in parallel inside the shelf unit 101, as shown in Figure 16.
Four fans (blowers) are installed in the cooling unit 102 with the blowing direction facing forward.
Therefore, for each shelf unit in two stages, arrow A (15th
As shown in the figure, outside air is taken in from the bottom of the two-tier shelf unit, passes through the two-tier shelf unit, and is exhausted from the front of the rack through a front door (not shown).
上記従来の冷却構造にあっては次のような問題点があっ
た。The above-described conventional cooling structure has the following problems.
ファンユニット104の下側に積層された複数個（この
場合は２個）のシェルフユニット101は、下側のユニッ
トで奪熱して温められた冷却風がそのまゝ上側のユニッ
トを通過して上側のユニットで奪熱して冷却する方法で
あるため、上側ユニットの冷却風温度が下側ユニットの
冷却風温度より高くなり、上側ユニットと下側ユニット
との温度差が生じる。このため上側ユニットの冷却能力
が低下し、また各冷却ブロック内の全体許容発熱量は高
温となるユニット（通常は下側ユニット）の温度を基準
として設定されるので、その温度差分だけ上側ユニット
の発熱量が制限される。The multiple shelf units 101 (two in this case) stacked below the fan unit 104 use a method in which cooling air heated by heat removal in the lower units passes directly through the upper units to remove heat and cool the upper units, so the cooling air temperature in the upper units becomes higher than that of the lower units, resulting in a temperature difference between the upper and lower units. This reduces the cooling capacity of the upper units, and because the total allowable heat generation capacity within each cooling block is set based on the temperature of the unit with the highest temperature (usually the lower unit), the heat generation capacity of the upper units is limited by the temperature difference.
上記項の問題点を解消するために、各シェルフユニ
ット上にファンユニットを個別に設置すると、これらの
ファンユニットの占める空間が大となり、キャビネット
全体としての高密度実装が不可能になる。If fan units are individually installed on each shelf unit to solve the above problem, the space occupied by these fan units will become large, making it impossible to achieve high-density packaging for the entire cabinet.
冷却風（矢印Ａ）がファンユニット102の後部傾斜面1
02aによって上下方向から横方向（水平方向）に急激に
流れ方向を変えられるので流れ抵抗が大となり、冷却効
率が良くない。The cooling air (arrow A) flows through the rear inclined surface 1 of the fan unit 102.
02a causes the flow direction to change suddenly from vertical to horizontal (horizontal), which increases flow resistance and results in poor cooling efficiency.
ファンが故障時に、当該ファンユニット下部のシェル
フユニットが高温になり易く、このため信頼性に欠け
る。When a fan fails, the shelf unit below the fan unit is likely to become too hot, making it unreliable.
冷却風がキャビネットの前面扉を介して横方向（水平
方向）に排気されるため、保守者に不快感を与えると共
に、ファンの騒音が大となる
発明の開示
本発明は前記従来技術の問題点に鑑みなされたものであ
って、上下方向のスペースを増大させることなく各シェ
ルフユニットを効率良く冷却し放熱に必要な所定の風速
を確保可能とした電子装置用架の冷却構造の提供を目的
とする。Since the cooling air is exhausted sideways (horizontally) through the front door of the cabinet, it causes discomfort to the maintenance personnel and also makes the fans noisy. Disclosure of the Invention The present invention has been made in consideration of the problems of the prior art, and aims to provide a cooling structure for an electronic device rack that can efficiently cool each shelf unit without increasing the vertical space and ensure the specified air speed required for heat dissipation.
この目的を達成するため、本発明に係る電子装置用架の
冷却構造においては、複数枚のプルント板を収納しかつ
上下面部それぞれに通風穴を有するシェルユニットをキ
ャビネット内に複数個上下方向に積み重ねて成る電子装
置用架の冷却構造において、上記各シェルフユニット上
に少くとも１つのファンを有するファンユニットを個別
に設けて個々の冷却ブロックを形成し、これら各冷却ブ
ロックのファンユニットによって冷却風を上記各シェル
フユニットの下方から上方に向けて直線状に通過させ、
かつ該冷却風の流速を利用して上記各ファンユニットの
側面部に形成した通風穴より外気を導入して上記冷却風
に混入し、上記各ファンユニットの上方への吹込み力の
加算により上方の冷却ブロックに進むに従って冷却風の
流量を漸次増大化するように構成している。In order to achieve this object, in the cooling structure for an electronic device rack according to the present invention, a plurality of shell units each containing a plurality of print boards and each having ventilation holes on the upper and lower surfaces thereof are stacked vertically in a cabinet, and a fan unit having at least one fan is individually provided on each shelf unit to form individual cooling blocks, and cooling air is passed in a straight line from the bottom to the top of each shelf unit by the fan unit of each cooling block,
Furthermore, by utilizing the flow velocity of the cooling air, outside air is introduced through ventilation holes formed in the side of each fan unit and mixed into the cooling air, and the flow rate of the cooling air gradually increases as it proceeds to the upper cooling block by adding up the upward blowing force of each fan unit.
図面の簡単な説明
第１図は本発明に係る冷却構造の基本構成図、第２図は
本発明に係る冷却構造を備えた電子装置用架の構成図、
第３図は本発明に係る冷却構造を備えた電子装置用架の
別の例の構成図、第４図は本発明に係る冷却構造の基本
構成の斜視図、第５図は第４図に示した構成のファンユ
ニット部の断面図、第６図および第７図は本発明に係る
ファンユニットの格別の例の斜視図、第８図および第９
図は各々、従来構造および本発明構造の温度上昇実験の
説明図、第10図は上記実験効果のグラフ、第11図は本発
明構造を用いた別の実験の説明図、第12図は第11図の実
験結果のグラフ、第13図は本発明構造を用いたさらに別
の実験の説明図、第14図は第13図の実験結果のグラフ、
第15図は従来の電子装置用架の構成説明図、第16図は従
来の架の一部を示す斜視図、第17図はシェルフユニット
の発熱密度の増大を説明するための図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing the basic configuration of a cooling structure according to the present invention; FIG. 2 is a diagram showing the configuration of an electronic device rack equipped with a cooling structure according to the present invention;
FIG. 3 is a structural diagram of another example of an electronic device rack equipped with a cooling structure according to the present invention; FIG. 4 is a perspective view of the basic structure of the cooling structure according to the present invention; FIG. 5 is a cross-sectional view of the fan unit portion of the structure shown in FIG. 4; FIGS. 6 and 7 are perspective views of a special example of a fan unit according to the present invention; and FIGS. 8 and 9 are perspective views of a special example of a fan unit according to the present invention.
The figures are explanatory diagrams of temperature rise experiments for the conventional structure and the structure of the present invention, FIG. 10 is a graph of the effects of the above experiment, FIG. 11 is an explanatory diagram of another experiment using the structure of the present invention, FIG. 12 is a graph of the experimental results of FIG. 11, FIG. 13 is an explanatory diagram of yet another experiment using the structure of the present invention, and FIG. 14 is a graph of the experimental results of FIG. 13.
FIG. 15 is a diagram illustrating the configuration of a conventional electronic device rack, FIG. 16 is a perspective view showing a part of the conventional rack, and FIG. 17 is a diagram illustrating an increase in heat density of a shelf unit.
発明を実施するための最良の形態
第１図に本発明の基本構成を示す。複数のプリント板３
（１枚のみ図示）を収容した各シェルフユニット１の上
段にファンユニット９が設けられる。各シェルフユニッ
ト１にはその上下面に冷却空気を通過させるための通風
穴（図示しない）が設けられている。各ファンユニット
９内には複数のファン４（１つのみ図示）が吹出方向を
上に向けて水平に配置されている。各ファン４は支持枠
７に固定され、この支持枠７が、各ファンユニット９の
フレームを構成するサポートプレート６に装着される。
サポートプレート６の前端部および後端部にはファンユ
ニット９の前面（図の左側）および後面（図の右側）か
ら矢印Ｂのように外気を取り入れるための傾斜ガイド部
6aが設けられる。ファン４はその下段のシェルフユニッ
ト１から矢印Ｃのように空気を吸引してその上段のシェ
ルフユニット内に送り込むとともに各ファンユニット毎
に矢印Ｂのように外気を取り入れてこれをその上段のシ
ェルフユニット内に圧送する。このように１つのシェル
フユニット１に対し１つのファンユニット９を組合せて
１つの冷却ブロックを構成する。このような冷却ブロッ
クを複数段積層してキャビネット（図示しない）内に収
納し架を構成する。BEST MODE FOR CARRYING OUT THE INVENTION Fig. 1 shows the basic configuration of the present invention.
A fan unit 9 is provided on the upper level of each shelf unit 1, which houses fan units 4 (only one shown). Each shelf unit 1 has ventilation holes (not shown) on its top and bottom surfaces to allow cooling air to pass through. Within each fan unit 9, multiple fans 4 (only one shown) are arranged horizontally with their airflow direction facing upward. Each fan 4 is fixed to a support frame 7, and this support frame 7 is attached to a support plate 6 that forms the frame of each fan unit 9.
The front and rear ends of the support plate 6 are provided with inclined guide portions for taking in outside air as indicated by arrow B from the front (left side of the figure) and rear (right side of the figure) of the fan unit 9.
6a are provided. Fans 4 draw air from the shelf unit 1 below as shown by arrow C and send it into the shelf unit above, while each fan unit takes in outside air as shown by arrow B and pressurizes it into the shelf unit above. In this way, one cooling block is constructed by combining one fan unit 9 with one shelf unit 1. Multiple such cooling blocks are stacked and stored in a cabinet (not shown) to construct a rack.
第２図は本発明に係る冷却構造を備えた電子装置用架の
一例の構成図である。２つの架5a,5bが相互に背面を対
向させて床上に設けた空気通路46上に設置される。両架
5a,5b間には床上の空気通路46と連通する空気通路47が
形成される。各架5a,5bの前面には適当な外気導入用開
口（図示しない）を有する前面扉８が備わる。各架5a,5
bは複数段（この例では５段）のシェルフユニット１か
らなり、各シェルフユニット１の上段には少なくとも１
つの水平配置のファン４（１つのみ図示）を有するファ
ンユニット９が設けられる。各ファンユニット９は矢印
Ｃのように下側のシェルフユニット１から空気を吸引し
て上へ送り出すとともに各ファンユニットの前面および
後面より矢印B1,B2のように外気を取入れてこれを上側
のシェルフユニットに圧送する。即ち、冷却空気は床上
の空気通路46から最下段のシェルフユニット内に導入さ
れ矢印Ｃのように順次直線的に上段のシェルフユニット
を通過して最上段のシェルフユニットよりその上面に排
出されるとともに各段のシェルフユニットにおいて矢印
B1,B2のように外気が導入される。従って、上段に進む
ほど各シェルフで熱せられて温度上昇する矢印Ｃの冷却
空気は各シェルフ毎に導入される矢印B1,B2の外気によ
り冷却され上段側のシェルフの冷却空気の温度上昇は比
較的低く抑えられる。さらに、各シェルフ毎に外気が導
入されるため上段に進む程流量が多くなり風速が大きく
なる。このため、上段シェルフでの放熱効果が大きくな
り、冷却空気温度が多少上昇しても各シェルフ機能を安
定に保つために必要な冷却効果が得られる。冷却空気は
各シェルフ通過後上方に吹出され架の前面には排出され
ない。従って、架の前面にいる保守作業者に不快感を与
えず、またファンの回転による騒音も低く抑えられる。
各ファンは吹出方向を上方に向けた水平配置であるため
上下方向のスペースは少くてすみ、機器設置スペースを
高密度に効率良く利用できる。また、各シェルフユニッ
ト毎にファンユニットが設けられているため、１つのシ
ェルフユニットについてみればその上下にファンが備わ
ることになる。従って、一方のファンが故障等で停止し
ても冷却空気の強制対流作用はほとんど支障なく行われ
冷却作用の信頼性が増加する。また上下のシェルフ同士
でプリント板の厚さ、配列ピッチ等が異っていても通気
作用は円滑に行われるため、プリント板実装の自由度が
増加する。なお、発熱量のさほど大きくないシェルフユ
ニットに対してその直接上段のファンユニットを省略す
ることも可能である。2 is a diagram showing the construction of an example of an electronic device rack equipped with a cooling structure according to the present invention. Two racks 5a and 5b are installed on an air passage 46 provided on the floor with their backs facing each other.
An air passage 47 is formed between the racks 5a and 5b, which communicates with an air passage 46 on the floor. A front door 8 having an appropriate opening (not shown) for introducing outside air is provided on the front of each rack 5a and 5b.
b is made up of multiple shelves (five shelves in this example) and the top shelf of each shelf unit 1 has at least one
Each fan unit 9 has four horizontally arranged fans 4 (only one is shown). Each fan unit 9 sucks air from the shelf unit 1 below as indicated by arrow C and sends it upward, and also takes in outside air from the front and rear of each fan unit as indicated by arrows B1 and B2 and sends it under pressure to the shelf unit above. That is, the cooling air is introduced into the lowest shelf unit from an air passage 46 on the floor, passes through the upper shelf units in a straight line as indicated by arrow C, and is discharged from the top of the top shelf unit as indicated by arrows
Outside air is introduced as shown by B1 and B2 . Therefore, the cooling air (arrow C), which heats up at each shelf and rises in temperature as it moves higher, is cooled by the outside air (arrows B1 and B2) introduced at each shelf, keeping the temperature rise of the cooling air at the upper shelves relatively low. Furthermore, because outside air is introduced at each shelf, the flow rate increases and the wind speed increases as you move higher. This increases the heat dissipation effect at the upper shelves, and even if the cooling air temperature rises slightly, the cooling effect required to maintain stable shelf function is achieved. The cooling air is blown upward after passing through each shelf and is not exhausted to the front of the rack. This prevents discomfort to maintenance workers in front of the rack, and also keeps the noise caused by the fan rotation low.
Because each fan is positioned horizontally with its airflow facing upward, less space is required vertically, allowing for efficient, high-density use of the equipment installation space. Furthermore, because each shelf unit is equipped with a fan unit, each shelf unit has fans above and below it. Therefore, even if one fan stops due to a malfunction or other reason, the forced convection of cooling air continues with almost no disruption, increasing the reliability of the cooling effect. Furthermore, even if the thickness and arrangement pitch of printed circuit boards differ between the upper and lower shelves, ventilation is smooth, allowing for greater flexibility in printed circuit board installation. It is also possible to omit the fan unit directly above a shelf unit that does not generate much heat.
第３図は本発明に係る冷却構造を備えた架の別の例の構
成図である。この例においては、各架5a,5bの最上段の
シェルフユニット1aの上段にはファンユニットを設け
ず、ガイド板49を設けて熱気の排気方向を中央の空気通
路47内に向け、最上段シェルフユニット1aの上面には排
気されないように構成している。このような構成は、例
えば各架5a,5bの最上段スペース40にケーブル等を配設
する場合、ケーブルを排気熱から保護するために必要で
ある。その他の構成、作用、効果は第２図の例と同様で
ある。Fig. 3 is a structural diagram of another example of a rack equipped with a cooling structure according to the present invention. In this example, no fan unit is provided above the top shelf unit 1a of each rack 5a, 5b. Instead, a guide plate 49 is provided to direct the exhaust of hot air into the central air passage 47, preventing it from being exhausted to the top surface of the top shelf unit 1a. This configuration is necessary, for example, when cables or the like are routed in the top space 40 of each rack 5a, 5b, to protect the cables from exhaust heat. The other configurations, functions, and effects are the same as those of the example shown in Fig. 2.
ファンユニット９の一例の外観を第４図に示す。シェル
フユニット１内には各々縦置にされた複数のプリント板
３が並列して収容されている。そのシェルフユニット１
上に設置されたファンユニット９は、側枠10aおよび横
断枠10bからなるユニットフレーム10に４つのファン４
を水平配置で装着したものである。横断枠10bは第５図
に示すようにほぼ三角形断面であり、前記に複数の外気
取入口11を有し、上面に通気口12を有し、下面には外気
を上方へ案内し（矢印B1,B2）かつ下からの空気をファ
ンへ導く（矢印Ｃ）ための傾斜ガイド部13を設けられて
いる。各ファン４はフレーム4aを介してネジ等の適当な
手段で横断枠10bに固定される。An example of the appearance of the fan unit 9 is shown in Fig. 4. A plurality of printed circuit boards 3, each of which is vertically arranged, are housed in parallel within the shelf unit 1.
The fan unit 9 installed on the top has four fans 4 mounted on a unit frame 10 consisting of side frames 10a and cross frames 10b.
The cross frame 10b has a substantially triangular cross section as shown in Fig. 5, and has the above-mentioned multiple outside air intakes 11, a vent 12 on its upper surface, and an inclined guide portion 13 on its lower surface for guiding outside air upward (arrows B1 and B2 ) and for guiding air from below to the fans (arrow C). Each fan 4 is fixed to the cross frame 10b via the frame 4a by appropriate means such as screws.
第６図はファンユニット９の別の例の斜視図である。こ
の例においては、外気取入口11、通気口12および傾斜ガ
イド部13からなる前後の支持枠15とファン４とを予め一
体に形成して個々別々のカセット式ファン14を構成し、
このカセット式ファン14を矢印Ｄのようにユニットフレ
ーム10に対し前面から装着するように構成したものであ
る。このようなカセット構造を用いることによりファン
の着脱作業が容易になり保守、交換時等の作業性が向上
する。6 is a perspective view of another example of the fan unit 9. In this example, the front and rear support frames 15, each consisting of an outside air intake 11, a vent 12, and an inclined guide portion 13, are integrally formed with the fan 4 to form individual cassette-type fans 14.
This cassette type fan 14 is configured to be attached to the unit frame 10 from the front as shown by arrow D. By using such a cassette structure, the fan can be easily attached and detached, improving the workability during maintenance and replacement.
第７図にカセット式ファンの別の例を示す。この例にお
いては、第１図に示した断面形状の傾斜ガイド部6aを有
するサポートプレート６がユニットフレーム10に固定さ
れ、このサポートプレート６のガイドレール24に沿って
カセット式ファン14の側片22をスライドさせてカセット
を矢印Ｄのようにユニット９の前面から挿入する。サポ
ートプレート６にはファン４の位置に孔23が設けられ
る。25はカセット固定手段である。カセット固定手段
は、例えば２つの弾発的に係合するローラ間にカセット
側の突起を挾んで固定保持する機械的手段又はマグネッ
ト式手段であってもよい。カセット式ファン14は、外気
導入口11、引出し用つまみ17、電源供給用コネクタ19、
プリント板18等を有する前面パネル20をファン４ととも
に支持枠21に一体的に固定したものである。Figure 7 shows another example of a cassette fan. In this example, a support plate 6 having an inclined guide portion 6a with the cross-sectional shape shown in Figure 1 is fixed to the unit frame 10, and the side piece 22 of the cassette fan 14 is slid along the guide rails 24 of this support plate 6, and the cassette is inserted from the front of the unit 9 as shown by arrow D. A hole 23 is formed in the support plate 6 at the position of the fan 4. Reference numeral 25 denotes a cassette fixing means. The cassette fixing means may be, for example, a mechanical means in which a protrusion on the cassette side is sandwiched and fixed between two resiliently engaging rollers, or a magnetic means. The cassette fan 14 has an outside air inlet 11, a drawer knob 17, a power supply connector 19,
A front panel 20 having a printed circuit board 18 and the like is fixed integrally to a support frame 21 together with the fan 4 .
本発明構造の温度上昇についての実験を第８図から第10
図を用いて説明する。The temperature rise of the structure of the present invention was measured using the experiment shown in Figs.
This will be explained using the diagram.
第８図および第９図において、符号S1とS2はそれぞれ１
段目と２段目のシェルフユニットを示し、P6,P8,P16,P1
9,P20はプリント板を示すと同時にその配列番号を示
す。例えば、P6は図に向かって左から６列目のプリント
板、P8は８列目のプリント板を示し、他の符号もこれと
同じ要領で示している。そして、符号102は従来のファ
ンユニット、104はそのファン、９は本発明のファンユ
ニット、４はそのファンを示す、この場合の実験条件と
しては、従来例（第８図）と本発明の実施例（第９図）
の全消費電力（供給電力）、各プリント板の個別消費電
力及び発熱分布、及びファンユニットの送風量は全く同
一条件とした。このような条件で各プリント板上の周囲
温度を測定して、第10図に示すような実測値が得られ
た。In Figs. 8 and 9, symbols S1 and S2 are respectively
Showing the first and second shelf units, P6, P8, P16, P1
P9 and P20 indicate printed circuit boards and also their sequence numbers. For example, P6 indicates the printed circuit board in the sixth row from the left in the figure, P8 indicates the printed circuit board in the eighth row, and other symbols are indicated in the same manner. Symbol 102 indicates a conventional fan unit, 104 indicates its fan, 9 indicates the fan unit of the present invention, and 4 indicates its fan. The experimental conditions in this case were a conventional example (Fig. 8) and an embodiment of the present invention (Fig. 9).
The total power consumption (power supply), the individual power consumption and heat distribution of each printed circuit board, and the airflow rate of the fan unit were all kept the same. Under these conditions, the ambient temperature above each printed circuit board was measured, and the actual measured values shown in Figure 10 were obtained.
第10図は縦軸に温度上昇値（℃）をとり、横軸に測定位
置をとり、かつ黒丸は従来例の測定値、白丸は本発明実
施例の測定値を示している。同図から明らかなように、
従来例は１段目のシェルフユニットS1における温度上昇
値が実施例に比べて大幅に大であり、このためその消費
電力（供給電力）が制限される。これに対して実施例の
場合は温度上昇値が小であるため消費電力（供給電力）
を大とすることが可能、換言すると許容発熱量を増大化
することができる。また、２段目のシェルフユニットS2
においても実施例の温度上昇値は従来例よりも全体とし
て小となる。なお実施例の場合は、第９図において、実
際上はシェルフユニットS2上にさらに別のファンユニッ
トを配設する。従って、本発明構造の冷却効果は実際に
はさらに大きいものである。In Fig. 10, the vertical axis represents the temperature rise (°C) and the horizontal axis represents the measurement position, with black circles representing the measured values of the conventional example and white circles representing the measured values of the embodiment of the present invention. As is clear from the figure,
In the conventional example, the temperature rise value in the first shelf unit S1 is significantly larger than in the embodiment, and therefore the power consumption (power supply) is limited. In contrast, in the embodiment, the temperature rise value is small, so the power consumption (power supply) is limited.
In other words, the allowable heat generation can be increased.
Even in this case, the temperature rise value of the embodiment is smaller overall than that of the conventional example. In the case of the embodiment, in reality, another fan unit is disposed above shelf unit S2 in Figure 9. Therefore, the cooling effect of the structure of the present invention is actually even greater.
第11図と第12図は本発明に係る架装置60における温度上
昇の実測値の説明図である。第11図は架装置60の正面図
であって各シェルフユニット（30-1〜30-5）における消
費電力値（Ｗ）と本発明のファンユニット（20-1〜20-
4）を示す図、第12図は第11図の各段のシェルフユニッ
ト（30-1〜30-5）における温度上昇の実測値を示す図で
ある。11 and 12 are explanatory diagrams of the measured values of temperature rise in the rack device 60 according to the present invention. FIG. 11 is a front view of the rack device 60, showing the power consumption values (W) in each shelf unit (30-1 to 30-5) and the fan units (20-1 to 20-5) according to the present invention.
11), and FIG. 12 shows the actual measured values of temperature rise in the shelf units (30-1 to 30-5) on each level of FIG.
第11図において、消費電力は、各シェルフユニット30-1
〜30-4においてはそれぞれ620W（但し、プリント板１枚
当り最大45W）、シェルフユニット30-5においては312W
（但し、プリント板１枚当り最大13W）であり、合計279
2Wである。この消費電力に対して、本発明のファンユニ
ット（ファン４個搭載）20-1〜20-4を適用して、各シュ
ルフユニット30-1〜30-5における最高温度を測定して、
第12図に示すような実測値が得られた。In FIG. 11, the power consumption of each shelf unit 30-1
620W for each of the 30-4 (however, maximum 45W per printed circuit board), 312W for the shelf unit 30-5
(However, the maximum power consumption per printed circuit board is 13W.)
The power consumption is 2 W. The fan units (equipped with four fans) 20-1 to 20-4 of the present invention are applied, and the maximum temperatures in each shelf unit 30-1 to 30-5 are measured.
The measured values shown in FIG. 12 were obtained.
第12図は、縦軸に温度上昇値（℃）をとり、横軸に各段
のシェルフユニット（30-1〜30-5）をとってその測定値
を示している。同図において、温度上昇値25℃（図中斜
線部）は発熱部品の信頼度を保証するための許容値（設
計目標）を示している。同図が示すように、温度上昇値
は各シェルフユニット30-1〜30-5の下段から上段に進む
に従って漸次上昇し、最上段のシェルフユニット30-5に
おいて25℃に抑えられており、上下の各シェルフユニッ
トの温度差が小さい。このような温度上昇値を有する冷
却方式を用いれば、第11図に示すような架装置60におい
て、合計2792Wの電力を消費することができる。この消
費電力は従来の略２倍に相当するものである。Figure 12 shows the measured values, with the vertical axis representing temperature rise (°C) and the horizontal axis representing each shelf unit (30-1 to 30-5). In this figure, the temperature rise of 25°C (shaded area) represents the allowable value (design target) for ensuring the reliability of heat-generating components. As shown in this figure, the temperature rise gradually increases from the bottom to the top of each shelf unit 30-1 to 30-5, and is kept at 25°C in the top shelf unit 30-5, resulting in a small temperature difference between the upper and lower shelf units. Using a cooling method with such a temperature rise value, a rack system 60 such as that shown in Figure 11 can consume a total of 2792 W of power. This power consumption is approximately double that of conventional systems.
第13図および第14図を参照して、本発明構造における風
速についての実験結果について説明する。実験の架５は
第14図左側に示すような４段のシェルフユニット１の各
々の上段にファンユニット９を設けたものである。各フ
ァンユニット９には４つのファン（１段目00〜03、２段
目10〜13……で示す）が備わる。各シェルフユニット１
内には32枚のプリント板３が収容され、左から19番目の
プリント板について第13図に示すＡ〜Ｌの各位置での風
速を測定した。26はプリント板上に搭載された電子部品
である。測定プリント板の位置はほぼ左から３番目のフ
ァン（02,12,22,32）の下側である。測定結果のグラフ
はグラフの左側に図示した４段の架に対応して示してあ
る。各段のシェルフユニットにおいて、ファンを正常動
作させた状態（実線折れ線）とファンを１台停止させた
状態（破線折れ線）での結果を示している。右側に示し
た数値は各測定結果の平均値である。グラフから分るよ
うに、上段に進む程風速が大きくなり、従って放熱が効
果的に行われ冷却空気の温度が上昇しても装置機能を安
定に保持するのに必要な冷却作用が達成される。The experimental results of the wind speed in the structure of the present invention will be explained with reference to Figs. 13 and 14. The experimental rack 5 has four shelf units 1 as shown on the left side of Fig. 14, each of which has a fan unit 9 on the top shelf. Each fan unit 9 has four fans (indicated as 00-03 on the first shelf, 10-13 on the second shelf, etc.).
Thirty-two printed circuit boards 3 were housed inside the cabinet, and the airflow speed was measured for the 19th printed circuit board from the left at positions A through L shown in Figure 13. Reference numeral 26 denotes electronic components mounted on the printed circuit board. The measured printed circuit board was located approximately below the third fan from the left (02, 12, 22, 32). A graph of the measurement results is shown on the left side of the graph, corresponding to the four shelves shown. The results for each shelf unit are shown with the fans operating normally (solid broken line) and with one fan stopped (dashed broken line). The values on the right are the average values of the measurement results. As can be seen from the graph, the airflow speed increases with increasing levels, resulting in more effective heat dissipation and achieving the cooling required to maintain stable equipment function even when the cooling air temperature rises.
産業上の利用可能性
本発明は、プリント板収容シェルフからなる架により構
成した通信装置、交換装置等の電子装置産業において適
用できる。INDUSTRIAL APPLICABILITY The present invention is applicable in the electronic device industry to communication devices, switching devices, and the like, which are constructed with racks made up of printed board storage shelves.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−132395（ＪＰ，Ａ) 実開 昭57−6296（ＪＰ，Ｕ) 特公 昭56−2439（ＪＰ，Ｂ２) 実公 昭55−27279（ＪＰ，Ｙ２) ──────────────────────────────────────────────────── Continued from the front page (56) References: JP Patent Publication No. 132395 (JP, A) JP Utility Model Publication No. 6296 (JP, U) JP Patent Publication No. 2439 (JP, B2) JP Utility Model Publication No. 27279 (JP, Y2)
Claims (6)
それぞれに通風穴を有するシェルフユニットをキャビネ
ット内に複数個上下方向に積み重ねて成る電子装置用架
の冷却構造において、上記各シェルフユニット上に少く
とも１つのファンを有するファンユニットを個別に設け
て個々の冷却ブロックを形成し、これら各冷却ブロック
のファンユニットによって冷却風を上記各シェルフユニ
ットの下方から上方に向けて直線状に通過させ、かつ該
冷却風の流速を利用して上記各ファンユニットに形成し
た通風穴より外気を導入して上記冷却風に混入し、上記
各ファンユニットの上方への吹込み力の加算により上方
の冷却ブロックに進むに従って冷却風の流量を漸次増大
化するように構成したことを特徴とする電子装置用架の
冷却構造。[Claim 1] A cooling structure for an electronic equipment rack, which is composed of a plurality of shelf units each containing a plurality of printed circuit boards and each having ventilation holes on the top and bottom surfaces thereof stacked vertically within a cabinet, wherein a fan unit having at least one fan is individually provided on each shelf unit to form individual cooling blocks, and the fan unit of each cooling block causes cooling air to pass in a straight line from the bottom to the top of each shelf unit, and the flow rate of the cooling air is taken in through the ventilation holes formed in each fan unit by utilizing the flow rate of the cooling air and mixed with the cooling air, and the flow rate of the cooling air gradually increases as it proceeds to the upper cooling blocks by adding up the upward blowing force of each fan unit.
を具備しファンユニットのフレームに対し前面より個別
に挿抜可能なカセット式ファンとして構成した請求の範
囲第１項記載の電子装置用架の冷却構造。2. The cooling structure for an electronic device rack according to claim 1, wherein each of said fan units is provided with an air hole for introducing outside air and is configured as a cassette type fan that can be individually inserted and removed from the front of the fan unit frame.
ト式ファンに共通の外気導入用傾斜ガイド部を有するサ
ポートプレートを含み、前記カセット式ファンを該サポ
ートプレート上に装着した請求の範囲第２項記載の電子
装置用架の冷却構造。[Claim 3] A cooling structure for an electronic device rack as described in claim 2, wherein the frame of the fan unit includes a support plate having an inclined guide portion for introducing outside air common to each cassette-type fan, and the cassette-type fan is mounted on the support plate.
ンを個別に挿抜可能なガイドレールおよび挿入したカセ
ット式ファンの自動ロック手段を有する請求の範囲第３
項記載の電子装置用架の冷却構造。4. The support plate has guide rails that allow each cassette fan to be inserted and removed individually, and an automatic locking means for the inserted cassette fan.
Item 4. A cooling structure for an electronic device rack.
段のシェルフユニットの上段には、ファンユニットに代
えて、架内を通過した冷却空気を最上段シェルフユニッ
トの上面以外に案内するための排気案内板を設けた請求
の範囲第１項記載の電子装置用架の冷却構造。[Claim 5] A cooling structure for an electronic device rack described in claim 1, in which, instead of a fan unit, an exhaust guide plate is provided on the upper level of the top shelf unit among the multiple shelf units to guide cooling air that has passed through the rack to a location other than the top surface of the top shelf unit.
該シェルフユニットの直接上段のファンユニットを省略
可能とした請求の範囲第１項記載の電子装置用架の冷却
構造。6. The cooling structure for an electronic device rack according to claim 1, wherein the fan unit directly above each shelf unit can be omitted depending on the amount of heat generated by the shelf unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60-505110A JPH0685471B2 (en) | 1984-11-15 | 1985-11-15 | Cooling structure for electronic equipment rack |
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59-241217 | 1984-11-15 | ||
| JP24121784 | 1984-11-15 | ||
| JP60-20931 | 1985-02-07 | ||
| JP2093185 | 1985-02-07 | ||
| JP3017985 | 1985-02-20 | ||
| JP60-30179 | 1985-02-20 | ||
| PCT/JP1985/000640 WO1986003089A1 (en) | 1984-11-15 | 1985-11-15 | Cooling structure of a rack for electronic devices |
| JP60-505110A JPH0685471B2 (en) | 1984-11-15 | 1985-11-15 | Cooling structure for electronic equipment rack |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO1986003089A1 JPWO1986003089A1 (en) | 1986-08-07 |
| JPH0685471B2 true JPH0685471B2 (en) | 1994-10-26 |
| JPH0685471B1 JPH0685471B1 (en) | 1994-10-26 |
Family
ID=27283229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60-505110A Expired - Lifetime JPH0685471B2 (en) | 1984-11-15 | 1985-11-15 | Cooling structure for electronic equipment rack |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4774631A (en) |
| EP (1) | EP0236501B1 (en) |
| JP (1) | JPH0685471B2 (en) |
| KR (1) | KR900001842B1 (en) |
| DE (1) | DE3585447D1 (en) |
| WO (1) | WO1986003089A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5527279Y2 (en) * | 1975-06-24 | 1980-06-30 | ||
| JPS5333361A (en) * | 1976-09-08 | 1978-03-29 | Nippon Telegraph & Telephone | Densely mounted electronic device |
| JPS6011830B2 (en) * | 1977-05-24 | 1985-03-28 | 日本電気株式会社 | Cooling device for electronic parts |
| JPS5527279A (en) * | 1978-08-18 | 1980-02-27 | Toyo Boseki | Board material continuous treatment method and its treatment device |
| GB2045537B (en) * | 1979-03-30 | 1983-06-15 | Lundqvist G | Apparatus for gaseous cooling of equipment |
| JPS5927675Y2 (en) * | 1980-06-12 | 1984-08-10 | 沖電気工業株式会社 | Drawer type fan unit structure |
| JPS5899821A (en) * | 1981-12-08 | 1983-06-14 | Toshiba Corp | Cooling fan controlling system |
| JPS60132395A (en) * | 1983-12-20 | 1985-07-15 | 三菱電機株式会社 | Cooler |
-
1985
- 1985-11-15 WO PCT/JP1985/000640 patent/WO1986003089A1/en not_active Ceased
- 1985-11-15 DE DE8585905881T patent/DE3585447D1/en not_active Expired - Lifetime
- 1985-11-15 EP EP85905881A patent/EP0236501B1/en not_active Expired - Lifetime
- 1985-11-15 JP JP60-505110A patent/JPH0685471B2/en not_active Expired - Lifetime
- 1985-11-15 KR KR1019860700469A patent/KR900001842B1/en not_active Expired
- 1985-11-15 US US06/885,839 patent/US4774631A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US4774631A (en) | 1988-09-27 |
| KR900001842B1 (en) | 1990-03-24 |
| EP0236501B1 (en) | 1992-02-26 |
| WO1986003089A1 (en) | 1986-05-22 |
| DE3585447D1 (en) | 1992-04-02 |
| EP0236501A1 (en) | 1987-09-16 |
| KR880700622A (en) | 1988-03-15 |
| JPH0685471B1 (en) | 1994-10-26 |
| EP0236501A4 (en) | 1989-03-14 |
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