JPH0686673B2 - Plating equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a plating treatment facility for continuously supplying a long strip-shaped material such as a lead frame used in an IC device to a plating treatment tank for plating. Regarding

[Conventional technology]

In the manufacturing process of a lead frame of an IC device, in order to properly perform wire bonding, die bonding, etc., metal plating is applied to the surfaces of pads, inner leads and other regions after the mold is manufactured. Because of this plating process,
A plurality of plating baths, pickling baths, water washing baths and degreasing baths are arranged in the production line, and materials are passed in the order of treatment.

When the material is a long strip, continuous treatment is possible by passing through a treatment line instead of immersing the individual products one by one in a plating bath or the like. For example, conventionally, the work is started by inserting the tip of the strip-shaped material into the processing tank and passing it through, and hanging the tip of the material on an uncoiler or the like arranged at the end of the line. After the setup, the material is continuously passed at a uniform speed, and the plated material is wound on an uncoiler to prepare for the next step.

[Problems to be Solved by the Invention]

However, in the case of manufacturing a lead frame of an IC device, for example, if the line length exceeds 10 m, it is inevitable that a large number of lead frames become defective.
This is because, as a setup work, a material having a length substantially equal to the line length is laid over the uncoiler, and one reason is that the plating process cannot be substantially performed in this setup process. Therefore, the yield is significantly reduced, and it takes time to set up from setup to the start of processing, which limits productivity improvement.

In response to such a problem in production, a dummy frame has been used in recent years to improve the yield. The dummy frame is made of scrap or the like and is used by connecting to the tip of the lead frame and having a length approximately equal to the plating line. If this dummy frame is used, the lead frame will not be wasted for setup, and the yield can be improved.

However, since it is necessary to connect the lead frame and the dummy frame and to connect the lead frame to the on-coiler or the like, the worker must always be engaged in the line. Further, when the lead frames are continuously processed, the work of connecting the succeeding frame to the preceding one also requires manpower. Thus, in terms of productivity, there is no improvement compared with the conventional manufacturing.

Therefore, it is an object of the present invention to improve the productivity as well as the yield.

[Means for Solving the Problems]

The present invention arranges a plurality of plating treatment tanks in a line, arranges a feeding device for the material to be plated before the entrance to each plating treatment tank, and the feeding device in which the tip end portion in the path direction of the material to be plated is the upstream. When it reaches the next downstream feeding device after passing through, the control system is provided to stop the driving of the upstream feeding device and at the same time to start the driving of the downstream feeding device. It is characterized in that a feeding device is provided on the side, and the feeding device at the most upstream is continuously driven by the control system for a period during which the material to be plated is removed.

〔Example〕

Hereinafter, the features of the present invention will be specifically described with reference to the embodiments shown in the drawings.

FIG. 1 is a perspective view showing an example in which the feeding device of the present invention is arranged on a plating line of a lead frame.

In the figure, the lead frame A is conveyed in a standing posture such that the pressing direction of the mold is horizontal, and is fed into the processing bath B. The feeding device is provided near the entrance of the processing tank B by the base 1, and the feeding drive roll 2 and the shift roll 3 are provided on the base 1 with the pass line of the lead frame A interposed therebetween.

The feed drive roll 2 transmits the rotation of the output shaft of the drive motor 4 provided on the base 1 by the pulley 4a and the belt 4b,
Rotate in the direction of the arrow in the figure as the proper peripheral speed. Then, a collar 2a using an elastic body such as rubber is wound around the peripheral surface of the feed drive roll 2 so as not to damage the lead frame A, and the peripheral surface of the collar 2a matches the pass surface of the lead frame A. Have a structure.

On the other hand, similarly to the feed drive roll 2, the shift roll 3 also has a collar 3a wound around its peripheral surface, and is rotatable around its shaft portion 3b. The base 1 is provided with a shift cylinder 5, and the lower end of the shaft portion 3b is fixed to a block 5b provided at the tip of the actuator 5a. The stroke direction of the actuator 5a is orthogonal to the pass line of the lead frame A, and the centers of the feed drive roll 2 and the shift roll 3 are located on line segments orthogonal to the pass line. With such a configuration, the collars 2a and 3a of the feed drive roll 2 and the shift roll 3 can carry the lead frame A while sandwiching it.

To feed the lead frame A, the drive motor 4 is actuated and at the same time, the actuator 5a of the shift cylinder 5 is advanced to the pass line side to feed the feed drive roll 2 and the shift roll 3.
This is possible only when the lead frame A is clamped by. That is, the collar 2a of the feed drive roll 2 is always in contact with the lead frame A, but does not press the lead frame A. Therefore, even if the feed drive roll 2 rotates, the lead frame A and the collar 2a slip and the lead frame A is not fed. On the other hand, the shift cylinder 5 is operated to shift the shift roll 3
When the collar 3a is abutted against the lead frame A, the feed drive roll 2 strongly sandwiches the lead frame A with the shift roll 3, and the feed is given to the lead frame A without slipping.

FIG. 2 is a schematic block diagram of the lead frame A plating process line. In the figure, degreasing, Cu plating, and water washing are performed in the first treatment tank 10, followed by the second treatment.
The respective treatments are performed by the treatment tank 11 and the third treatment tank 12.

FIG. 3 is a schematic view showing the arrangement of the feeding device for the first, second and third processing tanks 10, 11, 12. As shown in the figure, four sets of feeding devices are arranged for three processing tanks 10 to 12, and the first stand I, the second stand II, the third stand III, and the fourth stand are arranged in this order from the entry side of the lead frame A. IV is laid out. The feeding devices provided in each of these stands I to IV have the structure shown in FIG. Then, the operation of the drive motor 4 and the shift cylinder 5 is controlled by the control unit C that suppresses the operation of each stand with respect to the position of the lead frame A.

In FIG. 3 (a), the lead frame A is in the process of entering the first processing tank 10, and at this time, only the feeding device of the first stand I is operated. That is, the lead frame A is the first
When loaded into the feeding device of the stand I, the drive motor 4 operates and at the same time the actuator 5a of the shift cylinder 5
Drive and feed both sides of lead frame A to drive roll 2
And the shift roll 3 are sandwiched. Therefore, the feed of the feed drive roll 2 is given to the lead frame A, and the lead frame A is conveyed toward the second processing tank 11.

After this, when the tip of the lead frame A reaches the second stand II as shown in FIG. 3 (b), the feeding device is actuated and feed is given by the feed drive roll 2 and the shift roll 3. At the same time, the actuator 5a of the shift cylinder 5 moves backward in the first stand I, and the feed is not transmitted to the lead frame A. After that, when the lead frame A reaches the third stand III toward the third processing tank 12, the second stand II is removed from the feed drive, and at the same time, the third stand III participates in the feed drive. Fourth stand I
The same is true when the lead frame A reaches V. That is, when the lead frame A advances and its tip enters the downstream stand, this stand gives the feed, and the stand on the upstream side moves away from the feed drive. Needless to say, the operation of each stand is performed by the control of the controller C while detecting the position of the lead frame A.

Also, after sending out the lead frame A, FIG. 3 (c)
When a new lead frame A is supplied to the line as described above, the feeding device of the first stand I operates as illustrated. And the lead frame A is the 4th stand IV.
While it is not getting out, the feeding devices of the first stand I and the fourth stand IV both operate.

By disposing the feeding device before each processing tank and after the last processing tank, the lead frame A can be passed while being continuously flowed. Therefore, it is not necessary to use a dummy frame or the like as in the prior art, or to connect the preceding and succeeding lead frames A to each other, and productivity can be improved. Further, when the dummy frame is used, it is unavoidable that the plating solution is affected, but since only the lead frame A passes, such a problem is also solved. Furthermore, since it is possible to pass even lead frame A shorter than the plating line,
It is also advantageous for small-scale production and sample collection, and the yield is significantly improved.

Incidentally, in the Ag plating performed in the second processing tank 11, the lead frame A needs to be intermittently fed unlike the other plating treatments. Therefore, a loop is formed in the lead frame A between the first processing tank 10 and the second processing tank 11 and between the second processing tank 11 and the third processing tank 12 to form the first and third processing tanks 10, 10. Allows connection with 12 continuous feeds.

As a device for forming a loop on the lead frame A, for example, the device shown in FIG. 4 can be adopted. This is the loop chamber
The lead frame A is passed through the inside of 20, and the lead frame A is removed from the pass line by the jet pressure of water during this pass to form a loop. A water supply pipe 21 is provided in the loop chamber 20 along the pass line of the lead frame A, and an injection hole 21a is formed in the peripheral wall thereof.
Open. Further, a pair of guides 22a and 22b are arranged on both sides of the pass line, and the guide 22b separated from the water supply pipe 21 has a structure capable of turning in a horizontal position above the pass line as shown in the figure. Let Normally, the guide 22b is also set at a position sandwiching the pass line so as to face the other guide 22a, but when the loop is formed in the lead frame A, it is retracted to the upper side as shown in the drawing. Further, inside the loop chamber 20, a plurality of loop detection sensors 23 for detecting a loop of the lead frame A are provided. These loop detectors 23 detect the distance to the lead frame A, etc. and output a signal to the control unit C.
Enter into and figure out the loop situation.

In the loop chamber 20, the injection hole 21a of the water supply pipe 21
Due to the water pressure of the water jetted from the lead frame A, the lead frame A warps in an arc shape as shown in the figure, and a loop can be formed before and after the second processing tank 11. Then, when this loop is detected by the loop detection sensor 23, a buffer is obtained between the upstream and downstream feed rates, so that the upstream feed device of the second processing tank 11, that is, the second stand II operates. Then, the lead frame A is intermittently fed.

In addition, although the plating line of the lead frame of the IC device has been described in the embodiment, it is needless to say that the feeding device of the present invention can be used for the treatment of a long strip-shaped material.

〔The invention's effect〕

In the present invention, the material to be plated, which sequentially enters the feeding device provided in front of the inlets of the plating treatment tanks of a plurality of stages, can be conveyed while feeding the tip end side thereof, and further, the feed provided at the rear side of the exit of the final stage. Whenever the machine is operating, the upstream feeder operates to feed the subsequent material to be plated. For this reason, it is not necessary to use a dummy frame or hang it around an uncoiler simply by supplying the plated material to the line in order, and the yield can be improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an outline of a feeding device of the present invention, FIG. 2 is a schematic block diagram showing an example of a plating processing line, FIG. 3 is a path of a material to be plated by the feeding device, and FIG. 4 is a loop. 1 shows an outline of a chamber. 1: Base, 2: Feed drive roll 2a: Color, 3: Shift roll 3a: Base, 3b: Shaft part 4: Drive motor, 4a: Pulley 4b: Belt, 5: Shift cylinder 5a: Actuator, 5b: Block 10: First treatment tank, 11: Second treatment tank 12: Third treatment tank, 20: Loop chamber 21: Water supply pipe, 21a: Injection holes 22a, 22B: Guide, 23: Loop detection sensor A: Lead frame (material to be plated) ) B: Processing tank, C: Control unit

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 23/50 D 9272-4M // C21D 9/56 F

Claims (1)

[Claims] 1. A plurality of plating treatment tanks are arranged in a line, and a feed device for the material to be plated is arranged before the entrance to each plating treatment tank, and the tip end portion in the path direction of the material to be plated is fed upstream. A control system is provided for stopping the driving of the upstream feeding device and simultaneously starting the driving of the downstream feeding device when reaching the next feeding device on the downstream side through the device. A plating treatment facility, which is provided with a feeder on the rear side and serves as a system in which the most upstream feeder is continuously driven by the control system while the material to be plated is removed from the feeder.