JPH0687475B2 - Substrate table - Google Patents

Description

TECHNICAL FIELD The present invention relates to a substrate mounting table.

(Prior Art) Conventionally, in the process of manufacturing a substrate such as a semiconductor wafer, the electrical characteristics of the manufactured wafer are inspected and measured by a probe device. Here, the semiconductor wafers have different inspection and measurement methods for each product type, and depending on the product type, there are some that heat the semiconductor wafer to perform the inspection and measurement. In such a case, the semiconductor wafer is usually heated by the heating mechanism provided on the mounting table on which the semiconductor wafer is mounted.
Further, in order to perform the inspection measurement at room temperature after performing the inspection measurement on the heated mounting table, it is necessary to cool the heated mounting table.

As described above, a mounting table having a heating mechanism and a cooling mechanism is known from Japanese Patent Laid-Open No. 55-44931.

(Problems to be Solved by the Invention) However, the mounting table having the heating / cooling mechanism as described above has a problem in that the structure becomes complicated and the mounting table itself becomes large. Further, since the mounting table already owned cannot be used, it is necessary to newly manufacture an expensive mounting table, which lacks versatility.

The present invention has been made to improve the above points,
(EN) Provided is a substrate mounting table capable of easily cooling the mounting table and shortening the cooling time.

〔The invention's effect〕

(Means for Solving the Problems) In order to solve the above problems, according to the present invention, there is provided a substrate mounting table for mounting a substrate on a mounting surface, wherein the substrate mounting table is provided to heat the substrate. Heating means, an air channel provided in the substrate mounting table and opened to the mounting surface, and the air channel are provided so as to be able to communicate with each other via a channel switching means, and the substrate is mounted on the mounting surface. An exhaust unit for vacuum adsorption to the air passage, and an air blowing unit for communicating with the air flow path through the flow path switching unit to send air to the mounting surface to cool the substrate mounting table. A substrate mounting table is provided in which the path switching means is configured to selectively switch and communicate the air flow path with either the exhaust means or the air blowing means.

Furthermore, according to the present invention, it is preferable that the air blown out by the blower is cooling air, and the substrate can be heated to 150 ° C. by the heating unit, and the flow path switching unit is It is preferably a solenoid valve.

(Operation) According to the present invention, air is circulated in the air flow passage provided in the substrate mounting table to cool the substrate mounting table.
The mounting table can be easily cooled, and the cooling time can be shortened. Moreover, since the air flow passage for circulating the cooling air and the air flow passage for vacuum-adsorbing the substrate on the mounting surface are used in common, the structure of the apparatus can be simplified.

(Example) Next, one example in which the substrate mounting table of the present invention is mounted on a probe device will be described with reference to the drawings.

As shown in FIG. 2, the probe device (1) is composed of a cassette housing section (4) and an inspection and measurement section.
Substrates such as semiconductor wafers (2) are wafer cassettes (3)
Twenty-five pieces are installed at a predetermined interval. The cassette (3) accommodating the wafer (2) is carried into the cassette accommodating portion (4).

Wafers (2) to be inspected and measured from the cassette housing (4) are taken out one by one by vacuum tweezers (not shown) or the like, and a wafer pre-positioning stage (5).
Be transported to.

After the orientation flat of the wafer (2) is pre-positioned by the preliminary positioning stage (5) to an accuracy of about ± 1 ° with respect to the reference, the wafer (2) is transferred to a mounting table, for example, a measurement stage (6), and vacuumed. The back surface of the wafer (2) is suction-held by the suction mechanism. This transfer is performed by vacuum suction of the back surface of the wafer (2).

The wafer (2) thus transferred to the measurement stage (6) is positioned with higher accuracy by using a pattern recognition mechanism using a CCD camera or a laser recognition mechanism. After this accurate positioning, probe card (7)
The wafer (2) is automatically lifted from below to the tip of the probe needle (8) and soft-touched to measure the electrical characteristics of the wafer (2).

When performing this measurement, depending on the type of wafer, the wafer (2)
It is necessary to set to the heating state and measure. The heating of the wafer (2) is performed by heating the measurement stage (6) on which the wafer (2) is placed and utilizing heat conduction from the measurement stage (6) to the wafer (2). The measurement stage (6) can be heated up to, for example, about 150 ° C. by the heating mechanism (9) provided on the measurement stage (6).

Next, after measuring the wafer (2) in the heated state, when the wafer (2) is measured at a room temperature state, for example, about 25 ° C., the measurement stage (6) in the heated state is cooled and returned to the room temperature state. There is a need.

According to the present invention, this cooling is performed by utilizing, for example, the above vacuum suction mechanism. Vacuum suction mechanism is used for wafer (2)
A hole (11) is provided on a mounting surface (10) on which the air is placed, and an air flow passage (12) corresponding to the hole (11) is provided in a mounting table, for example, a measurement stage (6), and the air flow passage is provided. (12) and the vacuum mechanism (13) are connected.

According to the present invention, this vacuum suction mechanism can be used for the cooling mechanism. That is, the tube (14) from the air flow passage provided inside the measurement stage (6). A tube (15) from the vacuum mechanism (13) and a tube (17) from the air delivery mechanism (16) are connected to a switching valve, for example, a solenoid valve (18) in a 3-port state. Solenoid valves here (18)
The vacuum suction mechanism and the cooling mechanism can be switched and used by operating.

Next, the operation of the mounting table will be described.

First, at the time of inspection measurement, a substrate such as a semiconductor wafer (2) is placed on a mounting table such as a measuring stage (6). At this time, the back surface of the wafer (2) is suction-held, and the suction-holding is performed by the hole (11) provided on the mounting surface (10) of the measurement stage (6) and the vacuum mechanism (13) by the tube ( 15)
And the solenoid valve (18), the tube (14) and the air flow passage (12) are connected to each other, so that the vacuum mechanism (13) is operated to vacuum-adsorb the wafer (2) through the hole (11). Can be performed by At the same time as this adsorption, the wafer (2) is heated to, for example, about 150 ° C. by the heating mechanism (9) provided on the measurement stage (6), and then the electrical characteristics of the wafer (2) are inspected and measured by a predetermined operation. Is executed.

Next, after measuring the wafer (2) in a heated state, the measurement stage (6) is set to a room temperature state. In this setting, after the wafer (2) is transferred from the measurement stage (6) to another position, the solenoid valve (18) is switched and air is sent from the air delivery mechanism (16) to the tube (17) and solenoid valve (18). ) And the tube (14) to the measurement stage (6), the air is circulated in the air flow passage (12) provided in the measurement stage (6), and the air is further ejected from the hole (11). . In this way, the cooling time can be shortened as compared with the natural cooling by circulating the air in the measurement stage (6) and forcibly cooling it.

FIG. 3 shows a comparison between the forced cooling and the natural cooling described above. When the setting temperature of the mounting table is 90 ° C, the room temperature is 21 ° C, the mounting table room temperature is 22.5 ° C, and the vertical axis is the mounting table temperature (° C) and the horizontal axis is the elapsed time (minutes), (A) is naturally cooled. ,
(B) is forced cooling. It takes 60 minutes or more for the natural cooling (A) to cool the mounting table from the set temperature of 90 ° C. to the room temperature of 22.5 ° C., whereas in the case of the forced cooling (B), the cooling is completed in about 30 minutes. That is, in the case of forced cooling, the mounting table can be cooled in about half the time as compared with natural cooling.

The present invention is not limited to the above embodiment, and the cooling time can be further shortened by using cooling air as the air. Further, the air has only to flow in the mounting table, and it is not always necessary to eject the air from the mounting table. Furthermore, when air is circulated inside the mounting table and air is blown from the outside toward the mounting table, the cooling effect is further enhanced.

(Effects of the Invention) As described above, according to the substrate mounting table of the present invention, even when the substrate is heated by the heating means provided therein and the mounting surface of the substrate mounting table becomes high in temperature, It is possible to easily cool the substrate mounting table by sending out air through the vacuum suction air flow passage provided in the substrate mounting table. Therefore, it is possible to provide the state of the substrate that is not heated in a short time by newly mounting the substrate on the substrate mounting table that is cooled in a short time compared to natural cooling,
It is possible to provide a substrate mounting table that is convenient for manufacturing and inspection in which the temperature of the mounted substrate is different.

Furthermore, since the air flow passage for vacuum-adsorbing the substrate on the mounting surface and the air flow passage for circulating the air for cooling the substrate mounting table are also used in the air flow path opened on the mounting surface. The structure of the device can be simplified.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a substrate mounting table for explaining an embodiment of the present invention, FIG. 2 is a diagram of a probe device equipped with the mounting table of FIG. 1, and FIG. 3 is a mounting table of FIG. It is a figure which shows the cooling period of. 6 ... Measuring stage 9 ... Heating mechanism 11 ... Hall 12 ... Air flow passage 16 ... Air delivery mechanism 18 ... Solenoid valve

Claims (4)

[Claims] 1. A substrate mounting table for mounting a substrate on a mounting surface, the heating means being provided on the substrate mounting table for heating the substrate, and being mounted on the substrate mounting table on the mounting surface. An open air flow path, an exhaust means provided so as to be able to communicate with the air flow path via a flow path switching means, and a vacuum means for adsorbing the substrate on the mounting surface by vacuum, and the flow path switching means in the air flow path And a blower means for sending air to the placement surface to cool the substrate mounting table, the flow path switching means having the air flow passage through the exhaust means and the blower means. And a substrate mounting table configured to selectively communicate with either one of the two. 2. The substrate mounting table according to claim 1, wherein the air blown out by the blower means is cooling air. 3. The substrate according to claim 1, wherein the substrate can be heated up to 150 ° C. by the heating means.
The substrate mounting table according to item 2 or item 2. 4. The substrate mounting table according to claim 1, wherein the flow path switching means is an electromagnetic valve.