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JPH0688309B2 - Method for rapid film formation of polyamide-based multilayer film - Google Patents
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JPH0688309B2 - Method for rapid film formation of polyamide-based multilayer film - Google Patents

Method for rapid film formation of polyamide-based multilayer film

Info

Publication number
JPH0688309B2
JPH0688309B2 JP61302422A JP30242286A JPH0688309B2 JP H0688309 B2 JPH0688309 B2 JP H0688309B2 JP 61302422 A JP61302422 A JP 61302422A JP 30242286 A JP30242286 A JP 30242286A JP H0688309 B2 JPH0688309 B2 JP H0688309B2
Authority
JP
Japan
Prior art keywords
film
polyamide
specific resistance
layer
cooling roll
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61302422A
Other languages
Japanese (ja)
Other versions
JPS63154326A (en
Inventor
純吉 渡辺
健二 坪内
晃 榎田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unitika Ltd
Original Assignee
Unitika Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitika Ltd filed Critical Unitika Ltd
Priority to JP61302422A priority Critical patent/JPH0688309B2/en
Publication of JPS63154326A publication Critical patent/JPS63154326A/en
Publication of JPH0688309B2 publication Critical patent/JPH0688309B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/30Extrusion nozzles or dies
    • B29C48/305Extrusion nozzles or dies having a wide opening, e.g. for forming sheets
    • B29C48/307Extrusion nozzles or dies having a wide opening, e.g. for forming sheets specially adapted for bringing together components, e.g. melts within the die
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/16Articles comprising two or more components, e.g. co-extruded layers
    • B29C48/18Articles comprising two or more components, e.g. co-extruded layers the components being layers
    • B29C48/21Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明はポリアミド系高層フィルムの製造方法に関する
もので,フィルムに特殊な機能を与えるため,比抵抗の
低い層の設けられた多層ポリアミド系フィルムを静電ピ
ニング法により,冷却ロールに密着させて急冷する方法
を提供するものである。
Description: TECHNICAL FIELD The present invention relates to a method for producing a polyamide-based high-layer film, and a multilayer polyamide-based film provided with a layer having a low specific resistance in order to impart a special function to the film. The method provides a method of rapidly cooling by adhering to a cooling roll by electrostatic pinning.

(従来の技術) ポリアミド系フィルムを静電ピニング法で急冷製膜する
方法は従来から知られており,たとえば特公昭59-23270
号公報にはポリアミド系フィルムを冷却するに際し,ス
トリーマコロナ状態のコロナ放電を行い,高電流をフィ
ルムに付与して冷却ロールに密着させる方法が記載され
ている。
(Prior Art) A method of rapidly forming a polyamide film by electrostatic pinning has been known, for example, Japanese Patent Publication No. 59-23270.
The publication describes a method of corona discharge in a streamer corona state when cooling a polyamide-based film and applying a high current to the film to bring it into close contact with a cooling roll.

また,本発明者等は特願昭59-217521号(特公平1−463
04号公報)で作業の安全性とフィルムの均質性を改良す
るために,ストリーマ状態に致らない低電流放電でポリ
アミド系フィルムを静電ピニングする方法,すなわち冷
却ロール表面に絶縁破壊電圧5KV以上の電気絶縁性被覆
を設け,見掛けの印加密度2μC/cm2以下の電荷をフィ
ルムに付与する方法を提案している。
In addition, the inventors of the present invention filed Japanese Patent Application No. 59-217521 (Japanese Patent Publication No. 1-463).
No. 04), in order to improve work safety and film homogeneity, a method of electrostatically pinning a polyamide-based film with a low current discharge that does not reach a streamer state, that is, a dielectric breakdown voltage of 5 KV or more on the surface of a cooling roll. We propose a method of applying an electric insulating coating to the film to impart an electric charge of an apparent applied density of 2 μC / cm 2 or less to the film.

(発明が解決しようとする問題点) 特願昭59-217521号(特公平1-4630号公報)の方法は,
溶融状態における比抵抗が105Ω・cm程度で他の熱可塑
性樹脂,たとえばポリエチレンテレフタレート(比抵抗
108〜109Ω・cm)にくらべて比抵抗の小さいポリアミド
系フィルムを安全な低電流で静電ピニングするために有
利な方法であり,さらにポリアミド系樹脂に帯電防止
剤,金属系耐熱剤を添加して比抵抗が5.0×104Ω・cm以
下にまで低下したフィルムについても,これを静電ピニ
ングすることは可能である。しかしながら本発明者等は
特願昭59-217521号(特公平1-46304号公報)の方法をさ
らに改良し,応用技術を展開すべく鋭意研究した結果,
104〜106Ω・cmの範囲では比抵抗は大きい方がより有利
であることを知った。特公昭59-23270号公報の方法のよ
うに高電流のストリーマコロナ放電により,静電ピニン
グする方法の場合は比抵抗をより小さくしてストリーマ
コロナ放電に流量を大きくすることが有利であること
は,たとえば特開昭60-58830号公報の記載からも明らか
であるが,特願昭59-217521号(特公平1-46304号公報)
の方法は冷却ロールに電気抵抗層を設けて電流を制限
し,できるだけ少ない電流量で安全に静電ピニングする
ことを目的とするものであるから,比抵抗が小さすぎる
場合不利となる。
(Problems to be Solved by the Invention) The method of Japanese Patent Application No. 59-217521 (Japanese Patent Publication No. 1-4630) is
The specific resistance in the molten state is about 10 5 Ω · cm and other thermoplastic resins such as polyethylene terephthalate (specific resistance
This is an advantageous method for electrostatically pinning a polyamide-based film with a smaller specific resistance at a safe low current than that of 10 8 to 10 9 Ω ・ cm). It is possible to perform electrostatic pinning on a film whose specific resistance has dropped to 5.0 × 10 4 Ω · cm or less by adding. However, the inventors of the present invention further improved the method of Japanese Patent Application No. 59-217521 (Japanese Patent Publication No. 1-46304), and as a result of diligent research to develop applied technology,
It was found that a larger specific resistance is more advantageous in the range of 10 4 to 10 6 Ω · cm. In the case of electrostatic pinning by high-current streamer corona discharge as in the method of Japanese Patent Publication No. 59-23270, it is advantageous to reduce the specific resistance and increase the flow rate for streamer corona discharge. For example, as is clear from the description in Japanese Patent Laid-Open No. 60-58830, Japanese Patent Application No. 59-217521 (Japanese Patent Publication No. 1-46304)
Since the method of (1) aims to limit the current by providing an electric resistance layer on the cooling roll and safely perform electrostatic pinning with a minimum amount of current, it is disadvantageous if the specific resistance is too small.

通常のポリアミド系樹脂たとえばナイロン6,ナイロン66
などの溶融状態における比抵抗は1.0×105〜3.0×105Ω
・cm程度であり,この場合は特願昭59-217521号公報の
方法は極めて有効であり,たとえば二軸延伸フィルム製
造プロセスにこの方法を適用する場合,キャスティング
速度がライン速度の律速段階となることはない。
Ordinary polyamide resin such as nylon 6 and nylon 66
The specific resistance in the molten state is 1.0 × 10 5 to 3.0 × 10 5 Ω
・ Approximately cm, and in this case, the method of Japanese Patent Application No. 59-217521 is extremely effective. For example, when this method is applied to the biaxially stretched film manufacturing process, the casting speed is the rate-determining step of the line speed. There is no such thing.

しかしながら,イオン性の帯電防止剤や耐熱剤,酸化防
止剤を添加して比抵抗が1.0×104〜5.0×104Ω・cmの範
囲にはいる場合は,静電ピニオグ可能なキャスティング
速度に律速され始める。すなわち電気絶縁性被覆を設け
た冷却ロールを用いて静電ピニングする場合でも比抵抗
が小さすぎると電流が増加し始め,遂にはストリーマ状
態に到って作業安全上の問題となったり,厚さを乱した
りするため,キャスティング速度を遅くして電流を下げ
る必要があった。
However, if the specific resistance is in the range of 1.0 × 10 4 to 5.0 × 10 4 Ω · cm by adding an ionic antistatic agent, heat-resistant agent, and antioxidant, the casting speed that allows electrostatic piniog is set. Start to be rate controlled. That is, even when electrostatic pinning is performed using a cooling roll provided with an electrically insulating coating, if the specific resistance is too small, the current begins to increase, and finally a streamer state is reached, which is a work safety problem and the thickness It was necessary to slow down the casting speed to lower the current in order to disturb the temperature.

(問題点を解決するための手段) 本発明者等は電気絶縁性被覆を設けた冷却ロールを用い
てポリアミド系フィルムを静電ピニング製膜する場合で
も,比抵抗が小さくなると電流が増加する現象について
調べた結果,比抵抗が小さくなると,フィルムを伝導し
てTダイへ逃げる電荷が増加することがその原因である
ことを知った。Tダイへの漏洩電流が増すと冷却ロール
との間に十分な電気的引力が作用するに必要な電荷をフ
ィルムに与えるためには,それだけ余分の電流が必要に
なる。
(Means for Solving Problems) The present inventors have found that when the polyamide-based film is electrostatically pinned by using a cooling roll provided with an electrically insulating coating, the current increases when the specific resistance decreases. As a result of the investigation, it was found that the cause is that when the specific resistance becomes small, the electric charge that conducts through the film and escapes to the T-die increases. As the leakage current to the T-die increases, the extra current is needed to provide the film with the charge necessary for sufficient electrical attraction between it and the chill roll.

一方ポリアミド系フィルム,特にその二軸延伸フィルム
は包装用フィルム等の種々の用途分野で広く使われてお
り,使用用途上の要求からイオン性の帯電防止剤や酸化
防止剤,耐熱剤を添加することが必要になり,この場合
溶融状態の比抵抗は低下し,その結果,製膜速度に制限
がくわわることになる。
On the other hand, polyamide films, especially their biaxially stretched films, are widely used in various fields of application such as packaging films, and ionic antistatic agents, antioxidants, and heat-resistant agents are added due to the requirements of the application. In this case, the specific resistance in the molten state decreases, and as a result, the film forming rate is limited.

本発明者等はポリアミド系フィルムを多層構造とし,帯
電防止剤,酸化防止剤をそれが必要とされる層にのみ添
加するにとどめても,多くの場合添加剤機能はそれ程低
下しないこと,およびイオン性の添加剤を練り込んで比
抵抗の低下した層と,それらを練り込まないで,したが
って比抵抗の低下しない層の多層構造として共押出しす
ることにより,溶融状態の電気抵抗をある程度維持する
ことが可能になり,Tダイへの漏洩電流を制限できること
を知って本発明に到達した。すなわち溶融状態における
比抵抗が5.0×104Ω・cm以下の層を含むポリアミド系多
層フィルムをダイから押出し,表面に絶縁破壊電圧5KV
以上の電気絶縁性被覆を設けた冷却ロールにキャスティ
ングする際に,該フィルムの上方に配設した電極によっ
て静電荷を与え,冷却ロールとの間に作用する電気的引
力によって前記フィルムを冷却ロールに密着させて冷却
する方法において,比抵抗が1.4×105Ω・cm以上の層を
組み合わせることにより,厚みで荷重平均したフィルム
平均の比抵抗を1.0×105Ω・cm以上とすることを特徴と
するポリアミド系多層フィルムの急冷製膜方法である。
The inventors of the present invention have a multilayer structure of a polyamide-based film and add an antistatic agent and an antioxidant only to a layer in which they are required, but in many cases, the additive function does not deteriorate so much, and The electric resistance in the molten state is maintained to some extent by co-extruding as a multi-layer structure of a layer having a lowered specific resistance by kneading an ionic additive and a layer not kneading them and thus not lowering the specific resistance. The present invention has been achieved by knowing that the leakage current to the T-die can be limited. That is, a polyamide-based multilayer film containing a layer with a specific resistance in the molten state of 5.0 × 10 4 Ω · cm or less was extruded from the die, and a dielectric breakdown voltage of 5 KV was applied to the surface.
When the film is cast on a cooling roll provided with the above electrically insulating coating, an electrostatic charge is applied by an electrode arranged above the film, and the film is applied to the cooling roll by an electric attraction acting between the film and the cooling roll. In the method of closely contacting and cooling, by combining layers with a specific resistance of 1.4 × 10 5 Ω · cm or more, the average resistance of the film averaged by thickness is 1.0 × 10 5 Ω · cm or more. And a method for rapidly cooling a polyamide-based multilayer film.

異なる比抵抗を有する層で構成された多層フィルムを絶
縁性被覆を設けた冷却ロールを使って,静電ピニング製
膜する場合のTダイへの漏洩電流は各層の比抵抗をその
層の厚みで荷重平均したフィルム平均の比抵抗にほぼ反
比例する。イオン性の帯電防止剤,酸化防止剤等を練り
込む場合,それぞれの性能を十分に発揮させるために必
要な添加剤の種類と濃度とを選ぶと,溶融状態の比抵抗
は5.0×104Ω・cm以下となることが多く,この範囲のフ
ィルムを絶縁被覆を設けた冷却ロールを使って非ストリ
ーマ状態で静電ピニングしようとすると,キャスティン
グ速度はたとえば40m/min以下に制約される。しかしな
がらフィルムを多層構造とし,添加剤を含むため比抵抗
が5.0×104Ω・cm以下となったポリアミド系樹脂で表層
を構成し,内層はイオン性の添加剤を含まず比抵抗が1.
4×105Ω・cm以上のポリアミド系樹脂で構成し,厚みで
荷重平均したフィルム平均の比抵抗を1.0×105Ω・cm以
上とすることにより,添加剤の効果はそれ程低下せず,
しかもキャスティング速度についての制約はほとんどな
くなり,たとえば50m/min以上で均一急冷製膜すること
が可能になる。
Leakage current to the T-die when electrostatically pinning a multi-layer film composed of layers having different specific resistances using a cooling roll provided with an insulative coating determines the specific resistance of each layer by the thickness of that layer. It is almost inversely proportional to the weight-averaged film average resistivity. When kneading an ionic antistatic agent, antioxidant, etc., selecting the type and concentration of the additive required to fully exhibit each performance, the specific resistance in the molten state is 5.0 × 10 4 Ω.・ It is often less than cm, and when trying to electrostatically pin films in this range in a non-streamer state using a chill roll with an insulating coating, the casting speed is limited to, for example, 40 m / min or less. However, since the film has a multi-layer structure and contains additives, the surface layer is composed of a polyamide resin that has a resistivity of 5.0 × 10 4 Ω · cm or less, and the inner layer contains no ionic additives and has a resistivity of 1.
By using a polyamide-based resin of 4 × 10 5 Ω · cm or more and setting the average resistance of the film weight averaged to 1.0 × 10 5 Ω · cm or more, the effect of the additive does not decrease so much.
Moreover, there are almost no restrictions on the casting speed, and it becomes possible to perform uniform quench film formation at 50 m / min or higher, for example.

本発明方法は冷却ロールの表面に電気絶縁性被覆を設け
ることにより電極〜冷却ロール間の漏洩電流を低減し,
フィルムの比抵抗をある範囲以上に保持して電極〜Tダ
イ間の漏洩電流を低減し,それらの効果でストリーマ状
態に到らない低電流放電で,イオン性添加剤を含有し,
比抵抗が低下した機能層を含むポリアミド系多層フィル
ムを静電ピニング製膜法で高速急冷製膜する方法を提供
するものである。
The method of the present invention reduces the leakage current between the electrode and the cooling roll by providing an electrically insulating coating on the surface of the cooling roll,
Holds the specific resistance of the film above a certain range to reduce the leakage current between the electrode and the T-die, and due to these effects, contains a ionic additive with a low current discharge that does not reach a streamer state,
It is intended to provide a method for rapidly and rapidly forming a polyamide-based multilayer film including a functional layer having a reduced specific resistance by an electrostatic pinning film forming method.

本発明の適用を受けるポリアミド系多層フィルムとは,
ナイロン6,ナイロン66,ナイロン6−10等のホモポリマ
ーあるいはこれらの混合物およびこれらポリアミドの基
本的性質を変えない範囲の共重合物,さらにこれらに各
種添加物の添加された材料で構成される多層フィルムで
あり,通常はイオン性添加剤の有無あるいは濃度以外は
同一の材料より構成される二層又は三層のフィルムであ
る。また電気絶縁性被覆とはフッ素系樹脂,アクリル系
樹脂,ポリエステル系樹脂等の有機重合体材料あるいは
Al2O3のような電気絶縁性セラミックス材料であり,通
常はこれらの組み合わせが最も適している。被覆層は絶
縁破壊電圧5KV以上,さらに好ましくは10KV以上の耐電
圧を備えるという条件を第一に考慮して材質,厚みを選
択する。これは製膜操作中に何かのトラブルでアーク放
電が生じた場合に被覆層が破損することを避けなければ
ならないからである。しかし電気絶縁性被覆材料は一般
に熱伝導度が低いため被覆層を厚くしすぎると冷却ロー
ルの冷却効率が悪くなるという問題がある。このため被
覆層は絶縁破壊電圧5KV以上15KV以下の範囲が綜合的に
は適しており,この範囲からポリマーの比抵抗,フィル
ム厚み,速度,冷却ロール温度などの製膜条件に応じて
最適なものを選択する。電極は直径0.1〜0.3mmの鋼線,
タングスイテン線をフィルムが冷却ロールに接触する位
置の上方でフィルム面から1〜10mmの位置に配設する方
法が一般的である。電極には直流高電圧発生装置により
正又は負で5〜15KVの直流電圧を印加する。極性は一般
的には正負とちらでもよいが,絶縁被覆材料とフィルム
の帯電列から決定される被覆材料の帯電極性と逆の極性
電圧を電極に印加するのがより好ましい場合が多い。
The polyamide-based multilayer film to which the present invention is applied is
Homopolymers such as Nylon 6, Nylon 66, Nylon 6-10, etc. or mixtures thereof and copolymers of these polyamides within the range not changing the basic properties, and multilayers composed of materials to which various additives are added. The film is usually a two-layer or three-layer film composed of the same material except for the presence or absence or concentration of the ionic additive. The electrically insulating coating is an organic polymer material such as a fluorine resin, an acrylic resin, a polyester resin, or the like.
It is an electrically insulating ceramic material such as Al 2 O 3 , and usually a combination of these is the most suitable. The material and thickness of the coating layer are selected in consideration of the condition that the dielectric breakdown voltage is 5 KV or more, more preferably 10 KV or more. This is because it is necessary to avoid damage to the coating layer when arcing occurs due to some trouble during the film forming operation. However, since the electrically insulating coating material generally has low thermal conductivity, if the coating layer is made too thick, the cooling efficiency of the cooling roll deteriorates. For this reason, the covering layer is generally suitable in the range of dielectric breakdown voltage of 5 KV or more and 15 KV or less. From this range, the most suitable one according to the film forming conditions such as polymer resistivity, film thickness, speed, and cooling roll temperature. Select. The electrode is a steel wire with a diameter of 0.1 to 0.3 mm,
A method of arranging the tongue-stain wire at a position 1 to 10 mm above the film surface above the position where the film contacts the cooling roll is common. A DC high voltage generator is used to apply a positive or negative DC voltage of 5 to 15 KV to the electrodes. The polarity may generally be positive or negative, but it is often more preferable to apply a voltage having a polarity opposite to the charging polarity of the coating material, which is determined from the charging sequence of the insulating coating material and the film, to the electrodes.

溶融状態における比抵抗の厚みによる荷重平均とは,た
とえば押出温度における比抵抗が4.0×104Ω・cmのポリ
マーで冷却後の厚みがそれぞれ25μの量側表層を構成
し,内層を厚みが100μで比抵抗が1.6×105Ω・cmのポ
リマーで構成する三層フィルムの場合,平均の比抵抗は すなわち1.2×105Ω・cmとなる。押出成形に適した粘度
をもつポリアミド系樹脂で全厚みが100〜500μのフィル
ムを本発明方法で静電ピニング製膜する場合,厚みで荷
重平均したフィルム平均の比抵抗は少なくとも1.0×105
Ω・cm以上,さらに好ましくは1.2×105Ω・cm以上が適
している。
The weighted average of the specific resistance thickness in the molten state means, for example, a polymer having a specific resistance at the extrusion temperature of 4.0 × 10 4 Ω · cm and a thickness of 25 μm after cooling. In the case of a three-layer film composed of a polymer with a specific resistance of 1.6 × 10 5 Ω · cm, the average specific resistance is That is 1.2 × 10 5 Ω · cm. When a film of polyamide resin having a viscosity suitable for extrusion molding and having a total thickness of 100 to 500 μ is subjected to electrostatic pinning by the method of the present invention, the average resistance of the film averaged by weight is at least 1.0 × 10 5
Ω · cm or more, more preferably 1.2 × 10 5 Ω · cm or more is suitable.

(作用) 本発明方法を適用することにより,非ストリーマ法静電
ピニング技術では,キャスティング速度に制約のあった
低比抵抗機能層を含むポリアミド系フィルムを制約なく
して急冷製膜することが可能になる。
(Operation) By applying the method of the present invention, in the non-streamer electrostatic pinning technology, it is possible to perform rapid cooling film formation without restriction on a polyamide-based film including a low-resistivity functional layer whose casting speed is restricted. Become.

また低電流でポリアミド系フィルムを冷却ロールに密着
させて急冷製膜できるため,作業の安全性は確保され,
ストリーマ放電点で生じる厚さの乱れもなく,均一なフ
ィルムを製膜することができる。
In addition, the polyamide-based film can be adhered to the cooling roll at a low current to perform rapid cooling film formation, ensuring work safety,
A uniform film can be formed without the thickness irregularity occurring at the streamer discharge point.

また本発明方法により製膜したポリアミド系多層フィル
ムを,さらに二軸延伸する場合は厚み精度,光学的均一
性等が良好で,しかも帯電防止性,耐熱性等の改質され
た二軸延伸フィルムが得られ,本発明方法の効果がさら
に高まる。
When the polyamide-based multilayer film formed by the method of the present invention is further biaxially stretched, the biaxially stretched film has good thickness accuracy, optical uniformity, and the like, and has improved antistatic property and heat resistance. And the effect of the method of the present invention is further enhanced.

(実施例および比較例) 実施例1 2台の押出機,フィードブロック式三層ダイ,表面にセ
ラミック(Al2O3)を0.15mm厚に被覆した冷却ロールよ
りなる製膜装置で,ナイロン6フィルムを製膜した。両
側表層形成用押出機にはナイロン6(ユニチカ(株)製
A1030BRF)にアニオン系帯電防止剤(三洋化成工業
(株)ケミスタット3033)を1重量%添加した原料を投
入し,内層形成用押出機には無添加の同じナイロン6原
料を投入し,押出温度260℃で三層ナイロンフィルムを
押出した。Tダイから吐出したフィルムが冷却ロールに
接する位置の上方に,直径0.2mmのタングステン線を冷
却ロールに平行に張り,静電ピニング電極とした。
(Examples and Comparative Examples) Example 1 A film forming apparatus comprising two extruders, a feed block type three-layer die, and a cooling roll having a surface coated with ceramics (Al 2 O 3 ) to a thickness of 0.15 mm. The film was formed. Nylon 6 (manufactured by Unitika Ltd.) is used for both side surface layer forming extruders.
A1030BRF) with 1% by weight of an anionic antistatic agent (Chemistat 3033, Sanyo Kasei Co., Ltd.) added, the same nylon 6 raw material with no additive added to the extruder for forming the inner layer, and the extrusion temperature 260 A three-layer nylon film was extruded at ° C. A tungsten wire having a diameter of 0.2 mm was stretched in parallel with the cooling roll above the position where the film discharged from the T-die was in contact with the cooling roll, to form an electrostatic pinning electrode.

小型押出機と比抵抗測定セルよりなる別の装置でそれぞ
れの原料の比抵抗を測定したところ,帯電防止剤の添加
された原料の260℃における比抵抗は2.2×104Ω・cm,無
添加原料は1.7×105Ω・cmであった。
The specific resistance of each raw material was measured by a separate device consisting of a small extruder and a specific resistance measuring cell. The specific resistance of the raw material added with the antistatic agent at 260 ° C was 2.2 × 10 4 Ω · cm, no addition. The raw material was 1.7 × 10 5 Ω · cm.

冷却固化後のフィルムの表層厚みが両面とも23μ,内層
厚みが124μになるように押出機の吐出量を調整しなが
ら静電ピニング製膜したところ,冷却ロールの速度50m/
minまでストリーマ放電なしに均一急冷製膜することが
でき,得られたフィルムを縦方向3.3倍,横方向3.5倍に
同時二軸延伸したところ帯電防止効果,厚み精度,光学
的均一性の優れたフィルムが得られた。なおこの例にお
ける厚みで荷重平均したフィルム平均の比抵抗は1.3×1
05Ω・cmである。
After the film was cooled and solidified, electrostatic pinning was performed while adjusting the discharge rate of the extruder so that the surface layer thickness was 23μ on both sides and the inner layer thickness was 124μ.
A uniform rapid cooling film can be formed without streamer discharge up to min, and the obtained film is simultaneously biaxially stretched 3.3 times in the longitudinal direction and 3.5 times in the transverse direction, resulting in excellent antistatic effect, thickness accuracy, and optical uniformity. A film was obtained. In this example, the average resistance of the film averaged by the weight is 1.3 × 1
It is 0 5 Ω · cm.

比較例1 実施例1と同じ装置を用い,表層用および内層用押出機
の両方に実施例1で表層押出機に投入したものと同じ帯
電防止剤添加原料を供給し,2台の押出機の吐出量比を実
施例1と同じに保って厚み170μのフィルムを静電ピニ
ング製膜した。
Comparative Example 1 Using the same apparatus as in Example 1, the same antistatic additive raw material as that charged in the surface layer extruder in Example 1 was supplied to both the surface layer and inner layer extruders, and two extruders were used. A 170 μm-thick film was formed by electrostatic pinning while maintaining the same discharge amount ratio as in Example 1.

冷却ロールの速度が30m/min以上になると局部的なスト
リーマ放電が生じ,フィルムと冷却ロールの均一な密着
が不可能になり均一な急冷製膜のできる速度は約25m/mi
nであった。
When the speed of the chill roll exceeds 30 m / min, local streamer discharge occurs, making it impossible to evenly adhere the film to the chill roll, and a uniform rapid film-forming speed of about 25 m / mi.
It was n.

また25m/minで製膜したフィルムを実施例1と同じ条件
で同時二軸延伸したところ,得られたフィルムの帯電防
止効果は実施例1で得られたフィルムと実用上大差のな
い程度のものであった。
Further, when the film formed at 25 m / min was simultaneously biaxially stretched under the same conditions as in Example 1, the antistatic effect of the obtained film was similar to the film obtained in Example 1 in practical use. Met.

(発明の効果) ポリアミド系フィルムにイオン性の添加剤を添加して,
フィルムに特殊な機能を与える方法はポリアミド系フィ
ルムの改質技術として有用なものであるが,非ストリー
マ法静電ピニング技術と組み合わせる場合に従来におい
ては製膜速度が制限されるという問題があった。本発明
方法はイオン性添加剤の機能を失うことなく製膜速度を
高めることを可能にするものであり,その経済的効果は
大きい。
(Effect of the invention) By adding an ionic additive to the polyamide film,
The method of giving a special function to the film is useful as a modification technology for polyamide film, but when combined with the non-streamer method electrostatic pinning technology, there was a problem that the film formation speed was conventionally limited. . The method of the present invention makes it possible to increase the film formation rate without losing the function of the ionic additive, and its economic effect is great.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】溶融状態における比抵抗が5.0×104Ω・cm
以下の層を含むポリアミド系多層フィルムをダイから押
出し,表面に絶縁破壊電圧5KV以上の電気絶縁性被覆を
設けた冷却ロールにキャスティングする際に,該フィル
ムの上方に配設した電極によって静電荷を与え,冷却ロ
ールとの間に作用する電気的引力によって前記フィルム
を冷却ロールに密着させて冷却する方法において,比抵
抗が1.4×105Ω・cm以上の層を組み合わせることによ
り,厚みで荷重平均したフィルム平均の比抵抗を1.0×1
05Ω・cm以上とすることを特徴とするポリアミド系多層
フィルムの急冷製膜方法。
1. The specific resistance in the molten state is 5.0 × 10 4 Ω · cm.
When a polyamide-based multilayer film containing the following layers was extruded from a die and cast on a chill roll having an electrically insulating coating with a dielectric breakdown voltage of 5 KV or more on its surface, an electrostatic charge was applied by electrodes placed above the film. In the method in which the film is brought into close contact with the cooling roll by an electric attraction acting between it and the cooling roll to cool it, by combining layers with a specific resistance of 1.4 × 10 5 Ω · cm or more, the load average by thickness is obtained. The average resistivity of the film was 1.0 x 1
A method for forming a rapid cooling film of a polyamide-based multilayer film, which is characterized in that it is at least 5 Ω · cm.
JP61302422A 1986-12-18 1986-12-18 Method for rapid film formation of polyamide-based multilayer film Expired - Lifetime JPH0688309B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61302422A JPH0688309B2 (en) 1986-12-18 1986-12-18 Method for rapid film formation of polyamide-based multilayer film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61302422A JPH0688309B2 (en) 1986-12-18 1986-12-18 Method for rapid film formation of polyamide-based multilayer film

Publications (2)

Publication Number Publication Date
JPS63154326A JPS63154326A (en) 1988-06-27
JPH0688309B2 true JPH0688309B2 (en) 1994-11-09

Family

ID=17908728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61302422A Expired - Lifetime JPH0688309B2 (en) 1986-12-18 1986-12-18 Method for rapid film formation of polyamide-based multilayer film

Country Status (1)

Country Link
JP (1) JPH0688309B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4997600A (en) * 1988-05-24 1991-03-05 Mitsubishi Monsanto Chemical Company, Ltd. Process for preparation of thermoplastic resin sheets

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5923270B2 (en) 2011-10-07 2016-05-24 株式会社日立ハイテクノロジーズ Sample processing system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5923270B2 (en) 2011-10-07 2016-05-24 株式会社日立ハイテクノロジーズ Sample processing system

Also Published As

Publication number Publication date
JPS63154326A (en) 1988-06-27

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