JPH0691131B2 - Film carrier - Google Patents

Description

TECHNICAL FIELD The present invention relates to high-density mounting technology for semiconductor IC chips,
The present invention relates to a film carrier capable of improving the positioning accuracy with respect to the electrodes of the hard substrate when the narrow pitch electrodes of the hard substrate and the lead electrodes of the film carrier are simultaneously connected at multiple points.

2. Description of the Related Art A conventional film carrier positioning method will be described with reference to FIG. In FIG. 3, panel 1 which is a rigid substrate
When the film carriers 2 are collectively connected to the panel, the panel 1 is set on the panel mounting jig pallet 3 and fixed by the vacuum suction method, while the film carrier 2 can be slid in the direction of arrow A in FIG. Positioned by the reference pin 5 protruding from 4, and the panel electrode 6,
The copper foil lead electrode 8 connected to the semiconductor IC chip 7 bonded to the film carrier 2 is aligned.

FIG. 4 is a plan view of a connecting device between the panel 1 and the film carrier 2. In FIG. 4, a panel 1 such as a liquid crystal display has a pitch width of 0.2 m from the upper, lower, left and three sides, for example.
Several hundreds of panel electrodes 6 having a width of m and an electrode width of 0.1 mm are formed, and the copper foil lead electrodes 8 of the film carrier 2 are placed on the panel electrodes 6 to align the electrodes. At this time, the positioning reference pin 5 is inserted into the positioning hole of the film carrier 2 and the actual microscope 9 is slid to the position of the electrode 8 of the film carrier 2 in the direction of arrow A. The panel electrode 6 and the electrode 8 of the film carrier 2 are aligned with each other while being observed in an enlarged manner. The fine adjustment at the time of alignment is performed by moving the slide base 4 laterally along the guide base 11 while rotating the micrometer head 10 connected to each slide base 4.

Next, when the position adjustment is completed, the stage 12
Is moved in the direction of arrow B, and the electrode part is pressed and heated.
When the pressing / heating tool 13 is moved downward when it is located below 13, and the connection of the electrode parts is completed, the stage 12 is moved in the direction opposite to the arrow B, and one connection cycle is completed.

FIG. 5 is a sectional view taken along line XX of FIG. In FIG. 3, a reference pin 5 is arranged on a slide base 4 that slides on a guide base 11, and a block 14 to which the reference pin 5 is fixed is connected to a shaft 16 which is vertically driven by a cylinder 15. When the cylinder 15 moves up and down, the reference pin 5 moves up and down, and the film of the film carrier 2
Positioning is performed via a position hole 20 formed by punching through the 2a and the copper foil 2b, or the positioning is released. The spring 17 is interposed between the pin 18 fixed to the block 14 and the slide base 4, and has a function of urging the reference pin 5 fixed to the block 14 upward. Reference numeral 19 is a film carrier retainer for smoothly inserting and removing the reference pin 5.

At this time, if the electrode pitch is large, for example, 0.5 mm
If the above, the accuracy of the hole diameter of the film carrier 2 is ± 30μ
Even if it is a little big, short-circuit failure does not occur after connection,
There was no problem as long as it was electrically connected.

However, the electrode pitch is a narrow pitch of 0.2 mm or less, and the electrode width is 0.1 mm (for example, several tens to several hundreds).
When simultaneously connecting all together, considering the positioning accuracy of the reference pin 5 and the film carrier 2 as in the conventional case, considering the variation in the hole diameter dimension accuracy of the film carrier 2 as ± 30 μ and the processing accuracy of the reference pin 5 as ± 5 μ, The positioning accuracy is relatively low due to the narrow pitch, which causes a disadvantage that a short circuit occurs between the electrodes. Therefore, it is desirable to improve the hole diameter accuracy of the reference pin 5 and the film carrier 2 in order to obtain the positional accuracy. Reference pin 5
Can be solved by improving the machining accuracy, but the hole diameter accuracy of the film carrier 2 is 1 while feeding the film.
Since punching is done individually, there is a limit to the film feed accuracy, so it is not possible to make it less than ± 30μ.

The present invention is to solve the above problems, the accuracy of the positioning hole diameter of the film carrier from the conventional ± 30μ accuracy ±
It is an object to provide a film carrier that can be improved to 2μ.

Means for Solving the Problems In order to solve the above problems, the present invention forms an electrode copper foil pattern on a copper foil instead of forming a positioning hole of a film carrier by punching with a punching die as in the conventional case. At the same time, a positioning hole is formed in the copper foil by exposure etching. At this time, the holes of the film portion corresponding to the positioning holes of the copper foil are formed in advance and are larger than the positioning holes of the copper foil, and after the copper foil is lined on this film, The exposure etching of the positioning holes in the copper foil portion is performed simultaneously with the exposure etching of the electrode copper foil pattern.

Action With the above configuration, since the positioning hole of the film carrier is formed in the copper foil by the exposure etching process simultaneously with the electrode copper foil pattern forming, the hole diameter is formed in correlation with the electrode copper foil pattern. Accuracy can be secured. In addition, since the positioning is performed only with copper foil, the clearance between the reference pin and the hole diameter is designed to be 0, and even if the hole diameter is formed on the minus side with a hole diameter accuracy of ± 2μ, the reference pin does not fall into the hole diameter, so workability is extremely high. However, good alignment is possible.

Embodiment One embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of an essential part showing the relationship between a film carrier positioning hole and a reference pin according to an embodiment of the present invention. In FIG. 1, reference numeral 21 denotes a film carrier, which is composed of a film 21a made of polyimide or the like and a copper foil 21b.
2 has a large hole diameter that has been punched with a mold in advance, corresponding to the position where the positioning hole is formed, and the hole diameter accuracy may be the same as the conventional ± 30μ or more. This film
21a is lined with a copper foil 21b having a film thickness of 29μ ± 6μ, and the hole 23 of the copper foil 21b is formed in the copper foil portion corresponding to the hole 22 of the film 21a by exposure etching simultaneously with the formation of the electrode copper foil pattern. Has been done. The hole diameter accuracy of the hole 23 of the copper foil 21b is 2μ or less because the hole 23 of the copper foil 21b is formed in the copper foil 21b by exposure etching simultaneously with the electrode copper foil pattern forming. it can. At this time, as the exposure etching, exposure etching using ultraviolet rays is adopted. A reference pin 24 is inserted into the positioning hole 23.

The film carrier 21 is manufactured as follows. A film with large holes 22 punched first with a die
21a is lined with a copper foil 21b, and a copper foil pattern serving as a lead electrode is formed on this copper foil 21b by exposure etching, and at the same time, a positioning hole 23 is formed on the copper foil 21b in the hole 22 of the film 21a by exposure etching. To do. Therefore,
The hole diameter of the positioning hole 23 is correlated with the electrode copper foil pattern, and an accuracy of ± 2μ can be secured.

Comparing this with FIG. 2 showing the relationship between the positioning hole 20 of the conventional film carrier 2 and the reference pin 5, in the conventional one, the positioning hole 20 has a film 2a made of polyimide or the like and a copper foil 2b lined with the film 2a. Since the holes and are mechanically formed by punching at the same time, the hole diameter accuracy is ± 30μ, which cannot be used as the hole diameter accuracy for lead electrodes with a pitch width of 200μ or less. However, in the case of FIG. 1, since the positioning hole 23 is formed by exposure etching only in the copper foil portion corresponding to the reference pin 24, it is possible to make it ± 2 μ or less as described above,
If the machining accuracy of the reference pin 24 is improved, the positioning accuracy can be sufficiently improved.

EFFECTS OF THE INVENTION As described above, according to the present invention, when connecting multi-point electrodes, the positioning hole accuracy for electrode alignment can be reduced from the conventional ± 30 μ to ± 2 μ or less. It is possible to shorten the work man-hours related to the positioning of and to significantly improve the yield of connection.

Also, since only the holes of the copper foil by exposure etching at the same time as the electrode copper foil pattern forming are used as the positioning holes, it is not necessary to carry out any operation to obtain the precision of the hole diameter of the die punch when manufacturing the film carrier. The cost of the film carrier can be reduced.

[Brief description of drawings]

FIG. 1 is a sectional view of a main part of a film carrier according to an embodiment of the present invention, and FIG. 2 is a sectional view of a main part of a conventional film carrier.
3 is a perspective view for explaining a positioning method using a reference pin, FIG. 4 is a plan view of a connecting device between a film carrier and a hard substrate, and FIG. 5 is a sectional view taken along line XX of FIG. 21 …… Film carrier, 21a …… Film, 21b …… Copper foil, 22 …… Hole previously punched by die in film, 23 ……
Positioning holes in copper foil by etching, 24 ... Reference pin.

Claims (1)

[Claims] 1. A film carrier having electrodes to which a semiconductor IC chip is bonded and connected to narrow-pitch electrodes on a hard substrate, wherein a positioning hole for improving the alignment accuracy of the electrodes is formed into an electrode copper foil pattern. At the same time, a film carrier composed only of copper foil holes formed by exposure etching.