JPH0691134B2 - Semiconductor device testing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention is a test device for a semiconductor device having a plurality of pins protruding in a matrix form, in which a test plate is electrically short-circuited with a plurality of pins of the semiconductor device. By attaching the member, it becomes possible to easily and surely test the semiconductor device having a plurality of pins protruding in a matrix.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device testing apparatus, and more particularly to a semiconductor device testing apparatus having a matrix of a plurality of protruding pins.

[Conventional technology]

In recent years, the degree of integration of semiconductor devices has advanced, and along with this, the number of terminals of semiconductor devices has increased.

By the way, in the test of a semiconductor device, first, a DC test and a functional test are performed on a plurality of chips formed on a wafer. The DC test is to test whether or not there is a cut-off point or a short-circuited point other than the design between a plurality of pins of the semiconductor device.

In addition, the functional test is usually performed only on a chip that satisfies the DC test, and tests whether the chip has a function as designed.

2. Description of the Related Art Conventionally, a semiconductor device testing apparatus provided with a plurality of pins corresponding to the high integration of the semiconductor device as described above, particularly an apparatus for testing a semiconductor device (chip) having a plurality of matrix pins is There was nothing practical.

As an example of such a semiconductor device testing apparatus, probe needles are arranged on a test plate in a similar matrix so as to correspond to the matrix pins of the semiconductor device, and the probe needles are provided on a plurality of semiconductor devices. There has been proposed a semiconductor device testing apparatus for performing a DC test and a functional test of the semiconductor device by bringing the pins into contact with each other.

[Problems to be solved by the invention]

The above-described conventional semiconductor device test apparatus, for example, a test apparatus in which probe needles are arranged in a matrix on a test plate, causes the probe needles arranged in the matrix to completely contact the pins of the corresponding semiconductor device. However, it has a drawback that it is difficult to completely contact all probe needles. Furthermore, if the probe needles are arranged in a matrix so as to correspond to the multiple pins of the semiconductor device, the spacing between adjacent probe needles will be extremely narrow, so the above-mentioned matrix probe needles can be accurately attached to the test plate. It is difficult to provide such a test device, and such a test device has not been put to practical use.

In view of the above-described conventional semiconductor device test apparatus, the present invention attaches a short member electrically contacting a plurality of pins of the semiconductor device to a test plate,
An object of the present invention is to easily and surely test a semiconductor device having a matrix of a plurality of protruding pins.

[Means for solving problems]

FIG. 1 is a diagram for explaining the principle of a semiconductor device testing apparatus according to the present invention.

According to the present invention, there is provided a test device for a semiconductor device 4 having a plurality of pins 3 protruding in a matrix, the test plate 1 being attached to the test plate 1, and being electrically connected to the plurality of pins 3 of the semiconductor device. There is provided a semiconductor device testing device including a short-circuit member 2 that is in contact with each other.

[Action]

According to the semiconductor device testing apparatus of the present invention having the above-described configuration, the matrix-shaped protruding pins 3 of the semiconductor device 4 are electrically contacted by the short-circuit member 2 attached to the test plate 1, The semiconductor device 4 is tested using the short-circuit member 2.

〔Example〕

An embodiment of a semiconductor device testing apparatus according to the present invention will be described below with reference to the drawings.

FIG. 2 is a diagram showing a state of a plurality of pins provided in a semiconductor device, and FIG. 3 is a schematic diagram showing an embodiment of a semiconductor device testing apparatus of the present invention.

A semiconductor device to which the present invention is applied is a semiconductor device 4 having a plurality of pins 3 protruding in a matrix as shown in FIG. 2, and is a semiconductor device mounted by the CCB method, for example. That is, the connection points (pins) 3 of the chip (semiconductor device) 4 are provided in a matrix not only on the outer periphery of the chip 4 but also on the inner periphery of the chip,
Then, in the semiconductor device, these connection points 3 project from the surface of the chip 4. The CCB method described above uses a plurality of bump balls (pins) 3 such as solder on the chip 4.
Are formed in a matrix shape, a package (not shown) having connection terminals is placed on the matrix-shaped plurality of bump balls 3, and the bump
This is a method of melting the ball 3 and mounting the chip in the package. This CCB method is effective as a method of mounting a semiconductor device provided with a plurality of pins in a package in accordance with higher integration, but the semiconductor device test apparatus of the present invention is particularly a CCB method. It is suitable for testing a semiconductor device to be mounted.

As shown in FIG. 3, the semiconductor device testing apparatus of the present invention generally includes a test plate 1, a short-circuit member 2, and a probe needle 5.

In the embodiment shown in FIG. 3, two short-circuit members 2 are attached to the test plate 1. These two short members 2a and 2b are elastically attached to the test plate 1 by connecting members 6a and 6b, respectively, so as to surely contact the plurality of bump balls 3 of the chip 4. These short-circuit members 2a and 2b are formed of an electrically good conductor such as metal, and the short-circuit members 2a and 2b are provided with wiring similar to that of the probe needle 5, for example, one electrode of a DC test. It has been made available for use as.

The connecting members 6a and 6b are movable in the vertical direction, and contact or non-contact with the bump balls 3 of the chip 4 can be selected as required. Thereby, the test between the short members 2a and 2b, the test between the short member 2a or 2b and the probe needle 5, and
A test or the like using each probe needle 5 can be selectively performed.

The probe needles 5 are arranged so as to correspond to one vertical or horizontal row of the bump balls 3 on the chip 4. Here, for example, when the probe needles 5 are arranged in rows corresponding to the vertical bump balls 3, the chips 4 (wafer) are bumped while the test plate 1 moves in the vertical direction.
The chips 4 are tested by moving the balls 3 in the horizontal direction by one row and sequentially contacting the probe needles 5 in one vertical row with the adjacent vertical rows of the bump balls 3. Then, for example, a DC test is performed between the bump ball 3a in contact with the probe needle 5 and the bump ball 3 in contact with the short members 2a and 2b. In this way, if the probe needles 5 are provided side by side so as to correspond to one row of the bump balls 3 vertically or horizontally and the chip 4 is moved,
Various tests including DC test can be performed on all the bump balls 3.

Here, in order to correspond to the probe needles 5 arranged in a line, the bump balls 3a dedicated to the function test are arranged in a line on the chip 4
If the probe needles 5 are brought into contact only with the bump balls 3a arranged in a line, the chip 4 is provided.
The functional test of can be performed.

In the above embodiment, the test plate 1 is provided with two short-circuit members 2a and 2b, and
The probe needles 5 are provided side by side so as to correspond to one row of the bump balls 3 vertically or horizontally, but the test apparatus of the present invention is not limited to this, and, for example, only one short member 2 is provided. Alternatively, only one probe needle 5 may be provided. Further, it is possible to provide a plurality of short-circuit members 2 on the test plate 1 and perform a test between the plurality of short-circuit members 2.

〔The invention's effect〕

As described above in detail, in the semiconductor device testing apparatus according to the present invention, the test plate is provided with the short-circuit member electrically contacting the plurality of pins of the semiconductor device, whereby a plurality of matrix-shaped protruding portions are provided. A semiconductor device having a pin can be tested easily and surely.

[Brief description of drawings]

FIG. 1 is a diagram for explaining the principle of a semiconductor device testing device according to the present invention, FIG. 2 is a diagram showing a plurality of pins of a semiconductor device, and FIG. 3 is a semiconductor device testing device of the present invention. It is the schematic which shows one Example. 1 ... Test plate, 2,2a, 2b ... Short member, 3,3a ... Pin (bump ball), 4 ... Semiconductor device (chip), 5 ... Probe needle, 6a, 6b ... Connecting member .

Claims (5)

[Claims] 1. A test device for a semiconductor device (4) having a plurality of protruding pins (3) arranged in a matrix, comprising: a test plate (1); and the semiconductor device mounted on the test plate (1). A short circuit member (2) electrically contacting a plurality of pins (3), and a semiconductor device testing device comprising: 2. The test according to claim 1, wherein at least one probe needle provided on the test plate (1) is brought into contact with a pin of the semiconductor device to perform a test.
The device according to paragraph. 3. The probe needles are arranged in a line,
The device according to claim 2, wherein the probe needles arranged in a line move sequentially in each line of the pins of the semiconductor device to perform a test. 4. The apparatus according to claim 1, wherein the short member is elastically held by the test plate. 5. The first short circuit member can be cut off from a plurality of pins of the semiconductor device.
The device according to paragraph.