JPH0692882B2 - Printed circuit board inspection equipment - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention recognizes the position and presence / absence of an electronic component mounted on a printed circuit board, and rejects an electronic component whose displacement amount from a pre-registered position is a certain amount or more. The present invention relates to a printed circuit board inspection device that is determined as a component.

2. Description of the Related Art In recent years, as leadless electronic parts (chip parts) have become widespread, the types of shapes and sizes have become widespread, and devices that form electronic circuits by combining these electronic parts are rapidly becoming widespread. With the spread of these, the inspection process of electronic components mounted on a printed circuit board is becoming more and more important.

A conventional technique will be described below with reference to the drawings. FIG. 6 is an overall conceptual diagram of a conventional printed circuit board inspection device.

Reference numeral 101 is a printed circuit board inspection device, and 102 is a defective component instruction device. The printed circuit board inspection device 101 recognizes the electronic component 105 mounted on the printed circuit board 104 held on the XY table 103 through the lens 106 and the camera 107. The recognition method is to calculate the center position from the outer peripheral shape of the electronic component, detect the amount of deviation from the preregistered position, determine that the electronic component with a certain amount of deviation is defective, and record the position data. By moving the XY table 103, the printed circuit board 104
Repeat the inspection of the electronic components mounted above. Reference numeral 108 denotes a loader, which supplies the printed circuit board conveyed in the previous process to the XY table 103. Reference numeral 109 denotes an unloader, which takes out the inspected printed circuit board from the XY table 103 and conveys it in the next process.

The defective component instruction device 102 fixes the inspected printed circuit board 110 inspected by the printed circuit board inspection device 101 in the middle of the carrying section 111. A galvanometer 112 is capable of irradiating an arbitrary position on the inspected printed circuit board 110 with spot light from a light source (not shown). The defective part indicating device 102 is
The position data of the defective part is transferred from the printed circuit board inspecting device 101, and the defective part 113 on the inspected printed circuit board 110 is irradiated with the spot light based on the position data to indicate the defective part. An operator is on standby near the defective component indicating device 102 to correct the position of the designated defective component.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described above, in the conventional printed circuit board inspection device and defective component indicating device, when correcting the position of the defective component of the inspected printed circuit board, a device called a defective component indicating device is required. The whole becomes large and expensive. In addition, when a worker corrects a defective part, it must be performed in synchronization with the instruction from the defective component indicating device, and for example, when there are a plurality of workers or after a certain amount of printed circuit boards have been inspected, they are intensively corrected. There is a restriction on the rationalization of the inspection process because it cannot take steps such as performing.

Means for Solving the Problems In order to solve the above problems, the printed circuit board inspection apparatus according to the present invention includes a carrying section for carrying a printed circuit board and an X unit.
And a Y table unit, a camera unit, and a recognition device, and compares the position and angle of the electronic component registered in advance with the actual position and angle, and determines that the deviation amount is equal to or more than a certain value,
The nozzle is configured to perform marking by the marking means, and the tip of the nozzle for discharging the marking paint of the marking means is installed at an angle inclined with respect to the marking surface.

With the above configuration, the position and angle of the electronic component mounted on the printed circuit board is recognized from the preregistered position, and the electronic component having a certain amount or more of displacement is regarded as a defective component. judge. Furthermore, by applying a coating material to the electronic component determined to be a defective component, confirmation of the defective component can be performed reliably and easily.

Further, since the tip of the nozzle is installed at an angle inclined with respect to the marking surface, the coating property of the paint is good and the stringing of the paint is less likely to occur.

EXAMPLES Examples of the present invention will be described below with reference to the drawings.
FIG. 1 (A) is a front view of an embodiment of the present invention.
FIG. 3B is a side view of the same.

Reference numeral 1 denotes a printed circuit board transporting unit that transports and fixes a printed circuit board 2 supplied from a machine (not shown) on the right side in FIG. 1A to a predetermined position. Reference numeral 3 is a Y-axis robot, and the printed circuit board transport unit 1 is fixed to the robot movable unit. The movable part of the Y-axis robot 3 moves to the left and right in FIG. 1 (B) and can be positioned at any position.

An X-axis robot 4 has a head 5 fixed to its movable portion. The movable part of the X-axis robot 4 moves left and right in FIG. 1 (A) and can be positioned arbitrarily. A camera 6, a lens 7, a lighting unit 8 and a paint applying unit 9 are fixed to the head 5. Since the X-axis robot 4 and the Y-axis robot 3 are orthogonal to each other and can be positioned at arbitrary positions, the camera 6 and the paint application unit 9 are arranged on the printed circuit board 2
It can be positioned at any position above.

Next, a method of detecting the position and angle of the electronic component will be described. Second
The figure is a detailed view of the printed circuit board. Electronic components having various shapes and sizes are mounted on the printed circuit board. The method of fixing electronic components to a printed circuit board is generally mounting on an adhesive or cream solder. Due to the mounting accuracy and reliability of the electronic component mounting device, the electronic component may be displaced or not mounted.

FIG. 3 is a detailed view of the electronic component in which the positional deviation has occurred. Ten
Is the regular position of the electronic component registered in advance in the recognition device, and 11 is the mounted electronic component. From the image of the electronic component 11 displayed through the lens 7 and the camera 6, the positional deviation amounts dx and dy between the regular position 10 and the electronic component 11 and the rotational angle deviation amount dθ are calculated by a recognition device (not shown). When dx, dy and dθ are equal to or more than preset amounts, the recognition device determines that the electronic component 11 is a defective component and records the position data.

Next, the paint application device will be described. FIG. 4 (A) is a front view of the coating material application device, and FIG. 4 (B) is a side view thereof. 12 is paint and 13 is a tank for storing paint. The tank 13 is held by the block 14. The block 13 has a structure that can move up and down along the slider 15 in the figure. The slider 15 and the cylinder 16 are fixed to the head 5.
The head 5 can be positioned by the X-axis robot 4 as shown in FIG.

The electronic component 17 determined to be a defective component by the recognition device is coated with paint in the following manner. That is, the piston 18 of the cylinder 16 descends and the block 14 descends via the spring 19. The nozzle 20 is fixed to the tank 12,
Since it is held at 14, it descends together. Since the head 5 and the printed circuit board 21 are preliminarily positioned at the defective part positions by the X-axis robot 4 and the Y-axis robot 3, respectively.
The nozzle 20 contacts the electronic component 17. Then, compressed air is supplied through the path 22 and the paint is discharged. Then, the piston 18 moves up. The lever 23 swings around a fulcrum 25 by a cam 24 fixed to the block 14 and serves as a nozzle lid member that opens and closes the tip of the nozzle 20. When the piston 18 rises, the tip of the lever 23 contacts the nozzle 20 and the nozzle 20
It prevents the paint 12 from drying inside.

FIG. 5 is a detailed view of the tip of the nozzle in contact with the electronic component. The nozzle 20 and a tank (not shown) holding the nozzle are installed at a constant angle θ with respect to the vertical direction.
As a result, when the nozzle 20 abuts the electronic component 17, the opening at the tip of the nozzle is provided on the right side in the drawing, so that the coating area of the paint 12 on the electronic component 17 is increased. Therefore, the applicability of the paint 12 to the electronic component 17 is improved, and the yarn of the paint is less likely to occur when the nozzle 20 moves up.

As a procedure for applying the coating material to the electronic component that is determined to be defective, all the electronic components on the printed circuit board are once inspected, and then the coating material is continuously applied only to the defective electronic component.
The method of applying every time a defective part is generated requires a longer time than the method of the present invention because the camera and the nozzle reciprocate every time.

EFFECTS OF THE INVENTION As described above, the printed circuit board inspecting apparatus of the present invention surely and easily confirms a defective component by clearly applying the paint to the electronic component determined as the defective component without stringing.

Furthermore, after all the electronic components on the printed circuit board have been inspected once, the paint is continuously applied only to the defective electronic components, so that the inspection time can be greatly shortened compared with the past.

[Brief description of drawings]

FIG. 1 (A) is a front view of a printed circuit board inspection apparatus according to an embodiment of the present invention, FIG. 1 (B) is a side view thereof, FIG. 2 is a plan view of a printed circuit board, and FIG. A plan view, FIG. 4 (A) is a front view of a coating material application device, FIG. 4 (B) is a sectional view of the same side, FIG. 5 is a front view of a nozzle tip, and FIG. 6 is a conventional printed circuit board inspection device. It is a perspective view. 2 ... Printed circuit board, 3 ... Y-axis robot, 4 ... X-axis robot, 6 ... Camera, 11 ... Electronic parts, 12 ... Paint,
13 ... tank.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akio Okada 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-58-218132 (JP, A) (JP, U)

Claims (2)

[Claims] 1. A camera unit for recognizing an electronic component on a printed circuit board, a recognition device for detecting an electronic component having a defective mounting position based on the recognition of the camera unit, and a marking paint applied to the electronic component having a defective mounting position. An inspection device for a printed circuit board, comprising: marking means, wherein a tip of a nozzle for discharging the marking paint of the marking means is installed at an angle inclined with respect to the marking surface. 2. A nozzle lid member that can be selectively moved to a position where it abuts against the tip of the nozzle to cover it and a position that is apart from the tip of the nozzle and does not prevent the nozzle from discharging the marking paint. The printed circuit board inspection apparatus according to claim 1.