JPH069316B2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH069316B2 JPH069316B2 JP9401988A JP9401988A JPH069316B2 JP H069316 B2 JPH069316 B2 JP H069316B2 JP 9401988 A JP9401988 A JP 9401988A JP 9401988 A JP9401988 A JP 9401988A JP H069316 B2 JPH069316 B2 JP H069316B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- inner layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 20
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
本発明はハローイングの発生のない多層プリント配線板
に関する。The present invention relates to a multilayer printed wiring board that does not cause haloing.
従来より、内層材に樹脂層を介して多層材を積層し、ス
ルーホールめっきを施した多層プリント配線板は周知で
ある。Conventionally, a multilayer printed wiring board in which a multilayer material is laminated on an inner layer material via a resin layer and plated with through holes is well known.
内層材の回路を形成している銅は酸化銅の状態では塩酸
や硫酸と反応して金属塩を作り、溶解する。多層プリン
ト配線板のスルーホール部でこの反応が起きて、溶解し
た部分が外観的に白く見えるハローイングが発生してし
まっていた。 本発明は上記以上に鑑みて為されたものであり、その目
的とするところは、半田耐熱性及びスミアー性が損なわ
れることがなく、ハローイングの発生もない多層プリン
ト配線板を提供することにある。In the state of copper oxide, the copper forming the circuit of the inner layer material reacts with hydrochloric acid or sulfuric acid to form a metal salt and dissolve. This reaction occurred in the through-hole part of the multilayer printed wiring board, causing haloing in which the melted part appeared white in appearance. The present invention has been made in view of the above, and an object thereof is to provide a multilayer printed wiring board in which solder heat resistance and smear property are not impaired and haloing does not occur. is there.
本発明の多層プリント配線板は、内層材１に絶縁層２を
介して外層材３を積層し、スルーホールめっきを施した
多層プリント配線板であって、内層材１のスルーホール
部４の周辺の内層回路６部分にエポキシ当量４５０〜５
００、分子量８００〜９００、融点６４〜７５℃のビス
フェノール型エポキシ樹脂を主成分とする樹脂層５を形
成させて成ることを特徴とする ［作用］ 内層材１のスルーホール部４の外周縁部にエポキシ当量
４５０〜５００、分子量８００〜９００、融点６４〜７
５℃のビスフェノール型エポキシ樹脂を主成分とする樹
脂層５を形成させているので、樹脂層５が可撓性に優
れ、しかも樹脂層５の溶融粘度が小さいことからスルー
ホール部４の周辺の内層回路６部分に樹脂が入り込み、
樹脂層５とスルーホール部４の周辺部との密着性が良く
なり、ハローイングが発生することがないものである。 以下、本発明を詳細に説明する。 内層材１は、両面に内層回路６が形成された両面スルー
ホールめっきプリント配線板である。この内層材１のス
ルーホール部４の外周縁部の内層回路６部分には樹脂層
５が形成されている。この樹脂層５はエポキシ当量４５
０〜５００、分子量８００〜９００、融点６４〜７５℃
のビスフェノール型エポキシ樹脂に硬化材等を配合した
樹脂組成物から形成されたものである。内層回路６は黒
化処理された銅箔から形成されており、樹脂層５が形成
される際に樹脂分が内層回路６の表面の微細な機械粗面
に入り込みスルーホール部４との密着性が良好となる。
この樹脂層５はスルーホール部４の外周縁部の内層回路
６部分にだけ設けてもよい。 内層材１の両面には複数枚のプリプレグを介して銅箔が
貼着され、この銅箔から外層回路７が形成されて多層プ
リント配線板Ａが製造される。プリプレグとしては、例
えば臭素化エポキシ樹脂１００重量部、DICY３重量部、
MC１５重量部、DMF１５重量部、２Ｅ４MZ０．２重量部
の樹脂ワニスに紙、不織布、ガラス布等の基材を含浸さ
せ乾燥させて製造したものである。 次に、本発明の実施例を説明する。以下において部とあ
るのは重量部を示す。 （実施例１） エピコート１００１(商品名、シェル(株)製)７５部、エ
ピコート８７２(商品名、シェル(株)製)２５部に硬化剤
等の他の添加物を配合して樹脂組成物を調製した。 次に、エポキシ樹脂積層板にドリルにより開孔し、開孔
内部に塩化パラジウムを含有するエポキシ樹脂液を薄く
塗布し硬化させた後、無電解めっきを施し、塩化パラジ
ウムを核にしてめっき層を形成後、電解めっきを施す
等、通常の方法により、予め両面に回路を形成し、スル
ホールめっきしたプリント配線板を内層材として、この
内層材のスルーホール部の周辺の内層回路部分に、前記
樹脂組成物を最大厚み１０μの樹脂層になるように塗布
し、乾燥した。 次いで、複数枚のプリプレグを介して銅箔は貼着して銅
箔から外層回路を形成し、多層プリント配線板を製造し
た。 この多層プリント配線板のハローイングの発生、半田耐
熱製及びスミアー性を検査した。結果を第１表に示す。 （実施例２） 樹脂層の最大厚みを５０μとした以外は実施例１と同様
にして多層プリント配線板を製造し、同様の検査を行っ
た。結果を第１表に示す。 （比較例） 樹脂層を形成しなかった以外は実施例１と同様にして多
層プリント配線板を製造し、同様の検査を行った。結果
を第１表に示す。 第１表の結果より明らかなように本発明の実施例におい
てはハローイングの発生はなく、しかも半田耐熱性及び
スミアー性において比較例よりも大きく劣ることがな
い。ただ、実施例１及び実施例２を比較すれば樹脂層の
厚みが小さい程スミアー性に優れることが理解される。The multilayer printed wiring board of the present invention is a multilayer printed wiring board in which an outer layer material 3 is laminated on an inner layer material 1 with an insulating layer 2 interposed therebetween, and through-hole plating is performed, and a periphery of a through hole portion 4 of the inner layer material 1 is provided. Epoxy equivalent 450 to 5 in the inner layer circuit 6 part of
00, a molecular weight of 800 to 900, a melting point of 64 to 75 ° C., and a resin layer 5 containing a bisphenol type epoxy resin as a main component. [Function] The outer peripheral portion of the through hole portion 4 of the inner layer material 1. Epoxy equivalent of 450-500, molecular weight 800-900, melting point 64-7
Since the resin layer 5 containing bisphenol type epoxy resin at 5 ° C. as a main component is formed, the resin layer 5 is excellent in flexibility and the melt viscosity of the resin layer 5 is small. Resin enters the inner layer circuit 6 part,
Adhesion between the resin layer 5 and the peripheral portion of the through hole portion 4 is improved, and haloing does not occur. Hereinafter, the present invention will be described in detail. The inner layer material 1 is a double-sided through-hole plated printed wiring board having inner layer circuits 6 formed on both sides. A resin layer 5 is formed on the inner layer circuit 6 at the outer peripheral edge of the through hole portion 4 of the inner layer material 1. This resin layer 5 has an epoxy equivalent of 45.
0-500, molecular weight 800-900, melting point 64-75 ° C
It is formed from a resin composition obtained by mixing a curing agent or the like with the bisphenol type epoxy resin. The inner layer circuit 6 is made of blackened copper foil, and when the resin layer 5 is formed, the resin component enters the fine mechanical rough surface of the inner layer circuit 6 and adheres to the through hole portion 4. Will be good.
The resin layer 5 may be provided only on the inner layer circuit 6 portion of the outer peripheral edge portion of the through hole portion 4. Copper foils are attached to both surfaces of the inner layer material 1 via a plurality of prepregs, and the outer layer circuit 7 is formed from the copper foils to manufacture the multilayer printed wiring board A. As the prepreg, for example, 100 parts by weight of brominated epoxy resin, 3 parts by weight of DICY,
It is manufactured by impregnating a resin varnish of 15 parts by weight of MC, 15 parts by weight of DMF and 0.2 part by weight of 2E4MZ with a base material such as paper, non-woven fabric, glass cloth and drying. Next, examples of the present invention will be described. In the following, "part" means "part by weight". Example 1 A resin composition in which 75 parts of Epicoat 1001 (trade name, manufactured by Shell Co., Ltd.) and 25 parts of Epicoat 872 (trade name, manufactured by Shell Co.) are mixed with other additives such as a curing agent. Was prepared. Next, a hole is drilled in the epoxy resin laminated plate, an epoxy resin solution containing palladium chloride is thinly applied to the inside of the hole and cured, and then electroless plating is performed to form a plating layer with palladium chloride as the nucleus. After formation, electrolytic plating etc. are applied to form a circuit on both sides in advance by a normal method, and a through-hole plated printed wiring board is used as an inner layer material. The composition was applied so as to form a resin layer having a maximum thickness of 10 μm and dried. Next, a copper foil was attached via a plurality of prepregs to form an outer layer circuit from the copper foil, to manufacture a multilayer printed wiring board. Occurrence of haloing, heat resistance of solder, and smearing property of this multilayer printed wiring board were inspected. The results are shown in Table 1. (Example 2) A multilayer printed wiring board was manufactured in the same manner as in Example 1 except that the maximum thickness of the resin layer was 50 µm, and the same inspection was performed. The results are shown in Table 1. Comparative Example A multilayer printed wiring board was manufactured in the same manner as in Example 1 except that the resin layer was not formed, and the same inspection was performed. The results are shown in Table 1. As is clear from the results of Table 1, haloing does not occur in the examples of the present invention, and solder heat resistance and smearing properties are not significantly inferior to the comparative examples. However, comparing Example 1 and Example 2, it is understood that the smaller the thickness of the resin layer, the better the smear property.
本発明は、内層材に絶縁層を介して外層材を積層し、ス
ルーホールめっきを施した多層プリント配線板であっ
て、内層材のスルーホール部の周辺の内層回路部分にエ
ポキシ当量４５０〜５００、分子量８００〜９００、融
点６４〜７５℃のビスフェノール型エポキシ樹脂を主成
分とする樹脂層を形成させているので、樹脂層が可撓性
に優れ、しかも樹脂層の溶融粘度が小さいことから樹脂
層の形成に際してスルーホール部の周辺の内層回路部分
に樹脂が入り込み、樹脂層とスルーホール部の密着性が
良くなり、ハローイングが発生することがないものであ
り、しかも半田耐熱性及びスミアー性も損なわれること
がないものである。The present invention is a multilayer printed wiring board in which an outer layer material is laminated on an inner layer material via an insulating layer, and through-hole plating is performed, and an epoxy equivalent of 450 to 500 is applied to an inner layer circuit portion around the through hole portion of the inner layer material. Since the resin layer containing bisphenol type epoxy resin having a molecular weight of 800 to 900 and a melting point of 64 to 75 ° C. as a main component is formed, the resin layer has excellent flexibility and the resin layer has a small melt viscosity, so that the resin When the layer is formed, the resin enters the inner layer circuit part around the through hole, the adhesion between the resin layer and the through hole is improved, and haloing does not occur. Moreover, solder heat resistance and smear property Is not impaired.
第１図は本発明の一実施例を示す概略破断斜視図であっ
て、Ａは多層プリント配線板、１は内層材、２は絶縁
層、３は外層材、４はスルーホール部、５は樹脂層であ
る。FIG. 1 is a schematic broken perspective view showing an embodiment of the present invention, in which A is a multilayer printed wiring board, 1 is an inner layer material, 2 is an insulating layer, 3 is an outer layer material, 4 is a through hole portion, 5 is a It is a resin layer.
Claims (1)
スルーホールめっきを施した多層プリント配線板であっ
て、内層材のスルーホール部の周辺の内層回路部分にエ
ポキシ当量４５０〜５００、分子量８００〜９００、融
点６４〜７５℃のビスフェノール型エポキシ樹脂を主成
分とする樹脂層を形成させて成ることを特徴とする多層
プリント配線板。1. A multilayer material is laminated on an inner layer material via an insulating layer,
A through-hole plated multilayer printed wiring board, which is mainly composed of a bisphenol type epoxy resin having an epoxy equivalent of 450 to 500, a molecular weight of 800 to 900 and a melting point of 64 to 75 ° C in the inner layer circuit portion around the through hole portion of the inner layer material. A multilayer printed wiring board comprising a resin layer as a component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9401988A JPH069316B2 (en) | 1988-04-15 | 1988-04-15 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9401988A JPH069316B2 (en) | 1988-04-15 | 1988-04-15 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01265594A JPH01265594A (en) | 1989-10-23 |
| JPH069316B2 true JPH069316B2 (en) | 1994-02-02 |
Family
ID=14098826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9401988A Expired - Lifetime JPH069316B2 (en) | 1988-04-15 | 1988-04-15 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH069316B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6154275B2 (en) | 2013-09-27 | 2017-06-28 | 株式会社Ｌｉｘｉｌ | Antibacterial / antiviral coating and method for forming antibacterial / antiviral coating |
| JP6603495B2 (en) | 2015-07-01 | 2019-11-06 | 株式会社Ｌｉｘｉｌ | Antibacterial and antiviral coating agent |
-
1988
- 1988-04-15 JP JP9401988A patent/JPH069316B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01265594A (en) | 1989-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0221667B2 (en) | ||
| JPH069316B2 (en) | Multilayer printed wiring board | |
| JPH0573077B2 (en) | ||
| JP2659490B2 (en) | Printed circuit laminate | |
| JPS62169495A (en) | Manufacture of multilayer printed board | |
| JP3343443B2 (en) | Resin composition and prepreg | |
| JPH0320354A (en) | Film for metallic substrate | |
| JPH06302926A (en) | Multilayered boad for printed circuit | |
| JPH06112611A (en) | Laminated board for printed circuit | |
| JPH0573076B2 (en) | ||
| JPH0423654B2 (en) | ||
| JPH07176843A (en) | Laminated board for printed circuit | |
| JPH0360862B2 (en) | ||
| JPH02252294A (en) | Manufacture of multilayer board | |
| JP3288819B2 (en) | Copper clad laminate | |
| JP2005002226A (en) | Flame-retardant epoxy resin composition and laminated plate-related product using the same | |
| JPH069318B2 (en) | Multilayer board manufacturing method | |
| JP2557325B2 (en) | Multilayer copper clad laminate | |
| JP2568347B2 (en) | Copper clad laminate for printed circuit | |
| JP2734912B2 (en) | Copper-clad laminate for surface mount printed wiring boards | |
| JPS62164757A (en) | Solderable, electrically conductive composition | |
| JPH05327150A (en) | Laminated plate for printed circuit | |
| JP2633286B2 (en) | Manufacturing method of electric laminate | |
| JPH0437870B2 (en) | ||
| JPH08103984A (en) | Copper-clad laminated plate |