JPH0693546B2 - Electronics - Google Patents
ElectronicsInfo
- Publication number
- JPH0693546B2 JPH0693546B2 JP29433388A JP29433388A JPH0693546B2 JP H0693546 B2 JPH0693546 B2 JP H0693546B2 JP 29433388 A JP29433388 A JP 29433388A JP 29433388 A JP29433388 A JP 29433388A JP H0693546 B2 JPH0693546 B2 JP H0693546B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- case
- outer mold
- mold case
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
Landscapes
- Casings For Electric Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は電子機器に係り、特にケース裏面に回路パター
ンが一体形成された外装モールドケースを使用した電子
機器に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly to an electronic device using an exterior molded case having a circuit pattern integrally formed on the back surface of the case.
従来、カメラ等の電子機器は、電子機器の外装ケース面
にプリント基板を固定し、プリント基板に電子部品を実
装していた。しかしながら、近年、電子機器の小型軽量
化が図られ、その方法の一つとして、プリント基板を除
去すべく電子機器の外装ケースの内面に、直接回路パタ
ーンを形成することが出来る外装モールドケースを使用
して、直接電子部品を外装モールドケースに実装する方
法が開示されている。Conventionally, in electronic devices such as cameras, a printed circuit board is fixed to the outer case surface of the electronic device, and electronic components are mounted on the printed circuit board. However, in recent years, electronic devices have been made smaller and lighter, and one of the methods is to use an outer mold case that can directly form a circuit pattern on the inner surface of the outer case of the electronic device to remove the printed circuit board. Then, a method of directly mounting the electronic component in the exterior molded case is disclosed.
また、実開昭63−44482号公報には、電子機器を構成す
る一対の外装モールドケースの、一方の外装モールドケ
ースと、他方の外装モールドケースとに実装された電子
部品等が、外装モールドケース同士を組立てると共に、
電気的に接続される電子機器が開示されている。即ち、
一方の外装モールドケースに突状部を一体成形し、この
突状部に一方の外装モールドケースの回路パターンの端
子を形成する。又、他方の外装モールドケースに突状部
を受け入れる帯状のコネクタ部を一体成形し、このコネ
クタ部に他方の外装モールドケースの回路パターンの端
子を形成する。従って、一方の外装モールドケースと他
方の外装モールドケースとを組立てると、突状部をコネ
クタ部に嵌合させることが出来るので、突状部の端子と
コネクタ部の端子とが電気的に接続する。この結果、一
方の外装モールドケースの回路パターンと他方の外装モ
ールドケースの回路パターンとが電気的に接続し、一方
の外装モールドケースに実装された電子部品と、他方の
外装モールドケースに実装された電子部品とが電気的に
接続する。Further, in Japanese Utility Model Laid-Open No. 63-44482, an electronic component etc. mounted on one external mold case and the other external mold case of a pair of external mold cases constituting an electronic device is described as an external mold case. Assembling each other,
Electronic devices that are electrically connected are disclosed. That is,
The protruding portion is integrally formed on one of the outer molded cases, and the terminals of the circuit pattern of the one outer molded case are formed on the protruding portion. In addition, a strip-shaped connector portion that receives the protruding portion is integrally formed in the other outer molded case, and terminals of the circuit pattern of the other outer molded case are formed in this connector portion. Therefore, by assembling the one outer mold case and the other outer mold case, the protruding portion can be fitted into the connector portion, so that the terminal of the protruding portion and the terminal of the connector portion are electrically connected. . As a result, the circuit pattern of the one outer mold case and the circuit pattern of the other outer mold case were electrically connected to each other, and the electronic components mounted in the one outer mold case and the other outer mold case were mounted. The electronic parts are electrically connected.
しかしながら、実開昭63−44482号公報に開示されてい
る電子機器は、突状部をコネクタ部に嵌合させて回路パ
ターン同士を電気的に接続させるので、電気的接続部、
即ち突状部とコネクタ部との寸法を高精度に成形する必
要があり、電子機器のコストが高くなるという問題があ
る。However, in the electronic device disclosed in Japanese Utility Model Laid-Open No. 63-44482, since the protruding portions are fitted into the connector portion to electrically connect the circuit patterns to each other, the electrical connection portion,
That is, it is necessary to form the dimensions of the protruding portion and the connector portion with high accuracy, which causes a problem of increasing the cost of the electronic device.
本発明はこのような事情に鑑みてなされたもので、一方
の外装モールドケースと他方の外装モールドケースと
の、電気的接続部を高精度に成形しなくても一方の外装
モールドケースと他方の外装モールドケースとに実装さ
れている、電子部品等を電気的に接続することが出来る
電子機器を提供することを目的とする。The present invention has been made in view of the above circumstances, and one outer mold case and the other outer mold case are not required to be formed with high accuracy to form an electrical connection between the outer mold case and the other outer mold case. It is an object of the present invention to provide an electronic device mounted on an outer mold case and capable of electrically connecting electronic components and the like.
本発明は前記目的を達成するために、ケース裏面に回路
パターンが一体形成された一対の外装モールドケースを
有する電子機器に於いて、一方の外装モールドケースに
一体成形され、一方の外装モールドケースの回路パター
ンの端子が設けられたブロックと、他方の外装モールド
ケースに一体成形され、他方の外装モールドケースの回
路パターンの端子が設けられた弾性部と、を有し、一方
の外装モールドケースと他方の外装モールドケースとを
組立てると共に、ブロックが弾性部を押圧して弾性部の
端子とブロックの端子とを電気的に接続することを特徴
としている。In order to achieve the above-mentioned object, the present invention provides an electronic device having a pair of exterior mold cases in which a circuit pattern is integrally formed on the back surface of the case. A block having a circuit pattern terminal and an elastic portion integrally molded with the other outer mold case and having a circuit pattern terminal of the other outer mold case; The outer mold case is assembled, and the block presses the elastic portion to electrically connect the terminal of the elastic portion and the terminal of the block.
本発明によれば、一方の外装モールドケースにブロック
が一体成形され、このブロックに回路パターンの端子が
形成されている。また、他方の外装モールドケースに弾
性部が一体成形され、この弾性部に回路パターンの端子
が形成されている。従って、一方の外装モールドケース
と他方の外装モールドケースとを組立てると、ブロック
が弾性部に押圧接触するので、ブロックの端子と弾性体
の端子とを電気的に接続することが出来る。According to the present invention, the block is integrally formed on one of the exterior mold cases, and the circuit pattern terminal is formed on the block. An elastic portion is integrally formed with the other outer molded case, and a circuit pattern terminal is formed on the elastic portion. Therefore, when one outer mold case and the other outer mold case are assembled, the block comes into pressure contact with the elastic portion, so that the terminal of the block and the terminal of the elastic body can be electrically connected.
以下添付図面に従って本発明に係る電子機器の好ましい
実施例を詳説する。Hereinafter, preferred embodiments of an electronic device according to the present invention will be described in detail with reference to the accompanying drawings.
第１図に示すように、電子機器10は、主に、上側電子機
器部分12及び下側電子機器部分14から構成されている。As shown in FIG. 1, the electronic device 10 mainly includes an upper electronic device portion 12 and a lower electronic device portion 14.
上側電子機器部分12は、一方の外装モールドケース、即
ち、モールド成形された上側外装基板18を有し、上側外
装基板18の内側の四隅にはボス20、20、20、20が、上側
外装基板18と一体成形されている。又、上側外装基板18
にはブロック22が、上側外装基板18と一体成形されてい
る。更に、上側外装基板18の裏面には回路パターン24が
形成されている。回路パターン24の端子24A、24B、24C
はブロック22の端面22Aまで伸びている。この回路パタ
ーン24には電子部品26が実装されている。The upper electronic device portion 12 has one outer mold case, that is, an upper outer substrate 18 that is molded, and the bosses 20, 20, 20, 20 are provided at the four inner corners of the upper outer substrate 18 with the upper outer substrate 18. It is integrally molded with 18. Also, the upper exterior substrate 18
A block 22 is integrally formed with the upper exterior substrate 18. Further, a circuit pattern 24 is formed on the back surface of the upper exterior substrate 18. Circuit pattern 24 terminals 24A, 24B, 24C
Extends to the end face 22A of the block 22. Electronic components 26 are mounted on the circuit pattern 24.
下側電子機器部分14は、他方の外装モールドケース、即
ち、モールド成形された下側外装基板28を有している。
下側外装基板28の端面28Aは、上側外装基板18の端面18A
と対向するように成形されている。この下側外装基板28
の内側の四隅には、ボス30、30、30、30が、ボス20、2
0、20、20に対向するように、下側外装基板28と一体成
形されている。又、下側外装基板28には弾性体31が、下
側外装基板28と一体成形されている。弾性体31は、第２
図に示すように、保持部32と、弾性部33、33、33とから
成り、保持部32は略コ字形に成形されている。弾性部33
は、その一端が保持部32のコ字形の内側に支持され、そ
の他端33Aは、半円弧形に成形されている。半円弧形の
他端33Aは、保持部32の上端32Aより上方に突出してい
る。又、第１図、第２図に示すように、下側外装基板28
の裏面には回路パターン34が形成され、回路パターン34
の端子34A、34B、34Cは弾性部33、33、33の半円弧形の
部分33A、33A、33Aまで伸びている。端子34A、34B、34C
は、それぞれ端子24A、24B、24Cに対向するように形成
されている。又、第１図に示すように、回路パターン34
には電子部品36が実装されている。The lower electronic device portion 14 has the other exterior molded case, that is, the lower exterior substrate 28 molded.
The end surface 28A of the lower exterior substrate 28 is the end surface 18A of the upper exterior substrate 18.
Is formed so as to face with. This lower exterior substrate 28
In the four inner corners of the boss 30, 30, 30, 30, the boss 20, 2
It is integrally molded with the lower exterior substrate 28 so as to face 0, 20, 20. Further, an elastic body 31 is formed on the lower exterior substrate 28 integrally with the lower exterior substrate 28. The elastic body 31 is the second
As shown in the figure, it comprises a holding part 32 and elastic parts 33, 33, 33, and the holding part 32 is formed in a substantially U-shape. Elastic part 33
Has one end supported inside the U-shape of the holding portion 32, and the other end 33A formed in a semi-circular shape. The other end 33A of the semi-circular shape projects above the upper end 32A of the holding portion 32. Further, as shown in FIGS. 1 and 2, the lower exterior substrate 28
The circuit pattern 34 is formed on the back surface of the
The terminals 34A, 34B, 34C of the elastic members 33, 33, 33 extend to the semi-circular portions 33A, 33A, 33A of the elastic parts 33, 33, 33. Terminals 34A, 34B, 34C
Are formed so as to face the terminals 24A, 24B, and 24C, respectively. Also, as shown in FIG.
An electronic component 36 is mounted on.
前記の如く構成された本発明に係る電子機器の作用につ
いて説明する。The operation of the electronic device according to the present invention configured as described above will be described.
先ず、上側電子機器部分12を、第１図上で、矢印Ａ方向
に移動して下側電子機器部分14に蓋をするように載置す
る。次いで、ねじ38、38、38、38をボス20、20、20、20
に挿入してボス30、30、30、30に螺合連結する。従っ
て、第３図に示すように、ブロック22の端面22Aは、弾
性部33、33、33の半円弧形の他端33A、33A、33Aに押圧
接触する。この結果、端子24Aと端子34A、端子24Bと端
子34B、及び端子24Cと端子34Cとが電気的に接続する。First, the upper electronic device portion 12 is moved in the direction of arrow A in FIG. 1 and placed so as to cover the lower electronic device portion 14. Then screw 38, 38, 38, 38 onto boss 20, 20, 20, 20
And then screwed and connected to the bosses 30, 30, 30, 30. Therefore, as shown in FIG. 3, the end surface 22A of the block 22 is in pressure contact with the semi-arcuate other ends 33A, 33A, 33A of the elastic portions 33, 33, 33. As a result, the terminals 24A and 34A, the terminals 24B and 34B, and the terminals 24C and 34C are electrically connected.
前記実施例ではブロック22を板状に形成したが、これに
限らず、第４図に示すように、上側外装基板18の表面に
凹部40を形成して、その裏面に凸部42を形成してもよ
い。Although the block 22 is formed in a plate shape in the above embodiment, the present invention is not limited to this, and as shown in FIG. 4, a concave portion 40 is formed on the surface of the upper exterior substrate 18 and a convex portion 42 is formed on the rear surface thereof. May be.
〔発明の効果〕 以上説明したように本発明に係る電子機器によれば、一
方の外装モールドケースと他方の外装モールドケースと
を組立てると共に、ブロックで弾性部を押圧接触してブ
ロックの端子と弾性部の端子とを電気的に接続すること
が出来る。従って、ブロックと弾性部とを高精度に成形
しなくても、ブロックの端子と弾性部の端子とを確実に
電気的に接続することが出来るので、電子機器のコスト
低減を図ることが出来る。[Effects of the Invention] As described above, according to the electronic device of the present invention, one outer mold case and the other outer mold case are assembled, and the elastic portion is pressed into contact with the block to elastically connect with the terminal of the block. It can be electrically connected to the terminal of the part. Therefore, the terminals of the block and the terminals of the elastic portion can be surely electrically connected without forming the block and the elastic portion with high precision, so that the cost of the electronic device can be reduced.
【図面の簡単な説明】 第１図は本発明に係る電子機器の外装モールドケースの
開放状態を示す斜視図、第２図は第１図の要部拡大図、
第３図は本発明に係る電子機器の組立状態を示す要部断
面図、第４図は本発明に係る他の実施例の電子機器の組
立状態を示す要部拡大断面図である。 10…電子機器、12…上側電子機器部分、14…下側電子機
器部分、18、28…外装基板、22…ブロック、24、34…回
路パターン、24A、24B、24C、34A、34B、34C…端子、33
A、33B、33C…弾性部。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an open state of an outer mold case of an electronic device according to the present invention, and FIG. 2 is an enlarged view of a main part of FIG.
FIG. 3 is a sectional view of a main part showing an assembled state of an electronic device according to the present invention, and FIG. 4 is an enlarged sectional view of a main part showing an assembled state of an electronic device according to another embodiment of the present invention. 10 ... Electronic device, 12 ... Upper electronic device part, 14 ... Lower electronic device part, 18, 28 ... Exterior substrate, 22 ... Block, 24, 34 ... Circuit pattern, 24A, 24B, 24C, 34A, 34B, 34C ... Terminal, 33
A, 33B, 33C ... Elastic part.
Claims (1)
た一対の外装モールドケースを有する電子機器に於い
て、 一方の外装モールドケースに一体成形され、一方の外装
モールドケースの回路パターンの端子が設けられたブロ
ックと、 他方の外装モールドケースに一体成形され、他方の外装
モールドケースの回路パターンの端子が設けられた弾性
部と、 を有し、一方の外装モールドケースと他方の外装モール
ドケースとを組立てると共に、ブロックが弾性部を押圧
して弾性部の端子とブロックの端子とを電気的に接続す
ることを特徴とする電子機器。1. An electronic device having a pair of exterior mold cases integrally formed with a circuit pattern on the back surface of the case, wherein one of the exterior mold cases is integrally molded, and a terminal of the circuit pattern of the one exterior mold case is provided. And an elastic portion integrally formed with the other outer mold case and provided with terminals of the circuit pattern of the other outer mold case, and one outer mold case and the other outer mold case. An electronic device characterized in that a block presses an elastic portion to electrically connect a terminal of the elastic portion and a terminal of the block while assembling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29433388A JPH0693546B2 (en) | 1988-11-21 | 1988-11-21 | Electronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29433388A JPH0693546B2 (en) | 1988-11-21 | 1988-11-21 | Electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02140995A JPH02140995A (en) | 1990-05-30 |
| JPH0693546B2 true JPH0693546B2 (en) | 1994-11-16 |
Family
ID=17806345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29433388A Expired - Fee Related JPH0693546B2 (en) | 1988-11-21 | 1988-11-21 | Electronics |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0693546B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0717168Y2 (en) * | 1990-06-13 | 1995-04-19 | 山武ハネウエル株式会社 | High-density packaging |
| JP3621615B2 (en) | 1999-11-12 | 2005-02-16 | ヤマハメタニクス株式会社 | Microphone holder |
-
1988
- 1988-11-21 JP JP29433388A patent/JPH0693546B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02140995A (en) | 1990-05-30 |
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