JPH0694498B2 - Acid anhydride composition and curing agent composition for epoxy resin - Google Patents
Acid anhydride composition and curing agent composition for epoxy resinInfo
- Publication number
- JPH0694498B2 JPH0694498B2 JP25772787A JP25772787A JPH0694498B2 JP H0694498 B2 JPH0694498 B2 JP H0694498B2 JP 25772787 A JP25772787 A JP 25772787A JP 25772787 A JP25772787 A JP 25772787A JP H0694498 B2 JPH0694498 B2 JP H0694498B2
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- Prior art keywords
- acid anhydride
- composition
- epoxy resin
- curing agent
- anhydride
- Prior art date
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Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は、作業性の改善された酸無水物組成物並びにエ
ポキシ樹脂との相溶性及び保存安定性が改良されたエポ
キシ樹脂用の硬化剤組成物に関する。TECHNICAL FIELD The present invention relates to an acid anhydride composition having improved workability, and a curing agent for an epoxy resin having improved compatibility with an epoxy resin and storage stability. It relates to a composition.
[従来の技術] 一般に、エポキシ樹脂硬化物は、その電気的及び機械的
特性が良好であることから、電気、電子製品の注型物、
含浸物、塗装物、積層板、接着剤等の広範な用途に適用
されている。[Prior Art] Generally, a cured epoxy resin has good electrical and mechanical properties, and therefore, a cast product of an electrical or electronic product,
It is applied to a wide range of applications such as impregnated products, painted products, laminates, and adhesives.
下記の一般式(I)や(II)で表される四塩基酸無水物
は、既に知られたものであり(特公昭44−2986号、英国
特許第944,721号)、斯かる酸無水物を構成成分とする
エポキシ樹脂用の硬化剤組成物は、架橋密度が高いため
に、耐熱性に優れた樹脂硬化物を提供する。Tetrabasic acid anhydrides represented by the following general formulas (I) and (II) are already known (Japanese Patent Publication No. 2986/44, British Patent 944,721), and such acid anhydrides are The curing agent composition for an epoxy resin, which is a constituent component, provides a cured resin product having excellent heat resistance because of its high crosslink density.
(式中、R1、R2は、水素原子又は炭素数1〜8のアルキ
ル基を表わす。) [発明が解決しようとする問題点] しかしながら、当該四塩基酸無水物は、相対的に融点が
高いため作業性に劣り、エポキシ樹脂硬化剤として使用
した場合には樹脂との相溶性が低く、かつ高温で加熱溶
融中にエポキシ樹脂が部分的に四塩基酸無水物と反応硬
化し始めるため、均一な混合物を得ることが困難であ
る。 (In the formula, R 1 and R 2 represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.) [Problems to be Solved by the Invention] However, the tetrabasic acid anhydride has a relatively high melting point. The workability is poor because it is high, the compatibility with the resin is low when used as an epoxy resin curing agent, and the epoxy resin begins to partially react and cure with the tetrabasic anhydride during heating and melting at high temperature. , It is difficult to obtain a homogeneous mixture.
又、一般式(I)で表わされる四塩基酸無水物と特定の
二塩基酸無水物とからなる液状のエポキシ樹脂用の硬化
剤組成物(特開昭58−136619号)は、耐熱性及び機械的
特性に優れた硬化物を提供するものの、硬化剤組成物と
しての保存安定性に欠ける傾向がある。Further, a liquid curing agent composition for an epoxy resin comprising a tetrabasic acid anhydride represented by the general formula (I) and a specific dibasic acid anhydride (JP-A-58-136619) has heat resistance and Although it provides a cured product having excellent mechanical properties, it tends to lack storage stability as a curing agent composition.
本発明者らは、斯かる欠点を改良し、融点を下げること
により作業性を改善し、更にはこのものをエポキシ樹脂
用の硬化剤組成物の成分として適用する場合の樹脂との
相溶性並びにその保存安定性を向上すべく鋭意検討の結
果、斯かる酸無水物と特定の樹脂とを併用することによ
り、所定の効果が得られることを見い出し、この知見に
基づいて本発明を完成するに至った。The present inventors have improved such drawbacks and improved workability by lowering the melting point, and further have compatibility with resins when applied as a component of a curing agent composition for epoxy resins and As a result of diligent studies to improve its storage stability, by using such an acid anhydride in combination with a specific resin, it was found that a predetermined effect was obtained, and the present invention was completed based on this finding. I arrived.
即ち、本発明は、酸無水物本来の特性を保持しつつ作業
性の改善された酸無水物系組成物を提供するとともに、
エポキシ樹脂との相溶性に優れ、かつ保存安定性の改善
された新規なエポキシ樹脂用の硬化剤組成物を提供する
ことを目的とする。That is, the present invention provides an acid anhydride composition having improved workability while maintaining the original properties of the acid anhydride,
An object of the present invention is to provide a novel curing agent composition for an epoxy resin, which has excellent compatibility with an epoxy resin and has improved storage stability.
[問題点を解決するための手段] 本発明に係る酸無水物系組成物は、一般式(I)で表さ
れる四塩基酸無水物及び/又は一般式(II)で表される
四塩基酸無水物(以下「四塩基酸無水物」と総称す
る。)と芳香族炭化水素−ホルムアルデヒド樹脂とを含
有することを特徴とする。[Means for Solving Problems] The acid anhydride-based composition according to the present invention is a tetrabasic acid anhydride represented by the general formula (I) and / or a tetrabasic acid represented by the general formula (II). It is characterized by containing an acid anhydride (hereinafter collectively referred to as "tetrabasic acid anhydride") and an aromatic hydrocarbon-formaldehyde resin.
(式中、R1、R2は、水素原子又は炭素数1〜8のアルキ
ル基を表わす。) 本発明において芳香族炭化水素−ホルムアルデヒド樹脂
とは、トルエン、o−、m−、p−キシレン、エチルベ
ンゼン等の単独又はそれらの混合物並びにメシチレン、
プロイドキュメン等の炭素数9を有する異性体の単独又
はそれらの混合物に例示される芳香族炭化水素等を適宜
選択し、これとホルムアルデヒドとを反応せしめて得ら
れるアルキル置換芳香族炭化水素−ホルムアルデヒド樹
脂の総称である。 (In the formula, R 1 and R 2 represent a hydrogen atom or an alkyl group having 1 to 8 carbon atoms.) In the present invention, the aromatic hydrocarbon-formaldehyde resin means toluene, o-, m-, p-xylene. , Ethylbenzene and the like alone or a mixture thereof and mesitylene,
Alkyl-substituted aromatic hydrocarbon-formaldehyde resin obtained by appropriately selecting an aromatic hydrocarbon or the like exemplified by isomers having 9 carbon atoms such as prodcumene or a mixture thereof and reacting this with formaldehyde Is a general term for.
本発明に係る酸無水物系組成物の調製方法としては、所
定量の四塩基酸無水物と芳香族炭化水素−ホルムアルデ
ヒド樹脂とを加熱下において攪拌する方法が提示できる
が、所定の効果を奏する限りこれに限定されるものでは
ない。As a method of preparing the acid anhydride composition according to the present invention, a method of stirring a predetermined amount of a tetrabasic acid anhydride and an aromatic hydrocarbon-formaldehyde resin under heating can be presented, but it has a predetermined effect. As long as it is not limited to this.
処理条件としては、四塩基酸無水物の融点よりやや高め
の温度で10分〜10時間程度処理することが好ましい。As the treatment conditions, it is preferable to perform the treatment at a temperature slightly higher than the melting point of the tetrabasic acid anhydride for about 10 minutes to 10 hours.
両者の配合比率(重量)は、四塩基酸無水物:芳香族炭
化水素−ホルムアルデヒド樹脂=99:1〜30:70とするの
が好ましく、より好ましくは95:5〜50:50である。四塩
基酸無水物の配合比率がこの範囲より少ない場合には、
当該酸無水物系組成物を硬化剤組成物として適用して得
られるエポキシ樹脂硬化物組成物を適用して得られる樹
脂硬化物の耐熱性や機械的特性が低下する傾向にあり、
逆に多い場合には酸無水物系組成物の作業性やこのもの
を適用したエポキシ樹脂用の硬化剤組成物の保存安定性
の改善が不十分となる傾向にある。The blending ratio (weight) of both is preferably tetrabasic acid anhydride: aromatic hydrocarbon-formaldehyde resin = 99: 1 to 30:70, and more preferably 95: 5 to 50:50. When the compounding ratio of the tetrabasic acid anhydride is less than this range,
There is a tendency that the heat resistance and mechanical properties of the resin cured product obtained by applying the epoxy resin cured product composition obtained by applying the acid anhydride composition as a curing agent composition,
On the contrary, when the amount is large, the workability of the acid anhydride composition and the storage stability of the curing agent composition for epoxy resin to which this composition is applied tend to be insufficiently improved.
本発明に係る新規なエポキシ樹脂用の硬化剤組成物は、
上記の酸無水物系組成物を必須成分とする。The curing agent composition for a novel epoxy resin according to the present invention,
The above acid anhydride composition is an essential component.
斯かる芳香族炭化水素−ホルムアルデヒド樹脂は300〜1
000程度の分子量を有し、90℃以下で液状となる樹脂で
あって、含酸素率が8〜15%の範囲のものが望ましい。
含酸素率とは、直接酸素を分析するか、あるいは元素分
析で炭素、水素を分析し、その残りを酸素原子として計
算した値である。Such aromatic hydrocarbon-formaldehyde resin is 300 to 1
It is desirable that the resin has a molecular weight of about 000 and becomes a liquid at 90 ° C. or lower and has an oxygen content of 8 to 15%.
The oxygen content is a value obtained by directly analyzing oxygen or by analyzing carbon and hydrogen by elemental analysis and calculating the rest as oxygen atoms.
芳香族炭化水素−ホルムアルデヒド樹脂中における酸素
の存在は、芳香族炭化水素の核と核との結合がエーテル
結合[−CH2OCO2−]やアセタール結合[−CH2(OCH2)
nOCH2−]であること、又は核の側鎖として存在するメ
チロール基[−CH2OH]やメトキシメチル基[−CH2OC
H3]によるものである。The presence of oxygen in the aromatic hydrocarbon-formaldehyde resin indicates that the bond between the aromatic hydrocarbon nucleus and the nucleus is an ether bond [-CH 2 OCO 2- ] or an acetal bond [-CH 2 (OCH 2 ).
nOCH 2- ] or a methylol group [-CH 2 OH] or a methoxymethyl group [-CH 2 OC] present as a side chain of the nucleus
H 3 ].
このような含酸素基を含む芳香族炭化水素−ホルムアル
デヒド樹脂は、酸無水物及びエポキシ樹脂をよく溶かす
ばかりでなく、無触媒又は僅かの酸触媒の存在下で四塩
基酸無水物とよく反応してエステルを形成し、四塩基酸
無水物の結晶温度を低下させることができる。Such an aromatic hydrocarbon-formaldehyde resin containing an oxygen-containing group not only dissolves an acid anhydride and an epoxy resin well, but also reacts well with a tetrabasic acid anhydride in the presence of a catalyst or a slight acid catalyst. Can form an ester to reduce the crystallization temperature of the tetrabasic anhydride.
四塩基酸無水物の中に芳香族核を導入することにより、
硬化剤組成物又はエポキシ樹脂組成物中における四塩基
酸無水物の溶解度が一層向上し、均一な状態を長期に維
持することができる。 By introducing an aromatic nucleus into the tetrabasic anhydride,
The solubility of the tetrabasic acid anhydride in the curing agent composition or the epoxy resin composition is further improved, and a uniform state can be maintained for a long period of time.
更に、本発明に係るエポキシ樹脂用の硬化剤組成物は、
必要に応じて他のカルボン酸無水物を配合してなる組成
物であって、なかでも25℃において液状を呈する組成物
であることが好ましい。Further, the curing agent composition for epoxy resin according to the present invention,
It is a composition prepared by blending other carboxylic acid anhydride as needed, and is preferably a liquid composition at 25 ° C.
斯かる他のカルボン酸無水物は、本発明に係る酸無水物
系組成物と併用して所定の効果を奏するものであれば足
り、具体的には、無水フタル酸、テトラヒドロ無水フタ
ル酸、ヘキサヒドロ無水フタル酸、メチルテトラヒドロ
無水フタル酸、メチルヘキサヒドロ無水フタル酸、無水
メチルナジック酸、ドデシル無水コハク酸、無水クロレ
ンディック酸、無水トリメリット酸、ポリアゼライン酸
無水物、無水ピロメリット酸、ベンゾフェノンテトラカ
ルボン酸無水物、エチレングリコールビス(アンヒドロ
トリメリテート)等が例示され、上記酸無水物の1種又
は2種以上が併用される。Such other carboxylic acid anhydride is sufficient as long as it exhibits a predetermined effect in combination with the acid anhydride composition according to the present invention, specifically, phthalic anhydride, tetrahydrophthalic anhydride, hexahydro. Phthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic acid anhydride, dodecylsuccinic anhydride, chlorendic acid anhydride, trimellitic anhydride, polyazelaic anhydride, pyromellitic anhydride, benzophenone Tetracarboxylic acid anhydride, ethylene glycol bis (anhydrotrimellitate) and the like are exemplified, and one or more of the above acid anhydrides are used in combination.
なかでも、3−メチルテトラヒドロ無水フタル酸、4−
メチルテトラヒドロ無水フタル酸等のメチルテトラヒド
ロ無水フタル酸、3−メチルヘキサヒドロ無水フタル
酸、4−メチルヘキサヒドロ無水フタル酸等のメチルヘ
キサヒドロ無水フタル酸、メチルナジック酸無水物、ド
デセニル無水コハク酸及びそれらの構造異性体若しくは
立体異性体又はそれらの混合物等の、室温で液状を呈す
る酸無水物が推奨される。Among them, 3-methyltetrahydrophthalic anhydride, 4-
Methyltetrahydrophthalic anhydride such as methyltetrahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, methylhexahydrophthalic anhydride such as 4-methylhexahydrophthalic anhydride, methylnadic acid anhydride, dodecenylsuccinic anhydride and Acid anhydrides that are liquid at room temperature, such as their structural isomers or stereoisomers or mixtures thereof, are recommended.
この場合、液状二塩基酸無水物に対する本発明に係る酸
無水物系組成物の配合比率(重量基準)は、好ましくは
10:90〜70:30である。本発明に係る酸無水物系組成物の
比率が当該範囲を越える場合には、常温で液状の組成物
が得られず、逆に、少ない場合には得られる硬化物の耐
熱性が十分でない。In this case, the blending ratio (weight basis) of the acid anhydride composition according to the present invention to the liquid dibasic acid anhydride is preferably
It is from 10:90 to 70:30. When the ratio of the acid anhydride composition according to the present invention exceeds the above range, a liquid composition at room temperature cannot be obtained. On the contrary, when the ratio is small, the heat resistance of the obtained cured product is insufficient.
又、当該硬化剤組成物には、第三級アミン類、イミダゾ
ール類等のアミン系化合物の他、フェノール類等の公知
の硬化促進剤を適宜配合することができる。Further, in addition to amine compounds such as tertiary amines and imidazoles, known curing accelerators such as phenols can be appropriately added to the curing agent composition.
第三級アミンとしては、ラウリルジメチルアミン、ジメ
チルベンジルアミン、ジメチルアミノメチルフェノー
ル、2,4,6−トリス(N,N−ジメチルアミノメチル)フェ
ノール(以下「DMP−30」と称する。)、1,8−ジアザビ
シクロ(5,4,0)ウンデセン−7等が例示される。As the tertiary amine, lauryldimethylamine, dimethylbenzylamine, dimethylaminomethylphenol, 2,4,6-tris (N, N-dimethylaminomethyl) phenol (hereinafter referred to as "DMP-30"), 1 Examples include 8,8-diazabicyclo (5,4,0) undecene-7 and the like.
又、イミダゾール類としては、2−エチル−4−メチル
イミダゾール(以下「2E4MZ」と称する。)、2−メチ
ルイミダゾール、1−ベンジル−3−メチルイミダゾー
ル、2−ウンデシルイミダゾール、2−フェニルイミダ
ゾール、1−シアノエチル−2−エチル−4−メチルイ
ミダゾール等が例示される。Further, as the imidazoles, 2-ethyl-4-methylimidazole (hereinafter referred to as "2E4MZ"), 2-methylimidazole, 1-benzyl-3-methylimidazole, 2-undecylimidazole, 2-phenylimidazole, 1-Cyanoethyl-2-ethyl-4-methylimidazole and the like are exemplified.
又、これらのアミン系化合物の、ルイス酸塩、有機酸塩
及びアダクト化等による変性物も適当な化合物である。Further, Lewis acid salts, organic acid salts, and modified products of these amine compounds by adduct formation are also suitable compounds.
かくして得られるエポキシ樹脂用の酸無水物系硬化剤組
成物は、ビスフェノールA、ビスフェノールF、ビスフ
ェノールS、レゾルシノール、ヘキサヒドロビスフェノ
ールA、ポリプロピレングリコール、ネオペンチルグリ
コール、テトラブロモビスフェノールA、ビスフェノー
ルヘキサフロロアセトン等とエピクロルヒドリンとから
得られるジグリシジルエーテル型、フタル酸等とエピク
ロルヒドリンとから得られるジグリシジルエステル型、
フェノールノボラック型、クレゾールノボラック型、グ
リシジルアミン型、環式脂肪族型、複素環型、ハロゲン
化型等の公知のエポキシ樹脂の硬化剤組成物として好適
である。The acid anhydride type curing agent composition for epoxy resin thus obtained is bisphenol A, bisphenol F, bisphenol S, resorcinol, hexahydrobisphenol A, polypropylene glycol, neopentyl glycol, tetrabromobisphenol A, bisphenol hexafluoroacetone, etc. And a diglycidyl ether type obtained from epichlorohydrin, a diglycidyl ester type obtained from phthalic acid and the like and epichlorohydrin,
It is suitable as a known epoxy resin curing agent composition such as phenol novolac type, cresol novolac type, glycidyl amine type, cycloaliphatic type, heterocyclic type and halogenated type.
エポキシ樹脂に対する本発明の係る酸無水物系硬化剤組
成物の好ましい配合量は、エポキシ樹脂のエポキシ当量
当りの酸無水物当量が0.5〜1.5当量に相当する量であ
る。A preferable amount of the acid anhydride-based curing agent composition of the present invention to be mixed with the epoxy resin is an amount corresponding to 0.5 to 1.5 equivalents of acid anhydride equivalent per epoxy equivalent of the epoxy resin.
本発明に係る硬化剤組成物が適用されるエポキシ樹脂組
成物には、必要に応じてその他の添加剤としてアスファ
ルト、石英粉、雲母、有機繊維、無機繊維、タルク、粘
度、カオリン、ベントナイト、炭酸カルシウム、硫酸バ
リウム、酸化マグネシウム、ボロンナイトライド、酸化
チタン、水和アルミナ若しくはアルミニウム粉の如き金
属粉等の充填剤、染料若しくは顔料、成形潤滑剤、三酸
化アンチモン若しくは赤燐の如き難燃剤、キシレン、ト
ルエン、メチルエチルケトン若しくはメチルイソブチル
ケトンの如き用材、その他汎用の変性剤を加えることも
でき、耐熱性・耐湿性の注型若しくは成形用あるいは、
一般若しくは特殊用塗料あるいは積層若しくは含浸用ワ
ニス等の材料として使用することができる。The epoxy resin composition to which the curing agent composition according to the present invention is applied, as the other additives as required, asphalt, quartz powder, mica, organic fibers, inorganic fibers, talc, viscosity, kaolin, bentonite, carbonic acid. Calcium, barium sulfate, magnesium oxide, boron nitride, titanium oxide, filler such as metal powder such as hydrated alumina or aluminum powder, dye or pigment, molding lubricant, flame retardant such as antimony trioxide or red phosphorus, xylene , Materials such as toluene, methyl ethyl ketone or methyl isobutyl ketone, and other general-purpose modifiers can be added for heat- and moisture-resistant casting or molding, or
It can be used as a general or special coating material or a material for a varnish for lamination or impregnation.
[実施例] 以下に実施例を掲げ、本発明を更に詳しく説明する。[Examples] The present invention will be described in more detail with reference to the following examples.
実施例1〜3 (1)撹拌機付セパラブルフラスコに3,4−ジカルボキ
シ−1,2,3,4−テトラヒドロ−1−ナフタレンコハク酸
二無水物(以下、「TDA」と略記する。)とm−キシレ
ン・ホルムアルデヒド樹脂(三菱瓦斯化学(株)製、商
品名「ニカノールLL」)とを仕込み、所定の条件にて酸
無水物系組成物を調製した。調製条件及び得られた酸無
水物系組成物(組成物番号〜)の軟化温度を第1表
に示す。尚、軟化温度は環球法により測定した。Examples 1 to 3 (1) 3,4-dicarboxy-1,2,3,4-tetrahydro-1-naphthalene succinic acid dianhydride (hereinafter abbreviated as "TDA") in a separable flask equipped with a stirrer. ) And m-xylene-formaldehyde resin (manufactured by Mitsubishi Gas Chemical Co., Inc., trade name “Nikanol LL”) were charged and an acid anhydride composition was prepared under predetermined conditions. Table 1 shows the preparation conditions and the softening temperature of the obtained acid anhydride-based composition (composition number to). The softening temperature was measured by the ring and ball method.
(2)エピコート828(液状エポキシ樹脂、エポキシ当
量190、シェル化学社製)100重量部に、硬化剤として上
記(1)で得られた酸無水物系組成物を所定量配合し、
100〜130℃で加熱混合した後、80℃付近まで冷却した。
次いで硬化促進剤としてDMP−30を0.5重量部添加混合
し、その際の系内の状態を観察して液状エポキシ樹脂と
の相溶性を評価した。得られた結果を第1表に示す。(2) 100 parts by weight of Epicoat 828 (liquid epoxy resin, epoxy equivalent 190, manufactured by Shell Chemical Co., Ltd.) was mixed with a predetermined amount of the acid anhydride composition obtained in (1) above as a curing agent,
After heating and mixing at 100 to 130 ° C, the mixture was cooled to around 80 ° C.
Next, 0.5 part by weight of DMP-30 as a curing accelerator was added and mixed, and the state of the system at that time was observed to evaluate the compatibility with the liquid epoxy resin. The results obtained are shown in Table 1.
(3)更に、このようにして得られたエポキシ樹脂組成
物を150℃で5時間、次いで200℃で5時間にて硬化せし
め、その硬化物の物性を測定した。評価方法を以下に示
し、得られた結果を第1表に示す。(3) Further, the epoxy resin composition thus obtained was cured at 150 ° C. for 5 hours and then at 200 ° C. for 5 hours, and the physical properties of the cured product were measured. The evaluation methods are shown below, and the results obtained are shown in Table 1.
熱変形温度:JIS K−6911に準拠する。Heat distortion temperature: According to JIS K-6911.
曲げ強度:JIS K−6911に準拠する。Bending strength: According to JIS K-6911.
比較例1 TDAの融点は、202〜203℃である。液状エポキシ樹脂100
重量部に対しTDAを80重量部配合し実施例1に準じて加
熱混合したところ、TDAが溶解せず系が白濁した。又、2
05℃で加熱混合し、一旦均一にしてから80℃付近まで冷
却した場合、TDAの結晶が析出して同様に系が白濁し
た。このためエポキシ樹脂組成物の硬化物性は評価でき
なかった。Comparative Example 1 TDA has a melting point of 202 to 203 ° C. Liquid epoxy resin 100
When 80 parts by weight of TDA was mixed in parts by weight and heated and mixed according to Example 1, TDA was not dissolved and the system became cloudy. Also, 2
When the mixture was heated and mixed at 05 ° C, homogenized once, and then cooled to around 80 ° C, TDA crystals were precipitated and the system likewise became cloudy. Therefore, the cured physical properties of the epoxy resin composition could not be evaluated.
実施例4〜11 (1)撹拌機付セパラブルフラスコに所定の酸無水物系
組成物(組成物番号〜)と常温で液状の二塩基酸無
水物とを夫々所定量仕込み、150℃で30分混合して常温
で液状のエポキシ樹脂用の硬化剤組成物(硬化剤番号
(1)〜(8))を調製し、このものを20℃の温度条件
下、結晶が析出するまでの日数を観察することにより、
その保存安定性を評価した。得られた結果を第2表に示
す。Examples 4 to 11 (1) A separable flask equipped with a stirrer was charged with a predetermined acid anhydride composition (composition number ~) and a dibasic acid anhydride liquid at room temperature in predetermined amounts, and the mixture was heated at 150 ° C for 30 minutes. Mixing is performed to prepare a curing agent composition (curing agent numbers (1) to (8)) for an epoxy resin that is liquid at room temperature, and the number of days until crystals are deposited under the temperature condition of 20 ° C. By observing,
The storage stability was evaluated. The results obtained are shown in Table 2.
(2)このようにして得られた硬化剤組成物を適用して
調製されたエポキシ樹脂組成物の硬化物性を評価した。
評価方法を以下に示し、得られた結果を第3表に示す。(2) The cured physical properties of the epoxy resin composition prepared by applying the thus obtained curing agent composition were evaluated.
The evaluation methods are shown below, and the results obtained are shown in Table 3.
曲げ弾性率:JIS K−6911に準拠する。Flexural modulus: Complies with JIS K-6911.
プレッシャークッカーテスト:121℃、2.2atmの条件下、
24時間後の重量増加率を測定した。Pressure cooker test: 121 ℃, 2.2atm condition,
The weight increase rate after 24 hours was measured.
誘電正接:JIS K−6911に準拠し、50Hzで測定した。Dielectric loss tangent: Measured at 50 Hz according to JIS K-6911.
比較例2 実施例4に準じて、TDAを配合した硬化組成物(硬化剤
番号(9))の保存安定性を評価した。得られた結果を
第2表に示す。更に、このものを適用して調製した硬化
物の物性を第3表に示す。Comparative Example 2 In accordance with Example 4, the storage stability of the cured composition containing TDA (curing agent number (9)) was evaluated. The results obtained are shown in Table 2. Further, Table 3 shows the physical properties of a cured product prepared by applying this product.
比較例3 実施例4に準じて、リカシッドMH−700(4−メチルヘ
キサヒドロ無水フタル酸:新日本理化(株)製)を配合
して調製したエポキシ樹脂組成物の硬化物性を第3表に
示す。Comparative Example 3 According to Example 4, the cured physical properties of the epoxy resin composition prepared by blending RIKACID MH-700 (4-methylhexahydrophthalic anhydride: manufactured by Shin Nippon Rika Co., Ltd.) are shown in Table 3. Show.
実施例12 (1)酸無水物として、TDA85重量%と5,6,9,10−テト
ラカルボキシトリシクロ−(6.2.2.02,7)−ドデカ−2,
11−ジエン二無水物15重量%からなる混合酸無水物を使
用した以外は、実施例2と同様にして酸無水物系組成物
(組成分号の)を得た。この組成物の軟化温度は113
℃であった。Example 12 (1) As an acid anhydride, 85% by weight of TDA and 5,6,9,10-tetracarboxytricyclo- (6.2.2.0 2,7 ) -dodeca-2,
An acid anhydride-based composition (compositional part) was obtained in the same manner as in Example 2 except that a mixed acid anhydride consisting of 15% by weight of 11-diene dianhydride was used. The softening temperature of this composition is 113.
It was ℃.
(2)当該酸無水物系変性分()の液状エポキシ樹脂
との相溶性を実施例2に準じて評価したところ、透明均
一なエポキシ樹脂組成物か得られた。(2) When the compatibility of the acid anhydride-based modified component () with the liquid epoxy resin was evaluated according to Example 2, a transparent and uniform epoxy resin composition was obtained.
(3)実施例2に準じ、上記(2)に係るエポキシ樹脂
組成物の硬化物の物性を測定したところ、このものの熱
変形温度は201℃であり、曲げ強度は11.5kg/mm2であっ
た。(3) According to Example 2, the physical properties of the cured product of the epoxy resin composition according to (2) above were measured, and the heat distortion temperature was 201 ° C and the bending strength was 11.5 kg / mm 2. It was
実施例13 実施例12で得た酸無水物系組成物を使用した以外は実
施例5に準拠し、常温で液状のエポキシ樹脂硬化剤組成
物を調製した。当該組成物の20℃における保存安定性を
評価したところ、50日経過後においても結晶の析出は認
められなかった。Example 13 An epoxy resin curing agent composition which was liquid at room temperature was prepared according to Example 5 except that the acid anhydride composition obtained in Example 12 was used. When the storage stability of the composition at 20 ° C. was evaluated, no crystal precipitation was observed even after 50 days.
参考例 エポキシ粉体塗料への適用例を以下に示す。Reference example An example of application to an epoxy powder coating is shown below.
エピコート1004(シェル化学社製、エポキシ当量925)
に対し、硬化剤として実施例1で得られた酸無水物系組
成物を、硬化促進剤として1−シアノエチル−2−メ
チルイミダゾリウム・トリメリテート(四国化成工業
(株)製、商品名「キュアゾール2MZ−CNS」)を、レベ
リング剤としてモダフロー(モンサント社製)を及び充
填剤として酸化チタンを夫々所定量配合し、予備混合し
たものをエクストルーダー(スイス・ブス社製、コニー
ダーPL−46型)で100℃にて溶融混合し、ハンマーミル
で粉砕後、200メッシュの金網でふるい、粉体塗料を製
造した。Epicoat 1004 (Shell Chemical Co., epoxy equivalent 925)
On the other hand, the acid anhydride composition obtained in Example 1 was used as a curing agent, and 1-cyanoethyl-2-methylimidazolium trimellitate (manufactured by Shikoku Chemicals Co., Ltd., trade name "CUREZOL 2MZ" as a curing accelerator. -CNS ") was mixed with Modaflow (manufactured by Monsanto) as a leveling agent and titanium oxide as a filler in predetermined amounts, and the mixture was pre-mixed with an extruder (Bus Co., Ltd., Cokneader PL-46 type). The mixture was melt-mixed at 100 ° C., crushed with a hammer mill, and sieved with a 200-mesh wire net to produce a powder coating.
得られた粉体塗料を適用してリン酸亜鉛処理鋼板を静電
塗装した(−50kVの印加電圧下、膜厚60μm)。次い
で、20分間焼付けを行ない、その焼付け塗膜の諸物性を
測定した。評価方法を以下に示し、得られた結果を第4
表に示す。The obtained powder coating material was applied and the zinc phosphate-treated steel plate was electrostatically coated (under an applied voltage of −50 kV, a film thickness of 60 μm). Then, baking was performed for 20 minutes, and various physical properties of the baked coating film were measured. The evaluation method is shown below, and the obtained results are
Shown in the table.
密着性:JIS K−5400に準拠に、碁盤目を作り、この上
に市販のセロハンテープを圧着後、剥離する(合格数/
碁盤目数)。Adhesion: In conformity with JIS K-5400, make a grid pattern, press commercially available cellophane tape on it, and peel it off (number of passes /
Go board number).
エリクセン:押し出し距離による。Erichsen: Depends on extrusion distance.
耐衝撃性:JIS K−5400に準拠する。Impact resistance: Conforms to JIS K-5400.
測定条件は1/2インチφ×1kgである。The measurement condition is 1/2 inch φ × 1 kg.
耐屈曲性:JIS K−5400に準拠する。Flex resistance: conforms to JIS K-5400.
測定条件は4mm×180゜である。The measurement condition is 4 mm × 180 °.
耐沸騰水性:沸騰水に3時間浸漬後の塗膜を目視にて観
察する。Boiling resistance: Visual observation of the coating film after immersion in boiling water for 3 hours.
比較のためにTDAを硬化剤として適用した場合に得られ
た塗膜の物性を「参考比較例」として併せて第4表に示
す。For comparison, the physical properties of the coating films obtained when TDA was applied as a curing agent are also shown in Table 4 as "Reference Comparative Examples".
以下の結果より、本発明品を硬化剤として適用して得ら
れた粉体塗料塗膜は、可撓性、機械的性質等に優れてい
る。From the following results, the powder coating film obtained by applying the product of the present invention as a curing agent is excellent in flexibility, mechanical properties and the like.
[発明の効果] 本発明に係る酸無水物系組成物は、軟化温度が低く、係
る変性物を構成成分とするエポキシ樹脂効果剤組成物
は、エポキシ樹脂との相溶性が高く、かつ保存安定性に
優れたものである。EFFECTS OF THE INVENTION The acid anhydride composition according to the present invention has a low softening temperature, and the epoxy resin effect agent composition containing the modified product as a constituent has high compatibility with the epoxy resin and is stable in storage. It has excellent properties.
───────────────────────────────────────────────────── フロントページの続き 審査官 冨士 良宏 (56)参考文献 特開 昭58−136619(JP,A) 特開 昭61−155421(JP,A) 特開 昭63−132912(JP,A) 米国特許4451637(US,A) 米国特許3422076(US,A) ─────────────────────────────────────────────────── --Continued from the front page Examiner Yoshihiro Fuji (56) References JP-A-58-136619 (JP, A) JP-A-61-155421 (JP, A) JP-A-63-132912 (JP, A) US Patent 4451637 (US, A) US Patent 3422076 (US, A)
Claims (3)
び/又は一般式(II)で表される四塩基酸無水物と芳香
族炭化水素−ホルムアルデヒド樹脂とを含有することを
特徴とする酸無水物系組成物。 [式中、R1、R2は同一又は異なって、水素原子又は炭素
数1〜8のアルキル基を表す。]1. A tetrabasic acid anhydride represented by the general formula (I) and / or a tetrabasic acid anhydride represented by the general formula (II) and an aromatic hydrocarbon-formaldehyde resin. A featured acid anhydride composition. [In the formula, R 1 and R 2 are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. ]
び/又は一般式(II)で表される四塩基酸無水物と芳香
族炭化水素−ホルムアルデヒド樹脂とを含有してなる酸
無水物系組成物を含有することを特徴とするエポキシ樹
脂用の硬化剤組成物。 [式中、R1、R2は同一又は異なって、水素原子又は炭素
数1〜8のアルキル基を表す。]2. A tetrabasic acid anhydride represented by the general formula (I) and / or a tetrabasic acid anhydride represented by the general formula (II) and an aromatic hydrocarbon-formaldehyde resin. A curing agent composition for an epoxy resin, comprising an acid anhydride composition. [In the formula, R 1 and R 2 are the same or different and each represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms. ]
記載のエポキシ樹脂用の硬化剤組成物。3. A curing agent composition for an epoxy resin according to claim 2, which is liquid at 25 ° C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25772787A JPH0694498B2 (en) | 1987-10-13 | 1987-10-13 | Acid anhydride composition and curing agent composition for epoxy resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25772787A JPH0694498B2 (en) | 1987-10-13 | 1987-10-13 | Acid anhydride composition and curing agent composition for epoxy resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0198616A JPH0198616A (en) | 1989-04-17 |
| JPH0694498B2 true JPH0694498B2 (en) | 1994-11-24 |
Family
ID=17310255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25772787A Expired - Lifetime JPH0694498B2 (en) | 1987-10-13 | 1987-10-13 | Acid anhydride composition and curing agent composition for epoxy resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0694498B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145317A1 (en) * | 2010-05-21 | 2011-11-24 | 日本曹達株式会社 | Curable powder coating composition, and cured product of same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3422076A (en) | 1965-08-12 | 1969-01-14 | American Cyanamid Co | Reaction product of alkylated hexamethylolmelamines and polyanhydrides |
| US4451637A (en) | 1982-02-08 | 1984-05-29 | Nippon Zeon Co., Ltd. | Epoxy resin composition |
-
1987
- 1987-10-13 JP JP25772787A patent/JPH0694498B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3422076A (en) | 1965-08-12 | 1969-01-14 | American Cyanamid Co | Reaction product of alkylated hexamethylolmelamines and polyanhydrides |
| US4451637A (en) | 1982-02-08 | 1984-05-29 | Nippon Zeon Co., Ltd. | Epoxy resin composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0198616A (en) | 1989-04-17 |
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