JPH0698658B2 - Method and apparatus for detecting operating state of injection molding machine - Google Patents
Method and apparatus for detecting operating state of injection molding machineInfo
- Publication number
- JPH0698658B2 JPH0698658B2 JP8197290A JP8197290A JPH0698658B2 JP H0698658 B2 JPH0698658 B2 JP H0698658B2 JP 8197290 A JP8197290 A JP 8197290A JP 8197290 A JP8197290 A JP 8197290A JP H0698658 B2 JPH0698658 B2 JP H0698658B2
- Authority
- JP
- Japan
- Prior art keywords
- time
- sampling
- physical quantity
- change amount
- molding machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001746 injection moulding Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 11
- 238000005070 sampling Methods 0.000 claims description 50
- 238000001514 detection method Methods 0.000 claims description 34
- 230000008859 change Effects 0.000 claims description 33
- 238000002347 injection Methods 0.000 description 18
- 239000007924 injection Substances 0.000 description 18
- 238000000465 moulding Methods 0.000 description 14
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Testing Or Calibration Of Command Recording Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は成形サイクル中の動作状態に係わる複数の物理
量を同時に検出する際における射出成形機の動作状態検
出方法及び装置に関する。The present invention relates to a method and apparatus for detecting an operating state of an injection molding machine when simultaneously detecting a plurality of physical quantities related to an operating state during a molding cycle.
一般に、射出成形機では、所定の成形サイクルにて成形
を行い、この際、動作状態の確認、成形品の品質確認、
最適成形条件の探求等を目的として成形サイクル中の動
作状態に係わる物理量を検出している。Generally, an injection molding machine performs molding in a predetermined molding cycle, and at this time, confirms the operating state, confirms the quality of the molded product,
The physical quantity related to the operation state during the molding cycle is detected for the purpose of searching for the optimum molding condition.
従来、このような物理量を検出するに際しては、一定の
サンプリング時間を設定し、サンプリング時間毎に各物
理量の値を検出していた。しかし、成形サイクル中の物
理量は急激に変化する区間(高速動作区間)と緩やかに
変化する区間(低速動作区間)が混在するため、急激に
変化する区間の動作状態を高精度に検出すべく、サンプ
リング時間を短く設定した場合には、サンプリング点が
著しく多くなり、結局、記憶装置の大容量化、装置全体
の大型化及び高価格化を招く問題を生じ、特に、複数の
物理量を同時に検出する場合には重大な問題となる。Conventionally, when detecting such a physical quantity, a fixed sampling time is set and the value of each physical quantity is detected for each sampling time. However, since the physical quantity in the molding cycle includes a rapidly changing section (high-speed operation section) and a gently changing section (low-speed operation section), it is necessary to detect the operating state of the rapidly changing section with high accuracy. When the sampling time is set to be short, the number of sampling points increases remarkably, which eventually causes a problem of increasing the capacity of the storage device, increasing the size of the entire device, and increasing the price. In particular, a plurality of physical quantities are detected simultaneously. In some cases it becomes a serious problem.
そこで、本出願人は、既に特開昭63-114620号公報にお
いて、圧力を継続して検知し、検知した圧力が予め設定
した一定圧力変化した時点の動作状態に係わる物理量を
順次検出するとともに、一定時間を設定し、当該一定時
間内に圧力が前記一定圧力変化しないときは、当該一定
時間経過した時点の物理量を検出するようにし、動作状
態を高精度に検出するとともに、必要かつ最適な検出点
を設定し、記憶容量の適切化、装置の小型・低コスト化
を図った射出成形機の動作状態検出方法を提案した。Therefore, the present applicant already disclosed in Japanese Patent Laid-Open No. 63-114620, continuously detects the pressure, and sequentially detects the physical quantity related to the operating state at the time when the detected pressure changes by a predetermined constant pressure, and When a fixed time is set and the pressure does not change within the fixed time, the physical quantity at the time when the fixed time has elapsed is detected, and the operating state is detected with high accuracy, and necessary and optimal detection is performed. We proposed a method for detecting the operating state of an injection molding machine that sets points, optimizes the storage capacity, and reduces the size and cost of the device.
ところで、射出成形機における成形サイクル、特に、射
出開始時から射出終了時までの射出スクリュ速度Vs、射
出ラム圧Pi及び金型内圧Pmは、通常、第4図に示す特性
となり、各物理量(Vs、Pi、Pm)の急激な変化区間と緩
やかな変化区間の発生する時間と度合は各物理量間で大
きく異なる。By the way, the molding cycle in the injection molding machine, in particular, the injection screw speed Vs, the injection ram pressure Pi and the mold internal pressure Pm from the start of injection to the end of injection usually have the characteristics shown in FIG. , Pi, Pm), the time and degree of occurrence of the abrupt change section and the gradual change section vary greatly among the physical quantities.
このため、上述した従来の動作状態検出方法を、例えば
射出ラム圧Piに適用し、得られる検出点における射出ス
クリュ速度Vsと金型内圧Pmを同時に検出しても、射出ラ
ム圧Piが緩やかに変化する区間Ta及びTbでは、射出スク
リュ速度Vs及び金型内圧Pmは急激に変化し、結局、高精
度の検出は望めない。Therefore, even if the conventional operating state detection method described above is applied to, for example, the injection ram pressure Pi and the injection screw speed Vs and the mold internal pressure Pm at the obtained detection point are simultaneously detected, the injection ram pressure Pi becomes gentle. In the changing sections Ta and Tb, the injection screw speed Vs and the mold internal pressure Pm change abruptly, so that highly accurate detection cannot be expected.
なお、各物理量に対して上述した従来の動作状態検出方
法を個別に適用することもできるが、制御系が各物理量
に対応して必要となるため、構成が著しく繁雑となり、
しかも、各物理量に対する検出時点が異なるため、相対
的な検出精度も低下する。Although the above-mentioned conventional operation state detection method can be applied to each physical quantity individually, the control system is required to correspond to each physical quantity, resulting in a significantly complicated configuration.
Moreover, since the detection time points for each physical quantity are different, the relative detection accuracy is also reduced.
本発明はこのような従来の技術に存在する課題を解決し
た射出成形機の動作状態検出方法及び同方法を実施する
動作状態検出装置の提供を目的とするものである。An object of the present invention is to provide a method for detecting an operating state of an injection molding machine and an operating state detecting apparatus for carrying out the method, which solves the problems existing in the related art.
本発明に係る動作状態検出方法は、射出成形機の動作状
態に係わる複数の物理量をサンプリングにより同時に検
出するに際し、予め、サンプリング時間(間隔をいう。
以下同じ))Tsと各物理量に対する所定のサンプリング
変化量dx1、dx2…dxnを設定し、各物理量を同時に検知
するとともに、いずれかの物理量の検知変化量dk1、dk2
…dknがサンプリング変化量dx1、dx2…dxnに達した時点
又はサンプリング時間Tsに達した時点のいずれか早い時
点をサンプリング点とし、順次発生するサンプリング点
における各物理量の値K1、K2…Knと時間tを同時に検出
するようにした。The operation state detection method according to the present invention, in detecting a plurality of physical quantities related to the operation state of the injection molding machine at the same time by sampling, means a sampling time (interval) in advance.
The same shall apply hereinafter)) Ts and predetermined sampling variations dx1, dx2 ... dxn for each physical quantity are set, and each physical quantity is detected at the same time, and the detected variation quantity dk1, dk2 of one of the physical quantities is set.
... dkn reaches the sampling change amount dx1, dx2 ... dxn or the sampling time Ts, whichever is earlier, whichever is earlier, and the values K1, K2 ... Kn and time of each physical quantity at the sequentially occurring sampling points t was detected at the same time.
また、本発明に係る動作状態検出装置1は射出成形機の
動作状態に係わる複数の物理量を検知するセンサS1、S2
…Snと、各物理量に対する所定のサンプリング変化量dx
1、dx2…dxnを設定する変化量設定器2と、所定のサン
プリング時間Tsを設定する時間設定器3と、センサS1…
から検知したいずれかの物理量の検知変化量dk1…がサ
ンプリング変化量dx1…に達した時点又はサンプリング
時間Tsに達した時点のいずれか早い時点をサンプリング
点とし、順次発生するサンプリング点における各物理量
の値K1…と時間tを同時に検出する検出制御部4を備え
たことを特徴とする。In addition, the operation state detection device 1 according to the present invention includes sensors S1 and S2 that detect a plurality of physical quantities related to the operation state of the injection molding machine.
... Sn and a predetermined sampling variation dx for each physical quantity
1, dx2 ... dxn change amount setting device 2, time setting device 3 setting a predetermined sampling time Ts, sensor S1 ...
The detected change amount dk1 of one of the physical quantities detected from the sampling change amount dx1 ... or the sampling time Ts, whichever comes first, is taken as the sampling point, and the physical quantity of each physical quantity at the sampling points is sequentially generated. .. and the time t are detected at the same time.
本発明に係る動作状態検出方法(又は検出装置1)によ
れば、まず、変化量設定器2により各物理量に対する所
定のサンプリング変化量dx1、dx2…dxnが設定される。
また、時間設定器3により所定のサンプリング時間Tsが
設定される。According to the operation state detecting method (or the detecting device 1) of the present invention, first, the change amount setting unit 2 sets predetermined sampling change amounts dx1, dx2 ... Dxn for each physical quantity.
Further, the time setter 3 sets a predetermined sampling time Ts.
一方、成形サイクル中はセンサS1、S2…Snにより各物理
量を同時に検知し、検出制御部4は検知した物理量を監
視する。そして、検出制御部4は、いずれかの物理量の
検知変化量dk1…がサンプリング変化量dx1…に達した時
点で各物理量の値K1…とその時の時間tを検出(サンプ
リング)する。なお、各物理量の検知変化量dk1…が各
サンプリング変化量dx1…に達するまでに、先にサンプ
リング時間Tsに達したなら、この時点の各物理量の値K1
…と時間tを検出(サンプリング)する。On the other hand, during the molding cycle, the sensors S1, S2 ... Sn simultaneously detect each physical quantity, and the detection control unit 4 monitors the detected physical quantity. Then, the detection control unit 4 detects (samples) the value K1 of each physical quantity and the time t at that time when the detected variation dk1 ... Of any physical quantity reaches the sampling variation dx1. If the detected change amount dk1 of each physical amount reaches the sampling change amount dx1 ... before reaching the sampling time Ts, the value K1 of each physical amount at this point
... and time t are detected (sampled).
よって、順次発生するサンプリング点において検出を繰
返えせば、各物理量における全ての急激な変化区間は高
精度に検出される。Therefore, if the detection is repeated at the sampling points that occur sequentially, all the abrupt change sections in each physical quantity can be detected with high accuracy.
次に、本発明に係る好適な実施例を挙げ、図面に基づき
詳細に説明する。Next, preferred embodiments according to the present invention will be described in detail with reference to the drawings.
まず、本発明を明確にするため、射出成形機の概略構成
について第2図を参照して説明する。図中、符号Mで示
す射出成形機は大別して機台11と、この機台11の上に設
置した直圧式型締装置12と、この型締装置12の型取付面
に取付けた可動型13aと固定型13bからなる金型13と、機
台11上に設置したインラインスクリュ式射出装置14を備
え、これらは公知の射出成形機を構成している。また、
機台11には成形機コントローラ15を内蔵するとともに、
本発明に係る動作状態検出装置1を装備する。First, in order to clarify the present invention, a schematic configuration of an injection molding machine will be described with reference to FIG. In the figure, the injection molding machine indicated by the symbol M is roughly classified into a machine base 11, a direct pressure type mold clamping device 12 installed on the machine base 11, and a movable mold 13a mounted on a mold mounting surface of the mold clamping device 12. And a fixed mold 13b, and a mold 13 and an in-line screw type injection device 14 installed on the machine base 11, which constitute a known injection molding machine. Also,
In addition to incorporating the molding machine controller 15 in the machine base 11,
The operation state detection device 1 according to the present invention is equipped.
次に、動作状態検出装置1及びその周辺構成について第
1図及び第2図を参照して説明する。Next, the operation state detection device 1 and its peripheral configuration will be described with reference to FIGS. 1 and 2.
まず、型締装置12には型締時の油圧力を検出する型締圧
力センサS4、可動型133aを取付けた可動盤21の位置を検
出する可動盤位置センサS7を付設する。また、金型13に
は金型キャビティ内に充填された樹脂温度を検出する型
内樹脂温度センサS8、金型キャビティ内の樹脂圧を検出
する金型内圧センサS2及び金型温度を検出する金型温度
センサS5を付設する。さらに、射出装置14には加熱筒22
の温度を検出する加熱筒温度センサS6、スクリュ位置
(速度)を検出するスクリュ位置(速度)センサS1、射
出時の油圧力を検出する射出ラム圧センサS3をそれぞれ
付設する。First, the mold clamping device 12 is provided with a mold clamping pressure sensor S4 for detecting hydraulic pressure during mold clamping and a movable platen position sensor S7 for detecting the position of the movable platen 21 on which the movable mold 133a is mounted. Further, the mold 13 has an in-mold resin temperature sensor S8 that detects the temperature of the resin filled in the mold cavity, an in-mold pressure sensor S2 that detects the resin pressure in the mold cavity, and a mold that detects the mold temperature. A mold temperature sensor S5 is attached. Further, the injection device 14 has a heating cylinder 22.
A heating cylinder temperature sensor S6 for detecting the temperature, a screw position (speed) sensor S1 for detecting the screw position (speed), and an injection ram pressure sensor S3 for detecting the oil pressure at the time of injection are additionally provided.
これらの各センサS1〜S8は必要に応じて変換、補正、増
幅、A/D変換等の機能を備えるアンプ部25〜32を介して
スレーブCPU33に接続する。また、スレーブCPU33はRAM3
4を介してメインCPU35に接続し、さらにメインCPU35に
は表示装置36、外部記憶装置37、後述する設定部40をそ
れぞれ接続するとともに、前記成形機コントローラ15が
接続される。Each of these sensors S1 to S8 is connected to the slave CPU 33 via amplifier units 25 to 32 having functions such as conversion, correction, amplification, and A / D conversion as necessary. In addition, slave CPU33 is RAM3
The main CPU 35 is connected to the main CPU 35 via a display device 36, an external storage device 37, and a setting unit 40 described later, and the molding machine controller 15 is connected to the main CPU 35.
第1図は動作状態検出装置1の主要部のみを抽出して示
す。同図において、4は検出制御部である。検出制御部
4には前述したスレーブCPU33、RAM34、メインCPU35を
含み、また、前記センサS1…がアンプ部25…を介して接
続されるとともに、成形機コントローラ15が接続され
る。さらにまた、RAM38を介してCRT、プラズマディスプ
レイ、液晶ディスプレー等を利用した前記表示装置36、
X−Yレコーダ、プリンタ等の記録装置39、フロッピデ
ィスク、ICカード等を利用できる前記外部記憶装置37が
接続される。一方、検出制御部4には設定部40を接続す
る。設定部40には本発明に従って所定のサンプリング変
化量dx1…を設定する変化量設定器2及び所定のサンプ
リング時間Tsを設定する時間設定器3を備えるととも
に、検出する物理量を設定(選択)する検出物理量設定
器を備えている。FIG. 1 shows only the main part of the operating state detection device 1 in an extracted manner. In the figure, 4 is a detection control unit. The detection control unit 4 includes the slave CPU 33, the RAM 34, and the main CPU 35 described above, and the sensors S1 ... Are connected via the amplifier units 25 ... And the molding machine controller 15 is connected. Furthermore, the display device 36 using a CRT, a plasma display, a liquid crystal display or the like via the RAM 38,
A recording device 39 such as an XY recorder and a printer, and the external storage device 37 that can use a floppy disk, an IC card, etc. are connected. On the other hand, the setting unit 40 is connected to the detection control unit 4. According to the present invention, the setting unit 40 includes a change amount setter 2 for setting a predetermined sampling change amount dx1 ... And a time setter 3 for setting a predetermined sampling time Ts, and a detection unit for setting (selecting) a physical quantity to be detected. Equipped with a physical quantity setting device.
次に、検出制御部4の機能を含む本発明に係る動作状態
検出方法について説明する。Next, an operation state detection method according to the present invention including the function of the detection control unit 4 will be described.
まず、設定部40における検出物理量設定器には検出する
物理量、一例として、スクリュ速度、金型内圧、射出ラ
ム圧を設定する。また、変化量設定器2には各物理量、
即ち、スクリュ速度、金型内圧、射出ラム圧に対する最
適なサンプリング変化量dx1、dx2、dx3をそれぞれ設定
するとともに、時間設定器3にはサンプリング時間Tsを
設定する。First, a physical quantity to be detected, for example, a screw speed, a mold internal pressure, and an injection ram pressure are set in the detected physical quantity setting device in the setting unit 40. In addition, the physical quantity,
That is, the optimum sampling variations dx1, dx2, dx3 for the screw speed, the mold internal pressure, and the injection ram pressure are set, and the sampling time Ts is set in the time setting device 3.
一方、射出成形機が動作した場合には第3図に示すフロ
ーチャートに従って動作状態の検出が行われる。成形サ
イクルが進行し、射出工程に移行すれば、成形機コント
ローラ15における射出開始指令に基づいて、サンプリン
グタイマが計時を開始し、同時に、各センサS1、S2、S3
により検知される物理量は検出制御部4に入力する(ス
テップ51、52)。On the other hand, when the injection molding machine operates, the operation state is detected according to the flowchart shown in FIG. When the molding cycle progresses and shifts to the injection process, the sampling timer starts timing based on the injection start command in the molding machine controller 15, and at the same time, each sensor S1, S2, S3.
The physical quantity detected by is input to the detection controller 4 (steps 51 and 52).
検出制御部4は検知した各物理量における検知変化量dx
1、dx2、dx3を監視する(ステップ53、54、55)ととも
に、各検知変化量dx1…を予め設定した各サンプリング
変化量dx1…と比較し、いずれかの検知変化量dx1…がサ
ンプリング変化量dx1…に達した時点で各物理量の値K
1、K2、K3と、その時の時間tを検出する(ステップ5
6、57、58)。なお、この際、各物理量における検知変
化量dx1…がサンプリング変化量dx1…に達するまでに、
先にサンプリング時間Tsに達したなら、この時点の各物
理量の値K1…と時間tを検出する(ステップ59)。そし
て、検出した各物理量の値K1…と時間tはRAM38に書込
む(ステップ60)。同時に、検出制御部4はこのときの
検知変化量dx1…をクリアし、再び各物理量の検知変化
量dx1…を監視する(ステップ61)。このようにして、
サンプリング点が順次発生し、発生したサンプリング点
における各物理量の値K1…と時間tを検出して順次RAM3
8に書込み、射出工程の射出終了指令に基づいて1サイ
クルの検出を終了する(ステップ62)。The detection control unit 4 detects the detected change amount dx for each physical quantity.
While monitoring 1, dx2, dx3 (steps 53, 54, 55), each detected change amount dx1 ... is compared with each preset sampling change amount dx1. The value K of each physical quantity when it reaches dx1 ...
1, K2, K3 and time t at that time are detected (step 5).
6, 57, 58). At this time, until the detected change amount dx1 ... In each physical quantity reaches the sampling change amount dx1.
If the sampling time Ts is reached first, the value K1 ... Of each physical quantity at this time and the time t are detected (step 59). Then, the detected value K1 of each physical quantity and the time t are written in the RAM 38 (step 60). At the same time, the detection control unit 4 clears the detected change amount dx1 ... At this time, and again monitors the detected change amount dx1 ... Of each physical quantity (step 61). In this way
Sampling points are sequentially generated, and the values K1 of each physical quantity and the time t at the sampling points are detected to sequentially detect the RAM3.
8 is written, and the detection of one cycle is completed based on the injection end command of the injection process (step 62).
よって、検出したデータから横軸に時間tをとり、縦軸
に各物理量の値K1、K2、K3をとって表示すれば、第4図
に示すVs(K1)、Pm(K2)、Pi(K3)の特性曲線とな
り、物理量に対する高精度の変化特性を得れる。Therefore, if the time t is plotted on the horizontal axis and the physical quantity values K1, K2, K3 are plotted on the vertical axis from the detected data, Vs (K1), Pm (K2), Pi ( It becomes the characteristic curve of K3), and highly accurate change characteristics with respect to physical quantities can be obtained.
以上、実施例について詳細に説明したが本発明はこのよ
うな実施例に限定されるものではなく、本発明の要旨を
逸脱しない範囲で任意に変更できる。Although the embodiments have been described in detail above, the present invention is not limited to such embodiments and can be arbitrarily modified without departing from the scope of the present invention.
このように、本発明に係る射出成形機の動作状態検出方
法(又は検出装置)は、予め、サンプリング時間と各物
理量に対する所定のサンプリング変化量を設定し、各物
理量を同時に検知するとともに、いずれかの物理量の検
知変化量が前記サンプリング変化量に達した時点又は前
記サンプリング時間に達した時点のいずれか早い時点を
サンプリング点とし、順次発生するサンプリング点にお
ける各物理量の値と時間を同時に検出するようにしたた
め、次のような顕著な効果を奏する。As described above, the operating state detection method (or detection device) of the injection molding machine according to the present invention sets the sampling time and the predetermined sampling change amount for each physical quantity in advance, detects each physical quantity at the same time, and The detection point of the physical quantity of 1 reaches the sampling change point or the time point of reaching the sampling time, whichever is earlier, whichever is earlier, and the value and time of each physical quantity at the sampling points that occur sequentially are detected simultaneously. Therefore, the following remarkable effects are obtained.
複数の物理量を同時に検出する際にも、全物理量に対
する高精度の検出が可能になるとともに、サンプリング
点も必要最少の数量で足りるため、記憶装置の低容量化
及び制御系の簡略化、さらには装置全体の小型化及び低
コスト化を達成できる。Even when detecting multiple physical quantities at the same time, it is possible to detect with high accuracy with respect to all physical quantities, and since the minimum number of sampling points is sufficient, the capacity of the storage device is reduced and the control system is simplified. It is possible to achieve downsizing and cost reduction of the entire device.
射出成形機の動作確認、成形品の品質確認、最適成形
条件の探究等を容易かつ短時間に行うことができるとと
もに、正確かつ精度の高い解析を行うことができる。It is possible to confirm the operation of the injection molding machine, confirm the quality of the molded product, search for the optimum molding conditions, etc. easily and in a short time, and perform accurate and highly accurate analysis.
第1図:本発明に係る動作状態検出装置のブロック回路
図、 第2図:同動作状態検出装置を含む射出成形機の概略構
成図、 第3図:本発明に係る動作状態検出方法における手順の
一部を示すフローチャート、 第4図:時間対物理量の変化特性図。 尚図面中、 1:動作状態検出装置 S1、S2…S8(Sn):センサ 2:変化量設定器、3:時間設定器 4:検出制御部1 is a block circuit diagram of an operating state detecting device according to the present invention, FIG. 2 is a schematic configuration diagram of an injection molding machine including the operating state detecting device, and FIG. 3 is a procedure in an operating state detecting method according to the present invention. FIG. 4 is a flowchart showing a part of FIG. In the drawing, 1: Operating state detection device S1, S2 ... S8 (Sn): Sensor 2: Change amount setting device 3: Time setting device 4: Detection control unit
Claims (2)
量をサンプリングにより同時に検出するに際し、予め、
サンプリング時間(間隔)と各物理量に対する所定のサ
ンプリング変化量を設定し、各物理量を同時に検知する
とともに、いずれかの物理量の検知変化量が前記サンプ
リング変化量に達した時点又は前記サンプリング時間に
達した時点のいずれか早い時点をサンプリング点とし、
順次発生するサンプリング点における各物理量の値と時
間を同時に検出することを特徴とする射出成形機の動作
状態検出方法。1. When simultaneously detecting a plurality of physical quantities relating to the operating state of an injection molding machine by sampling, in advance,
Sampling time (interval) and a predetermined sampling change amount for each physical quantity are set, each physical quantity is detected at the same time, and the detection change amount of one of the physical quantities reaches the sampling change amount or reaches the sampling time. The earliest of the time points is the sampling point,
A method for detecting an operating state of an injection molding machine, which is characterized by simultaneously detecting the value of each physical quantity and the time at successively occurring sampling points.
量を検知するセンサと、各物理量に対する所定のサンプ
リング変化量を設定する変化量設定器と、所定のサンプ
リング時間(間隔)を設定する時間設定器と、各センサ
から検知したいずれかの物理量の検知変化量が前記サン
プリング変化量に達した時点又は前記サンプリング時間
に達した時点のいずれか早い時点をサンプリング点と
し、順次発生するサンプリング点における各物理量の値
と時間を同時に検出する検出制御部を備えてなることを
特徴とする射出成形機の動作状態検出装置。2. A sensor for detecting a plurality of physical quantities relating to the operating state of an injection molding machine, a change amount setter for setting a predetermined sampling change amount for each physical quantity, and a time for setting a predetermined sampling time (interval). A setter and a detection change amount of any physical quantity detected from each sensor reach a sampling change amount or a sampling time at whichever of the sampling time is reached, whichever is earlier. An operation state detection device for an injection molding machine, comprising a detection control unit that simultaneously detects the value of each physical quantity and time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8197290A JPH0698658B2 (en) | 1990-03-29 | 1990-03-29 | Method and apparatus for detecting operating state of injection molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8197290A JPH0698658B2 (en) | 1990-03-29 | 1990-03-29 | Method and apparatus for detecting operating state of injection molding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03278931A JPH03278931A (en) | 1991-12-10 |
| JPH0698658B2 true JPH0698658B2 (en) | 1994-12-07 |
Family
ID=13761409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8197290A Expired - Fee Related JPH0698658B2 (en) | 1990-03-29 | 1990-03-29 | Method and apparatus for detecting operating state of injection molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0698658B2 (en) |
-
1990
- 1990-03-29 JP JP8197290A patent/JPH0698658B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03278931A (en) | 1991-12-10 |
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