JPH07100326B2 - Tablet manufacturing method - Google Patents
Tablet manufacturing methodInfo
- Publication number
- JPH07100326B2 JPH07100326B2 JP61106068A JP10606886A JPH07100326B2 JP H07100326 B2 JPH07100326 B2 JP H07100326B2 JP 61106068 A JP61106068 A JP 61106068A JP 10606886 A JP10606886 A JP 10606886A JP H07100326 B2 JPH07100326 B2 JP H07100326B2
- Authority
- JP
- Japan
- Prior art keywords
- tablet
- molding
- processing means
- vacuum
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/06—Making preforms by moulding the material
- B29B11/12—Compression moulding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体集積回路等（以下ICと記す）を封止す
る樹脂からなるタブレツトの製造方法の改良に関するも
のである。TECHNICAL FIELD The present invention relates to an improvement in a method for manufacturing a tablet made of a resin for encapsulating a semiconductor integrated circuit or the like (hereinafter referred to as an IC).
従来一般に知られているタブレットの製造方法は、特開
昭52−39579号公報、特開昭53−75264号公報、特開昭59
−7009号公報、特開昭59−139633号公報に開示されてい
るように、粉末を減圧処理によって脱気し、その後、そ
の脱気された粉末を圧縮してタブレット化するものであ
った。次に、このようにして製造されたタブレットを用
いてICを封止する方法を第４図ないし第６図で説明す
る。第４図は従来のタブレツトを示す断面図、第５図は
従来のトランスフア成形金型を示す断面図、第６図は成
形後のICを示す断面図である。図において、（１）はエ
ポキシ樹脂や無機質充填剤等を混合し、これ等を一旦粉
末状にして再び一定計量して圧力を加え、円柱状に成形
された軟化温度が80℃〜100℃の固形状タブレツト、
（２）はタブレツト（１）の粉末と粉末との接触界面に
発生した空間からなる多数の粒子間空気で、上記タブレ
ツト（１）の体積中10〜15％を占めている。（３）は金
型、（４）はこの金型（３）に形成されたポツト、
（５）はこのポツト（４）にタブレツト（１）を注入す
るプランジヤー、（６）はポツト（４）に連通するラン
ナー、（７）はこのランナー（６）に連通するキヤビテ
イ、（８）は成形されたICである。Conventionally known tablet manufacturing methods are disclosed in JP-A-52-39579, JP-A-53-75264, and JP-A-5959.
As disclosed in JP-A-70909 and JP-A-59-139633, the powder is deaerated by a decompression treatment, and then the deaerated powder is compressed into a tablet. Next, a method of encapsulating an IC using the tablet thus manufactured will be described with reference to FIGS. 4 to 6. FIG. 4 is a sectional view showing a conventional tablet, FIG. 5 is a sectional view showing a conventional transfer molding die, and FIG. 6 is a sectional view showing an IC after molding. In the figure, (1) is a mixture of an epoxy resin, an inorganic filler, etc., which are once made into a powder and again weighed a certain amount of pressure, and a pressure is applied. Solid tablet,
(2) is a large number of interparticulate air consisting of a space generated at the contact interface between the powder of the tablet (1) and the powder, and occupies 10 to 15% of the volume of the tablet (1). (3) is a mold, (4) is a pot formed in this mold (3),
(5) is a plunger for injecting the tablet (1) into the pot (4), (6) is a runner communicating with the pot (4), (7) is a cavity communicating with the runner (6), and (8) is It is a molded IC.
次に、従来の成形工程について説明する。予め、第４図
のように10〜15％の粒子間空気（２）を含んだタブレツ
ト（１）を、プリヒーター（図示せず）で80℃〜100℃
に予熱する。ここで、180℃に加熱された金型（３）の
キヤビテイ（７）には封止されるべきICが配置されてお
り、ポツト（４）内に軟化されたタブレツト（１）を入
れてプランジヤ（５）を上昇し、タブレツト（１）を圧
縮する。このため、タブレツト（１）はプランジヤー
（５）の上昇に伴つて変形され、ランナー（６）を介し
てキヤビテイ（７）内に注入されてIC（８）が封止され
る。この場合、タブレツト（１）内には粒子間空気
（２）が存在しているため、この粒子間空気（２）は、
変形されたタブレツト（１）に含まれたままキヤビテイ
（７）内に入ることになる。一方、プランジヤ（５）は
タブレツト（１）が硬化するまで加圧状態で維持され、
タブレツト（１）が硬化すると、金型（３）が解放さ
れ、キヤビテイ（７）から封止されたIC（８）が取りは
ずされ、以後、所定の後加工が行なわれてIC（８）が完
成することになる。Next, a conventional molding process will be described. As shown in FIG. 4, a tablet (1) containing 10 to 15% of interparticle air (2) was previously heated to 80 ° C to 100 ° C with a preheater (not shown).
Preheat to. Here, the IC to be sealed is placed in the cavity (7) of the mold (3) heated to 180 ° C., and the softened tablet (1) is put in the pot (4) and the plunger (7) is inserted. (5) is lifted and the tablet (1) is compressed. Therefore, the tablet (1) is deformed as the plunger (5) rises and is injected into the cavity (7) through the runner (6) to seal the IC (8). In this case, since interparticle air (2) exists in the tablet (1), this interparticle air (2) is
It will enter the cavity (7) while being included in the deformed tablet (1). On the other hand, the plunger (5) is kept under pressure until the tablet (1) hardens,
When the tablet (1) hardens, the mold (3) is released and the sealed IC (8) is removed from the cavity (7). Thereafter, predetermined post-processing is performed and the IC (8) is removed. It will be completed.
従来のタブレツトの製造方法では、単に減圧下で粉末を
圧縮処理してタブレットを製造したものであるため、タ
ブレットは粒子状の成形材料が機械的に凝集しているだ
けであり、タブレットの内部は外気と無数の細かな空間
でつながっており、このタブレットを大気圧に開放する
と直ちに外部から内部へと空気が侵入することになり、
このタブレットを用いてICを封止しようとした場合、タ
ブレツト内に存在する粒子間空気を軟化したタブレツト
（１）と共にキヤビテイ内に注入され、ICの中に多量の
粒子間空気が封入されて内部ボイドが発生したり、ICの
表面にもボイドが発生し、前者においてはICの信頼性の
低下を来たし、一方、後者においてはICの外観不良を生
じさせ、IC製造工程における歩留り低下の一固となる問
題点があつた。In the conventional tablet manufacturing method, the powder is simply compressed under reduced pressure to produce a tablet, so that the tablet is merely a mechanical agglomeration of the particulate molding material, and the inside of the tablet is It is connected to the outside air by a myriad of small spaces, and when this tablet is opened to atmospheric pressure, air will immediately enter the inside from the outside,
When an IC is to be sealed using this tablet, the interparticle air present in the tablet is injected into the cavity together with the softened tablet (1), and a large amount of the interparticle air is enclosed inside the IC. Voids or voids are generated on the surface of the IC, which reduces the reliability of the IC in the former case, while causing the appearance of the IC to deteriorate in the latter case, which is a solid decrease in yield in the IC manufacturing process. There was a problem that became.
この発明は上記のような問題点を解消するためになされ
たもので、ICの内部及び表面にボイドが発生することを
防止でき、ICの信頼性の向上、外観不良の低減を図るこ
とができるタブレツトの製造方法を得ることを目的とす
る。The present invention has been made to solve the above-mentioned problems, and it is possible to prevent the occurrence of voids inside and on the surface of the IC, and to improve the reliability of the IC and reduce appearance defects. The object is to obtain a method for manufacturing a tablet.
この発明に係るタブレットの製造方法は、加熱手段を備
えタブレット状の成形用樹脂を圧壊し真空中で加圧成形
する加工手段を、成形用樹脂の軟化温度よりも低いがこ
の軟化温度に近接する温度に昇温する工程と、成形用樹
脂を上記加工手段に投入する工程と、加工手段を真空吸
引する工程と、加工手段に投入された成形用樹脂を圧壊
する工程と、圧壊された成形用樹脂を加工手段で成形体
に加圧成形し、成形時の加圧状態でかつ加工手段の上記
温度で上記成形体が自己融着するまで保持する工程と、
を備えるものである。In the tablet manufacturing method according to the present invention, the processing means which is provided with a heating means and crushes the tablet-shaped molding resin and pressure-molds it in vacuum is lower than the softening temperature of the molding resin but close to this softening temperature. A step of raising the temperature to a temperature, a step of introducing the molding resin into the processing means, a step of vacuum suction of the processing means, a step of crushing the molding resin introduced into the processing means, and a crushed molding step. A step of pressure-molding a resin into a molded body by a processing means, and holding the molded body under pressure at the time of molding and at the temperature of the processing means until the molded body self-bonds,
It is equipped with.
また、タブレット状の成形用熱硬化性樹脂を、この成形
用熱硬化性樹脂の少なくとも表面が自己融着する軟化温
度に昇温する工程と、軟化温度に昇温された成形用熱硬
化性樹脂を、真空中で加圧成形する加工手段に投入する
工程と、加工手段を真空吸引する工程と、軟化温度に昇
温された成形用熱硬化性樹脂を脱気し加工手段で成形体
に加圧成形する工程と、を備えるものである。Further, a step of raising the thermosetting resin in the form of a tablet to a softening temperature at which at least the surface of the thermosetting resin for self-bonding, and the thermosetting resin for molding raised to the softening temperature. Are charged into a processing means for pressure molding in a vacuum, a step of vacuum suction of the processing means, and the thermosetting resin for molding that has been heated to the softening temperature is degassed and added to the molded body by the processing means. And a step of pressure forming.
この発明におけるタブレツトの製造方法は、タブレツト
内の粒子間空気が真空容器中で脱気され、この状態でタ
ブレツトが加熱圧縮され、タブレツトの粒子間が自己融
着され、IC封入時にICに粒子間空気が一緒に封入される
ことが防止され、ICの内部及び表面にボイドが発生する
ことが確実に防止させる。The method for producing a tablet in the present invention is such that the air between particles in the tablet is deaerated in a vacuum container, the tablet is heated and compressed in this state, the particles of the tablet are self-fused, and the IC is packed with particles during IC encapsulation. Air is prevented from being enclosed together, and voids are surely prevented from being generated inside and on the surface of the IC.
以下、この発明の一実施例を図について説明する。第１
図において、（10）はシリンダ室（Ａ）を有するシリン
ダ、（11）はシリンダ（10）にボルト（12）を介して結
合された上部カバーで、弁座（11a）と真空導入室
（Ｂ）を有している。（13）は真空導入室（Ｂ）に排気
口（14）を介して真空を導入する真空ポンプ、（15）は
シリンダ（10）内を摺動してタブレツト（１）を圧縮す
るピストン、（16）はピストン（15）とシリンダ（10）
間を封止するピストンリング、（17）は弁座（11a）に
離接する排気弁、（18）はこの排気弁（17）と弁座（11
a）間を封止する弁リング、（19）は排気弁（17）と上
部カバー（11）との間を封止する排気リング、（20）は
シリンダ（10）と上部カバー（11）とを封止する封止リ
ング、（21）はシリンダ（10）の外周に配置され、シリ
ンダ（10）等を加熱するヒータ、（22）は上記のシリン
ダ（10），上部カバー（11），ピストン（15）等により
構成されるタブレツト成形機である。なお、シリンダ
（10）の内径は37mm、ピストン（15）の直径は37mm、タ
ブレツト（１）の直径は28mm、高さ35mm、重さ35gで構
成している。An embodiment of the present invention will be described below with reference to the drawings. First
In the figure, (10) is a cylinder having a cylinder chamber (A), (11) is an upper cover connected to the cylinder (10) via bolts (12), and is a valve seat (11a) and a vacuum introducing chamber (B). )have. (13) is a vacuum pump that introduces a vacuum into the vacuum introducing chamber (B) through the exhaust port (14), and (15) is a piston that slides in the cylinder (10) to compress the tablet (1), ( 16) is a piston (15) and a cylinder (10)
A piston ring that seals the space between them, (17) is an exhaust valve that contacts and separates from the valve seat (11a), and (18) is this exhaust valve (17) and valve seat (11a).
a) A valve ring for sealing the space between them, (19) an exhaust ring for sealing between the exhaust valve (17) and the upper cover (11), and (20) a cylinder (10) and the upper cover (11). A sealing ring that seals the cylinder, (21) is a heater that is arranged on the outer periphery of the cylinder (10) and heats the cylinder (10), etc. (22) is the cylinder (10), upper cover (11), piston It is a tablet molding machine composed of (15) and the like. The cylinder (10) has an inner diameter of 37 mm, the piston (15) has a diameter of 37 mm, and the tablet (1) has a diameter of 28 mm, a height of 35 mm, and a weight of 35 g.
次に動作について第１図ないし第３図に従つて説明す
る。まず、ヒータ（21）に通電してタブレツト成形機
（22）を50℃〜60℃に加温し、このタブレツト成形機
（22）のシリンダ（10）内に室温で固形状のタブレツト
（１）を挿入し、シリンダ（10）と上部カバー（11）と
をボルト（12）で結合して密閉する。次に、排気弁（1
7）を弁座（11a）から離間した時、排気弁（17）が挿入
されたタブレツト（１）に接触しないようにピストン
（15）の位置調整した後、排気弁（17）を下方に動か
し、弁座（11a）と排気弁（17）とを十分に開放し、真
空ポンプ（13）を運転し、シリンダ室（Ａ）及び真空導
入室（Ｂ）の空気を排気口（14）を介して排気し、各室
（Ａ）（Ｂ）を真空にする。次に、排気弁（17）を上方
向へ変位させて弁リング（18）で排気弁（17）と上部カ
バー（11）の弁座（11a）とを封止させ、シリンダ室
（Ａ）内を真空保持する。ここで、第２図のようにピス
トン（15）を上方向に移動させ、排気弁（17）とピスト
ン（15）とシリンダ（10）とでタブレツト（１）を真空
下で圧縮破壊して粉末化する。この場合、粒子間空気
（２）も同時に破壊し、この空気は、直ちに、真空状態
下にあるシリンダ室（Ａ）に拡散脱泡する。なお、ここ
で、シリンダ室（Ａ）の真空度が下がれば、再びピスト
ン（15）を下方へ変位させると共に排気弁（17）を開放
してシリンダ室（Ａ）を再度真空引きすることになる。Next, the operation will be described with reference to FIGS. First, the heater (21) is energized to heat the tablet forming machine (22) to 50 to 60 ° C., and the tablet (1) which is solid at room temperature in the cylinder (10) of the tablet forming machine (22). Then, the cylinder (10) and the upper cover (11) are connected with a bolt (12) and sealed. Next, the exhaust valve (1
When the 7) is separated from the valve seat (11a), adjust the position of the piston (15) so that the exhaust valve (17) does not come into contact with the inserted tablet (1), and then move the exhaust valve (17) downward. , The valve seat (11a) and the exhaust valve (17) are fully opened, the vacuum pump (13) is operated, and the air in the cylinder chamber (A) and the vacuum introduction chamber (B) is exhausted through the exhaust port (14). The chambers (A) and (B) to a vacuum. Next, the exhaust valve (17) is displaced upward so that the valve ring (18) seals the exhaust valve (17) and the valve seat (11a) of the upper cover (11), and the cylinder chamber (A) is closed. Hold in vacuum. Here, as shown in FIG. 2, the piston (15) is moved upward, and the exhaust valve (17), the piston (15), and the cylinder (10) compress and rupture the tablet (1) under a vacuum, so that the powder Turn into. In this case, the inter-particle air (2) is also destroyed at the same time, and this air immediately diffuses and defoams into the cylinder chamber (A) under vacuum. When the degree of vacuum in the cylinder chamber (A) is lowered, the piston (15) is displaced downward again and the exhaust valve (17) is opened to evacuate the cylinder chamber (A) again. .
ところで、粉末化したタブレツト（１）を圧縮し続ける
と、タブレツト成形機（22）の熱により、粉末は外周部
分から順に融着し、最終的には第８図のように内部まで
一体化され、その直径はシリンダ（10）の内径と同じ87
mmのタブレツト（１）が完成する。このようにして、タ
ブレツト（１）内の粒子間空気（２）が除去されること
になり、このように粒子間空気（２）が除去されたタブ
レツト（１）をIC封止用として用いた場合には、IC封入
時に粒子間空気（２）がICに混入することが防止され、
ICの内部や表面にボイドが発生することが防止されるこ
とになる。By the way, when the powdered tablet (1) is continuously compressed, the powder is fused in order from the outer peripheral portion by the heat of the tablet molding machine (22) and finally integrated into the inside as shown in FIG. , Its diameter is the same as the inner diameter of the cylinder (10) 87
The mm tablet (1) is completed. In this way, the interparticle air (2) in the tablet (1) is removed, and thus the tablet (1) from which the interparticle air (2) is removed is used for IC sealing. In this case, interparticle air (2) is prevented from mixing into the IC when the IC is sealed,
This will prevent the generation of voids inside or on the surface of the IC.
なお、上記実施例では、圧縮破壊した後、再度タブレツ
ト化するために粉末化したタブレツトの内部まで自己融
着するように記載したが、粒子間空気が存在しないタブ
レツトを製作する目的としては、外周部だけが融着され
て内部には粒子間空気があっても、真空状態になつてい
れば、結果的に粒子間空気が存在しないので、全体を融
着した場合と同様の効果が得られる。In addition, in the above-mentioned embodiment, after compression fracture, it was described that the self-fusion is performed up to the inside of the powdered tablet to make the tablet again, but for the purpose of manufacturing the tablet without interparticle air, the outer circumference is Even if only the part is fused and there is interparticle air inside, if it is in a vacuum state, there is no interparticle air as a result, so the same effect as when the whole is fused can be obtained. .
また、上記実施例では、タブレツト成形機に挿入するタ
ブレツトは、固形状態のものを真空破壊するようにした
が、必ずしもこれに限定されるものではなく、例えば、
最初からタブレツトの温度を80℃以上に加熱溶融し、タ
ブレツト成形機内で真空脱泡してから再圧縮しても同様
な効果が得られることは言うまでもない。Further, in the above embodiment, the tablet to be inserted into the tablet molding machine is designed to be vacuum-disrupted in a solid state, but it is not necessarily limited to this, for example,
Needless to say, the same effect can be obtained by heating and melting the tablet at a temperature of 80 ° C. or higher from the beginning, defoaming in a vacuum in the tablet molding machine, and then recompressing.
以上のようにこの発明は、加工手段を成形用樹脂の軟化
温度をよりも低いがこの軟化温度に近接する温度に昇温
し、加工手段に投入された成形用樹脂を真空中で成形体
に加圧成形し、成形時の加圧状態でかつ加工手段の上記
温度で成形体が自己融着するまで保持する、また、成形
用樹脂を、この成形用樹脂の軟化温度に昇温し、この昇
温された成形用樹脂を加工手段に投入し、真空中で成形
用樹脂を脱気し成形体に加圧成形するようにしたので、
タブレットの全周に融着層が形成され、タブレットの内
部を外気から遮断でき、タブレットの内部の粒子間が脱
気されたままの真空状態で維持され、成形後のタブレッ
トを長期間空気中に放置しても、空気の侵入を防止でき
ることになり、ICの封止時に封止樹脂内に空気が混入す
ることが防止され、ICの内部や表面にボイドが発生する
ことを防止でき、ICの信頼性向上や外観不良の発生を確
実に防止できる効果がある。As described above, according to the present invention, the processing means is heated to a temperature lower than the softening temperature of the molding resin but close to the softening temperature, and the molding resin charged into the processing means is formed into a molded body in a vacuum. Pressure molding, in the pressure state at the time of molding and holding at the temperature of the processing means until the molded body self-melts, and the molding resin is heated to the softening temperature of this molding resin, Since the heated molding resin was charged into the processing means, the molding resin was degassed in vacuum and pressure-molded into the molded body,
A fusion layer is formed on the entire circumference of the tablet, the inside of the tablet can be shielded from the outside air, and the particles inside the tablet are maintained in a degassed vacuum state, and the tablet after molding is exposed to air for a long time. Even if left unattended, air can be prevented from entering, air can be prevented from entering the encapsulation resin during IC encapsulation, and voids can be prevented from occurring inside or on the surface of the IC. There is an effect that reliability can be improved and appearance defects can be reliably prevented.
しかも、粒子間にすでに空気が存在している従来のタブ
レットであっても、この発明に基づき、タブレットその
ものを真空容器内に配置してその粒子間空気を脱気する
ことにより、従来のタブレットでも廃却することなく、
IC封止用のタブレットとして用いることができ、極めて
経済的となる効果がある。Moreover, even with a conventional tablet in which air is already present between particles, according to the present invention, the tablet itself is placed in a vacuum container and the air between particles is deaerated, so that even a conventional tablet can be used. Without discarding
It can be used as a tablet for IC encapsulation, and is extremely economical.
また、タブレツトを一旦粒状に破砕した状態でその粒子
間空気を脱気するようにした場合には、粒子間の空気を
効率良く脱泡でき、タブレツトの量産性が優れる効果が
ある。Further, when the air between particles is deaerated in the state where the tablet is once crushed into particles, the air between particles can be efficiently degassed, and the mass productivity of the tablet is excellent.
第１図はこの発明の一実施例を示す断面図、第２図はそ
の動作の工程を示す断面図、第８図は他の動作工程を示
す断面図、第４図は従来のタブレツトを示す断面図、第
５図は従来の金型を示す断面図、第６図は従来のICを示
す断面図である。図において、（１）はタブレツト、
（２）は粒子間空気、（10）はシリンダ、（11）は上部
カバー、（13）は真空ポンプ、（14）は排気口、（15）
はピストン、（17）は排気弁、（21）はヒータ、（22）
はタブレツト成形機である。なお、各図中同一符号は同
一又は相当部分を示す。FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing steps of its operation, FIG. 8 is a sectional view showing other steps of operation, and FIG. 4 is a conventional tablet. A sectional view, FIG. 5 is a sectional view showing a conventional mold, and FIG. 6 is a sectional view showing a conventional IC. In the figure, (1) is a tablet,
(2) Air between particles, (10) Cylinder, (11) Upper cover, (13) Vacuum pump, (14) Exhaust port, (15)
Is a piston, (17) is an exhaust valve, (21) is a heater, (22)
Is a tablet molding machine. In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (3)
を圧壊し真空中で加圧成形する加工手段を、上記加熱手
段を用い上記成形用樹脂の軟化温度よりも低いがこの軟
化温度に近接する温度に昇温する工程と、 上記成形用樹脂を上記加工手段に投入する工程と、 上記加工手段を真空吸引する工程と、 上記加工手段に投入された上記タブレット状の成形用樹
脂を圧壊する工程と、 圧壊された上記成形用樹脂を上記加工手段で成形体に加
圧成形し、成形時の加圧状態でかつ加工手段の上記温度
で上記成形体が自己融着するまで保持する工程と、 を備えたタブレットの製造方法。1. A processing means comprising a heating means for crushing a tablet-shaped molding resin and press-molding in a vacuum, wherein the heating means is used, and the processing means is lower than the softening temperature of the molding resin but close to the softening temperature. Temperature, a step of introducing the molding resin into the processing means, a step of vacuum suction of the processing means, and a step of crushing the tablet-like molding resin introduced into the processing means. A step of pressure-molding the crushed molding resin into a molded body by the processing means, and holding the molded body under pressure at the time of molding and at the temperature of the processing means until the molded body self-bonds; A method for manufacturing a tablet, comprising:
のみであることを特徴とする特許請求の範囲第１項記載
のタブレットの製造方法。2. The method for producing a tablet according to claim 1, wherein the molded body is self-fused only on the outer peripheral surface layer.
の成形用熱硬化性樹脂の少なくとも表面が自己融着する
軟化温度に昇温する工程と、 軟化温度に昇温された上記成形用熱硬化性樹脂を、真空
中で加圧成形する加工手段に投入する工程と、 上記加工手段を真空吸引する工程と、 軟化温度に昇温された上記成形用熱硬化性樹脂を脱気し
上記加工手段で成形体に加圧成形する工程と、 を備えたタブレットの製造方法。3. A step of raising a tablet-shaped thermosetting resin for molding to a softening temperature at which at least the surface of the thermosetting resin for molding is self-fusing, and the above molding for which the temperature has been raised to the softening temperature. The step of introducing the thermosetting resin into the processing means for pressure-molding in vacuum, the step of vacuum-sucking the processing means, and the step of degassing the thermosetting resin for molding that has been raised to the softening temperature. A method of manufacturing a tablet comprising: a step of press-molding a molded body by a processing means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106068A JPH07100326B2 (en) | 1986-05-07 | 1986-05-07 | Tablet manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61106068A JPH07100326B2 (en) | 1986-05-07 | 1986-05-07 | Tablet manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62261404A JPS62261404A (en) | 1987-11-13 |
| JPH07100326B2 true JPH07100326B2 (en) | 1995-11-01 |
Family
ID=14424283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61106068A Expired - Lifetime JPH07100326B2 (en) | 1986-05-07 | 1986-05-07 | Tablet manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07100326B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4826931A (en) * | 1986-10-09 | 1989-05-02 | Mitsubishi Denki Kabushiki Kaisha | Tablet for resin-molding semiconductor devices |
| JPH03178405A (en) * | 1989-08-11 | 1991-08-02 | Hitachi Chem Co Ltd | Manufacture of tablet of thermosetting resin molding material for sealing semi conductor |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5239579A (en) * | 1975-09-26 | 1977-03-26 | Hitachi Ltd | Production process of solidified pellets from powder and its equipment |
| JPS5375264A (en) * | 1976-12-17 | 1978-07-04 | Hitachi Ltd | Tpblet compressing machine |
| JPS5445364A (en) * | 1977-09-19 | 1979-04-10 | Hitachi Ltd | Tablet pressing |
| JPS58145409A (en) * | 1982-02-24 | 1983-08-30 | Hitachi Ltd | Resin tablet molder |
| JPS597009A (en) * | 1982-07-03 | 1984-01-14 | Toshiba Corp | High-density tablet and method of sealing semiconductor with resin using said tablet |
| JPS59139633A (en) * | 1983-12-09 | 1984-08-10 | Hitachi Ltd | Resin seal method of electronic part |
-
1986
- 1986-05-07 JP JP61106068A patent/JPH07100326B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62261404A (en) | 1987-11-13 |
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