JPH0710034B2 - Method for manufacturing chassis substrate - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a chassis substrate used for electric equipment such as a video tape recorder.

2. Description of the Related Art The configuration of a conventional chassis substrate will be described with reference to FIG.

FIG. 3 is a perspective view showing an electrical connection between a reflection type photo sensor used for rotation detection of a reel base and a relay printed wiring board, among electric components mounted on a chassis board of a video tape recorder. Is.

Reference numeral 1 denotes a chassis substrate body, which serves as a base on which mechanical parts, electric parts, etc. are mounted. Reference numeral 2 is a cassette positioning pin for positioning the cassette and the chassis 1. A tension arm shaft boss 3 serves as a bearing for the tension arm shaft. Reference numeral 4 denotes a main brake shaft, which serves as a rotation center of the main brake. 5
Is a cassette receiving shaft, which serves as a receiver in the height direction of the cassette. Each of these is formed on the chassis substrate body 1 by outsert molding a resin. Reference numeral 6 denotes a reel sensor unit in which a reflection type optical coupling element 6a in which a light emitting diode and a photo transistor are integrally incorporated is soldered on a conductive pattern formed on a printed wiring board (hereinafter abbreviated as P board). A hole 6b for soldering the lead wire is formed at one end of the P plate. Reference numeral 7 is a lead wire, which is soldered to connect the P plate as the reel sensor unit 6 and the relay P plate 8 so as to establish conduction between them. The relay P plate 8 is fixed to the chassis substrate 1 and is used as a relay between the electrical components mounted on the chassis substrate 1 and the main P plate 9. The other end of the lead wire 7 is soldered through the hole 8b. It Reference numeral 8a is a male pin connector soldered to the relay P-plate 8, and is connected to the female pin connector 9a of the lead wire unit from the main P-plate 9.

The problem to be solved by the invention However, in the case of the above configuration, a connector is required for connection with the main P board 9, and a relay P board 8 is required for this connector. Further, there is a problem that lead wire processing for arranging the lead wire 7 to be arranged in a limited space position is required, workability is poor, cost is high, and miniaturization is hindered. It was In view of the above problems, the present invention fixes a lead wire portion of an electric component mounted on a chassis board onto the chassis board at the same time when the pin-shaped body is outsert-molded. A manufacturing method is provided.

Means for Solving the Problems In order to achieve this object, a method of manufacturing a chassis substrate according to the present invention provides a predetermined shape in advance during outsert molding in which a pin-shaped body is formed of an insulating resin on a metal substrate. While forming a fixed resin portion for fixing the conductive wire having rigidity stamped on the metal substrate in an insulating state with the insulating resin, an male pin connector having one end of the conductive wire as a connection pin, The insulating resin is formed on the metal substrate.

Effects According to the above configuration, it is possible to greatly reduce the work such as soldering of lead wires and wire treatment for conducting the electric parts mounted on the chassis board at the time of assembly, and the relay P board is also particularly necessary. It is possible to improve workability, reduce costs, and reduce space by effectively using space.

EXAMPLES Examples of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a method of manufacturing a chassis substrate according to an embodiment of the present invention. 1 is a chassis substrate body made of metal, 2 is a cassette positioning pin, 3 is a tension arm shaft boss, 4 is a main brake shaft, 5 is a cassette receiving shaft,
6 is a P plate as a reel sensor unit, 6a is a reflective optical coupling element, 6b is a soldering hole, 9 is a main P plate, and 9a is a female connector of a lead wire unit. The above is the conventional configuration shown in FIG. Is the same as. 10 is a square pin having a sufficient rigidity, which is molded into a predetermined shape, and is inserted into the mold when outsert-molding pins, bosses, etc. (2,3,4,5) with insulating resin. Simultaneously, molding is performed while holding the chassis 1 at a position where a gap is left, covered with a fixing resin 11 and fixed to the chassis 1 to form a conductive portion. One end 10 of square pin 10
The a is bent so that it can be soldered through the hole 6b of the reel sensor P plate 6. Further, the other end 10b is also bent, and the periphery thereof is molded into the same shape 12 as the male of the connector by resin so as to be detachably connectable to the female pin connector 9a of the lead wire unit from the main P plate 9. FIG. 2 is a side view of a chassis board according to an embodiment of the present invention. The chassis substrate 1 and the square pins 10 are held in a mold so that there is a gap, covered with a fixing resin 11 and fixed to form a conductive portion.

As described above, according to the present embodiment, at the time of outsert molding to the substrate, the square pins that have been molded are inserted, and the conduction portion is formed by molding and fixing at the same time as the pin-shaped body. Reduction of soldering work for electrical continuity,
Lead-less and connector-less costs can be reduced, and space can be effectively used for downsizing.

In the present embodiment, the lead wireless connection between the reel sensor P plate 6 and the relay P plate 8 is taken up (see FIG. 3).
Light-emitting diode part for detecting the beginning and end of tape, switch part for preventing accidental erasing of tape, each mode (PLAY, STOP
It is also possible to use it for a mode switch unit or the like for detecting the like). Further, in this embodiment, the connector 12 is formed at one end of the square pin 10, but the connector 12 may be replaced with a relay terminal for soldering.

EFFECTS OF THE INVENTION As described above, according to the present invention, when the pin-shaped body is formed on the metal substrate by the insulating resin, the insulating resin used at the time of the outsert molding is used to mold the pin shape into a predetermined shape. Since the conductive wire having the taken rigidity is held and fixed to the surface of the metal substrate while being insulated from the surface of the metal substrate, a lead wire for establishing electrical continuity with an electric component provided on the metal substrate. There is no need for line treatment such as fixing
Easy electrical wiring to the metal substrate. Furthermore, at the time of outsert molding in which a pin-shaped body is formed on a metal substrate with an insulating resin, by forming an male pin connector having one end of the conductive wire as a connecting pin at the same time with the insulating resin, the conductive wire and the connector are formed. No need for connection work and installation of a relay P plate for attaching the connector are required, so that workability can be improved, cost can be reduced, and space can be effectively used for miniaturization.

[Brief description of drawings]

FIG. 1 is a perspective view of an embodiment of a chassis substrate manufactured by the conduction device of the present invention, FIG. 2 is a side view of the same embodiment, and FIG. 3 is a perspective view of a conventional chassis substrate. 1 ... Chassis board, 2 ... Cassette positioning pin, 3
...... Tension arm shaft boss, 4 ...... Main brake shaft, 5 …… Cassette receiving shaft, 6 …… Reel sensor P
Plate, 6a ... Reflective optical coupling element, 7 ... Lead wire, 8 ...
Relay P board, 8a ... Male pin connector, 9 ... Main P
Plate, 9a ... Lead wire unit, 10 ... square pin, 11 ... Fixing resin.

Claims (1)

[Claims] 1. When conducting outsert molding in which a pin-shaped body is formed on a metal substrate with an insulating resin, a rigid conductive wire preliminarily molded into a predetermined shape is fixed on the metal substrate in an insulated state. A method for manufacturing a chassis substrate, characterized in that a fixed resin portion for molding is formed by the insulating resin, and a male pin connector having one end of the conductive wire as a connection pin is formed on the substrate by the insulating resin. .