JPH07100759B2 - Molded product of aromatic polyarylketone resin composition - Google Patents
Molded product of aromatic polyarylketone resin compositionInfo
- Publication number
- JPH07100759B2 JPH07100759B2 JP61166411A JP16641186A JPH07100759B2 JP H07100759 B2 JPH07100759 B2 JP H07100759B2 JP 61166411 A JP61166411 A JP 61166411A JP 16641186 A JP16641186 A JP 16641186A JP H07100759 B2 JPH07100759 B2 JP H07100759B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- aromatic
- polyarylketone
- phenol
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 125000003118 aryl group Chemical group 0.000 title claims description 12
- 239000011342 resin composition Substances 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 31
- 239000005011 phenolic resin Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000004696 Poly ether ether ketone Substances 0.000 description 5
- 150000001299 aldehydes Chemical class 0.000 description 5
- 229920002530 polyetherether ketone Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- -1 alkylphenol Chemical compound 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007859 condensation product Substances 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- LSQARZALBDFYQZ-UHFFFAOYSA-N 4,4'-difluorobenzophenone Chemical compound C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 LSQARZALBDFYQZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- RCHKEJKUUXXBSM-UHFFFAOYSA-N n-benzyl-2-(3-formylindol-1-yl)acetamide Chemical compound C12=CC=CC=C2C(C=O)=CN1CC(=O)NCC1=CC=CC=C1 RCHKEJKUUXXBSM-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は耐熱性のある成形品の素材として利用される
芳香族ポリアリールケトン樹脂組成物に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an aromatic polyarylketone resin composition used as a material for a molded article having heat resistance.
英国アイ・シー・アイ社の開発によるポリエーテルエー
テルケトン樹脂に代表されるポリアリールケトン樹脂は
耐熱性、難燃性、耐加水分解性、耐薬品性などにすぐれ
たいわゆるエンジニアリングプラスチツクとして広範囲
に利用されているが、電線およびケーブル類の絶縁被
覆、航空機部品、電気・電子部品などのように高温下で
使用されることの多い各種成形品においては高温時の機
械的特性の一層すぐれた樹脂が強く要望されている。Polyarylketone resins represented by polyetheretherketone resins developed by ICI Corporation in the UK are widely used as so-called engineering plastics with excellent heat resistance, flame retardancy, hydrolysis resistance and chemical resistance. However, for various molded products that are often used at high temperatures, such as insulation coatings for electric wires and cables, aircraft parts, electric / electronic parts, etc., a resin with better mechanical properties at high temperature should be used. There is a strong demand.
ポリアリールケトン樹脂は、元来、高結晶性の重合体で
はあるが、ガラス転移温度が140〜170℃程度と比較的低
く、ガラス転移点以上における機械的特性が充分である
とはいえず、特に前記した高温下に置かれる成形品の素
材として耐熱性の一層の向上が望まれることになる。Polyarylketone resin is originally a highly crystalline polymer, but has a relatively low glass transition temperature of about 140 to 170 ° C. and cannot be said to have sufficient mechanical properties at a glass transition point or higher, In particular, further improvement in heat resistance is desired as a material for the above-mentioned molded article placed under high temperature.
このように従来の技術においては、成形体として優れた
耐熱性、耐加水分解性、耐薬品性があり、さらにポリア
リールケトン樹脂のガラス転移温度以上の高温で荷重を
受ける条件において、優れた機械的強度を発揮するポリ
アリールケトン系樹脂組成物の成形体がないという問題
点があった。As described above, in the conventional technique, the molded product has excellent heat resistance, hydrolysis resistance, and chemical resistance, and further has excellent mechanical properties under conditions in which a load is applied at a temperature higher than the glass transition temperature of the polyarylketone resin. There is a problem that there is no molded product of the polyarylketone resin composition that exhibits the desired strength.
上記の問題点を解決するために、この発明は、下記の一
般式で表わされる繰り返し単位の重合体からなる芳香族
ポリアリールケトン樹脂にフェノール樹脂を、重量比で
(40〜99)対(60〜1)の割合で配合し、これを溶融成
形して芳香族ポリアリールケトン樹脂組成物の成形体と
する手段を採用したのである。以下その詳細を述べる。In order to solve the above problems, the present invention relates to an aromatic polyarylketone resin comprising a polymer of repeating units represented by the following general formula and a phenol resin in a weight ratio of (40 to 99) to (60). 1) to 1) and melt-molded the mixture to obtain a molded product of the aromatic polyarylketone resin composition. The details will be described below.
まず、この発明の芳香族ポリアリールケトン樹脂は一般
式 で表わされる重合体である。ここで式中のZ、Z′およ
びZ″は少なくとも一つの炭素6員環を含む2価の芳香
族残基、たとえば などであり、QはO、COまたは直接結合であり、nは0
〜3の整数である。そして特に典型的なポリアリールケ
トン樹脂は一般式 で表わされる結晶性のポリエーテルエーテルケトン樹脂
(以下これをPEEK樹脂と略称する)であつて、英国アイ
・シー・アイ社から市販されている。この樹脂はたとえ
ばヨーロツパ特許第1879号明細書(これに対応する特開
昭54−90296号公報)によると、4,4′−ジフルオロベン
ゾフェノンとハイドロキノンとをジフエニルスルホンの
溶媒中150〜400℃の温度条件下で反応させると得られ
る。この発明におけるポリアリールケトン樹脂には主要
成分としてのアリールケトン構造単位のほかに、必要に
応じて部分的に他の共重合単位を導入しても支障はな
い。このような共重合体の製造方法は、たとえば英国特
許第1,414,421号明細書、特開昭52−38000号公報などに
開示されている。First, the aromatic polyaryl ketone resin of the present invention has the general formula Is a polymer represented by. Wherein Z, Z ′ and Z ″ in the formula are divalent aromatic residues containing at least one carbon 6-membered ring, for example , Q is O, CO or a direct bond, and n is 0.
Is an integer of ˜3. And a particularly typical polyarylketone resin has the general formula A crystalline polyetheretherketone resin represented by the following formula (hereinafter abbreviated as PEEK resin), which is commercially available from ICI Corporation in the United Kingdom. For example, according to European Patent No. 1879 (corresponding to JP-A-54-90296), this resin contains 4,4'-difluorobenzophenone and hydroquinone in a solvent of diphenyl sulfone at 150 to 400 ° C. Obtained by reacting under temperature conditions. In the polyarylketone resin of the present invention, in addition to the arylketone structural unit as a main component, other copolymerized units may be partially introduced, if necessary. The method for producing such a copolymer is disclosed in, for example, British Patent No. 1,414,421 and Japanese Patent Laid-Open No. 52-38000.
つぎに、この発明で用いるフエノール樹脂は芳香族ポリ
アリールケトン樹脂の成形温度においても熱劣化しない
と同時に溶融可能なものが望ましく、たとえばフエノー
ル・アルキル系樹脂またはフエノール・ホルムアルデヒ
ド系樹脂が好ましい。フエノール・アルキル系樹脂は、
たとえば で示される化学構造の樹脂であつて、三井東圧化学社製
の商標名ミレツクスXL−225などを市販品として例示す
ることができる。またフエノール・ホルムアルデヒド系
樹脂はたとえばフエノール類とアルデヒド類との縮合物
であるフエノール・アルデヒド樹脂、またはフエノール
類、含窒素化合物およびアルデヒド類との縮合物である
含窒素フエノール・アルデヒド系共重合樹脂である。こ
こで、フエノール類としては、フエノール、クレゾー
ル、キシレノール、アルキルフエノール等の一価フエノ
ール、カテコール、レゾルシン、ヒドロキノン等の二価
フエノール、ピロガロール、フロログルシン等の三価フ
エノールを、アルデヒド類としてはホルムアルデヒド、
アセトアルデヒドなどの脂肪族飽和アルデヒド、パラホ
ルムアルデヒド、トリオキサン(メタホルムアルデヒ
ド)等を、さらに含窒素化合物としては尿素、アニリ
ン、メラミン、グアニジン等の少なくとも2個の活性水
素を有する化合物などを例示することができる。このよ
うなフエノール樹脂の製造方法はたとえば特開昭57−17
701号公報、同58−17114号公報その他において数多くの
ものが既に開示されている。Next, the phenol resin used in the present invention is preferably one that is not thermally deteriorated even at the molding temperature of the aromatic polyarylketone resin and can be melted at the same time. For example, a phenol / alkyl resin or a phenol / formaldehyde resin is preferable. The phenol / alkyl resin is
For example Examples of the resin having a chemical structure represented by the following are commercially available products such as trade name Millex XL-225 manufactured by Mitsui Toatsu Chemicals, Inc. The phenol / formaldehyde resin is, for example, a phenol / aldehyde resin which is a condensation product of phenols and aldehydes, or a nitrogen-containing phenol / aldehyde copolymer resin which is a condensation product of phenols, nitrogen-containing compounds and aldehydes. is there. Here, as the phenols, phenol, cresol, xylenol, monovalent phenol such as alkylphenol, catechol, resorcin, divalent phenol such as hydroquinone, pyrogallol, trivalent phenol such as phloroglucin, formaldehyde as aldehydes,
Examples thereof include aliphatic saturated aldehydes such as acetaldehyde, paraformaldehyde, trioxane (metaformaldehyde) and the like, and examples of nitrogen-containing compounds include compounds having at least two active hydrogens such as urea, aniline, melamine and guanidine. . A method for producing such a phenol resin is described in, for example, JP-A-57-17.
A large number have already been disclosed in Japanese Patent No. 701, Japanese Patent No. 58-17114, and others.
以上の芳香族ポリアリールケトン樹脂とフエノール樹脂
との配合割合は重量比で(40〜99)対(60〜1)である
ことが望ましい。なぜならばフエノール樹脂が1重量部
未満の少量のときはポリアリールケトン樹脂の熱変形温
度の向上効果が小さく、逆に60重量部を越える多量のと
きは熱変形温度の向上に及ぼす増量効果がほとんど期待
されず、ポリアリールケトン樹脂本来の特性を損うこと
になつて好ましくないからである。そして実用的に配合
する割合としてはポリアリールケトン樹脂が50〜95重量
部であり、フエノール樹脂が50〜5重量部であることが
望ましい。なおこの発明の組成物においても、通常の樹
脂組成物におけると同様に、発明の主目的を阻害しない
範囲内で、たとえば、グラフアイト、カーボン、珪石
粉、二硫化モリブデン、フツ素樹脂などの耐摩耗性向上
剤、ガラス繊維、カーボン繊維、ボロン繊維、炭化珪素
繊維、アスベストロツクウール、金属繊維などの補強
(強化)材、三酸化アンチモン、炭酸マグネシウム、炭
酸カルシウムなどの難燃剤、クレー、マイカ、石綿、シ
リカ、グラフアイト等の電気的特性の改良剤、硫酸バリ
ウム、シリカ、メタ珪酸カルシウムなどの耐酸性向上
剤、鉄、亜鉛、アルミニウム、銅などの金属粉末の熱伝
導度向上剤、ガラスビーズ、ガラス球、炭酸カルシウ
ム、アルミナ、タルク、珪藻土、水和アルミナ、シラス
バルーン、その他金属酸化物等の増量剤、さらには顔料
など、350℃程度以上で安定な物質を混合してもよい。The mixing ratio of the aromatic polyarylketone resin and the phenol resin is preferably (40 to 99) to (60 to 1) by weight. This is because when the amount of the phenol resin is less than 1 part by weight, the effect of improving the heat distortion temperature of the polyarylketone resin is small, and conversely, when the amount of the resin exceeds 60 parts by weight, there is almost no increase effect on the improvement of the heat distortion temperature. This is because it is not expected and it is not preferable because the original properties of the polyarylketone resin are impaired. It is preferable that the polyarylketone resin is 50 to 95 parts by weight, and the phenol resin is 50 to 5 parts by weight, as a ratio for practical use. Incidentally, also in the composition of the present invention, as in the case of the ordinary resin composition, within a range that does not impair the main purpose of the invention, for example, graphite, carbon, silica powder, molybdenum disulfide, fluorine resin, etc. Abrasivity improver, glass fiber, carbon fiber, boron fiber, silicon carbide fiber, asbestos rock wool, reinforcing (reinforcing) material such as metal fiber, flame retardant such as antimony trioxide, magnesium carbonate, calcium carbonate, clay, mica, Electrical property improvers such as asbestos, silica, graphite, acid resistance improvers such as barium sulfate, silica, calcium metasilicate, thermal conductivity improvers for metal powders such as iron, zinc, aluminum and copper, glass beads , Glass spheres, calcium carbonate, alumina, talc, diatomaceous earth, hydrated alumina, shirasu balloon, and other metal oxides News such as a pigment may be mixed stable materials are more than 350 ° C..
この発明の各原材料の配合、加熱、溶融、混合などの諸
操作は熱ローラ、バンバリーミキサ、ブラベンダ、押出
機などを利用し、通常340〜400℃、好ましくは350〜380
℃で均一な混合物が得られるまで継続すればよく、基材
であるポリアリールケトン樹脂、フエノール樹脂および
必要に応じて添加される充填材類は、それぞれ個別に溶
融混合機に供給しても、またはこれら一部もしくは全部
を乳鉢、ヘンシエルミキサー、ボールミル、リボンブレ
ンダーなどを用いて予備混合した後溶融混合機に供給し
てもよく、また、ポリアリールケトン樹脂と充填材とを
溶融ブレンドしてマスターバツチを作り、これとフエノ
ール樹脂とを溶融ブレンドするという2段ブレント方式
を採用してもかまわない。そして得られる成形品はポリ
アリールケトン樹脂の融点以下で熱処理を施すと成形品
の耐熱性を一層向上させることができる。Various operations such as blending, heating, melting, and mixing of the raw materials of the present invention utilize a heat roller, a Banbury mixer, a brabender, an extruder, etc., and usually 340 to 400 ° C., preferably 350 to 380.
It suffices to continue until a uniform mixture is obtained at 0 ° C, and the polyarylketone resin as the base material, the phenol resin, and the fillers added as necessary may be individually supplied to the melt mixer, Alternatively, a part or all of these may be pre-mixed with a mortar, a Henschel mixer, a ball mill, a ribbon blender or the like and then supplied to a melt mixer, or by melt-blending a polyarylketone resin and a filler. A two-stage Brent method of making a master batch and melt-blending this with a phenol resin may be adopted. The heat resistance of the obtained molded product can be further improved by subjecting it to a heat treatment at a temperature not higher than the melting point of the polyarylketone resin.
実施例1〜4: PEEK樹脂(英国アイ・シー・アイ社製、ガラス転移点14
3℃、融点334℃)およびフエノール樹脂(三井東圧化学
社製:ミレツクスSP−2000を表に示す割合で、ドライブ
レンドした後、溶融押出機に供給して、シリンダー温度
350〜360℃、スクリユー回転数100rpmで溶融混練して造
粒し、これを360℃、100kg/cm2の条件下で試験片を成形
した。得られた試験片の熱変形温度℃(ASTM−D648によ
る)、曲げ応力kg/cm2(ASTM−D790による)、曲げ弾性
率(ASTM−D790による)およびアイゾツト衝撃強度kg・
cm/cm(ASTM−D256による)を測定し、その結果を表に
まとめた。Examples 1 to 4: PEEK resin (manufactured by UK ICI, glass transition point 14
3 ° C., melting point 334 ° C.) and phenol resin (Mitsui Toatsu Chemical Co., Inc .: Millex SP-2000 at the ratios shown in the table) were dry-blended and then fed to a melt extruder to obtain a cylinder temperature
The mixture was melt-kneaded at 350 to 360 ° C. and a screw rotation speed of 100 rpm to be granulated, and this was molded into a test piece under the conditions of 360 ° C. and 100 kg / cm 2 . Heat distortion temperature of the obtained test piece (according to ASTM-D648), bending stress kg / cm 2 (according to ASTM-D790), bending elastic modulus (according to ASTM-D790) and Izod impact strength kg.
cm / cm (according to ASTM-D256) was measured and the results are summarized in the table.
比較例1〜3: PEEK樹脂とフエノール樹脂との配合割合を表に示したよ
うにこの発明の限定範囲外とした以外は実施例1と全く
同じ操作をして試験片を作製し、その性質を同様に測定
し、得られた結果を表に併 記した。Comparative Examples 1 to 3: Test pieces were prepared by the same procedure as in Example 1 except that the mixing ratio of PEEK resin and phenol resin was out of the range of the present invention as shown in the table. In the same manner, and the obtained results are also shown in the table. I wrote it.
表から明らかなように実施例1〜4においては、フエノ
ール樹脂を混合しない比較例1に比べて熱変形温度は遥
かに高く、また高温下の曲げ弾性率も著しく優れてお
り、耐熱性、曲げ応力、アイゾツト衝撃強度などについ
ても均衡のとれたものであつた。フエノール樹脂の混合
量が比較例3のように少量のときは高温時の曲げ弾性率
の改善効果はほとんど認められず、また比較例2のよう
に多量のときはアイゾツト衝撃強度が著しく低下し、い
ずれの場合も好ましい結果は得られなかつた。As is clear from the table, in Examples 1 to 4, the heat deformation temperature was much higher than in Comparative Example 1 in which no phenol resin was mixed, and the bending elastic modulus at high temperature was also extremely excellent. The stress and Izod impact strength were well balanced. When the amount of the phenol resin mixed is small as in Comparative Example 3, almost no effect of improving the flexural modulus at high temperature is observed, and when it is large as in Comparative Example 2, the Izod impact strength is significantly reduced. In either case, no favorable result was obtained.
この発明の芳香族ポリアリールケトン樹脂組成物の成形
体は、ポリアリールケトン樹脂特有の耐熱老化性を保持
し、成形品素材として高温荷重下の使用条件において高
い強度、弾性率、さらに耐加水分解性、耐薬品などをも
兼備していることから、航空・宇宙機器、電気・電子機
器、原子力関係機器、自動車、一般産業機器、熱水機器
などあらゆる分野の部品として、その耐熱性、機械的強
度、摺動特性、電気的特性、耐溶剤性などのすぐれた性
能を発揮することができるので、この発明の意義はきわ
めて大きいといえる。The molded product of the aromatic polyarylketone resin composition of the present invention retains the heat aging resistance peculiar to the polyarylketone resin, and has high strength, elastic modulus, and further hydrolysis resistance under the usage conditions under high temperature load as a molded material. Since it also has both heat resistance and chemical resistance, it is used as a component in all fields such as aerospace equipment, electric and electronic equipment, nuclear power equipment, automobiles, general industrial equipment, hot water equipment, etc. It can be said that the present invention is extremely significant because it can exhibit excellent properties such as strength, sliding properties, electrical properties, and solvent resistance.
Claims (1)
を含む2価の芳香族残基を、QはO、COまたは直接接合
を、nは0〜3の整数を示す) の繰り返し単位を主要構造単位とする重合体からなる芳
香族ポリアリールケトン樹脂と、フェノール樹脂を重量
比で(40〜99)対(60〜1)の割合で配合し、これを溶
融成形してなる芳香族ポリアリールケトン樹脂組成物の
成形体。1. A general formula (In the formula, Z, Z ′ and Z ″ are divalent aromatic residues containing at least one 6-membered carbon ring, Q is O, CO or a direct bond, and n is an integer of 0 to 3) Aromatic polyarylketone resin consisting of a polymer having the repeating unit of (1) as a main structural unit and a phenolic resin are blended in a weight ratio of (40 to 99) to (60 to 1) and melt-molded. A molded article of the aromatic polyarylketone resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61166411A JPH07100759B2 (en) | 1986-07-14 | 1986-07-14 | Molded product of aromatic polyarylketone resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61166411A JPH07100759B2 (en) | 1986-07-14 | 1986-07-14 | Molded product of aromatic polyarylketone resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6320358A JPS6320358A (en) | 1988-01-28 |
| JPH07100759B2 true JPH07100759B2 (en) | 1995-11-01 |
Family
ID=15830923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61166411A Expired - Lifetime JPH07100759B2 (en) | 1986-07-14 | 1986-07-14 | Molded product of aromatic polyarylketone resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07100759B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11267938B2 (en) * | 2017-12-20 | 2022-03-08 | Solvay Specialty Polymers Usa, Inc | Method of making a shaped article comprising printing layers of a polymer composition comprising at least one PEEK-PEmEK copolymer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030095B2 (en) * | 1973-05-14 | 1975-09-29 |
-
1986
- 1986-07-14 JP JP61166411A patent/JPH07100759B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6320358A (en) | 1988-01-28 |
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