JPH07101419B2 - Printed wiring board automatic modification processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A method of modifying a printed wiring board having a surface mount device (SMD) mounted thereon, with an object of outputting information on a section where wiring is cut and / or connected as modification instruction information. Then, it is determined that the surface mount component is mounted on the printed wiring board, and it is determined whether the pad of the surface mount component is mounted on the solder side or the component side, and the surface mount component is connected to the surface mount component. Generates an array of all wiring pattern information for the solder side and component side, compares the previously generated wiring pattern with the wiring pattern generated this time, extracts the changed net number, and changes the net number to perform wiring. For the section that needs to be cut, the wiring pattern is cut and the information of the cut section is stored, and / or the connection of the wiring becomes necessary by changing the net number. By performing the strap line connection process for the section and storing the information of the connected section, the information of the disconnected section and / or the information of the connected section is output as the modification instruction information during the modification processing of the printed wiring board. To configure.

[Industrial application field]

The present invention relates to a method for modifying a printed wiring board mounted with surface mount components (SMD), and more particularly to a method for automatically modifying a printed wiring board that changes the circuit of an existing printed wiring board using a CAD system. Is.

Generally, a printed wiring board is often designed by using an automatic design (CAD) system. However, in such a printed wiring board, for example, after completion of the circuit, a wiring pattern is cut, a strap line is connected, It may be necessary to perform modification processing such as output of modification point instruction drawings.

In recent years, with the demand for high-density packaging, surface-mounted components have come to be generally used as components to be mounted on a printed wiring board, and the weight and the number of pins have been increased, and the pin pitch has been larger than in the past. Narrow ones tend to be adopted. Therefore, the automatic modification of the printed wiring board is becoming more complicated and more difficult.

Therefore, as a method of modifying the printed wiring board in such a case, it is not necessary to rely on humans for the modification processing, and by storing the required data for the printed wiring board in the computer, the information for designating the modified portion can be obtained. Is required to be automatically output.

[Conventional technology]

Conventionally, as a method of mounting components mounted on a printed wiring board, a hole (through hole) is formed through the board, and the lead wire of the component is pierced through the through hole to mount the component. By doing so, the method of connecting and fixing parts has become the mainstream.

In this case, since the surface of the component to be mounted is constant and the through hole is a through type, it is not necessary to be aware of the layout layer of the through hole, and if attention is paid only to the wiring pattern connected to the through hole, We were able to easily carry out automatic modification.

[Problems to be Solved by the Invention]

However, in a printed wiring board using surface-mounted components, the pads to which the components are connected are formed only on the surface (layer) on which the components are mounted. It is difficult to handle with the automatic modification processing method. Therefore, when both sides are mounted on a component, it is formed on the solder side (usually, the bottom surface of the n-layer printed wiring board, the L1 surface, is treated as the component mounting surface and the top surface, the Ln surface, as the solder surface). The pad is no longer recognized. Further, even when the pads are arranged on one coordinate of both sides, it becomes impossible to handle them by the automatic remodeling process by recognizing only one side (component side).

Since it cannot be handled by the automatic remodeling process, it is impossible to automate the output of the drawing instructing the remodeled portion, and thus it is necessary to manually handle it. Therefore, the amount of work is increased, and errors such as manual entry errors are likely to occur.

Problems such as occur.

The present invention is intended to solve such a problem of the conventional art, and an object thereof is to be able to output information of a section to be cut as modification instruction information during automatic modification processing of a printed wiring board. And

Another object of the present invention is to be able to output the information of the section to be connected as the modification instruction information during the automatic modification process of the printed wiring board.

Further, another object of the present invention is to be able to output the information of the section to be cut and the information of the section to be connected as the modification instruction information during the automatic modification process of the printed wiring board.

[Means for solving the problem]

In the present invention, as shown in the principle configuration in FIG. 1, it is determined by the component determination step S101 that a surface mount component is mounted in the printed wiring board, and the mounting surface determination step S102 determines the surface mount component. It is determined whether the pad of the component is mounted on the solder surface or the partial surface, and by the information array generation step S103, an array of all wiring pattern information connected to this surface mount component is obtained for the solder surface and the component surface. In the change extraction step S104, the wiring pattern generated last time is compared with the wiring pattern generated this time to extract the change in the net number, and in the cutting processing step S105, the wiring needs to be cut by changing the net number. The wiring pattern cutting process is performed on the section to store information about the section that has been cut, and when the printed wiring board is modified, this cut section information is used as modification instruction information. It is intended to and output.

Further, in the component determination step S101, it is determined that the surface mount component is mounted in the printed wiring board, and in the mounting surface determination step S102, the pad of the surface mount component is mounted on either the solder side or the component side. It is determined, by the information array generation step S103, an array of all wiring pattern information connected to this surface mount component is generated for the solder side and the component side, and by the change extraction step S104, the wiring pattern previously generated. And the wiring pattern generated this time are compared to extract the changed net number, and the connection process
S106 is used to store the information of the connected section by connecting the strap line for the section that requires the connection of the wire due to the change of the net number, and when the printed wiring board is modified, the information of the connected section is modified. It is to be output as information.

Further, in the component determination step S101, it is determined that the surface mount component is mounted in the printed wiring board, and in the mounting surface determination step S102, the pad of the surface mount component is mounted on either the solder side or the component side. Determine whether
By the information array generation process S103, an array of all wiring pattern information connected to this surface mount component is generated for the solder component surface, and by the change extraction process S104, the previously generated wiring pattern and the wiring pattern generated this time are generated. Matching and extracting the changed part of the net number, disconnection process S1
The section for which wiring is cut by changing the net number by 05 is processed by cutting the wiring pattern and the information of the cut section is stored, and by the connection processing step S106, the section for which wiring must be connected by changing the net number The information of the connected section is stored by performing the strap wire connection processing, and the information of the disconnected section and the information of the connected section are output as the modification instruction information during the modification processing of the printed wiring board.

[Action]

Determines that the surface mount component is mounted on the printed wiring board, determines whether the pad of this surface mount component is mounted on the solder side or the component side, and connects to this surface mount component. Generates an array of wiring pattern information for the solder side and the component side, compares the previously generated wiring pattern with the currently generated wiring pattern, and extracts the changed net number. Since the wiring pattern cutting processing is performed for the section requiring cutting, and the information of the cut section is stored, it is possible to output the information of the cut section as modification instruction information when modifying the printed wiring board. it can.

In addition, it is determined that the surface mount component is mounted on the printed wiring board, and whether the pad of the surface mount component is mounted on the solder side or the component side is connected to this surface mount component. Change the net number by generating an array of all the wiring pattern information for the solder side and the component side, and comparing the previously generated wiring pattern with the currently generated wiring pattern to extract the changed net number. Since the wiring pattern connection processing is performed for the section that requires wiring connection and the information of the connected section is stored, the information of the cut section is output as the modification instruction information during the modification processing of the printed wiring board. be able to.

In addition, it is determined that the surface mount component is mounted on the printed wiring board, and whether the pad of the surface mount component is mounted on the solder side or the component side is connected to this surface mount component. Change the net number by generating an array of all the wiring pattern information for the solder side and the component side, and comparing the previously generated wiring pattern with the currently generated wiring pattern to extract the changed net number. The section that cuts the wiring pattern for the section where the wiring needs to be cut is stored and the information of the section that has been cut is stored, and the section where the wiring pattern is connected for the section that needs the wire connection by changing the net number Since the information of the section is stored, the information of this cut section can be output as the modification instruction information during the modification process of the printed wiring board. Can.

〔Example〕

The automatic modification processing of the printed wiring board according to the present invention is performed by the following means.

It is determined whether or not the surface mount component is mounted on the printed wiring board to be subjected to the automatic modification process.

Determine whether the pad of the mounted surface mount component is formed on the component side or the solder side,
Collects and stores information such as part number, part number, pad number, coordinates of pad placement position, layer on which pad is placed, coordinate information (shape information) that determines the shape and shape of the pad, and net number of the pad. To do. Here, the net refers to a section of wiring. As the storage means, for example, the data array is provided inside the computer.

All wiring patterns connected to the pads are collected and stored for each layer. The storage means in this case is the same as in the case of the above-mentioned component symbols and the like.

The difference information is extracted by comparing the information of the wiring pattern of the printed wiring board created last time with the information of the wiring pattern generated this time.

The difference information is checked and summarized according to the following criteria.

(In the case of cutting the wiring pattern) (a) By changing the net number, information on the wiring section which is the section to be cut is collected. That is, if different net numbers are to be given to the same wiring, the wiring in that section should not be connected and must be cut.

(B) The net number of the wiring pattern to be cut and the net number of the pad are checked to determine which layer the cut point is on.

(C) The start point or the end point of the wiring pattern to be cut is
Determine that it fits within the shape of the pad.

(D) A wiring pattern satisfying the above conditions (b) and (c) is cut.

(E) The section in which the wiring pattern is cut is stored as a result. (This result will be used later for output of modified drawing) (In the case of cutting the wiring pattern) (f) By changing the net number, information of the changed section is collected. That is, when the same net number is given to different wirings, the wirings in that section must be connected.

(G) Determine which layer the cut point is on by checking the match between the net number of the section to be connected and the net number of the pad.

With respect to those satisfying the conditions of (h), (f), and (g), a process of stretching a strap line between the pads is performed.

(I) Store the information of the section connected by the strap line.
(This information will be used later in the modified drawing output.) In addition, the reconnection process of the section where the strap line is once connected is
The above-mentioned two types of methods may be applied.

 The above-mentioned processing is repeated for the changed portion of the circuit.

Outputs information on the remodeling result (wiring pattern cut section, strap line connection section).

2 (a) and 2 (b) show a printed wiring board according to an embodiment of the present invention, in which (a) is a top view,
(B) has shown the side view.

FIG. 2 (a) shows a case where SMD components are mounted on both sides, where the solid line indicates the component surface and the dotted line indicates the solder surface. In addition, the bold line shows the double-sided arrangement.

In the figure, 30 is a printed wiring board, 31 is a solder surface, and 32 is a component surface. 33 to 36 are surface mount type ICs (IC1 to I
C4), as shown in FIG. 2 (b), IC33, IC35
Are connected to the component side, and IC34 and IC36 are connected to the solder side. IC35 and IC36 are placed on both sides at the same position.
A rectangular portion arranged around each IC indicates a pad 37, and 1 to 12 are pad numbers. The numbers 1 to 21 on the X coordinate axis and the numbers 1 to 7 on the Y coordinate axis of the printed wiring board are shown as coordinate values.

FIGS. 3 (a) to 3 (d) exemplify an array of information stored in the computer. FIG. 3 (a) shows the array, and the array is assigned with the numbers on the previous page. Generate the number of corresponding pads. As for the shape of the pad, the round shape is 1, the rectangular shape is 2, and the other shapes are 3. The layer on which the pads are formed has the solder surface as the first layer and the component surface as the second layer. (B) is IC1
Is shown, and the case where they are arranged on the component surface is shown. (C) shows the arrangement of IC2, which is arranged on the solder surface. (D) is IC4
And shows the case where they are arranged on the solder surface.

FIGS. 4A and 4B are flowcharts showing the processing procedure of the method of the present invention, exemplifying the case of a two-layer ultint wiring board.

First, it is checked whether or not the surface mount component is present in the mounted components (step S1), and if not, the process is terminated.

If the surface mount component is present, it is checked whether the surface mount component is mounted on the component surface or the solder surface (step S2). The layer (2) is set (step S3). In the case of the solder surface, the layer (1) of the solder surface is set when the array is generated (step S4). Here, the array means an array generated inside the computer.

Next, all wirings connected to the pads collect pattern information (step S5). Then, the previous wiring pattern is read and collated with the current one (step S6), and the changed net number is stored (step S7).

When the net is changed, the sections to be cut are collected (step S8), and when the cutting is necessary, the wiring pattern is cut and the information of the cut section is stored (step S8).
S9).

When the disconnection is not necessary and when the disconnection process is completed, the sections to be connected are collected (step S10), the process is terminated when the connection is not necessary, and the strap line connection process is performed when the connection is necessary. Store the results of the operation (Step S1
1), end the process. The processing result is output as a modified drawing by the CAD system.

Note that such loops are prepared for the number of pads of the mounted components.

〔The invention's effect〕

As described above, according to the present invention, it is possible to output the information of the section to be cut as the modification instruction information during the automatic modification process of the printed wiring board. In addition, during the automatic modification process of the printed wiring board, the information of the section to be connected can be output as the modification instruction information. Further, during the automatic modification process of the printed wiring board, the information of the section to be cut and the information of the section to be connected can be output as modification instruction information. Therefore, according to the present invention, when the printed wiring board is remodeled, it can be automatically processed without manual labor and information indicating the remodeled portion can be output.

[Brief description of drawings]

FIG. 1 is a diagram showing the basic configuration of the present invention, FIG. 2 (a),
FIG. 3B is a diagram showing a printed wiring board according to an embodiment of the present invention, FIGS. 3A to 3D are diagrams exemplifying an array of information stored in a computer, FIGS. 4A and 4B. The figure is a flow chart showing the processing procedure of the method of the present invention. S101 is a component determination process, S102 is a mounting surface determination process, S103 is an information array generation process, S104 is a change extraction process, S105 is a disconnection processing process, and S106 is a connection processing process.

Claims (3)

[Claims] 1. A component determination process (S101) for determining whether a surface-mounted component is mounted in a printed wiring board, and whether a pad of the surface-mounted component is mounted on a solder surface or a component surface. Mounting surface determination process (S102)
And an information array generation process (S103) for generating an array of all wiring pattern information connected to the surface-mounted component for the solder side and the component side, and the previously generated wiring pattern and the wiring pattern generated this time are compared. A change extraction process (S104) for extracting the changed part of the net number, and a disconnection process step of storing the information of the cut section by performing the cutting process of the wiring pattern for the section where the wiring needs to be cut by changing the net number (S104). S105) and a method for automatically modifying a printed wiring board, wherein the information on the cut section is output as modification instruction information when modifying the printed wiring board. 2. A component determination process (S101) for determining whether a surface mount component is mounted in a printed wiring board, and whether the pad of the surface mount component is mounted on the solder side or the component side. Mounting surface determination process (S102)
And an information array generation process (S103) for generating an array of all wiring pattern information connected to the surface-mounted component for the solder side and the component side, and the previously generated wiring pattern and the wiring pattern generated this time are compared. Change extraction process (S104) for extracting the changed part of the net number and connection process for storing the information of the connected section by performing the strap line connection processing for the section where wiring connection is required due to the change of the net number And a step (S106), wherein when the printed wiring board is modified, the information of the connected section is output as modification instruction information. 3. A component determination process (S101) for determining whether a surface mounting portion is mounted in a printed wiring board, and whether a pad of the surface mounting component is mounted on a solder surface or a component surface. Mounting surface determination process (S102)
And an information array generation process (S103) for generating an array of all wiring pattern information connected to the surface-mounted component for the solder side and the component side, and the previously generated wiring pattern and the wiring pattern generated this time are compared. A change extraction process (S104) for extracting the changed part of the net number, and a disconnection process step of storing the information of the cut section by performing the cutting process of the wiring pattern for the section where the wiring needs to be cut due to the change of the net number (S104). S105) and a connection processing step (S106) of storing the information of the connected section by performing the connection processing of the strap wire for the section where the wiring connection is required due to the change of the net number, and the modification processing of the printed wiring board At this time, the information of the connected section is output as modification instruction information, and an automatic modification processing method for a printed wiring board.